CN102190421A - Mold for forming optical component, optical component thereof and manufacturing method of the optical component - Google Patents
Mold for forming optical component, optical component thereof and manufacturing method of the optical component Download PDFInfo
- Publication number
- CN102190421A CN102190421A CN201010621562XA CN201010621562A CN102190421A CN 102190421 A CN102190421 A CN 102190421A CN 201010621562X A CN201010621562X A CN 201010621562XA CN 201010621562 A CN201010621562 A CN 201010621562A CN 102190421 A CN102190421 A CN 102190421A
- Authority
- CN
- China
- Prior art keywords
- optical element
- die
- upper layer
- element molding
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/06—Construction of plunger or mould
- C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
- C03B11/084—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
- C03B11/086—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Glass Compositions (AREA)
Abstract
The present invention provides a mold for forming an optical component, an optical component and a manufacturing method of the optical component. The mold for forming the optical component is characterized in that: the mold is provided with a substrate and a surface layer; the surface layer contains Si-containing diamond-shaped carbon; the ratio (Si/C) between the content of Si in the surface layer and C is 0.01-0.05; and the thickness of the surface layer is above 2 nm and below 50 nm.
Description
Technical field
The present invention relates to die for optical element molding and used the manufacture method of optical element of this die for optical element molding and the optical element that obtains by this manufacture method.
Background technology
With regard to regard to the manufacture method of the optical glass lens of optical element, known have a direct punching formation.Described direct punching formation, be on the die for optical element molding that is processed into required face quality and surface accuracy, block as the glass of optical element material is heated, perhaps the block through the glass of preheating is carried out drawing, make the method for optical glass lens.
In the die for optical element molding that in above-mentioned direct impact molding, uses, make slight crack (cracking) does not take place on the optical element, from viewpoints such as weather resistance, release properties, also requirement and optical element material is reactive low, the surface of die for optical element molding and the release property of optical element material are good, the adaptation excellence of the base material of die for optical element molding and upper layer, the frictional coefficient of the stamping surface of die for optical element molding is little, can produce optical element etc. at short notice.
Up to now, in the drawing of optical glass device, proposed diamond film or diamond-like carbon film to be formed on the press forming die assembly of the optical glass device that constitutes on the mother metal by use, can be the technology (for example, with reference to the special fair 02-047411 communique of Japan) that glass lens carries out good drawing to plumbous oxide.
In addition, proposed when drawing, by using in the part of joining with glass across the be covered molding die of hydrogenated amorphous carbon film of diamond film, can compare the technology (for example, with reference to Japanese kokai publication hei 02-080330 communique) of the reaction of further inhibited oxidation lead with the special fair 02-047411 communique of above-mentioned Japan.
In addition, also proposed by using more and at face side (stripping surface side) die for optical element molding that graphite is few at die for optical element molding parent material interface kerbstone China ink, thereby take into account the technology (for example, with reference to Japanese kokai publication hei 08-301625 communique) of release property and weather resistance.
In addition, proposed by using less and the die for optical element molding that increases from interface to surface (stripping surface) graphite with mother metal at parent material interface kerbstone China ink, take into account the technology (for example, with reference to Japanese kokai publication hei 09-12320 communique) of release property and weather resistance.
In addition, proposed by on mother metal, forming the diamond-like-carbon mold release film, the technology (for example, with reference to Proc.of the XX ICG in Kyoto (2004) " GLASS PREFORM DEFORMATION AND CRACK FORMATION MECHANISM IN MOLDING PROCESS " T.Igari et al.HOYA Corporation) that can significantly suppress the generation of slight crack (cracking).
In addition, proposed to contain Si-C (a-C:H:Si) film of amorphous hydrogen by lining on the forming face of mother metal, thereby continuous molding that can withstand prolonged and also can fully guarantee the die for optical element molding (for example, with reference to Japanese kokai publication hei 09-194216 communique) of the performance of molding.In this scheme, put down in writing and the content of Si in the a-C:H:Si film need be set at 10mol%～23mol%, the thickness of a-C:H:Si film is made as the content of 50nm～150nm.This can be to think, gives flexibility (resiliency) and oilness by contain Si in above-mentioned film.
On the other hand, in order to improve the adaptation between mother metal and the a-C:H:Si film, the thin thickness of preferred film.But, under the situation of the film that needs shock absorption, lubrication,, therefore there is the thickness attenuation that can not make film if the thickness attenuation of film then becomes and reduced its effect, can't obtain the problem of sufficient adaptation.
In addition, in the die for optical element molding of these prior aries, use the material contain hyperergy (TiO for example as optical element material
2, Nb
2O
5, WO
3, Bi
2O
3Deng) glass the time, the problem of welding takes place when exist being shaped, or during the lens that are shaped thin, produces the problem of slight crack (cracking) etc., weather resistance, release property meeting are insufficient.In addition, not only had base material and the adaptation of upper layer but also the good mould of sufficient weather resistance, release property and die for optical element molding, also do not obtained at present.
Therefore, present situation presses for the also excellent die for optical element molding of adaptation of the base material of developing a kind of weather resistance and release property excellence and die for optical element molding and upper layer.
Summary of the invention
Problem of the present invention is to solve above-mentioned all problems in the past, realizes following purpose.Promptly, the object of the present invention is to provide a kind of die for optical element molding, itself and optical element material reactive low, can reduce the frictional coefficient of the upper layer of optical element material and die for optical element molding, the adaptation excellence of the base material of die for optical element molding and upper layer, and release property and excellent in te pins of durability.The present invention also provides the manufacture method of the optical element that has used this die for optical element molding and the optical element that obtains by this manufacture method.
In order to solve above-mentioned problem, the inventor etc. further investigate, and the result obtains following new opinion.Promptly, by making upper layer contain the diamond-like-carbon of Si, the content of the Si of above-mentioned upper layer is in the ratio (Si/C) of Si with C, be 0.01～0.05, the thickness of above-mentioned upper layer is more than the 2nm and less than 50nm, can make reactivity reduction with optical element material, the frictional coefficient of the upper layer of optical element material and die for optical element molding can be reduced, base material and the adaptation excellence of upper layer and the die for optical element molding of release property and excellent in te pins of durability of die for optical element molding can be obtained.
Can think, this be because, by reducing the thickness of upper layer, can improve the adaptation of base material and upper layer, and then Si suppresses the oxidation of C, prevent that C from because of the oxidation disappearance of gasifying, can improve release property and weather resistance thus.
As the method that is used to solve above-mentioned problem, as described below.That is,
＜1〉a kind of die for optical element molding,, it is characterized in that,
Have base material and upper layer,
Above-mentioned upper layer contains the diamond-like-carbon of Si,
The content of Si is 0.01～0.05 in the ratio (Si/C) of Si with C in the above-mentioned upper layer,
The thickness of above-mentioned upper layer is more than the 2nm and less than 50nm.
According to above-mentioned＜1〉described die for optical element molding, wherein, the frictional coefficient of upper layer is 0.01～0.08.
＜3〉a kind of manufacture method of optical element is characterized in that, uses above-mentioned＜1 〉～＜2 in each described die for optical element molding, optical element material is shaped.
In the manufacture method of above-mentioned optical element, owing to use reactive low die for optical element molding with optical element material, thereby can suppress optical element material to the die for optical element molding welding, in addition, can suppress to the optical element transfer printing that obtains, therefore can suppress the bad of optical element.
