CN102205671B - Simple paste for measuring surface deformation of material and production method thereof - Google Patents
Simple paste for measuring surface deformation of material and production method thereof Download PDFInfo
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- CN102205671B CN102205671B CN 201110062679 CN201110062679A CN102205671B CN 102205671 B CN102205671 B CN 102205671B CN 201110062679 CN201110062679 CN 201110062679 CN 201110062679 A CN201110062679 A CN 201110062679A CN 102205671 B CN102205671 B CN 102205671B
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Abstract
The embodiment of the invention discloses a simple paste for measuring the surface deformation of a material and a production method thereof. The method comprises the following steps of: providing a substrate; sticking an adhesive tape with a coarse surface onto the substrate; forming a reflecting layer on the adhesive tape, wherein the surface of the reflecting layer and the surface of the adhesive tape have high optical contrast ratios; forming graphs of grids, dot matrixes or grid lines on the adhesive tape by adopting a photoetching process; and separating the adhesive tape from the substrate, thus the simple paste for measuring the surface deformation of the material is obtained. In the embodiment of the invention, the grids, dot matrixes or grid lines with the diameter in micron or millimetre can be obtained by adopting the photoetching process, thus the dimension of a final grid/dot matrix can meet the requirements of a CCD (charge coupled device) camera and an automatic grid method to small-dimension grids/dot matrixes. Meanwhile, the characteristics of an ultraviolet photoetching technology cause the produced grids, dot matrixes or grid lines to be regular and uniform, the production technology is mature and simple, and the production period is short.
Description
Technical field
The present invention relates to material surface distortion measurement technical field in the Experimental Mechanics, relate in particular to a kind of simple and easy subsides of measuring material surface deformation and preparation method thereof.
Background technology
The in-plane displacement of body surface and deformation measurement mainly contain Mechanical Method, electrical measuring method and optical measuring method three classes in the Experimental Mechanics, and wherein, optical measuring method is subjected to extensive use as a kind of whole audience non-contact measurement method.The measuring method that successively occurs in last century mainly contains single beam speckle imaging method, plane moire method, moir, Electronic Speckle Pattern Interferometry, digital speckle correlation technique and automatic mesh method.The automatic mesh method is by prefabricated orthogonal grid or quadrature dot matrix on object, record two trrellis diagram of throwing the net before and after the object deformation, and relatively each mesh point position amount of movement before and after the deformation obtains the whole audience displacement of each mesh point.At present, adopted the computer digital image treatment technology that in-plane displancement and strain etc. is measured automatically in the automatic mesh method, made its computational speed and certainty of measurement obtain improving greatly.
The principle that the automatic mesh method is measured the body surface displacement is, referring to Fig. 1, utilize high-resolution CCD (Charge Coupled Device, charge coupled cell) camera 5, increase load 3 front and back at object under test 2, the grid/dot matrix 1 that presets on the object under test 2 is taken imaging, afterwards by Digital Image Processing and analysis software on the computer 6, the relative displacement that increases the respective grid points in two width of cloth images of load 3 front and back is identified automatically, and then obtained whole audience displacement.
Compare with additive method, automatic mesh method principle is simple, and The Mesh Point Battle is made simple, and easy to use, adaptability is strong, can measure big object deformation and also can measure zonule deformation, and be a kind of non-contacting measuring method.The prerequisite of utilizing the automatic mesh method to measure the body surface displacement is at object under test suitable grid/dot matrix to be set, and to the requirement of grid/dot matrix be: grid/dot matrix diameter and spacing size are advisable with the minimum dimension that does not reduce system accuracy; Computer Image Processing for convenience, grid/dot matrix and background must have high optical contrast, so grid/dot matrix mainly contains two classes, i.e. background stain battle array and black background white point battle array in vain; Grid/dot matrix should be able to be applied on the object of various different sizes, difformity and different materials easily.
