CN107541017A - A kind of encapsulating material with radiation-screening effect and its preparation method and application - Google Patents
A kind of encapsulating material with radiation-screening effect and its preparation method and application Download PDFInfo
- Publication number
- CN107541017A CN107541017A CN201710776996.9A CN201710776996A CN107541017A CN 107541017 A CN107541017 A CN 107541017A CN 201710776996 A CN201710776996 A CN 201710776996A CN 107541017 A CN107541017 A CN 107541017A
- Authority
- CN
- China
- Prior art keywords
- parts
- encapsulating material
- temperature
- radiation
- yttrium nitrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of encapsulating material with radiation-screening effect and its preparation method and application, the encapsulating material, include according to the raw material of parts by weight：11 19 parts of Methyl Hydrogen Polysiloxane Fluid, 51 25 35 parts of epoxy resin E, 33 41 parts of zeolite powder, 15 parts of yttrium nitrate, 37 parts of chloroplatinic acid.Zeolite powder is crushed, sieved, then with platinum acid chloride solution Hybrid Heating；Add epoxy resin E44 heating stirrings；Then Methyl Hydrogen Polysiloxane Fluid is added to produce with yttrium nitrate solution heating stirring, melting extrusion, injection molding.Encapsulating material produced by the present invention, have the characteristics that thermal coefficient of expansion is small, thermal conductivity factor is high, ageing-resistant and fine corrosion resistance, easy processing, good insulating, also there is extremely excellent alpha ray shield performance.Raw material of the present invention is simple, and preparation process is simple, light, environmentally friendly, safe and non-toxic, does not produce poisonous and harmful substances during production, cost is low, suitable for industrialized production.
Description
Technical field
The present invention relates to encapsulating material field, specifically a kind of encapsulating material and its preparation side with radiation-screening effect
Method and application.
Background technology
Electronic package material is with plastics, ceramic main at present.Wherein plastics radiation resistance is poor, heavy dose of rate ray spoke
The reaction such as aging, degraded easily occurs according to lower, and thermal coefficient of expansion is big, it is poor with chip matching.Ceramics itself have resistance to
The advantages such as radiance is good, mechanical strength is high, chemical resistance and thermal coefficient of expansion are low, it is a kind of excellent Electronic Packaging
Material.But ceramics hardly have radiation shield performance.The electronic component particularly to be worked in high-energy particle radiation environment, due to electricity
The radiation hardness grade of sub- device and chip is very low, especially chip etc. by after X, gamma Rays, radiating particle by with thing
Electron interaction in matter, produce ionisation effect and damage chip, cause the performance degradation of integrated circuit, cause logic function
The even completely permanent damage of mistake, so as to cause electronic component global failure.Radiation shield can effectively improve electronic device and
The radiation hardness grade of chip.But existing screen method exist single shielding material, thick and heavy, processing difficulties, it is poisonous the shortcomings of.
The content of the invention
It is an object of the invention to provide a kind of encapsulating material and its preparation method and application with radiation-screening effect,
To solve the problems mentioned in the above background technology.
To achieve the above object, the present invention provides following technical scheme：
A kind of encapsulating material with radiation-screening effect, includes according to the raw material of parts by weight：Methyl Hydrogen Polysiloxane Fluid 11-19 parts,
Epoxy resin E-51 25-35 parts, zeolite powder 33-41 parts, yttrium nitrate 1-5 parts, chloroplatinic acid 3-7 parts.
As the further scheme of the present invention：The encapsulating material with radiation-screening effect, according to the original of parts by weight
Material includes：Methyl Hydrogen Polysiloxane Fluid 13-17 parts, epoxy resin E-51 28-32 parts, zeolite powder 35-39 parts, yttrium nitrate 2-4 parts, chlorine
Platinic acid 4-6 parts.
As the further scheme of the present invention：The encapsulating material with radiation-screening effect, according to the original of parts by weight
Material includes：15 parts of Methyl Hydrogen Polysiloxane Fluid, 30 parts of epoxy resin E-51,37 parts of zeolite powder, 3 parts of yttrium nitrate, 5 parts of chloroplatinic acid.