＜4〉according to above-mentioned＜3〉manufacture method of described optical element, wherein, optical element material contains at least a among Ti, W, Nb and the Bi.
＜5〉a kind of optical element is characterized in that, by above-mentioned＜3 〉～＜4 in the manufacture method of each described optical element make.
According to the present invention, can solve all problems in the past, can provide and reactive low, the frictional coefficient that can reduce the upper layer of optical element material and die for optical element molding of optical element material, the base material that can obtain die for optical element molding and the adaptation excellence of upper layer and the die for optical element molding of release property and excellent in te pins of durability, the manufacture method of the optical element that has used this die for optical element molding and the optical element that utilizes this manufacture method to obtain can also be provided.
Description of drawings
Fig. 1 is the synoptic diagram of plasma CVD.
Fig. 2 is the coordinate diagram that the frictional coefficient to the upper layer of die for optical element molding 1～10 compares.
Fig. 3 is the explanatory view before the drawing.
Explanatory view when Fig. 4 is drawing.
Fig. 5 is the MIcrosope image on the surface of the die for optical element molding 1 after 100 times of embodiment 2-1 are shaped.
Fig. 6 is the MIcrosope image on the surface of the die for optical element molding 2 after 100 times of embodiment 2-2 are shaped.
Fig. 7 is the MIcrosope image on the surface of the die for optical element molding 5 after 100 times of embodiment 2-3 are shaped.
Fig. 8 is the MIcrosope image on the surface of the die for optical element molding 1 after 100 times of embodiment 2-4 are shaped.
Fig. 9 is the MIcrosope image on the surface of the die for optical element molding 3 after 100 times of embodiment 2-5 are shaped.
Figure 10 is the MIcrosope image on the surface of the die for optical element molding 3 after 100 times of embodiment 2-6 are shaped.
Figure 11 is the MIcrosope image on the surface of the die for optical element molding 3 after 100 times of embodiment 2-7 are shaped.
Figure 12 is the MIcrosope image on the surface of the die for optical element molding 4 after 100 times of embodiment 2-8 are shaped.
Figure 13 is the MIcrosope image on the surface of the die for optical element molding 6 after 100 times of embodiment 2-9 are shaped.
Figure 14 is the MIcrosope image on the surface of the die for optical element molding 7 after 100 times of embodiment 2-10 are shaped.
Figure 15 is the MIcrosope image on the surface of the die for optical element molding 8 after 100 times of embodiment 2-11 are shaped.
Figure 16 is the MIcrosope image on the surface of the die for optical element molding 9 after 100 times of comparative example 2-1 are shaped.
Figure 17 is the MIcrosope image on the surface of the die for optical element molding 9 after 100 times of comparative example 2-2 are shaped.
Figure 18 is the MIcrosope image on the surface of the die for optical element molding 9 after 100 times of comparative example 2-3 are shaped.
Figure 19 is the MIcrosope image on the surface of the die for optical element molding 10 after 100 times of comparative example 2-4 are shaped.
Embodiment
(die for optical element molding)
Die for optical element molding of the present invention has base material and upper layer at least, also contains other formations as required and forms.
＜base material 〉
Material, shape, size as above-mentioned base material are not particularly limited, and can select aptly according to purpose.
As the material of above-mentioned base material, for example can enumerate superhard alloy (wolfram varbide (WC), tungsten-cobalt carbide (WC-Co) alloy etc.), silicon carbide (SiC), the silicon nitride of nitrogen boron, sintering metal, zirconium white (ZrO
2), silicon nitride (Si
3N
4), titanium carbide (TiC), the mixing material of metal, 13Cr martensitic steel, silicon (Si), titanium oxide (TiO
2), stainless steel etc.
Wherein, from the viewpoint of adaptation and excellent in workability, superhard alloy, silicon carbide are favourable.
As shape, the size of above-mentioned base material, can suitably select according to shape, the size of objective optics element.
Above-mentioned substrate surface preferably before forming upper layer described later, carries out pre-treatments such as mirror ultrafinish, washing.
Method as pre-treatments such as above-mentioned mirror ultrafinish, washings is not particularly limited, and can suitably select known method.
In addition, also can above-mentioned base material be cleaned further by contrary sputter, ion exposure etc.
＜upper layer 〉
Above-mentioned upper layer contains the diamond-like-carbon of Si.
-diamond-like-carbon-
Above-mentioned diamond-like-carbon (Diamond-Like Carbon; Below be sometimes referred to as " DLC ".), be meant material with diamond-like structure and graphite-like structure.
As above-mentioned diamond-like-carbon, be not particularly limited, can suitably select according to purpose, for example can enumerate hydrogenated amorphous carbon, i-carbon, hard carbon etc.
As the analytical procedure of identifying above-mentioned diamond-like-carbon, for example can enumerate raman spectroscopy.
The content of-Si-
As the content of Si in the above-mentioned upper layer, in the ratio (Si/C) of Si,, just be not particularly limited as long as be 0.01～0.05 with C, can suitably select according to purpose, preferred 0.01～0.047, more preferably 0.01～0.045, preferred especially 0.01～0.04.The content of Si in the above-mentioned upper layer, in the ratio (Si/C) of Si with C, if less than 0.01, the DeGrain of the low reactivity that presents based on adding Si, low frictionization then, if greater than 0.05, then be used for the film regenerated and significantly worsen based on the stripping process productivity of oxygen ashing.On the other hand, if the content of Si is in above-mentioned particularly preferred scope in the above-mentioned upper layer, having the effect of the low frictionization of low reactivity, is being favourable aspect the inhibition surface oxidation also.
The content of Si and C can be tried to achieve by for example XPS (the sub-spectrography of X-ray Photoelectron Spectroscopy:X ray photoelectric) analysis, Auger (Auger) electronic spectrum in the above-mentioned upper layer.
-thickness-
As the thickness of above-mentioned upper layer, as long as above and less than 50nm, just be not particularly limited for 2nm, can suitably select, but preferred 2nm～49nm more preferably 2nm～45nm, further preferred 3nm～40nm, preferred especially 5nm～35nm according to purpose.The thickness of above-mentioned upper layer is during less than 2nm, sometimes can not be whole adequate relief film forming, be 50nm when above, and be used for the film regenerated and can significantly worsen based on the stripping process productivity of oxygen ashing.On the other hand, if the thickness of above-mentioned upper layer is in the above-mentioned special preferable range, can form film on whole, be favourable from the strong viewpoint of closing force.
The thickness of above-mentioned upper layer for example can be measured by ellipsometry.
-hardness-
Hardness as above-mentioned upper layer is not particularly limited, can suitably select according to purpose, but preferred 5GPa～25GPa, more preferably 5GPa～20GPa, especially preferably 10GPa～20GPa.If the intensity of above-mentioned upper layer is less than 5GPa, film can wear and tear sometimes, if greater than 25GPa, and the peeling off weather resistance and can become insufficient of film sometimes then.On the other hand, if the intensity of above-mentioned upper layer is favourable from wearability, driving fit weather resistance aspect then in above-mentioned particularly preferred scope.
The hardness of above-mentioned upper layer for example can be measured by nano-hardness tester.
