CN102168844A - 采用印刷线路的led灯板及其生产方法 - Google Patents

采用印刷线路的led灯板及其生产方法 Download PDF

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CN102168844A
CN102168844A CN2011100068640A CN201110006864A CN102168844A CN 102168844 A CN102168844 A CN 102168844A CN 2011100068640 A CN2011100068640 A CN 2011100068640A CN 201110006864 A CN201110006864 A CN 201110006864A CN 102168844 A CN102168844 A CN 102168844A
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led wafer
polyphenylene sulfide
copper conductor
radiating substrate
led
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邓衔翔
李强
花赟
李华
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FORTUNE (JIANGSU) MULTIMEDIA Co Ltd
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Abstract

本发明公开了一种采用印刷线路的LED灯板及其生产方法，在聚苯硫醚散热基板表面设置铜导线放置槽，铜导线放置槽中设置印刷铜导线层，在聚苯硫醚散热基板表面设置LED晶片放置槽，LED晶片通过固晶银胶固定在LED晶片放置槽中，LED晶片通过金属导线与印刷铜导线连接，在LED晶片外设置将LED晶片封装的矽胶封装层，在聚苯硫醚散热基板和印刷铜导线层上表面设置覆盖层。本发明产品结构合理，利用新的导热材料，可取代传统金属材料（铝等）降低产品重量。利用光碟片生產用印刷机印刷铜/银线路、可取代传统的蚀刻工艺，提升产能，保护环境减少污染。

Description

采用印刷线路的LED灯板及其生产方法
技术领域
本发明涉及一种LED灯板及其生产方法。
背景技术
现有的LED灯板，一般采用蚀刻工艺，工作效率低、污染大；传统产品散热性能不理想，基板采用金属材料，存在重量大等缺陷。
发明内容
本发明的目的在于提供一种结构合理，工艺简便、减少污染的采用印刷线路的LED灯板及其生产方法。
本发明的技术解决方案是：
一种采用印刷线路的LED灯板，其特征是：包括聚苯硫醚散热基板，在聚苯硫醚散热基板表面设置铜导线放置槽，铜导线放置槽中设置印刷铜导线层，在聚苯硫醚散热基板表面设置LED晶片放置槽，LED晶片通过固晶银胶固定在LED晶片放置槽中，LED晶片通过金属导线与印刷铜导线连接，在LED晶片外设置将LED晶片封装的矽胶封装层，在聚苯硫醚散热基板和印刷铜导线层上表面设置覆盖层。
聚苯硫醚散热基板底部呈波浪状，聚苯硫醚散热基板的厚度为1.2~1.8mm。
铜导线放置槽的深度为0.1mm，LED晶片放置槽的深度为0.2mm，覆盖层的厚度为0.3mm。
覆盖层为聚碳酸酯材料。
一种采用印刷线路的LED灯板的生产方法，其特征是：包括下列步骤：
（1）用注塑机生产聚苯硫醚散热基板，聚苯硫醚散热基板上设置铜导线放置槽、LED晶片放置槽，并在表面预留有印刷设备和贴合设备的定位点；
（2）将印刷设备定位在印刷设备的定位点上，并将铜导线印刷在铜导线印刷槽中；将LED晶片用固晶银胶固定在LED晶片放置槽中；
（3）将贴合设备定位在贴合设备的定位点，将覆盖层与用UV光粘合覆盖在聚苯硫醚散热基板和印刷铜导线层上表面，覆盖层上预留金属线接出口；
（4）在覆盖层粘合前用金属导线连接LED晶片与印刷铜导线；
（5）在LED晶片外用矽胶封装LED晶片和所述金属导线。
印刷设备和贴合设备的定位点为同一位置。
本发明产品结构合理，利用新的导热材料，可取代传统金属材料（铝等）降低产品重量。利用光碟片生產用印刷机印刷铜/银线路、可取代传统的蚀刻工艺，提升产能，保护环境减少污染。利用COB LED 技术，直接将LED 晶片封装于 LED 灯基板上，更有利于散热，免去传统的LED 晶片封装工序，以及LED 发光颗粒贴片工序，减少加工工艺，降低生产成本。
附图说明
下面结合附图和实施例对本发明作进一步说明。
图1是本发明一个实施例的结构示意图。
图2是聚苯硫醚散热基板主视图。
图3是覆盖层主视图。
图4、图5是产品形成过程的不同中间状态图。
具体实施方式
一种采用印刷线路的LED灯板的生产方法，包括下列步骤：
（1）用注塑机生产聚苯硫醚散热基板，聚苯硫醚散热基板上设置铜导线放置槽、LED晶片放置槽，并在表面预留有印刷设备和贴合设备的定位点，印刷设备和贴合设备的定位点为同一位置10；
（2）将印刷设备定位在印刷设备的定位点上，并将铜导线印刷在铜导线印刷槽中；将LED晶片用固晶银胶固定在LED晶片放置槽中；
（3）将贴合设备定位在贴合设备的定位点，将覆盖层与用UV光粘合覆盖在聚苯硫醚散热基板和印刷铜导线层上表面，覆盖层上预留金属线接出口；
（4）在覆盖层粘合前用金属导线连接LED晶片与印刷铜导线；
（5）在LED晶片外用矽胶封装LED晶片和所述金属导线。
聚苯硫醚散热基板底部呈波浪状，聚苯硫醚散热基板的厚度为1.2~1.8mm。铜导线放置槽的深度为0.1mm，LED晶片放置槽的深度为0.2mm，覆盖层的厚度为0.3mm。覆盖层为聚碳酸酯材料。
得到的产品为采用印刷线路的LED灯板，包括聚苯硫醚散热基板1，在聚苯硫醚散热基板表面设置铜导线放置槽2，铜导线放置槽中设置印刷铜导线层3，在聚苯硫醚散热基板表面设置LED晶片放置槽4，LED晶片5通过固晶银胶6固定在LED晶片放置槽4中，LED晶片通过金属导线7与印刷铜导线连接，在LED晶片外设置将LED晶片封装的矽胶封装层8，在聚苯硫醚散热基板和印刷铜导线层上表面设置覆盖层9。