A kind of preparation method of the encapsulating material with radiation-screening effect, comprises the following steps：
1）12-14 times of ethanol of chloroplatinic acid and its quality is mixed, platinum acid chloride solution is made；By 4-5 times of yttrium nitrate and its quality
Deionized water mixing, be made yttrium nitrate solution；
2）Zeolite powder is crushed, crosses 100-150 mesh sieves, is then mixed with platinum acid chloride solution, is heated to 62-65 DEG C and in the temperature
Lower stir process 0.8-1h；Epoxy resin E44 is added, is warming up to 78-80 DEG C, and stir process 35- at such a temperature
40min；Then Methyl Hydrogen Polysiloxane Fluid and yttrium nitrate solution are added, first the heating stirring 15-20min at a temperature of 60-65 DEG C, so
10-15min is stirred at a temperature of 95-98 DEG C afterwards, mixture A is made；
3）Mixture A is warming up to 125-130 DEG C and at such a temperature stir process 40-50min, then in 155-160 DEG C of temperature
The lower stirring 10-12min of degree, is made mixture B；
4）Mixture B is produced through melting extrusion, injection molding.
As the further scheme of the present invention：Step 2）In, mixing speed 120-150r/min.
As the further scheme of the present invention：Step 2）In, mixed with platinum acid chloride solution, be heated to 63 DEG C.
As the further scheme of the present invention：Step 2）In, Methyl Hydrogen Polysiloxane Fluid and yttrium nitrate solution are added, first at 62 DEG C
At a temperature of heating stirring 15-20min, then stir 10-15min at a temperature of 96 DEG C.
As the further scheme of the present invention：Step 3）In, mixing speed 250-280r/min.
As the further scheme of the present invention：Step 3）In, mixture A is warming up to 128 DEG C and stirred at such a temperature
40-50min is handled, then 10-12min is stirred at a temperature of 158 DEG C, mixture B is made.
Another object of the present invention is to provide the application of the encapsulating material in the electronic device.
Another object of the present invention is to provide application of the encapsulating material in radiation shield equipment.
Compared with prior art, the beneficial effects of the invention are as follows：
The present invention is using encapsulating material made from above-mentioned raw materials and technique, with thermal coefficient of expansion is small, thermal conductivity factor is high, ageing-resistant
And the features such as fine corrosion resistance, easy processing, good insulating, also there is extremely excellent alpha ray shield performance.Raw material letter of the present invention
Single, preparation process is simple, light, environmentally friendly, safe and non-toxic, does not produce poisonous and harmful substances during production, cost is low, suitable for industrial metaplasia
Production.
Embodiment
Below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described,
Obviously, described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Based in the present invention
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of protection of the invention.
Embodiment 1
In the embodiment of the present invention, a kind of encapsulating material with radiation-screening effect, including following raw material：Methyl Hydrogen Polysiloxane Fluid
11kg, epoxy resin E-51 25kg, zeolite powder 33kg, yttrium nitrate 1kg, chloroplatinic acid 3kg.
12 times of ethanol of chloroplatinic acid and its quality is mixed, platinum acid chloride solution is made；By 4 times go of yttrium nitrate and its quality
Ionized water mixes, and yttrium nitrate solution is made.Zeolite powder is crushed, crosses 100 mesh sieves, then mixes, is heated to platinum acid chloride solution
62 DEG C and stir process 0.8h at such a temperature；Epoxy resin E44 is added, is warming up to 78 DEG C, and at such a temperature at stirring
Manage 35min；Then Methyl Hydrogen Polysiloxane Fluid and yttrium nitrate solution are added, first heating stirring 15min, Ran Hou at a temperature of 60 DEG C
10min is stirred at a temperature of 95 DEG C, mixture A is made；In above-mentioned steps, mixing speed 120r/min.Mixture A is heated up
To 125 DEG C and stir process 40min, then 10min is stirred at a temperature of 155 DEG C at such a temperature, mixture B is made；It is above-mentioned
In step, mixing speed 250r/min.Mixture B is produced through melting extrusion, injection molding.
Embodiment 2
In the embodiment of the present invention, a kind of encapsulating material with radiation-screening effect, including following raw material：Methyl Hydrogen Polysiloxane Fluid
19kg, epoxy resin E-51 35kg, zeolite powder 41kg, yttrium nitrate 5kg, chloroplatinic acid 7kg.
14 times of ethanol of chloroplatinic acid and its quality is mixed, platinum acid chloride solution is made；By 5 times go of yttrium nitrate and its quality
Ionized water mixes, and yttrium nitrate solution is made.Zeolite powder is crushed, crosses 150 mesh sieves, then mixes, is heated to platinum acid chloride solution
65 DEG C and stir process 1h at such a temperature；Epoxy resin E44 is added, is warming up to 80 DEG C, and stir process at such a temperature
40min；Then Methyl Hydrogen Polysiloxane Fluid and yttrium nitrate solution are added, first the heating stirring 20min at a temperature of 65 DEG C, then 98
15min is stirred at a temperature of DEG C, mixture A is made；In above-mentioned steps, mixing speed 150r/min.Mixture A is warming up to
130 DEG C and stir process 50min, then 12min is stirred at a temperature of 160 DEG C at such a temperature, mixture B is made；Above-mentioned step
In rapid, mixing speed 280r/min.Mixture B is produced through melting extrusion, injection molding.