The preparation method of grid/dot matrix of the prior art has following several:
1) computer lettering method at first depicts the regular circular dot matrix with the computer carving machine at the adhesive sticker plastic foil, manages circular dot matrix commentaries on classics is attached on the test specimen again;
2) printing grid method processed generates required orthogonal grid figure with computer earlier, is transferred on the self-adhesive plastic film again, during experiment, film is changeed being attached to the test specimen surface again;
3) mask spraying process is made the mask plate with regular circular hole dot matrix, again to being close to mask plate spraying pigment or the paint of object surface;
4) silk screen print method, pour printing ink at screen printing forme one end that is carved with dot matrix, apply certain pressure with scraping the printing ink position of scraper plate on screen printing forme, move towards the screen printing forme other end simultaneously, printing ink is expressed on the object from the mesh of forme by scraper plate in movement.
Grid/the lattice dimensions that adopts above-mentioned fabrication techniques to go out is often bigger, and the very difficult making precision that guarantees, though larger-size grid/dot matrix can improve certainty of measurement, but grid/dot matrix is too big, grid/dot matrix in the visual field of CCD camera will be very little, thereby cause data volume not enough, so the diameter of grid/dot matrix should select not influence the minimum dimension of certainty of measurement.And, development along with the high resolution CCD camera, the size decreases of grid/dot matrix that camera itself can be differentiated, even can differentiate 100 microns of diameters, grid/dot matrix that spacing is 300 microns, and grid/lattice dimensions that the The Mesh Point Battle preparation method that adopts second kind to the 5th kind of prior art obtains is bigger than normal, can not satisfy the demand of high resolution CCD camera.
Based on above reason, it is simple to need a kind of manufacturing process at present badly, easy to use, can be applied to different testing samples, can satisfy high resolution CCD camera and automatic mesh method simultaneously again to the grid/dot matrix preparation method of grid/dot matrix requirement.
Summary of the invention
For solving the problems of the technologies described above, the embodiment of the invention provides a kind of simple and easy subsides of measuring material surface deformation and preparation method thereof, can satisfy high resolution CCD camera and automatic mesh method to grid/dot matrix requirement, and manufacturing process is simple, and is easy to use.
For addressing the above problem, the embodiment of the invention provides following technical scheme:
A kind of preparation method of measuring the simple and easy subsides of material surface deformation comprises:
Substrate is provided;
The coarse adhesive tape of adhesive surface in described substrate;
Form the reflecting layer at described adhesive tape, surface, described reflecting layer has high optical contrast with described tape surface;
Adopt photoetching process, form the figure of grid, dot matrix or grid line at described adhesive tape;
Described adhesive tape is separated with described substrate, complete and measure the simple and easy subsides of material surface deformation.
Preferably, described substrate is the flat glass substrate.
Preferably, the described adhesive tape one side of described substrate dorsad is black, and surface, described reflecting layer is white.
Preferably, described adhesive tape is PVC tape.
Preferably, described reflecting layer is the chromium film.
Preferably, described mode in described adhesive tape formation reflecting layer is to adopt the method for physical vapor deposition or chemical vapor deposition to form the reflecting layer at described adhesive tape.
Preferably, the thickness in described reflecting layer is more than or equal to 50nm.
Preferably, the process that forms the figure of grid, dot matrix or grid line at described adhesive tape is specially:
Form photoresist layer in described reflecting layer, form the figure of grid, dot matrix or grid line at described photoresist layer;
Be mask with the photoresist layer with grid, dot matrix or grid line figure, remove the reflector material that is not covered by photoresist layer, to form the figure of grid, dot matrix or grid line at described adhesive tape.
Preferably, also comprise, form protective layer at the adhesive tape of the figure with grid, dot matrix or grid line, come off with the figure of avoiding described grid, dot matrix or grid line.
The embodiment of the invention also discloses the simple and easy subsides of adopting the measurement material surface deformation that said method produces.
Compared with prior art, technique scheme has the following advantages:
The technical scheme that the embodiment of the invention provides, by adopting photoetching process, can make diameter for micron to grid, dot matrix or the grid line etc. of millimeter magnitude, make the size of final grid/dot matrix can satisfy CCD camera and automatic mesh method to the requirement of small size grid/dot matrix.And, because ultraviolet photolithographic technology self makes that grid, dot matrix or the grid line etc. produced are very regular and even, and manufacturing technology maturation, simple, fabrication cycle is short.
