CN102220571B - Wet-type coating system - Google Patents

Wet-type coating system Download PDF

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Publication number
CN102220571B
CN102220571B CN201010146840.0A CN201010146840A CN102220571B CN 102220571 B CN102220571 B CN 102220571B CN 201010146840 A CN201010146840 A CN 201010146840A CN 102220571 B CN102220571 B CN 102220571B
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CN
China
Prior art keywords
chamber
coating system
wet film
groove
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010146840.0A
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Chinese (zh)
Other versions
CN102220571A (en
Inventor
裴绍凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201010146840.0A priority Critical patent/CN102220571B/en
Publication of CN102220571A publication Critical patent/CN102220571A/en
Application granted granted Critical
Publication of CN102220571B publication Critical patent/CN102220571B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention relates to a wet-type coating system, which comprises a low-temperature cavity, a heating cavity, an insulating cavity, a transmitting device, a cleaning tank, a coating tank, a hot air blowing tank and a heating tank. The insulating cavity is communicated with the low-temperature cavity and the heating cavity to form a closed vacuum coating cavity. The transmitting device comprises a rail overcrossing the low-temperature cavity, the heating cavity and the insulating cavity and a lifting arm which is arranged on the sliding rail in a sliding manner and is used for holding a substrate. The cleaning tank, the coating tank, the hot air blowing tank and the heating tank are arranged under the sliding rail in turn along a sliding direction from the low-temperature cavity to the heating cavity. The cleaning tank and the coating tank are positioned in the low-temperature cavity; the hot air blowing tank is positioned in the insulating cavity; and the heating tank is positioned in the heating cavity. Thus, the substrate can be cleaned, coated, air dried and annealed in a single and closed environment in turn, so that the substrates are protected from being oxidized in stream assembly in different devices and the yield is increased.