-frictional coefficient-
Frictional coefficient as above-mentioned upper layer is not particularly limited, and can suitably select, but preferred 0.01～0.08 more preferably 0.02～0.07, preferred especially 0.04～0.06 according to purpose.If the frictional coefficient of above-mentioned upper layer is less than 0.01, then the forming face of metal die can not be needed on lens equably sometimes, if greater than 0.08, then sometimes because usage frequency can produce slight crack.On the other hand, if the frictional coefficient of above-mentioned upper layer is in above-mentioned particularly preferred scope, then the viewpoint stable, that suppress slight crack from lens shape is favourable.
The frictional coefficient of above-mentioned upper layer can be measured by for example following method: use ball disc type (ball on desk) device, make SUS system ball carry out the 10mm translational motion with load 100gf, 1mm/sec, measure.
-surface energy-
The surface energy of above-mentioned upper layer can be by for example calculating from the contact angle of water and methyl iodide.
Formation method as above-mentioned upper layer is not particularly limited, and can suitably select according to purpose, for example can enumerate plasma CVD (chemical vapour deposition: chemical vapor deposition), sputter, ion plating, ionic fluid evaporation etc.
In the formation of above-mentioned upper layer based on plasma CVD, as the gas of supplying with carbon (C), be not particularly limited, can suitably select, for example can enumerate alkane such as methane, ethane, propane according to purpose, alkene such as ethene, propylene, alkyl such as pentadiene, divinyl diene, alkynes such as acetylene, methylacetylene, aromatic hydrocarbonss such as benzene,toluene,xylene, naphthenic hydrocarbon such as cyclopropane, hexanaphthene, ring-type alkene such as cyclopentenes, tetrahydrobenzene etc.Above-mentioned gas can use a kind separately, also can more than 2 kinds and use.
In addition, in the formation based on the upper layer of above-mentioned plasma CVD, the gas as supplying with silicon (Si) is not particularly limited, and can suitably select according to purpose, for example can enumerate silane (SiH
4), tetramethylsilane (TMS:Si (CH
3)
4), silicon tetrachloride (SiCl
4) etc.Above-mentioned gas can use a kind separately, also can more than 2 kinds and use.
As at flow, pressure based on the gas in the formation of the upper layer of above-mentioned plasma CVD, be not particularly limited, can suitably select according to purpose.
Frequency as in the above-mentioned plasma CVD is not particularly limited, and can suitably select according to purpose, for example can enumerate high frequency (13.56MHz).
Output as above-mentioned high frequency is not particularly limited, can suitably select according to purpose, but preferred 1.0kW～5.0kW, more preferably 1.5kW～4.0kW, especially preferably 1.8kW～3.0kW.The output of above-mentioned high frequency is during less than 1.0kW, sometimes because usage frequency and film can be peeled off, if greater than 5.0kW, then sometimes in the film forming metal die become high temperature, the hardness of film can reduce.On the other hand, if the output of above-mentioned high frequency is in above-mentioned particularly preferred scope, then the hardness excellence of upper layer is preferred from this viewpoint.
＜other formation 〉
As above-mentioned other formation, in the scope of not damaging effect of the present invention, be not particularly limited, can suitably select according to purpose, for example can enumerate the middle layer.
-middle layer-
Above-mentioned middle layer forms between above-mentioned base material and upper layer.
By forming above-mentioned middle layer, can prevent the distortion of above-mentioned base material.
Material, thickness as above-mentioned middle layer are not particularly limited, and can suitably select according to purpose.
As above-mentioned material, for example can enumerate TiN, TaN, ZrN, HfN, AlN, TiC, TaC, ZrC, HfC, TiAlN, TiCN, TaCN, ZrCN, HfCN, SiC, SiN, diamond etc.
As the thickness in above-mentioned middle layer, for example can enumerate 2 μ m etc.
Formation method as above-mentioned middle layer is not particularly limited, and can suitably select according to purpose, for example can enumerate sputter, ion plating, CVD etc.
(optical element, and manufacture method)
Optical element of the present invention is made by the manufacture method of optical element of the present invention.
The manufacture method of optical element of the present invention is used die for optical element molding of the present invention, and optical element material is shaped.
-optical element material-
As above-mentioned optical element material, be not particularly limited, can suitably select according to purpose, for example can enumerate and contain TiO
2Glass, contain Nb
2O
5Glass, contain WO
3Glass, contain Bi
2O
3Glass etc.The above-mentioned at least a glass that contains among Ti, W, Nb and the Bi, reactive high, but the die for optical element molding of the application of the invention can be made the few optical element of defective.
-be shaped-
Method as above-mentioned optical element material is shaped is not particularly limited, and can suitably select according to purpose, for example can enumerate drawing, injection forming etc.
In above-mentioned drawing, can be on above-mentioned die for optical element molding the block to above-mentioned optical element material heat, punching press, also can carry out punching press to the block of the optical element material of preheating.
As the temperature of above-mentioned heating, the load of punching press, the time of punching press, be not particularly limited, can suitably select according to optical element material.
-optical element-
Shape, size as above-mentioned optical element are not particularly limited, and can suitably select according to purpose.
As above-mentioned optical element, for example can enumerate lens, prism etc.
Embodiment
Below, embodiments of the invention are described, but the present invention is not subjected to any qualification of these embodiment.
(embodiment 1-1)
The manufacturing of＜die for optical element molding 1 〉
As the base material of die for optical element molding, used superhard alloy (WC-Co).
The patrix base material of above-mentioned die for optical element molding has used the base material with flat surfaces.
The counterdie base material of above-mentioned die for optical element molding has used the base material on the surface with concave shape.
The formation of-upper layer-
On the surface of above-mentioned patrix base material and counterdie base material (stamping surface),, formed the upper layer of the diamond-like-carbon that contains Si of thickness 10nm by the plasma CVD of following condition.The content of Si in the above-mentioned upper layer is according to the mode of counting Si/C=0.01 with Si and the ratio (Si/C) of C, with methane (CH
4) gas flow (5sccm～200sccm) and tetramethylsilane (TMS) gas flow (0.1sccm～5sccm) adjust.
The condition of plasma CVD:
High frequency electric source ... 13.56MHz
High frequency output ... 2kW
Gaseous tension ... 4Pa
Methane (CH
4) gas flow ... be adjusted into 5sccm～200sccm.
Tetramethylsilane (TMS) gas flow ... be adjusted into 0.1sccm～5sccm.
The synoptic diagram of plasma CVD shown in Fig. 1.Among Fig. 1, symbol 1 expression gas, symbol 2 and 4 expression high-frequency electrodes, symbol 3 expression base materials, symbol 5 expression match boxes, symbol 6 expression high frequency electric sources.
Result after analyzing according to raman spectroscopy has formed diamond-like-carbon at above-mentioned upper layer.
Confirm the content of Si and C in the above-mentioned upper layer by XPS analysis, the result is Si/C=0.01.
The frictional coefficient of above-mentioned upper layer is measured in such a way, and the result is 0.06.
-Determination of Friction Coefficient method-
Use the ball disc type apparatus, make SUS system ball carry out the 10mm translational motion, measured frictional coefficient with load 100gf, 1mm/sec.
Calculate the surface energy on the surface of above-mentioned upper layer from the contact angle of water and methylene iodide, the result is 42mJ/m
2
(embodiment 1-2)
The manufacturing of＜die for optical element molding 2 〉
The base material of die for optical element molding has used the base material identical with embodiment 1-1.