And, owing to be that grid/dot matrix etc. is produced on the shaggy adhesive tape in the present embodiment, and optical contrast's height of reflecting layer and adhesive tape, diffuse reflection will take place in illumination beam to adhesive tape, shine then directly reflection on the reflecting layer, thereby can make grid/dot matrix and background in the image that the CCD camera shoots form strong contrast, be conducive to improve processing speed and the precision of later image.And, the grid/dot matrix of the height reflection adhesive tape with low reflection is used, need not consider the color of testing sample and problem such as reflective whether, therefore be fit to various materials, can be applicable to different testing samples, as long as it is this simple and easy subsides firmly can be adhered to sample surfaces, easy to use.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 measures the principle schematic of body surface displacement for adopting the automatic mesh method;
The schematic flow sheet of the preparation method of the simple and easy subsides of the measurement material surface deformation that Fig. 2 provides for the embodiment of the invention;
The profile of each step of the preparation method of the simple and easy subsides of the measurement material surface deformation that Fig. 3-Fig. 9 provides for the embodiment of the invention;
The schematic flow sheet of the preparation method of the simple and easy subsides of the measurement material surface deformation that Figure 10 provides for another embodiment of the present invention;
Figure 11 is the disclosed simple and easy subsides shape schematic diagram with black background white circular form point battle array of the embodiment of the invention;
Figure 12 is the disclosed simple and easy subsides shape schematic diagram with white background dark circles form point battle array of the embodiment of the invention;
Figure 13 has the simple and easy subsides shape schematic diagram of black background white grid line for the embodiment of the invention is disclosed;
Figure 14 is the disclosed simple and easy subsides shape schematic diagram with white background black grid line of the embodiment of the invention;
Figure 15 is the disclosed simple and easy subsides shape schematic diagram with black background white square dot matrix of the embodiment of the invention;
Figure 16 is the disclosed simple and easy subsides shape schematic diagram with white background black square dot matrix of the embodiment of the invention.
The specific embodiment
Just as stated in the Background Art, grid/dot matrix that method of the prior art is produced is often bigger than normal, can not satisfy the high resolution CCD camera to the development need of small size grid/dot matrix, therefore, in order to satisfy the measurement demand of various sample surfaces, need the preparation method of a kind of new grid/dot matrix of development badly.
At semiconductor applications, the pattern precision that photoetching technique is produced is very high, and the size of figure can do enough little, therefore, the inventor considers, if the manufacturing process with the introducing of the photoetching technique in semiconductor applications grid/dot matrix can solve grid/dot matrix problem bigger than normal of making in the prior art.
Based on above-mentioned thought, the embodiment of the invention provides a kind of simple and easy subsides of measuring material surface deformation and preparation method thereof, and this method may further comprise the steps:
Substrate is provided;
The coarse adhesive tape of adhesive surface in described substrate;
Form the reflecting layer at described adhesive tape, surface, described reflecting layer has high optical contrast with described tape surface;
Adopt photoetching process, form the figure of grid, dot matrix or grid line at described adhesive tape;
Described adhesive tape is separated with described substrate, complete and measure the simple and easy subsides of material surface deformation.
Pass through to adopt photoetching process in the embodiment of the invention, with the graphic making of grid/dot matrix/grid line on shaggy adhesive tape, because photoetching process self, make the size of grid/dot matrix/grid line of producing can satisfy CCD camera and automatic mesh method to the requirement of small size grid/dot matrix.
It more than is the application's core concept, below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
A lot of details have been set forth in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from alternate manner described here and implement, those skilled in the art can do similar popularization under the situation of intension of the present invention, so the present invention is not subjected to the restriction of following public specific embodiment.
Secondly, the present invention is described in detail in conjunction with schematic diagram, when the embodiment of the invention is described in detail in detail; for ease of explanation; the profile of expression device architecture can be disobeyed general ratio and be done local the amplification, and described schematic diagram is example, and it should not limit the scope of protection of the invention at this.The three dimensions size that in actual fabrication, should comprise in addition, length, width and the degree of depth.
