CN102169947A - 宽角度椭圆发光二极管封装 - Google Patents
宽角度椭圆发光二极管封装 Download PDFInfo
- Publication number
- CN102169947A CN102169947A CN201010624281XA CN201010624281A CN102169947A CN 102169947 A CN102169947 A CN 102169947A CN 201010624281X A CN201010624281X A CN 201010624281XA CN 201010624281 A CN201010624281 A CN 201010624281A CN 102169947 A CN102169947 A CN 102169947A
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- CN
- China
- Prior art keywords
- led
- reflector
- encapsulation
- light
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (36)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/657935 | 2010-01-29 | ||
US12/657,935 US8350370B2 (en) | 2010-01-29 | 2010-01-29 | Wide angle oval light emitting diode package |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102169947A true CN102169947A (zh) | 2011-08-31 |
CN102169947B CN102169947B (zh) | 2016-06-01 |
Family
ID=44318603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010624281.XA Active CN102169947B (zh) | 2010-01-29 | 2010-11-23 | 宽角度椭圆发光二极管封装 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8350370B2 (zh) |
KR (1) | KR20120124468A (zh) |
CN (1) | CN102169947B (zh) |
WO (1) | WO2011091569A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4764519B1 (ja) * | 2010-01-29 | 2011-09-07 | 株式会社東芝 | Ledパッケージ |
TW201330332A (zh) * | 2012-01-02 | 2013-07-16 | Lextar Electronics Corp | 固態發光元件及其固態發光封裝體 |
DE102013100121A1 (de) * | 2013-01-08 | 2014-07-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
US11107957B2 (en) * | 2019-03-08 | 2021-08-31 | Foshan Nationstar Optoelectronics Co., Ltd. | LED device and backlight module |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005057089A (ja) * | 2003-08-05 | 2005-03-03 | Stanley Electric Co Ltd | 白色ledランプ |
CN2809880Y (zh) * | 2005-04-07 | 2006-08-23 | 廖海 | 中功率发光二极管 |
CN1996624A (zh) * | 2006-01-04 | 2007-07-11 | 徐建国 | 发光二极管—led及其封装方法和应用 |
US20090129073A1 (en) * | 2007-11-16 | 2009-05-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Illumination Assembly Having Multiple Emitters |
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US4866005A (en) | 1987-10-26 | 1989-09-12 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
US4946547A (en) | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
US5200022A (en) | 1990-10-03 | 1993-04-06 | Cree Research, Inc. | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
JP3151219B2 (ja) | 1992-07-24 | 2001-04-03 | テツセラ,インコーポレイテッド | 取り外し自在のリード支持体を備えた半導体接続構成体およびその製造方法 |
JPH06177424A (ja) | 1992-12-03 | 1994-06-24 | Rohm Co Ltd | 発光ダイオードランプおよび集合型発光ダイオード表示装置 |
JPH09321343A (ja) | 1996-05-31 | 1997-12-12 | Dowa Mining Co Ltd | 光通信用の部品装置 |
DE29825022U1 (de) | 1997-07-29 | 2004-04-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US6259608B1 (en) | 1999-04-05 | 2001-07-10 | Delphi Technologies, Inc. | Conductor pattern for surface mount devices and method therefor |
US6710373B2 (en) | 1999-09-27 | 2004-03-23 | Shih-Yi Wang | Means for mounting photoelectric sensing elements, light emitting diodes, or the like |
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KR100367182B1 (ko) | 2001-01-04 | 2003-01-09 | 이성재 | 발광다이오드 램프 |
JP2002299698A (ja) | 2001-03-30 | 2002-10-11 | Sumitomo Electric Ind Ltd | 発光装置 |
WO2002086972A1 (en) | 2001-04-23 | 2002-10-31 | Plasma Ireland Limited | Illuminator |
JP4009097B2 (ja) | 2001-12-07 | 2007-11-14 | 日立電線株式会社 | 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム |
JP3939177B2 (ja) | 2002-03-20 | 2007-07-04 | シャープ株式会社 | 発光装置の製造方法 |
TW546799B (en) | 2002-06-26 | 2003-08-11 | Lingsen Precision Ind Ltd | Packaged formation method of LED and product structure |
US7224000B2 (en) | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
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DE10255932A1 (de) | 2002-11-29 | 2004-06-17 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
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US20050077535A1 (en) | 2003-10-08 | 2005-04-14 | Joinscan Electronics Co., Ltd | LED and its manufacturing process |
TWI291770B (en) | 2003-11-14 | 2007-12-21 | Hon Hai Prec Ind Co Ltd | Surface light source device and light emitting diode |
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USD576570S1 (en) * | 2007-07-27 | 2008-09-09 | Prolight Opto Technology Corporation | Light emitting diode |
-
2010
- 2010-01-29 US US12/657,935 patent/US8350370B2/en active Active
- 2010-11-19 KR KR1020127022529A patent/KR20120124468A/ko not_active Application Discontinuation
- 2010-11-19 WO PCT/CN2010/001854 patent/WO2011091569A1/en active Application Filing
- 2010-11-23 CN CN201010624281.XA patent/CN102169947B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005057089A (ja) * | 2003-08-05 | 2005-03-03 | Stanley Electric Co Ltd | 白色ledランプ |
CN2809880Y (zh) * | 2005-04-07 | 2006-08-23 | 廖海 | 中功率发光二极管 |
CN1996624A (zh) * | 2006-01-04 | 2007-07-11 | 徐建国 | 发光二极管—led及其封装方法和应用 |
US20090129073A1 (en) * | 2007-11-16 | 2009-05-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Illumination Assembly Having Multiple Emitters |
Also Published As
Publication number | Publication date |
---|---|
CN102169947B (zh) | 2016-06-01 |
US20110186865A1 (en) | 2011-08-04 |
KR20120124468A (ko) | 2012-11-13 |
US8350370B2 (en) | 2013-01-08 |
WO2011091569A1 (en) | 2011-08-04 |
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Effective date of registration: 20210223 Address after: 516029 No.38, Hechang 6th Road East, Zhongkai high tech Zone, Huizhou City, Guangdong Province Patentee after: CREE HUIZHOU SOLID STATE LIGHTING Co.,Ltd. Address before: 516003 TCL Industrial Park, 21 Yunshan East Road, Jiangbei, Huizhou, Guangdong Patentee before: Cree Huizhou Opto Ltd. |
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Inventor after: C.K.Chen Inventor after: Zhikuan Zhang Inventor after: Y.K.Liu Inventor after: H.Liu Inventor after: X.Fei Inventor after: M.Luo Inventor after: Sheng Juzuo Inventor before: C.K.Chen Inventor before: Zhikuan Zhang Inventor before: Y.K.Liu Inventor before: H.Liu Inventor before: X.Fei Inventor before: M.Luo Inventor before: J .sheng |
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