The formation of-upper layer-
On the surface of above-mentioned patrix base material and counterdie base material (stamping surface),, formed the upper layer of the diamond-like-carbon that contains Si of thickness 10nm by the plasma CVD of following condition.The content of Si in the above-mentioned upper layer is according to the mode of counting Si/C=0.05 with Si and the ratio (Si/C) of C, with methane (CH
4) gas flow (5sccm～200sccm) and tetramethylsilane (TMS) gas flow (0.1sccm～5sccm) adjust.
The condition of plasma CVD:
High frequency electric source ... 13.56MHz
High frequency output ... 2kW
Gaseous tension ... 4Pa
Methane (CH
4) gas flow ... be adjusted into 5sccm～200sccm.
Tetramethylsilane (TMS) gas flow ... be adjusted into 0.1sccm～5sccm.
The same with embodiment 1-1, analyze by raman spectroscopy, the result has formed diamond-like-carbon at above-mentioned upper layer.
For the content of Si and C in the above-mentioned upper layer, by XPS analysis confirm similarly that with embodiment 1-1 the result is Si/C=0.05.
Similarly measure the frictional coefficient of above-mentioned upper layer with embodiment 1-1, the result is 0.05.
Similarly measure the surface energy of above-mentioned upper layer with embodiment 1-1, the result is 43mJ/m
2
(embodiment 1-3)
The manufacturing of＜die for optical element molding 3 〉
In embodiment 1-1, the high frequency output about plasma CVD changes to 1.5kW with the 2kW that sets, and in addition, has similarly made die for optical element molding 3 with embodiment 1-1.
Similarly analyze by raman spectroscopy with embodiment 1-1, the result has formed diamond-like-carbon on the upper layer of above-mentioned die for optical element molding 3.
Similarly confirm the content of Si and C in the above-mentioned upper layer by XPS analysis with embodiment 1-1, the result is Si/C=0.01.
Similarly measure the frictional coefficient of above-mentioned upper layer with embodiment 1-1, the result is 0.08.
Similarly measure the surface energy of above-mentioned upper layer with embodiment 1-1, the result is 41mJ/m
2
(embodiment 1-4)
The manufacturing of＜die for optical element molding 4 〉
In embodiment 1-2, the high frequency output about plasma CVD changes to 1.5kW with the 2kW that sets, and in addition, has similarly made die for optical element molding 4 with embodiment 1-2.
Similarly analyze by raman spectroscopy with embodiment 1-1, the result has formed diamond-like-carbon on the upper layer of above-mentioned die for optical element molding 4.
Similarly confirm the content of Si and C in the above-mentioned upper layer by XPS analysis with embodiment 1-1, the result is Si/C=0.05.
Similarly measure the frictional coefficient of above-mentioned upper layer with embodiment 1-1, the result is 0.07.
Similarly measure the surface energy of above-mentioned upper layer with embodiment 1-1, the result is 42mJ/m
2
(embodiment 1-5)
The manufacturing of＜die for optical element molding 5 〉
In embodiment 1-1, by adjusting film formation time, the thickness of upper layer is changed to 30nm from the 10nm that sets, in addition, similarly made die for optical element molding 5 with embodiment 1-1.
With embodiment 1-1 similarly, analyze by raman spectroscopy, the result has formed diamond-like-carbon on the upper layer of above-mentioned die for optical element molding 5.
Similarly confirm the content of Si and C in the above-mentioned upper layer by XPS analysis with embodiment 1-1, the result is Si/C=0.01.
Similarly measure the frictional coefficient of above-mentioned upper layer with embodiment 1-1, the result is 0.06.
Similarly measure the surface energy of above-mentioned upper layer with embodiment 1-1, the result is 42mJ/m
2
(embodiment 1-6)
The manufacturing of＜die for optical element molding 6 〉
The base material of die for optical element molding uses the base material identical with embodiment 1-1.
The formation of-upper layer-
On the surface of above-mentioned patrix base material and counterdie base material (stamping surface),, formed the upper layer of the diamond-like-carbon that contains Si of thickness 10nm by the plasma CVD of following condition.About the content of Si in the above-mentioned upper layer, according to the mode of counting Si/C=0.03 with Si and the ratio (Si/C) of C, with methane (CH
4) gas flow (5sccm～200sccm) and tetramethylsilane (TMS) gas flow (0.1sccm～5sccm) adjust.
The condition of plasma CVD:
High frequency electric source ... 13.56MHz
High frequency output ... 2kW
Gaseous tension ... 4Pa
Methane (CH
4) gas flow ... be adjusted into 5sccm～200sccm.
Tetramethylsilane (TMS) gas flow ... be adjusted into 0.1sccm～5sccm.
With embodiment 1-1 similarly, analyze by raman spectroscopy, the result has formed diamond-like-carbon at above-mentioned upper layer.
Similarly confirm the content of Si and C in the above-mentioned upper layer by XPS analysis with embodiment 1-1, the result is Si/C=0.03.
Similarly measure the frictional coefficient of above-mentioned upper layer with embodiment 1-1, the result is 0.06.
Similarly measure the surface energy of above-mentioned upper layer with embodiment 1-1, the result is 42mJ/m
2
(embodiment 1-7)
The manufacturing of＜die for optical element molding 7 〉
In embodiment 1-1, by adjusting film formation time, the thickness of upper layer is changed to 2nm from the 10nm that sets, in addition, similarly make die for optical element molding 7 with embodiment 1-1.
With embodiment 1-1 similarly, analyze by raman spectroscopy, the result has formed diamond-like-carbon on the upper layer of above-mentioned die for optical element molding 7.
Similarly confirm the content of Si and C in the above-mentioned upper layer by XPS analysis with embodiment 1-1, the result is Si/C=0.01.
Similarly measure the frictional coefficient of above-mentioned upper layer with embodiment 1-1, the result is 0.06.
Similarly measure the surface energy of above-mentioned upper layer with embodiment 1-1, the result is 42mJ/m
2
(embodiment 1-8)
The manufacturing of＜die for optical element molding 8 〉
In embodiment 1-1, by adjusting film formation time, the thickness of upper layer is changed to 45nm from set 10nm, in addition, similarly make die for optical element molding 8 with embodiment 1-1.
With embodiment 1-1 similarly, analyze by raman spectroscopy, the result has formed diamond-like-carbon on the upper layer of above-mentioned die for optical element molding 8.
Similarly obtain the content of Si and C in the above-mentioned upper layer by XPS analysis with embodiment 1-1, the result is Si/C=0.01.
Similarly measure the frictional coefficient of above-mentioned upper layer with embodiment 1-1, the result is 0.06.
Similarly measure the surface energy of above-mentioned upper layer with embodiment 1-1, the result is 42mJ/m
2
(comparative example 1-1)
The manufacturing of＜die for optical element molding 9 〉
The base material of die for optical element molding uses the base material identical with embodiment 1-1.
The formation of-upper layer-
On the surface of above-mentioned patrix base material and counterdie base material (stamping surface),, form the upper layer of the diamond-like-carbon that does not contain Si of thickness 10nm by the plasma CVD of following condition.
The condition of plasma CVD:
High frequency electric source ... 13.56MHz
High frequency output ... 2kW
Gaseous tension ... 4Pa
Methane (CH
4) gas flow ... be adjusted into 5sccm～200sccm.
With embodiment 1-1 similarly, analyze by raman spectroscopy, the result has formed diamond-like-carbon at above-mentioned upper layer.