Embodiment 3
In the embodiment of the present invention, a kind of encapsulating material with radiation-screening effect, including following raw material：Methyl Hydrogen Polysiloxane Fluid
13kg, epoxy resin E-51 28kg, zeolite powder 35kg, yttrium nitrate 2kg, chloroplatinic acid 4kg.
12-14 times of ethanol of chloroplatinic acid and its quality is mixed, platinum acid chloride solution is made；By yttrium nitrate and its quality 4.5
Deionized water mixing again, is made yttrium nitrate solution.Zeolite powder is crushed, crosses 120 mesh sieves, is then mixed with platinum acid chloride solution,
It is heated to 63 DEG C and at such a temperature stir process 0.9h；Epoxy resin E44 is added, is warming up to 79 DEG C, and at such a temperature
Stir process 38min；Then Methyl Hydrogen Polysiloxane Fluid and yttrium nitrate solution are added, first the heating stirring 20min at a temperature of 62 DEG C,
Then 15min is stirred at a temperature of 96 DEG C, mixture A is made；In above-mentioned steps, mixing speed 150r/min.Will mixing
Thing A is warming up to 128 DEG C and at such a temperature stir process 50min, then stirs 12min at a temperature of 158 DEG C, and mixture is made
B；In above-mentioned steps, mixing speed 280r/min.Mixture B is produced through melting extrusion, injection molding.
Embodiment 4
In the embodiment of the present invention, a kind of encapsulating material with radiation-screening effect, including following raw material：Methyl Hydrogen Polysiloxane Fluid
17kg, epoxy resin E-51 32kg, zeolite powder 39kg, yttrium nitrate 4kg, chloroplatinic acid 6kg.
12-14 times of ethanol of chloroplatinic acid and its quality is mixed, platinum acid chloride solution is made；By yttrium nitrate and its quality 4.5
Deionized water mixing again, is made yttrium nitrate solution.Zeolite powder is crushed, crosses 120 mesh sieves, is then mixed with platinum acid chloride solution,
It is heated to 63 DEG C and at such a temperature stir process 0.9h；Epoxy resin E44 is added, is warming up to 79 DEG C, and at such a temperature
Stir process 38min；Then Methyl Hydrogen Polysiloxane Fluid and yttrium nitrate solution are added, first the heating stirring 20min at a temperature of 62 DEG C,
Then 15min is stirred at a temperature of 96 DEG C, mixture A is made；In above-mentioned steps, mixing speed 150r/min.Will mixing
Thing A is warming up to 128 DEG C and at such a temperature stir process 50min, then stirs 12min at a temperature of 158 DEG C, and mixture is made
B；In above-mentioned steps, mixing speed 280r/min.Mixture B is produced through melting extrusion, injection molding.
Embodiment 5
In the embodiment of the present invention, a kind of encapsulating material with radiation-screening effect, including following raw material：Methyl Hydrogen Polysiloxane Fluid
15kg, epoxy resin E-51 30kg, zeolite powder 37kg, yttrium nitrate 3kg, chloroplatinic acid 5kg.
12-14 times of ethanol of chloroplatinic acid and its quality is mixed, platinum acid chloride solution is made；By yttrium nitrate and its quality 4.5
Deionized water mixing again, is made yttrium nitrate solution.Zeolite powder is crushed, crosses 120 mesh sieves, is then mixed with platinum acid chloride solution,
It is heated to 63 DEG C and at such a temperature stir process 0.9h；Epoxy resin E44 is added, is warming up to 79 DEG C, and at such a temperature
Stir process 38min；Then Methyl Hydrogen Polysiloxane Fluid and yttrium nitrate solution are added, first the heating stirring 20min at a temperature of 62 DEG C,
Then 15min is stirred at a temperature of 96 DEG C, mixture A is made；In above-mentioned steps, mixing speed 150r/min.Will mixing
Thing A is warming up to 128 DEG C and at such a temperature stir process 50min, then stirs 12min at a temperature of 158 DEG C, and mixture is made
B；In above-mentioned steps, mixing speed 280r/min.Mixture B is produced through melting extrusion, injection molding.
Comparative example 1
In addition to chloroplatinic acid is not contained, its material composition is consistent with embodiment 5 with preparation technology.