Embodiment one
Present embodiment discloses a kind of preparation method of measuring the simple and easy subsides of material surface deformation, the flow chart of this method as shown in Figure 2, the profile of this each step of method such as Fig. 3-shown in Figure 9 may further comprise the steps:
Step S101: substrate 11 is provided;
Referring to Fig. 3, the main effect of described substrate 11 is to make the tape surface of follow-up stickup smooth, be convenient to make grid/dot matrix etc. at described tape surface, therefore, this substrate 11 is as long as guarantee to be planar substrates, the substrate of preferred employing flat glass certainly, also can be adopted other planar substrates in the present embodiment.
Step S102: the coarse adhesive tape 12 of adhesive surface in described substrate 11, as shown in Figure 3;
The material that can have adhesive sticker and so on described adhesive tape 12 and the one side that substrate 11 contacts, so that with after adhesive tape 12 tilings, be pasted together with substrate 11, and the another side rough surface of adhesive tape 12, make it be subjected to after the light beam irradiates diffuse reflection taking place, the adhesive tape 12 in the present embodiment is preferably PVC tape.
Step S103: form reflecting layer 13 at described adhesive tape 12,13 surfaces, described reflecting layer have high optical contrast with described adhesive tape 12 surfaces, as shown in Figure 4;
Wherein, because the grid/lattice dimensions that finally completes is very little, therefore, differentiate easily for the grid/dot matrix that makes formation, the thickness in described reflecting layer 13 is more than or equal to 50nm.
Preferably, adhesive tape 12 in the present embodiment one side of described substrate dorsad is black, and 13 surfaces, described reflecting layer are white, thereby makes grid/dot matrix of producing etc. or be white background stain battle array, be black background white point battle array, to satisfy the needs of Computer Image Processing.And, because the tape surface that adopts is coarse, when therefore taking pictures, diffuse reflection takes place in light beam irradiates to adhesive tape, and the reflecting layer part has highly reflective, and dot matrix and background form strong contrast in the image that the CCD camera shoots thereby make, and are conducive to improve later image processing speed and precision.
Concrete, select white metal in the present embodiment, especially powder be the metal of white as the material of making the reflecting layer, the preferred crome metal making reflecting layer of adopting in the present embodiment.Can adopt the mode of CVD (chemical vapor deposition), PECVD (chemical vapor deposition that plasma strengthens), HDP (high-density plasma chemical vapor deposition) or PVD (physical vapor deposition) to form the chromium film in the present embodiment, the preferred mode that adopts the sputter among the PVD in the present embodiment specifically can adopt ion beam sputtering, magnetron sputtering or adopt the mode of electroplate liquid electroplating deposition to form the chromium film.
Step S104: adopt photoetching process, form the figure of grid, dot matrix or grid line at described adhesive tape, as Fig. 5-shown in Figure 8;
Concrete, as shown in Figure 5, elder generation's spin coating photoresist layer 14 on reflecting layer 13, the thickness of this photoresist layer is about 6 μ m-10 μ m in order to guarantee exposure accuracy, also can between photoresist layer 14 and reflecting layer 13, form the anti-reflecting layer (not shown), to reduce unnecessary reflection, to have grid afterwards, the mask version of dot matrix or grid line figure is covered on the photoresist layer 14 exposes, develop, lithography steps such as oven dry, form grid on described photoresist layer 14 surfaces, the pattern of dot matrix or grid line, afterwards, as shown in Figure 6, remove grid, the photoresist layer of dot matrix or grid line area of the pattern, form grid at photoresist layer 14, the figure opening of dot matrix or grid line, afterwards as shown in Figure 7, to have grid, the photoresist layer of dot matrix or grid line figure opening is mask, adopts the reflector material (being crome metal) of the method removal corresponding site of wet etching, and then forms grid at adhesive tape, the figure of dot matrix or grid line.
Adopt the mode that the chromium film is soaked in the liquid that dechromises to form the figure of grid, dot matrix or grid line at adhesive tape in the present embodiment, adopt the corrosion that dechromises to fall not by the chromium film of photoresist layer overlay area, keep the chromium film that is covered by photoresist layer.The composition of liquid of dechromising in the present embodiment is, accounts for the perchloric acid of volume ratio 4%-8%, accounts for the ammonium ceric nitrate of volume ratio 7%-11%, and all the other are water, and preferred, by volume, perchloric acid: ammonium ceric nitrate: water=6: 9: 85, the time of dechromising is 1-2 minute.
