CN102192812A - 传感器模块、用于制造传感器模块的方法 - Google Patents

传感器模块、用于制造传感器模块的方法 Download PDF

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Publication number
CN102192812A
CN102192812A CN2011100366029A CN201110036602A CN102192812A CN 102192812 A CN102192812 A CN 102192812A CN 2011100366029 A CN2011100366029 A CN 2011100366029A CN 201110036602 A CN201110036602 A CN 201110036602A CN 102192812 A CN102192812 A CN 102192812A
Authority
CN
China
Prior art keywords
blank
ribbon conductor
housing
sensor assembly
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011100366029A
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English (en)
Chinese (zh)
Inventor
H·朔尔岑
C·格梅林
R·赫尔曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of CN102192812A publication Critical patent/CN102192812A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
CN2011100366029A 2010-02-01 2011-01-31 传感器模块、用于制造传感器模块的方法 Pending CN102192812A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010001418.4 2010-02-01
DE201010001418 DE102010001418A1 (de) 2010-02-01 2010-02-01 Sensormodul, Verfahren zur Herstellung eines Sensormoduls

Publications (1)

Publication Number Publication Date
CN102192812A true CN102192812A (zh) 2011-09-21

Family

ID=44315844

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011100366029A Pending CN102192812A (zh) 2010-02-01 2011-01-31 传感器模块、用于制造传感器模块的方法

Country Status (2)

Country Link
CN (1) CN102192812A (de)
DE (1) DE102010001418A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106030270A (zh) * 2014-02-17 2016-10-12 罗伯特·博世有限公司 用于压力传感器的联接装置、压力传感器以及制造联接装置的方法
CN107112706A (zh) * 2015-01-08 2017-08-29 雷蒙德·休伯 具有接触销的电的功能部件和用于制造电的功能部件的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4850227A (en) * 1987-12-22 1989-07-25 Delco Electronics Corporation Pressure sensor and method of fabrication thereof
US5900554A (en) * 1995-07-28 1999-05-04 Nippendenso Co., Ltd. Pressure sensor
US20070193359A1 (en) * 2006-02-20 2007-08-23 Mitsubishi Electric Corp. Semiconductor pressure sensor and die for molding the one
US20080034877A1 (en) * 2004-03-12 2008-02-14 Thomas Fessele Sensor Module
DE102008005153A1 (de) * 2008-01-18 2009-07-23 Robert Bosch Gmbh Druckmessmodul

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3452835B2 (ja) 1999-05-28 2003-10-06 三菱電機株式会社 圧力センサ装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4850227A (en) * 1987-12-22 1989-07-25 Delco Electronics Corporation Pressure sensor and method of fabrication thereof
US5900554A (en) * 1995-07-28 1999-05-04 Nippendenso Co., Ltd. Pressure sensor
US20080034877A1 (en) * 2004-03-12 2008-02-14 Thomas Fessele Sensor Module
US20070193359A1 (en) * 2006-02-20 2007-08-23 Mitsubishi Electric Corp. Semiconductor pressure sensor and die for molding the one
DE102008005153A1 (de) * 2008-01-18 2009-07-23 Robert Bosch Gmbh Druckmessmodul

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106030270A (zh) * 2014-02-17 2016-10-12 罗伯特·博世有限公司 用于压力传感器的联接装置、压力传感器以及制造联接装置的方法
CN106030270B (zh) * 2014-02-17 2019-02-15 罗伯特·博世有限公司 用于压力传感器的联接装置、压力传感器以及制造联接装置的方法
CN107112706A (zh) * 2015-01-08 2017-08-29 雷蒙德·休伯 具有接触销的电的功能部件和用于制造电的功能部件的方法
US10700445B2 (en) 2015-01-08 2020-06-30 Raimund Huber Electrical functional component having a contact pin and method for producing an electrical functional component

Also Published As

Publication number Publication date
DE102010001418A1 (de) 2011-08-04

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Application publication date: 20110921