Comparative example 2
In addition to yttrium nitrate is not contained, its material composition is consistent with embodiment 5 with preparation technology.
Comparative example 3
Each raw material is directly mixed to prepare mixture A, mixture A is warming up to 128 DEG C and at such a temperature stir process
50min, then 12min is stirred at a temperature of 158 DEG C, mixture B is made；In above-mentioned steps, mixing speed 280r/min.Will
Mixture B produces through melting extrusion, injection molding.Its material composition is consistent with embodiment 5.
Using Co-60 radioactive sources as irradiation bomb, the shielding properties of encapsulating material is tested.Test result is as shown in table 1：
Table 1
Radiation shield performance can be significantly improved using encapsulating material made from present invention process.
Also the thermal coefficient of expansion and thermal conductivity of encapsulating material are measured, as a result as shown in table 2.
Table 2
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and do not carrying on the back
In the case of spirit or essential attributes from the present invention, the present invention can be realized in other specific forms.Therefore, no matter from which
From the point of view of a bit, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention will by appended right
Ask rather than described above limits, it is intended that all changes in the implication and scope of the equivalency of claim will be fallen
Include in the present invention.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (10)
1. a kind of encapsulating material with radiation-screening effect, it is characterised in that include according to the raw material of parts by weight：Methyl hydrogen
Silicone oil 11-19 parts, epoxy resin E-51 25-35 parts, zeolite powder 33-41 parts, yttrium nitrate 1-5 parts, chloroplatinic acid 3-7 parts.
2. the encapsulating material according to claim 1 with radiation-screening effect, it is characterised in that according to the original of parts by weight
Material includes：Methyl Hydrogen Polysiloxane Fluid 13-17 parts, epoxy resin E-51 28-32 parts, zeolite powder 35-39 parts, yttrium nitrate 2-4 parts, chlorine
Platinic acid 4-6 parts.
3. the encapsulating material according to claim 1 with radiation-screening effect, it is characterised in that according to the original of parts by weight
Material includes：15 parts of Methyl Hydrogen Polysiloxane Fluid, 30 parts of epoxy resin E-51,37 parts of zeolite powder, 3 parts of yttrium nitrate, 5 parts of chloroplatinic acid.
4. a kind of preparation method of encapsulating material with radiation-screening effect as described in claim 1-3 is any, its feature
It is, comprises the following steps：
1）12-14 times of ethanol of chloroplatinic acid and its quality is mixed, platinum acid chloride solution is made；By 4-5 times of yttrium nitrate and its quality
Deionized water mixing, be made yttrium nitrate solution；
2）Zeolite powder is crushed, crosses 100-150 mesh sieves, is then mixed with platinum acid chloride solution, is heated to 62-65 DEG C and in the temperature
Lower stir process 0.8-1h；Epoxy resin E44 is added, is warming up to 78-80 DEG C, and stir process 35- at such a temperature
40min；Then Methyl Hydrogen Polysiloxane Fluid and yttrium nitrate solution are added, first the heating stirring 15-20min at a temperature of 60-65 DEG C, so
10-15min is stirred at a temperature of 95-98 DEG C afterwards, mixture A is made；
3）Mixture A is warming up to 125-130 DEG C and at such a temperature stir process 40-50min, then in 155-160 DEG C of temperature
The lower stirring 10-12min of degree, is made mixture B；
4）Mixture B is produced through melting extrusion, injection molding.
5. the preparation method of the encapsulating material according to claim 4 with radiation-screening effect, it is characterised in that step
2）In, mixing speed 120-150r/min.
6. the preparation method of the encapsulating material according to claim 4 with radiation-screening effect, it is characterised in that add
Methyl Hydrogen Polysiloxane Fluid and yttrium nitrate solution, the first heating stirring 15-20min at a temperature of 62 DEG C, then at a temperature of 96 DEG C
Stir 10-15min.
7. the preparation method of the encapsulating material according to claim 4 with radiation-screening effect, it is characterised in that step
3）In, mixing speed 250-280r/min.
8. the preparation method of the encapsulating material according to claim 4 with radiation-screening effect, it is characterised in that step
3）In, mixture A is warming up to 128 DEG C and at such a temperature stir process 40-50min, then stirred at a temperature of 158 DEG C
10-12min, mixture B is made.
9. the application of encapsulating material in the electronic device as described in claim 1-3 is any.