Description

Wet film-coating system
Technical field
The present invention relates to coating technique, relate in particular to a kind of wet film-coating system.
Background technology
Film preparing technology generally can be divided into two kinds of dry type plated film and wet type plated films, wherein, the advantages such as the shape that filming equipment is simple, cheap, sedimentation rate is fast owing to having for wet type plated film, be easy to control coating film thickness, coating temperature is low, be not limited to coating material and material (even can at flexible substrate plated film), are widely used in the film preparation of pottery, polymer and metal base in recent years.Usually, during wet type plated film, base material need circulate in different equipment, clean, the operation such as air-dry, plated film, annealing, in circulation process, substrate or the rete being plated on base material are exposed in air, easily oxidized, cause plated film layer quality not good, yield declines.
Summary of the invention
In view of this, be necessary to provide a kind of wet film-coating system that can promote plated film quality yield.
A wet film-coating system, it comprises a cryogenic chamber, a heated chamber, an isolated chamber, a transmitting device, a rinse bath, a plated film groove, a hot blast spray groove and a heating tank.This isolated chamber is communicated with this cryogenic chamber and heated chamber to form an airtight vacuum plating chamber.This transmitting device comprises a slide rail and a lifting arm.This slide rail is across establishing this cryogenic chamber, isolated chamber and heated chamber.This lifting arm slides and is arranged on this slide rail, for clamping a base material and driving this base material flexible along the direction perpendicular to this slide rail.This rinse bath, plated film groove, hot blast spray groove and heating tank are set in turn under this slide rail from this cryogenic chamber to sliding to of this heated chamber along this slide rail.This rinse bath and plated film groove are positioned at this cryogenic chamber; This hot blast spray groove is positioned at this isolated chamber; This heating tank is positioned at this heated chamber.
Utilize wet film-coating system of the present invention, base material can be under the drive of transmitting device, and (plated film chamber) cleaning successively in single, airtight environment, plated film, air-dry and annealing are avoided stream dress in substrate distinct device and oxidized, have promoted yield.
Accompanying drawing explanation
The structural representation of the wet film-coating system that Fig. 1 provides for better embodiment of the present invention.
Main element nomenclature
Wet film-coating system 100
Plated film chamber 101
Air intake 103
Air outlet 105
Cryogenic chamber 10
Heated chamber 30
Isolated chamber 20
Transmitting device 40
Slide rail 42
Lifting arm 44
CD-ROM drive motor 46
Mover 48
Rinse bath 50
The first leakage mouth 52
Plated film groove 60
The second leakage mouth 62
Hot blast spray groove 70
Hot-air mouth 72
Heating tank 80
The valve 90 of taking
Substrate 200
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present invention is described in further detail.
Refer to Fig. 1, the wet film-coating system 100 of better embodiment of the present invention comprises a cryogenic chamber 10, heated chamber 30, isolated chamber 20, transmitting device 40, rinse bath 50, plated film groove 60, hot blast spray groove 70 and a heating tank 80.Isolated chamber 20 connection cryogenic chamber 10 and heated chamber 30 are to form an airtight vacuum plating chamber 101.Transmitting device 40 comprises a slide rail 42 and a lifting arm 44.Slide rail 42 is across establishing cryogenic chamber 10, isolated chamber 20 and heated chamber 30.Lifting arm 44 slides and is arranged on slide rail 42, for clamping a base material 200 and driving base material 200 flexible along the direction perpendicular to slide rail 42.Rinse bath 50, plated film groove 60, hot blast spray groove 70 and heating tank 80 are set in turn in slide rail 42 times along slide rail 42 from cryogenic chamber 10 to sliding to of heated chamber 30.Rinse bath 50 and plated film groove 60 are positioned at cryogenic chamber 10; Hot blast spray groove 70 is positioned at isolated chamber 20; Heating tank 80 is positioned at heated chamber 30.
So, base material 200 can, under the clamping of lifting arm 44, slide to successively rinse bath 50, plated film groove 60, hot blast spray groove 70 and heating tank 80 in single, airtight plated film chamber 101 along slide rail 42.In sliding process, lifting arm 44 is along shrinking away from the direction of rinse bath 50, plated film groove 60, hot blast spray groove 70 or heating tank 80, and above arriving rinse bath 50, plated film groove 60, hot blast spray groove 70 or heating tank 80 time, stretch into rinse bath 50, plated film groove 60, hot blast spray groove 70 or heating tank 80 so that substrate 200 is cleaned, the technique such as plated film, air-dry and annealing, avoid substrate 200 to circulate in distinct device and oxidized, promoted yield.
Plated film chamber 101 is for single, an airtight vacuum environment is provided, oxidized to prevent substrate 200 or institute's coatings (not shown).Particularly, even can there be the valve 90 of taking in plated film chamber 101, and it closes the vacuum environment that provides airtight in coating process, and opens after plated film completes, and for taking off, has plated the substrate 200 of film and has loaded new substrate to be coated 200.
Particularly, wet film-coating system 100 also includes an air intake 103 and an air outlet 105.Air intake 103 is used to the interior introducing rare gas element in plated film chamber 101, as nitrogen, so that the cleaning of substrate 200, plated film, air-dry and annealing are carried out in inert gas environment, avoids chemical reaction to occur.Air outlet 105 is for discharging used rare gas element, to keep plated film chamber 101 internal gas pressure balances.According to flowing and service performance of gas, in present embodiment, air intake 103 is arranged at cryogenic chamber 10 near rinse bath 50 places, and air outlet 105 is arranged at the top of heated chamber 30.
Be appreciated that isolated chamber 20 is that its length should be depending on demand in order to be communicated with 30 two kinds of different environment of cryogenic chamber 10 and heated chamber.
Transmitting device 40 can include a CD-ROM drive motor 46 and a mover 48.CD-ROM drive motor 46 is for driving mover 48 to slide on slide rail 42, and lifting arm 44 is connected with mover 48, and so, transmitting device 40 can be controlled the slip of lifting arm 44 on slide rail 42 automatically.Certainly, in other embodiment, also can drive by manual mode tool arm 44 to slide on slide rail 42.
In rinse bath 50, there is scavenging solution (not shown), as water, and include a first leakage mouth 52.The first leakage mouth 52 stretches out outside cryogenic chamber 10, for to the untapped scavenging solution of the interior injection of rinse bath 50 and spill used scavenging solution.In present embodiment, rinse bath 50 is a ultrasonic cleaner.
In plated film groove 60, there is coated solution (not shown), and include a second leakage mouth 62.The second leakage mouth 62 stretches out outside cryogenic chamber 10, for to the untapped coated solution of the interior injection of plated film groove 60 and spill used coated solution.
Hot blast spray groove 70 includes a hot-air mouth 72, and hot-air mouth 72 stretches out outside isolated chamber 10 and is connected with a hot air source (not shown), for provide hot blast in hot blast spray groove 50.
Heating tank 80 is for heating so that substrate 200 is carried out to annealing process.Usually, heating tank 80 can be heated to 400-600 ℃ by substrate 200 at short notice, and stops at short notice heating, to allow substrate Slow cooling, annealing.
Preferably, wet film-coating system 100 also comprises that another is arranged at the hot blast spray groove 70 between rinse bath 50 and plated film groove 60, for the complete substrate 200 of air-dry firm cleaning.
Although the present invention discloses as above with better embodiment,, it is not in order to limit the present invention, and in addition, those skilled in the art can also do other variation etc. in spirit of the present invention.Certainly, the variation that these are done according to spirit of the present invention, within all should being included in the present invention's scope required for protection.