Similarly measure the frictional coefficient of above-mentioned upper layer with embodiment 1-1, the result is 0.12.
Similarly measure the surface energy of above-mentioned upper layer with embodiment 1-1, the result is 34mJ/m
2
(comparative example 1-2)
The manufacturing of＜die for optical element molding 10 〉
The base material of die for optical element molding uses the base material identical with embodiment 1-1.
The formation of-upper layer-
On the surface of above-mentioned patrix base material and counterdie base material (stamping surface),, formed the upper layer of the diamond-like-carbon that contains Si of thickness 10nm by the plasma CVD of following condition.About the content of Si in the above-mentioned upper layer, according to the mode of counting Si/C=0.008 with Si and the ratio (Si/C) of C, with methane (CH
4) gas flow (5sccm～200sccm) and tetramethylsilane (TMS) gas flow (0.1sccm～5sccm) adjust.
The condition of plasma CVD:
High frequency electric source ... 13.56MHz
High frequency output ... 2kW
Gaseous tension ... 4Pa
Methane (CH
4) gas flow ... be adjusted into 5sccm～200sccm.
Tetramethylsilane (TMS) gas flow ... be adjusted into 0.1sccm～5sccm.
With embodiment 1-1 similarly, analyze by raman spectroscopy, the result has formed diamond-like-carbon at above-mentioned upper layer.
Similarly confirm the content of Si and C in the above-mentioned upper layer by XPS analysis with embodiment 1-1, the result is Si/C=0.008.
Similarly measure the frictional coefficient of above-mentioned upper layer with embodiment 1-1, the result is 0.10.
Similarly measure the surface energy of above-mentioned upper layer with embodiment 1-1, the result is 36mJ/m
2
Fig. 2 is the coordinate diagram that the frictional coefficient to the upper layer of die for optical element molding 1～10 compares.By the result of Fig. 2 as can be known, upper layer is the frictional coefficient of upper layer of die for optical element molding 1～8 of embodiment 1-1～embodiment 1-8 that contains the diamond-like-carbon of Si, compare lower with upper layer for the frictional coefficient of the upper layer of the die for optical element molding 10 of the poor comparative example 1-2 of the die for optical element molding 9 of comparative example 1-1 of the diamond-like-carbon that do not contain Si and Si, by containing Si, can reduce frictional coefficient with specified quantitative.
In addition we know, the high frequency of plasma CVD is output as the frictional coefficient of upper layer of the die for optical element molding of embodiment 1-1, the 1-2 of 2kW and 1-5～1-8, and the frictional coefficient of upper layer of die for optical element molding that is made as the embodiment 1-3 of 1.5kW and embodiment 1-4 than high frequency output is lower.
(embodiment 2-1)
＜used the manufacturing-1 of the optical element of die for optical element molding 1 〉
As optical element material, use the glass 1 of the composition of following table 1, use die for optical element molding 1 as die for optical element molding, above-mentioned optical element material is heated to 580 ℃, carry out drawing with load 50kgf, carry out the making of optical lens of convex form of 100 times diameter 4mm, thickness 1.5mm.
Fig. 3, the 4th, the diagrammatic illustration figure of drawing.Fig. 3 is the explanatory view before the drawing, the explanatory view when Fig. 4 is drawing.Among Fig. 3,4, symbol 11 expression base materials (patrix), symbol 12 presentation surface layers, symbol 13 expression optical element materials, symbol 14 expression base materials (counterdie).
[table 1]
The composition of glass 1
| SiO 2 | TiO 2 | Na 2O | ?K 2O | ?WO 3 |
| 43 weight % | 29 weight % | 15 weight % | 8 weight % | 5 weight % |
Fig. 5 is the MIcrosope image on the surface of the die for optical element molding 1 after 100 times of embodiment 2-1 are shaped.By the result of Fig. 5 as can be known, in the die for optical element molding 1 of upper layer with the diamond-like-carbon that contains Si according to Si/C=0.01, even after being shaped for 100 times, upper layer does not chap yet, peels off equivalent damage, with regard to above-mentioned upper layer, and its film hardness excellence, in addition, reactive low with optical element material, with the adaptation excellence of the base material of die for optical element molding, the release property of above-mentioned die for optical element molding 1 and weather resistance are excellent.
In addition, in the shaping of optical lens, do not produce slight crack (cracking) yet.
Therefore, even above-mentioned die for optical element molding 1 surpasses 100 not damages that are shaped also, can be used in the manufacturing of optical element.
(embodiment 2-2)
＜used the manufacturing-1 of the optical element of die for optical element molding 2 〉
In embodiment 2-1, replace using die for optical element molding 1, and use die for optical element molding 2, in addition, similarly carry out the manufacturing of optical element with embodiment 2-1.
Fig. 6 is the MIcrosope image on the surface of the die for optical element molding 2 after 100 times of embodiment 2-2 are shaped.By the result of Fig. 6 as can be known, in the die for optical element molding 2 of upper layer with the diamond-like-carbon that contains Si with Si/C=0.05, even after being shaped for 100 times, on upper layer, do not chap yet, peel off equivalent damage, with regard to above-mentioned upper layer, its film hardness excellence, in addition, reactive low with optical element material, with the adaptation excellence of the base material of die for optical element molding, the release property of above-mentioned die for optical element molding 2 and weather resistance are excellent.
In addition, in the shaping of optical lens, do not produce slight crack (cracking) yet.
Therefore, even above-mentioned die for optical element molding 2 surpasses 100 not damages that are shaped also, can carry out the manufacturing of optical element.
(embodiment 2-3)
＜used the manufacturing-1 of the optical element of die for optical element molding 5 〉
In embodiment 2-1, the glass 2 that replaces using glass 1 and use the composition of following table 2, replace using die for optical element molding 1 and use die for optical element molding 5, replacement is made as 580 ℃ with Heating temperature, but it is changed to 570 ℃, in addition, similarly carry out the manufacturing of optical element with embodiment 2-1.
[table 2]
The composition of glass 2
| Nb 2O 5 | P 2O 5 | Bi 2O 3 | WO 3 | ?GeO 2 |
| 40 weight % | 22 weight % | 17 weight % | 15 weight % | 6 weight % |
Fig. 7 is the MIcrosope image on the surface of the die for optical element molding 5 after 100 times of embodiment 2-3 are shaped.By the result of Fig. 7 as can be known, even when using reactive high material as optical element material, for die for optical element molding 5, even after being shaped for 100 times, on upper layer, also do not chap, peel off equivalent damage, with regard to above-mentioned upper layer, its film hardness excellence, in addition, reactive low with optical element material, with the adaptation excellence of the base material of die for optical element molding, the release property of above-mentioned die for optical element molding 5 and weather resistance are excellent.
In addition, in the shaping of optical lens, do not produce slight crack (cracking) yet.
Therefore, for above-mentioned die for optical element molding 5, use reactive high material,, can carry out the manufacturing of optical element even surpass 100 not damages that are shaped also as optical element material.
(embodiment 2-4)
＜used the manufacturing-2 of the optical element of die for optical element molding 1 〉
In embodiment 2-1, replace to use glass 1, and use the glass 3 of the composition of following table 3, replace Heating temperature is made as 580 ℃ and it is changed to 560 ℃, in addition, similarly carry out the manufacturing of optical element with embodiment 2-1.