10. application of the encapsulating material as described in claim 1-3 is any in radiation shield equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710776996.9A CN107541017A (en) | 2017-09-01 | 2017-09-01 | A kind of encapsulating material with radiation-screening effect and its preparation method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710776996.9A CN107541017A (en) | 2017-09-01 | 2017-09-01 | A kind of encapsulating material with radiation-screening effect and its preparation method and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107541017A true CN107541017A (en) | 2018-01-05 |
Family
ID=60958582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710776996.9A Pending CN107541017A (en) | 2017-09-01 | 2017-09-01 | A kind of encapsulating material with radiation-screening effect and its preparation method and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107541017A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1745118A (en) * | 2003-01-30 | 2006-03-08 | 太阳诱电株式会社 | Electronic material composition, electronic product and method of using electronic material composition |
| CN102229737A (en) * | 2011-06-09 | 2011-11-02 | 孙国林 | Packaging material for high-blockage organic electronic device |
| CN104497356A (en) * | 2014-11-26 | 2015-04-08 | 三星半导体(中国)研究开发有限公司 | Filler, manufacturing method of filler and epoxy molding compound containing filler |
| CN104883412A (en) * | 2014-02-27 | 2015-09-02 | 南通录万电子有限公司 | Radiation resistance handset sleeve |
-
2017
- 2017-09-01 CN CN201710776996.9A patent/CN107541017A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1745118A (en) * | 2003-01-30 | 2006-03-08 | 太阳诱电株式会社 | Electronic material composition, electronic product and method of using electronic material composition |
| CN102229737A (en) * | 2011-06-09 | 2011-11-02 | 孙国林 | Packaging material for high-blockage organic electronic device |
| CN104883412A (en) * | 2014-02-27 | 2015-09-02 | 南通录万电子有限公司 | Radiation resistance handset sleeve |
| CN104497356A (en) * | 2014-11-26 | 2015-04-08 | 三星半导体(中国)研究开发有限公司 | Filler, manufacturing method of filler and epoxy molding compound containing filler |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Dong et al. | Effects of WO3 particle size in WO3/epoxy resin radiation shielding material | |
| CN102020963B (en) | High-temperature-resistant and high thermal conductive adhesive and preparation method thereof | |
| CN102010685B (en) | Epoxy resin conductive adhesive and preparation method thereof | |
| CN106317784B (en) | A kind of polyfunctional epoxy resin base radiation protection composite material and preparation method thereof | |
| CN105482225B (en) | A kind of anti-nuclear radiation rare earth composite material and preparation method thereof | |
| CN103865271B (en) | A kind of preparation method of the modified organosilicon heat conductive electronic pouring sealant of nano-hybrid material | |
| CN106753133A (en) | A kind of conductive silver glue and its production and use | |
| TW202421727A (en) | Method for producing silicon-containing oxide-coated aluminum nitride particles, and silicon-containing oxide-coated aluminum nitride particles | |
| CN112409757A (en) | High-thermal-conductivity epoxy plastic packaging material for high-power module packaging and preparation method thereof | |
| CN104130546A (en) | Preparation method for nuclear radiation shielding material | |
| CN107541017A (en) | A kind of encapsulating material with radiation-screening effect and its preparation method and application | |
| CN103497717B (en) | A kind of LED heat-conductive solid crystal glue binder and preparation method thereof | |
| CN104559880B (en) | A kind of low cost nano-silver conductive glue of crystal oscillator encapsulation and preparation method thereof | |
| CN107312483A (en) | A kind of aqueous epoxy resins type heat conduction adhesive and preparation method thereof | |
| CN107603151A (en) | A kind of encapsulating material and its preparation method and application of radiation-screening, high rigidity | |
| CN108148351B (en) | Radiation protection material | |
| CN107501701B (en) | X-waveband microwave radiation shielding composite material and preparation method thereof | |
| CN112812498A (en) | Preparation method of functionalized carbon nanotube modified resin-based composite radiation protection material | |
| CN103971775A (en) | High temperature resistance neutron shield material and preparation method thereof | |
| CN103087522A (en) | Radioprotection composite material of nanometer lead borate/polyimide and preparation method thereof | |
| CN102534804A (en) | Moisture-proof protection film of SrI2:Eu-doped scintillating crystal and preparation method thereof | |
| CN115058097A (en) | Ray shielding and high-voltage insulating resin composition and preparation method and application thereof | |
| CN109824092A (en) | A kind of preparation method and magnetic aligning Heat Conduction Material of carbon pipe coated magnetic material | |
| CN105506402A (en) | Electronic packaging material | |
| CN105694426A (en) | Polyurethane anti-radiation composite material and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180105 |
|
| WD01 | Invention patent application deemed withdrawn after publication |