Claims (10)

1. a wet film-coating system, is characterized in that comprising a cryogenic chamber, a heated chamber, an isolated chamber, a transmitting device, a rinse bath, a plated film groove, a hot blast spray groove and a heating tank; This isolated chamber is communicated with this cryogenic chamber and heated chamber to form an airtight vacuum plating chamber; This transmitting device comprises a slide rail and a lifting arm; This slide rail is across establishing this cryogenic chamber, isolated chamber and heated chamber; This lifting arm slides and is arranged on this slide rail, for clamping a base material and driving this base material flexible along the direction perpendicular to this slide rail; This rinse bath, plated film groove, hot blast spray groove and heating tank are set in turn under this slide rail from this cryogenic chamber to sliding to of this heated chamber along this slide rail; This rinse bath and plated film groove are positioned at this cryogenic chamber; This hot blast spray groove is positioned at this isolated chamber; This heating tank is positioned at this heated chamber.
2. wet film-coating system as claimed in claim 1, is characterized in that, this wet film-coating system also includes an air intake and an air outlet, and this air intake for introducing rare gas element in this plated film chamber, and this air outlet is used for discharging this rare gas element.
3. wet film-coating system as claimed in claim 2, is characterized in that, this air intake is arranged at this cryogenic chamber near this rinse bath place.
4. wet film-coating system as claimed in claim 2, is characterized in that, this air outlet is arranged at the top of this heated chamber.
5. wet film-coating system as claimed in claim 1, it is characterized in that, this transmitting device also includes a CD-ROM drive motor and a mover, and this CD-ROM drive motor is used for driving this mover to slide on this slide rail, and this lifting arm is connected to drive this lifting arm to slide with this mover.
6. wet film-coating system as claimed in claim 1, is characterized in that, this rinse bath includes a first leakage mouth, and this first leakage mouth stretches out outside this cryogenic chamber, for injecting in this rinse bath and spilling scavenging solution.
7. wet film-coating system as claimed in claim 1, is characterized in that, this rinse bath is a ultrasonic cleaner.
8. wet film-coating system as claimed in claim 1, is characterized in that, this plated film groove includes a second leakage mouth, and this second leakage mouth stretches out outside cryogenic chamber, for injecting in this plated film groove and spilling coated solution.
9. wet film-coating system as claimed in claim 1, is characterized in that, this hot blast spray groove includes a hot-air mouth, and this hot-air mouth stretches out outside this isolated chamber, for provide hot blast in this hot blast spray groove.
10. wet film-coating system as claimed in claim 1, is characterized in that, this wet film-coating system also comprises that another is arranged at the hot blast spray groove between this rinse bath and this plated film groove.
CN201010146840.0A 2010-04-15 2010-04-15 Wet-type coating system Expired - Fee Related CN102220571B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201010146840.0A CN102220571B (en) 2010-04-15 2010-04-15 Wet-type coating system

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Application Number Priority Date Filing Date Title
CN201010146840.0A CN102220571B (en) 2010-04-15 2010-04-15 Wet-type coating system

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CN102220571A CN102220571A (en) 2011-10-19
CN102220571B true CN102220571B (en) 2014-10-15

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103498135B (en) * 2013-09-18 2015-07-01 张家港市沙洲钢绳有限公司 Steel wire hoisting gear in steel wire copper-plating production line
CN105671521B (en) * 2016-01-14 2020-04-28 电子科技大学 High-throughput wet-process chemical combined material chip preparation device and preparation method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85101758A (en) * 1984-03-17 1987-01-31 黑士股份公司 Hot-dip galvanizing finned tubes technology and device
TW567580B (en) * 2000-10-13 2003-12-21 Sony Corp Semiconductor manufacturing device and manufacturing method for semiconductor device
CN1516755A (en) * 2000-03-29 2004-07-28 三洋电机株式会社 Plating apparatus, plasting method and method for mfg. semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050236268A1 (en) * 2004-04-21 2005-10-27 Koji Mishima Substrate processing apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85101758A (en) * 1984-03-17 1987-01-31 黑士股份公司 Hot-dip galvanizing finned tubes technology and device
CN1516755A (en) * 2000-03-29 2004-07-28 三洋电机株式会社 Plating apparatus, plasting method and method for mfg. semiconductor device
TW567580B (en) * 2000-10-13 2003-12-21 Sony Corp Semiconductor manufacturing device and manufacturing method for semiconductor device

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