Adopt methods such as wet-chemical cleaning afterwards, remove photoresist layer 14, the preferred acetone soln that adopts is removed photoresist layer in the present embodiment, and then formation black background (shaggy PVC tape, low reflectivity) silvery white grid/dot matrix (chromium dot matrix or grid, or silvery white background black grid/dot matrix etc. highly reflective).
Need to prove, the above grid/dot matrix etc. is just represented the general designation of the figure that the automatic mesh method adopts when measuring the body surface displacement, be not only expression grid or dot pattern, also can form arbitrary graphics such as grid line at adhesive tape, concrete which kind of figure that forms, the situation that depends on the object under test surface, the body surface displacement of adopting which kind of graphical measurement to go out is more accurate, will form which kind of figure.
In addition, the color of the grid/dot matrix of formation etc. depend on the type of the photoresist of employing can be positive photoresist, also can be negative photoresist, and concrete the selection decided by figure and the object under test surface condition of mask plate.
Step S105: described adhesive tape is separated with described substrate, complete and measure the simple and easy subsides of material surface deformation.
After finishing the making of grid/dot matrix, directly PVC tape is taken off from the flat glass substrate and got final product, can use 502 seccotines such as grade should simple and easy subsides to paste on the article to be measured afterwards gets final product, need to guarantee that simple and easy subsides and article surface to be measured stickup are fastening, in order to avoid in measuring process, break away from owing to article surface generation deformation makes simple and easy subsides and article surface.
Embodiment of the invention disclosed method, by adopting ultraviolet photolithographic technology, can make diameter for micron to grid, dot matrix or the grid line etc. of millimeter magnitude, make the size of final grid/dot matrix can satisfy CCD camera and automatic mesh method to the requirement of small size grid/dot matrix.And, because ultraviolet photolithographic technology self makes that grid, dot matrix or the grid line etc. produced are very regular and even, and manufacturing technology maturation, simple, fabrication cycle is short.
And, owing to be that grid/dot matrix etc. is produced on the shaggy adhesive tape in the present embodiment, and adopt argenteous chromium film as the reflecting layer, optical contrast's height with the adhesive tape of black, diffuse reflection will take place in illumination beam to adhesive tape, shine on the reflecting layer then directly reflection, thereby can make grid/dot matrix and background in the image that the CCD camera shoots form strong contrast, be conducive to improve processing speed and the precision of later image.
And, the grid/dot matrix of the height reflection adhesive tape with low reflection is used, need not consider the color of testing sample and problem such as reflective whether, therefore be fit to various materials, can be applicable to different testing samples, as long as it is this simple and easy subsides firmly can be adhered to sample surfaces, easy to use.
Embodiment two
The preparation method flow chart of the simple and easy subsides of the disclosed measurement material surface of present embodiment deformation as shown in figure 10; the profile of each step such as Fig. 3-shown in Figure 9; what present embodiment was different with a last embodiment is; increased step S205 on the basis of a last embodiment: after removing photoresist; adhesive tape at the figure with grid, dot matrix or grid line forms protective layer 15; come off with the figure of avoiding described grid, dot matrix or grid line, as shown in Figure 9.
Concrete, can adopt the mode at the PVC tape spraying colored varnish with chromium dot matrix, chromium grid/dot matrix is fixed on the PVC tape, avoiding in use, chromium grid/dot matrix comes off under the external force friction, and the thickness of the colored varnish is about 10nm, thickness is wanted evenly, in order to avoid influence measurement result.
Manufacturing process with several different simple and easy subsides is example below, and method of the present invention is described.
1) as manufacturing process profile such as Fig. 3-shown in Figure 9 may further comprise the steps of Figure 11 and simple and easy subsides with circular quadrature dot matrix shown in Figure 12:
Step 1: select black and shaggy PVC tape, with PVC tape 12 tiling of appropriate length and stick on the planar substrates 11 (as glass), as shown in Figure 3, adopt the ion beam sputtering deposition machine to adopt the mode of sputter coating to plate the chromium film 13 of thickness 100nm at adhesive tape afterwards, as shown in Figure 4;
Certainly, in order to increase the reflectivity of the chromium grid/dot matrix that finally obtains, to reach the contrast that increases dot matrix and background, make the photo of shooting more clear, Computer Processing result is more accurate, can increase the thickness of chromium film, plates the chromium film of thickness 200nm as sputter.