[table 3]
The composition of glass 3
| SiO 2 | BaO | Al 2O 3 | ?Na 2O | ?K 2O |
| 48 weight % | 29 weight % | 10 weight % | 8 weight % | 5 weight % |
Fig. 8 is the MIcrosope image on the surface of the die for optical element molding 1 after 100 times of embodiment 2-4 are shaped.By the result of Fig. 8 as can be known, even when using reactive low material as optical element material, for die for optical element molding 1, even after being shaped for 100 times, on upper layer, also do not chap, peel off equivalent damage, with regard to above-mentioned upper layer, its film hardness excellence, in addition, reactive low with optical element material, with the adaptation excellence of the base material of die for optical element molding, the release property of above-mentioned die for optical element molding 1 and weather resistance are excellent.
In addition, in the shaping of optical lens, do not produce slight crack (cracking) yet.
Therefore, for above-mentioned die for optical element molding 1, use reactive low material,, can carry out the manufacturing of optical element even surpass 100 not damages that are shaped also as optical element material.
(embodiment 2-5)
＜used the manufacturing-1 of the optical element of die for optical element molding 3 〉
In embodiment 2-1, replace using die for optical element molding 1 and use die for optical element molding 3, in addition, similarly carry out the manufacturing of optical element with embodiment 2-1.
Fig. 9 is the MIcrosope image on the surface of the die for optical element molding 3 after 100 times of embodiment 2-5 are shaped.By the result of Fig. 9 as can be known, film forming output is being made as in the die for optical element molding 3 of 1.5kW, the peripheral part of the mould after being shaped for 100 times produces check surface slightly, but do not produce slight crack (cracking), with regard to above-mentioned upper layer, its film hardness excellence, in addition, reactive low with optical element material, with the adaptation excellence of the base material of die for optical element molding, the release property of above-mentioned die for optical element molding 3 and weather resistance are excellent.
Therefore, be shaped, also can carry out the manufacturing of optical element even above-mentioned die for optical element molding 3 surpasses 100 times.
(embodiment 2-6)
＜used the manufacturing-2 of the optical element of die for optical element molding 3 〉
In embodiment 2-3, replace using die for optical element molding 5 and use die for optical element molding 3, in addition, similarly carry out the manufacturing of optical element with embodiment 2-3.
Figure 10 is the MIcrosope image on the surface of the die for optical element molding 3 after 100 times of embodiment 2-6 are shaped.By the result of Figure 10 as can be known, be made as in the die for optical element molding 3 of 1.5kW in film forming output, peripheral part at mould after being shaped for 100 times produces check surface a little, but do not produce slight crack (cracking), with regard to above-mentioned upper layer, its film hardness excellence, in addition, reactive low with optical element material, with the adaptation excellence of the base material of die for optical element molding, the release property of above-mentioned die for optical element molding 3 and weather resistance are excellent.
Therefore, be shaped, also can carry out the manufacturing of optical element even above-mentioned die for optical element molding 3 surpasses 100 times.
(embodiment 2-7)
＜used the manufacturing-3 of the optical element of die for optical element molding 3 〉
At embodiment 2-4, replace using die for optical element molding 1 and use die for optical element molding 3, in addition, similarly carry out the manufacturing of optical element with embodiment 2-4.
Figure 11 is the MIcrosope image on the surface of the die for optical element molding 3 after 100 times of embodiment 2-7 are shaped.By the result of Figure 11 as can be known, be made as in the die for optical element molding 3 of 1.5kW in film forming output, peripheral part at mould after being shaped for 100 times produces check surface a little, but do not produce slight crack (cracking), with regard to above-mentioned upper layer, its film hardness excellence, in addition, reactive low with optical element material, with the adaptation excellence of the base material of die for optical element molding, the release property of above-mentioned die for optical element molding 3 and weather resistance are excellent.
Therefore, be shaped, also can carry out the manufacturing of optical element even above-mentioned die for optical element molding 3 surpasses 100 times.
(embodiment 2-8)
＜used the manufacturing-1 of the optical element of die for optical element molding 4 〉
In embodiment 2-1, replace using die for optical element molding 1 and use die for optical element molding 4, in addition, similarly carry out the manufacturing of optical element with embodiment 2-1.
Figure 12 is the MIcrosope image on the surface of the die for optical element molding 4 after 100 times of embodiment 2-8 are shaped.By the result of Figure 12 as can be known, be made as in the die for optical element molding 4 of 1.5kW in film forming output, peripheral part at mould after being shaped for 100 times produces check surface a little, but do not produce slight crack (cracking), with regard to above-mentioned upper layer, the film hardness excellence, in addition, reactive low with optical element material, with the adaptation excellence of the base material of die for optical element molding, the release property of above-mentioned die for optical element molding 4 and weather resistance are excellent.
Therefore, be shaped, also can carry out the manufacturing of optical element even above-mentioned die for optical element molding 4 surpasses 100 times.
(embodiment 2-9)
＜used the manufacturing-1 of the optical element of die for optical element molding 6 〉
In embodiment 2-1, replace using die for optical element molding 1 and use die for optical element molding 6, in addition, similarly carry out the manufacturing of optical element with embodiment 2-1.
Figure 13 is the MIcrosope image on the surface of the die for optical element molding 6 after 100 times of embodiment 2-9 are shaped.By the result of Figure 13 as can be known, in the die for optical element molding 6 of upper layer with the diamond-like-carbon that contains Si with Si/C=0.03, even after being shaped for 100 times, on upper layer, do not chap yet, peel off equivalent damage, with regard to above-mentioned upper layer, its film hardness excellence, in addition, reactive low with optical element material, with the adaptation excellence of the base material of die for optical element molding, the release property of above-mentioned die for optical element molding 6 and weather resistance are excellent.
In addition, in the shaping of optical lens, do not produce slight crack (cracking) yet.
Therefore, even above-mentioned die for optical element molding 6 surpasses 100 not damages that are shaped also, can carry out the manufacturing of optical element.
(embodiment 2-10)
＜used the manufacturing-1 of the optical element of die for optical element molding 7 〉
In embodiment 2-1, replace using die for optical element molding 1, and use die for optical element molding 7, in addition, similarly carry out the manufacturing of optical element with embodiment 2-1.
Figure 14 is the MIcrosope image on the surface of the die for optical element molding 7 after 100 times of embodiment 2-10 are shaped.By the result of Figure 14 as can be known, for having the die for optical element molding 7 that the thickness of upper layer that contains the diamond-like-carbon of Si with Si/C=0.01 is 2nm, even after being shaped for 100 times, on upper layer, do not chap yet, peel off equivalent damage, with regard to above-mentioned upper layer, its film hardness excellence, in addition, reactive low with optical element material, with the adaptation excellence of the base material of die for optical element molding, the release property of above-mentioned die for optical element molding 7 and weather resistance are excellent.
In addition, in the shaping of optical lens, do not produce slight crack (cracking) yet.
Therefore, even above-mentioned die for optical element molding 7 surpasses 100 not damages that are shaped also, can carry out the manufacturing of optical element.
(embodiment 2-11)
＜used the manufacturing-1 of the optical element of die for optical element molding 8 〉
In embodiment 2-1, replace using die for optical element molding 1 and use die for optical element molding 8, in addition, similarly carry out the manufacturing of optical element with embodiment 2-1.