Claims (6)

1.一种采用印刷线路的LED灯板，其特征是：包括聚苯硫醚散热基板，在聚苯硫醚散热基板表面设置铜导线放置槽，铜导线放置槽中设置印刷铜导线层，在聚苯硫醚散热基板表面设置LED晶片放置槽，LED晶片通过固晶银胶固定在LED晶片放置槽中，LED晶片通过金属导线与印刷铜导线连接，在LED晶片外设置将LED晶片封装的矽胶封装层，在聚苯硫醚散热基板和印刷铜导线层上表面设置覆盖层。
2.根据权利要求1所述的采用印刷线路的LED灯板，其特征是：聚苯硫醚散热基板底部呈波浪状，聚苯硫醚散热基板的厚度为1.2~1.8mm。
3.根据权利要求1或2所述的采用印刷线路的LED灯板，其特征是：铜导线放置槽的深度为0.1mm，LED晶片放置槽的深度为0.2mm，覆盖层的厚度为0.3mm。
4.根据权利要求1或2所述的采用印刷线路的LED灯板，其特征是：覆盖层为聚碳酸酯材料。
5.一种权利要求1所述的采用印刷线路的LED灯板的生产方法，其特征是：包括下列步骤：
（1）用注塑机生产聚苯硫醚散热基板，聚苯硫醚散热基板上设置铜导线放置槽、LED晶片放置槽，并在表面预留有印刷设备和贴合设备的定位点；
（2）将印刷设备定位在印刷设备的定位点上，并将铜导线印刷在铜导线印刷槽中；将LED晶片用固晶银胶固定在LED晶片放置槽中；
（3）将贴合设备定位在贴合设备的定位点，将覆盖层与用UV光粘合覆盖在聚苯硫醚散热基板和印刷铜导线层上表面，覆盖层上预留金属线接出口；
（4）在覆盖层粘合前用金属导线连接LED晶片与印刷铜导线；
（5）在LED晶片外用矽胶封装LED晶片和所述金属导线。
6.根据权利要求5所述的采用印刷线路的LED灯板的生产方法，其特征是：印刷设备和贴合设备的定位点为同一位置。
CN2011100068640A 2011-01-13 2011-01-13 采用印刷线路的led灯板及其生产方法 Pending CN102168844A (zh)

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CN104763936A (zh) * 2015-04-15 2015-07-08 东莞市闻誉实业有限公司 装饰灯
CN104763933A (zh) * 2015-04-15 2015-07-08 东莞市闻誉实业有限公司 壁画灯
CN111063676A (zh) * 2019-12-06 2020-04-24 深圳市强生光电科技有限公司 一种用于理疗仪的led红外灯板及其制备工艺

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