Step 2: adopt rotation gluing method spin coating thickness on the chromium film to be about 10 microns photoresist 14, see Fig. 5, because of the PVC tape rough surface, photoresist thickness needs at least more than 5 microns, uses a series of lithography steps such as mask version exposure on the ultraviolet photolithographic machine with quadrature dot pattern, development, oven dry to obtain orthogonal grid/dot matrix relief pattern at photoresist, guarantees to expose between points chromium, see Fig. 6, wherein, 200 microns of diameters are arranged, the dot matrix that spacing is 400 microns on the mask version;
Step 3: after photoresist forms grid/dot pattern, it is soaked in the solution that dechromises, remove the chromium that is not covered by photoresist, soak time is about 2 minutes, obtains the figure of chromium grid/dot matrix of being covered by photoresist layer, sees Fig. 7, wherein, the solution that dechromises comprises by volume: 6% perchloric acid, 9% ammonium ceric nitrate, 85% water;
Step 4: adopt the method for soaking acetone soln, to remove the photoresist layer on the chromium dot matrix, see Fig. 8, about 20 seconds of soak time;
Step 5: at the delustring lacquer of chromium dot matrix spraying layer of transparent; as protective layer; wait for about 2 minutes; after the delustring lacquer solidifies; directly PVC tape is taken off from substrate of glass; acquisition has the simple and easy subsides of grid/dot matrix; as Fig. 9, Figure 11 and shown in Figure 12; Figure 11 makes the simple and easy subsides shape schematic diagram of the black background that obtains, silvery white dot matrix (i.e. black grid white point battle array) for adopting positive photoresist, and Figure 12 makes the silvery white background that obtains, the simple and easy subsides shape schematic diagram of black dot matrix (being white grid stain battle array) for adopting negative photoresist.
During use, at the back side of simple and easy subsides, the one side that does not namely have grid/dot matrix is coated 502 seccotines such as grade, develops the whole fastening testing sample surface that pastes and gets final product simple and easy afterwards.
2) make as the process of Figure 13 and simple and easy subsides with grating lines shown in Figure 14 still shown in Figure 9 as 3-, the process of the circular grid/dot matrix of this manufacturing process and above-mentioned making quadrature is similar, uniquely different be, the mask version that adopts is one-dimensional grating mask version, grating lines on this mask version (part is in the light) width is 200 microns, the spacing of per two grating lines is 400 microns, the shape schematic diagram of the simple and easy subsides of finally producing such as Figure 13 and shown in Figure 14, Figure 13 makes the black background (PVC tape) that obtains for adopting positive photoresist, the simple and easy subsides shape schematic diagram of silvery white grating lines (chromium lines), Figure 14 makes the silvery white background (chromium film) that obtains for adopting negative photoresist, the simple and easy subsides shape schematic diagram of black light grid line bar (PVC tape).
3) make as the process of Figure 15 and simple and easy subsides with square net/dot matrix shown in Figure 16 still shown in Figure 9 as 3-, the process of the circular orthogonal grid/dot matrix of this manufacturing process and above-mentioned making is similar, uniquely different be, the mask version that adopts is square dot matrix mask version, square dot matrix width on this mask version is 200 microns, spacing is 400 microns, the shape schematic diagram of the simple and easy subsides of finally producing such as Figure 15 and shown in Figure 16, Figure 15 makes the black background that obtains for adopting positive photoresist, the simple and easy subsides shape schematic diagram of silvery white square chromium dot matrix, Figure 16 makes the silvery white background that obtains for adopting negative photoresist, the simple and easy subsides shape schematic diagram of black square dot matrix.
Need to prove, below only be that to be example describe the simple and easy subsides manufacturing process of the embodiment of the invention for simple and easy subsides with circular orthogonal grid/dot matrix, square orthogonal grid/dot matrix and grid line, concrete which kind of pattern that adopts, the grid/dot matrix of which kind of dimensional requirement should be as the criterion with the concrete condition on testing sample surface.