Figure 15 is the MIcrosope image on the surface of the die for optical element molding 8 after 100 times of embodiment 2-11 are shaped.By the result of Figure 15 as can be known, for the die for optical element molding 8 that the thickness of the upper layer of the diamond-like-carbon that contains Si with Si/C=0.01 is 45nm, even after being shaped for 100 times, on upper layer, do not chap yet, peel off equivalent damage, with regard to above-mentioned upper layer, its film hardness excellence, in addition, reactive low with optical element material, with the adaptation excellence of the base material of die for optical element molding, the release property of above-mentioned die for optical element molding 8 and weather resistance are excellent.
In addition, in the shaping of optical lens, do not produce slight crack (cracking) yet.
Therefore, even above-mentioned die for optical element molding 8 surpasses 100 not damages that are shaped also, can carry out the manufacturing of optical element.
(comparative example 2-1)
＜used the manufacturing-1 of the optical element of die for optical element molding 9 〉
In embodiment 2-1, replace using die for optical element molding 1 and use die for optical element molding 9, in addition, similarly carry out the manufacturing of optical element with embodiment 2-1.
Figure 16 is the MIcrosope image on the surface of the die for optical element molding 9 after 100 times of comparative example 2-1 are shaped.By the result of Figure 16 as can be known, in the die for optical element molding 9 of the upper layer with the diamond-like-carbon that does not contain Si, upper layer produces be full of cracks, peels off.In addition, the be full of cracks of upper layer or peel off after being shaped for 60 times and will produce.
In addition, in the shaping of optical lens, produce slight crack (cracking) 30 backs that are shaped.
(comparative example 2-2)
＜used the manufacturing-2 of the optical element of die for optical element molding 9 〉
In embodiment 2-3, replace using die for optical element molding 5 and use die for optical element molding 9, in addition, embodiment 2-3 similarly carries out the manufacturing of optical element.
Figure 17 is the MIcrosope image on the surface of the die for optical element molding 9 after 100 times of comparative example 2-2 are shaped.By the result of Figure 17 as can be known, in the die for optical element molding 9 of the upper layer with the diamond-like-carbon that does not contain Si, upper layer produces be full of cracks, peels off.In addition, the be full of cracks of upper layer or peel off 40 backs that are shaped produces.
In addition, in the shaping of optical lens, produce slight crack (cracking) 20 backs that are shaped.
(comparative example 2-3)
＜used the manufacturing-3 of the optical element of die for optical element molding 9 〉
In embodiment 2-4, replace using die for optical element molding 1 and use die for optical element molding 9, in addition, embodiment 2-4 similarly carries out the manufacturing of optical element.
Figure 18 is the MIcrosope image on the surface of the die for optical element molding 9 after 100 times of comparative example 2-3 are shaped.By the result of Figure 18 as can be known, in the die for optical element molding 9 of the upper layer with the diamond-like-carbon that does not contain Si, upper layer produces be full of cracks, peels off.In addition, the be full of cracks of upper layer or peel off 80 backs that are shaped produces.
In addition, in the shaping of optical lens, produce slight crack (cracking) 40 backs that are shaped.
(comparative example 2-4)
＜used the manufacturing-1 of the optical element of die for optical element molding 10 〉
In embodiment 2-1, replace using die for optical element molding 1 and use die for optical element molding 10, in addition, similarly carry out the manufacturing of optical element with embodiment 2-1.
Figure 19 is the MIcrosope image on the surface of the die for optical element molding 10 after 100 times of comparative example 2-4 are shaped.By the result of Figure 19 as can be known, be that upper layer produces be full of cracks, peels off in the die for optical element molding 10 of upper layer of diamond-like-carbon of Si/C=0.008 at content with Si.In addition, the be full of cracks of upper layer or peel off 85 backs that are shaped produces.
In addition, in the shaping of optical lens, produce slight crack (cracking) 50 backs that are shaped.
Gather the foregoing description and comparative example, shown in the table 4.
[table 4]
In " peeling off (mould) " hurdle of table 4, " not damage of mould surpasses 100 times and also can be shaped during 100 shapings in " ◎ " expression.", " zero " expression " produces check surface a little at the mould peripheral part during 100 shapings, also can be shaped but surpass 100 times.", " * " expression " can not be carried out 100 times shaping.", the numeral upper layer in the bracket produces be full of cracks or the number of times when peeling off.In addition, " 100 ↑ " expression " when being shaped for 100 times, not have be full of cracks that generation can not the shaped surface layer, peels off.”。
In addition, in " slight crack " hurdle, " zero " expression " does not produce cracking during 100 shapings.", " * " expression " has produced cracking during 100 shapings.", the number of times the when numeral in the bracket produces cracking.In addition, " 100 ↑ " expression " does not produce cracking " during 100 shapings.
As shown in Table 4, the Si content of upper layer is counted the surface energy of the die for optical element molding 1～8 of Si/C=0.01～0.05 with Si and the ratio (Si/C) of C, the surface energy of die for optical element molding 10 that the specific surface layer does not contain the die for optical element molding 9 of Si and Si/C=0.008 is bigger, the surface of the upper layer of die for optical element molding 1～8, higher than the wetting ability on the surface of the upper layer of die for optical element molding 9 and 10.In addition, be output as 2kW with film forming and carry out film forming die for optical element molding 1, higher than the surface energy that carries out film forming die for optical element molding 3 with 1.5kW, equally as can be known, die for optical element molding 2 is higher than the surface energy of die for optical element molding 4.
In addition we know, the content that contains Si in the diamond-like-carbon of Si and the above-mentioned upper layer at upper layer with Si and the ratio (Si/C) of C count 0.01～0.05 and the thickness of above-mentioned upper layer be more than the 2nm and in the die for optical element molding 1～8 less than 50nm, the adaptation excellence of the base material of die for optical element molding and upper layer, and release property and weather resistance are excellent.
Can think that this is because by reducing the thickness of upper layer, can improve the adaptation of base material and upper layer, and then the oxidation of Si inhibition C can prevent that C from because of the oxidation disappearance of gasifying, can improve release property and weather resistance thus.
Die for optical element molding of the present invention, reactive low with optical element material, can reduce the frictional coefficient of the upper layer of optical element material and die for optical element molding, the adaptation excellence of the base material of die for optical element molding and upper layer, so release property and excellent in te pins of durability, so containing reactive high TiO
2, Nb
2O
5, WO
3, Bi
2O
3Deng the situation of shaping of optical element material, thin lens under also can be suitable for.
Claims (5)
1. a die for optical element molding is characterized in that,
Have base material and upper layer,
Described upper layer contains the diamond-like-carbon of Si,
The content of Si is that Si/C counts 0.01～0.05 with the ratio of Si and C in the described upper layer,
The thickness of described upper layer is more than the 2nm and less than 50nm.
2. die for optical element molding according to claim 1, wherein, the frictional coefficient of upper layer is 0.01～0.08.
3. the manufacture method of an optical element, it is characterized in that, use following die for optical element molding that optical element material is shaped, described die for optical element molding has base material and upper layer, described upper layer contains the diamond-like-carbon of Si, the content of Si is that Si/C counts 0.01～0.05 with the ratio of Si and C in the described upper layer, and the thickness of described upper layer is that 2nm is above and less than 50nm.
4. the manufacture method of optical element according to claim 3, wherein, optical element material contains at least a among Ti, W, Nb and the Bi.