Embodiment three
Corresponding with above method embodiment, present embodiment discloses the simple and easy subsides of the measurement material surface deformation that a kind of method that adopts above-mentioned 2 embodiment produces, and these simple and easy subsides comprise:
Shaggy adhesive tape is preferably the surface and is the PVC tape of black;
Be arranged at the figure of grid, dot matrix or grid line on the described adhesive tape, the patterned surface of described grid, dot matrix or grid line and described tape surface have high optical contrast, and the making of described grid, dot matrix or grid line figures is adopted and is preferably crome metal.
In addition, these simple and easy subsides also comprise, are covered in the protective layer on the figure of described grid, dot matrix or grid line, are preferably the colored varnish, come off under the external force friction to prevent grid, dot matrix or grid line figures.
The simple and easy subsides of being formed by PVC tape and chromium dot matrix in the present embodiment, grid/lattice dimensions on it is enough little, can satisfy the shooting demand of CCD camera, and be applicable to various material surfaces, especially suitable measuring object is a certain parts on some equipment of being inconvenient to dismantle, and some special surface (being hole, seam as measuring object, in the time of around the rib etc.).At this moment, can adopt large-area PVC tape to make the simple and easy subsides of large-sized dot matrix, to satisfy the measurement of large scale sample, also can adopt the simple and easy subsides of polylith small size simultaneously.Before measuring, can be beforehand with the simple and easy subsides of multiple different size, different size as deposit, select suitable simple and easy subsides according to actual conditions during use, and it is adhered on the sample and can measure, timely, convenient, fast.
Various piece adopts the mode of going forward one by one to describe in this specification, and what each part stressed is and the difference of other parts that identical similar part is mutually referring to getting final product between the various piece.To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.
Multiple modification to these embodiment will be apparent concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments herein.Therefore, the present invention will can not be restricted to embodiment illustrated herein, but will meet the wideest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. a preparation method of measuring the simple and easy subsides of material surface deformation is characterized in that, comprising:
Substrate is provided;
The coarse adhesive tape of adhesive surface in described substrate;
Form the reflecting layer at described adhesive tape, surface, described reflecting layer has high optical contrast with described tape surface;
Adopt photoetching process, form the figure of grid, dot matrix or grid line at described adhesive tape;
Described adhesive tape is separated with described substrate, complete and measure the simple and easy subsides of material surface deformation;
Wherein, the described adhesive tape one side of described substrate dorsad is black, and surface, described reflecting layer is white;
Described reflecting layer is the chromium film;
The process that forms the figure of grid, dot matrix or grid line at described adhesive tape is specially:
Form photoresist layer in described reflecting layer, form the figure of grid, dot matrix or grid line at described photoresist layer;
Be mask with the photoresist layer with grid, dot matrix or grid line figure, remove the reflector material that is not covered by photoresist layer, to form the figure of grid, dot matrix or grid line at described adhesive tape.
2. method according to claim 1 is characterized in that, described substrate is the flat glass substrate.
3. method according to claim 2 is characterized in that, described adhesive tape is PVC tape.
4. method according to claim 1 is characterized in that, described mode in described adhesive tape formation reflecting layer is to adopt the method for physical vapor deposition or chemical vapor deposition to form the reflecting layer at described adhesive tape.
5. method according to claim 4 is characterized in that, the thickness in described reflecting layer is more than or equal to 50nm.
6. method according to claim 1 is characterized in that, also comprises, forms protective layer at the adhesive tape of the figure with grid, dot matrix or grid line, comes off with the figure of avoiding described grid, dot matrix or grid line.
7. adopt the simple and easy subsides of the measurement material surface deformation that each described method of claim 1-6 produces.
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| CN104807416B (en) * | 2015-05-08 | 2017-09-01 | 南开大学 | A kind of micro structure array optical strain Sensor Design and its manufacture method |
| CN105157579B (en) * | 2015-07-27 | 2017-09-01 | 南开大学 | A kind of manufacture method of micro structure array optical displacement sensor and its method for detecting micro-displacement |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107923828A (en) * | 2015-08-24 | 2018-04-17 | 航天喷气发动机洛克达因股份有限公司 | The technique for carrying out nondestructive testing using direct strain imaging |
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