5. optical element, it is characterized in that, it is by using following die for optical element molding that the manufacture method of the optical element of optical element material shaping is made, described die for optical element molding has base material and upper layer, described upper layer contains the diamond-like-carbon of Si, the content of Si is that Si/C counts 0.01～0.05 with the ratio of Si and C in the described upper layer, and the thickness of described upper layer is that 2nm is above and less than 50nm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010024659A JP5577110B2 (en) | 2010-02-05 | 2010-02-05 | Optical element molding die, optical element, and method of manufacturing the optical element |
| JP2010-024659 | 2010-10-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102190421A true CN102190421A (en) | 2011-09-21 |
| CN102190421B CN102190421B (en) | 2014-08-27 |
Family
ID=44593505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010621562.XA Active CN102190421B (en) | 2010-02-05 | 2010-12-29 | Mold for forming optical component, optical component thereof and manufacturing method of the optical component |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5577110B2 (en) |
| CN (1) | CN102190421B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132884A (en) * | 2014-04-04 | 2016-11-16 | 奥林巴斯株式会社 | Optical element forming set of molds and the manufacture method of optical element |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999037471A1 (en) * | 1998-01-23 | 1999-07-29 | Axxicon Moulds Eindhoven B.V. | Injection mould |
| US20020041930A1 (en) * | 1998-04-20 | 2002-04-11 | Ali Erdemir | Method to produce ultra-low friction carbon films |
| CN1541960A (en) * | 2003-04-28 | 2004-11-03 | 鸿富锦精密工业（深圳）有限公司 | Die assembly for producing optical glass products and manufacturing method thereof |
| US20050126486A1 (en) * | 2002-03-14 | 2005-06-16 | Denis Teer | Apparatus and method for applying diamond-like carbon coatings |
| CN101619455A (en) * | 2008-07-03 | 2010-01-06 | 中国科学院兰州化学物理研究所 | Super lubricating Si-doped diamond film preparation method |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6130671A (en) * | 1984-07-23 | 1986-02-12 | Nippon Telegr & Teleph Corp <Ntt> | Hard carbon film |
| JPH04338121A (en) * | 1991-05-10 | 1992-11-25 | Konica Corp | Metallic mold for forming optical element |
| JP3810022B2 (en) * | 1995-06-28 | 2006-08-16 | キヤノン株式会社 | Method for manufacturing optical element molding die |
| JPH09194216A (en) * | 1996-01-17 | 1997-07-29 | Canon Inc | Die for forming optical element |
| JP2002356334A (en) * | 2001-06-01 | 2002-12-13 | Minolta Co Ltd | Mold for forming glass and method for manufacturing the mold |
| JP2004337935A (en) * | 2003-05-16 | 2004-12-02 | Matsushita Electric Ind Co Ltd | Magnesium alloy part, method for manufacturing the same and die |
| JP2006124214A (en) * | 2004-10-27 | 2006-05-18 | Canon Inc | Method of molding optical device and die for molding optical device |
| JP4922662B2 (en) * | 2006-05-17 | 2012-04-25 | トーヨーエイテック株式会社 | Machine parts and manufacturing method thereof |
| JP4962964B2 (en) * | 2007-11-16 | 2012-06-27 | 大阪府 | Glass lens mold and manufacturing method thereof |
| JP2010018453A (en) * | 2008-07-08 | 2010-01-28 | Hitachi Maxell Ltd | Metal mold for molding optical element, reproduction method of the same, and production method of optical element |
| JP2010285308A (en) * | 2009-06-10 | 2010-12-24 | Hitachi Maxell Ltd | Apparatus and method for manufacturing optical element |
-
2010
- 2010-02-05 JP JP2010024659A patent/JP5577110B2/en active Active
- 2010-12-29 CN CN201010621562.XA patent/CN102190421B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999037471A1 (en) * | 1998-01-23 | 1999-07-29 | Axxicon Moulds Eindhoven B.V. | Injection mould |
| US20020041930A1 (en) * | 1998-04-20 | 2002-04-11 | Ali Erdemir | Method to produce ultra-low friction carbon films |
| US20050126486A1 (en) * | 2002-03-14 | 2005-06-16 | Denis Teer | Apparatus and method for applying diamond-like carbon coatings |
| CN1541960A (en) * | 2003-04-28 | 2004-11-03 | 鸿富锦精密工业（深圳）有限公司 | Die assembly for producing optical glass products and manufacturing method thereof |
| CN101619455A (en) * | 2008-07-03 | 2010-01-06 | 中国科学院兰州化学物理研究所 | Super lubricating Si-doped diamond film preparation method |
Non-Patent Citations (2)
| Title |
|---|
| XINGYANG WU ET.AL: "Characteristics and tribological properties in water of Si-DLC coatings", 《DIAMOND & RELATED MATERIALS》 * |
| 柳清亮等: "非晶碳涂层在不同环境下的摩擦磨损行为研究", 《中国表面工程》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132884A (en) * | 2014-04-04 | 2016-11-16 | 奥林巴斯株式会社 | Optical element forming set of molds and the manufacture method of optical element |
| CN106132884B (en) * | 2014-04-04 | 2019-01-01 | 奥林巴斯株式会社 | The manufacturing method of optical element forming set of molds and optical element |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102190421B (en) | 2014-08-27 |
| JP5577110B2 (en) | 2014-08-20 |
| JP2011162371A (en) | 2011-08-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5669117B2 (en) | Method for manufacturing DLC film | |
| CN110777335B (en) | Temperature resistant carbon coating | |
| JP6211987B2 (en) | Mold for hot forming of Zn-plated steel sheet | |
| Brand et al. | Application of diamond-like carbon coatings on steel tools in the production of precision glass components | |
| WO2005015065B1 (en) | Valve component with multiple surface layers | |
| JP4690100B2 (en) | Mold for glass optical element and method for manufacturing glass optical element | |
| CN103214186A (en) | Glass substrate and preparation method thereof | |
| CN102190421B (en) | Mold for forming optical component, optical component thereof and manufacturing method of the optical component | |
| Lin et al. | Fabrication of High Transparency Diamond‐Like Carbon Film Coating on D263T Glass at Room Temperature as an Antireflection Layer | |
| CN100999383A (en) | Hard coating for glass molding and glass molding die having the hard coating | |
| CN101830089B (en) | Wear-resistant membrane structure, die and manufacturing method thereof | |
| JP4255292B2 (en) | Optical element molding glass material and optical element manufacturing method | |
| JP5713362B2 (en) | DLC film and DLC coated mold | |
| CN102190422A (en) | Mold for forming optical component, optical component thereof and manufacturing method of the optical component | |
| WO2011092794A1 (en) | Release film for mold for forming fine structure, and mold equipped with same | |
| KR101745544B1 (en) | Method for reduction of friction and wear by using alternating nanolayerded amorphous coatings having high elasticity and shear strength | |
| JP4822833B2 (en) | Optical glass element mold | |
| JP4667930B2 (en) | Optical element manufacturing method | |
| JP2005104068A (en) | Optical pattern forming member | |
| JP6816583B2 (en) | Glass mold mold and its manufacturing method | |
| JP4690058B2 (en) | Mold for resin molding | |
| JP4494913B2 (en) | Optical element manufacturing method | |
| JP3810022B2 (en) | Method for manufacturing optical element molding die | |
| CN116949418A (en) | DLC coating, preparation method and equipment thereof, composite coating and coated product | |
| JP2022073443A (en) | Dlc film, and component coated therewith |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |