CN102166573B - Device for immersion tin wire post-treatment of circuit board - Google Patents
Device for immersion tin wire post-treatment of circuit board Download PDFInfo
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- CN102166573B CN102166573B CN 201110147706 CN201110147706A CN102166573B CN 102166573 B CN102166573 B CN 102166573B CN 201110147706 CN201110147706 CN 201110147706 CN 201110147706 A CN201110147706 A CN 201110147706A CN 102166573 B CN102166573 B CN 102166573B
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- washing cylinder
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Abstract
The invention discloses a device for immersion tin wire post-treatment of a circuit board. The device comprises a first reverse osmosis washing cylinder, a back immersion cylinder, a second reverse osmosis washing cylinder and a thermal washing cylinder connected in sequence. At least one group of spraying pipes are arranged in the first, the second reverse osmosis washing cylinders and the thermal washing cylinder; each spraying pipe is provided with a plurality of spray nozzles spraying upwards and downwards; and ultrasonic devices are mounted in the back immersion cylinder and the thermal washing cylinder. Ultrasonic devices are mounted in the back immersion cylinder and the thermal washing cylinder in a posttreatment wire of the immersion tin wire, so that the cleaning effect on liquid medicine in a jack panel is strengthened; through the improvement of the number of the spraying pipes and the spray nozzles on the spraying pipes in the reverse osmosis washing cylinders in the posttreatment wire of the immersion tin wire, the cleaning effect of the board surface of the circuit board is strengthened, so that the defect that the green oil jack panel is not cleaned in the immersion tin working procedure is overcome. The invention can be widely applied to the manufacturing field of printed circuit boards (PCB).
Description
Technical field
The present invention relates to a kind of PCB surface treating apparatus, especially a kind of wiring board sinks the solder after-treatment device.
Background technology
Heavy solder post processing cleaning cylinder is the important component part on the heavy solder equipment during wiring board is produced, and the main effect of this section is a liquid medicine residual in the clean-out opening.
Difficulty cleans up in the heavy tin metapore of green oil jack panel, if cleaning dirty in the hole, cross high temperature test such as Reflow Soldering after liquid medicine evaporate the tin face that pollutes, cause bore edges to produce defectives such as the jaundice of tin face, blackout, and then influence the product solderability.So the cleaning performance of heavy solder post processing plays crucial effects to the quality of wiring board.Heavy solder before transforming can only be produced general common no green oil jack panel, must occur cleaning sordid defective when green oil jack panel (not full and half jack panel of consent) sinks tin if produce.For satisfying the hardware requirement of making the heavy sheet tin of green oil consent, must clean section to heavy solder post processing and transform, to reach excellent cleaning effect.
Summary of the invention
The technical problem that the present invention will solve is: a kind of heavy solder after-treatment device that the section cleaning performance is cleaned in heavy tin post processing that improves is provided, and said heavy solder after-treatment device can clean the green oil jack panel that heavy tin surfaces is handled.
In order to solve the problems of the technologies described above, the technical scheme that the present invention adopted is:
A kind of wiring board sinks the solder after-treatment device; Comprise successively first counter-infiltration washing cylinder that connects, after soak cylinder, second counter-infiltration washing cylinder and hot water wash cylinder; All be provided with at least one group of jet pipe in said first, second counter-infiltration washing cylinder and the hot water wash cylinder; Said jet pipe is provided with a plurality of spray and nozzles of spray down gone up, and soaks in cylinder and the hot water wash cylinder after said and installs ultrasonic unit additional.
Further as preferred embodiment, said first counter-infiltration washing cylinder is divided into three sections, and said jet pipe is positioned at second section and the 3rd section of first counter-infiltration washing cylinder.
Further as preferred embodiment, said second counter-infiltration washing cylinder is divided into three sections, and said jet pipe is positioned at first section and second section of first counter-infiltration washing cylinder.
Further as preferred embodiment, said hot water wash cylinder is divided into three sections, and said ultrasonic unit is positioned at first section, and said jet pipe is positioned at second section and the 3rd section.
Further as preferred embodiment, the said quantity that is provided with every section inner nozzle of jet pipe is 2, and going up the number that sprays nozzle on every group of jet pipe is 16 or 17, and the number of following spray nozzle is 25.
The invention has the beneficial effects as follows: the present invention is installed ultrasonic unit additional through soaking in cylinder and the hot water wash cylinder after in heavy solder post processing line, has strengthened the cleaning performance to liquid medicine in the jack panel plate; The present invention has strengthened the effect that wiring board plate face cleans through nozzle quantity on counter-infiltration washing cylinder inner nozzle and the jet pipe in the heavy solder post processing line is improved, thereby has overcome the cleaning dirty defective that the green oil jack panel occurs in heavy tin operation.
Description of drawings
Be described further below in conjunction with the accompanying drawing specific embodiments of the invention:
Fig. 1 is the structure chart of the heavy solder after-treatment device of wiring board of the present invention;
Fig. 2 is the structure chart of jet pipe of the present invention.
The specific embodiment
The main flow process of the heavy solder of wiring board is following: oil removing → little erosion → preimpregnation → heavy tin → counter-infiltration (RO) washing → after soak Ionix SF → counter-infiltration washing → Tin postdip270k → hot water wash → hot-air seasoning.The present invention relates generally to the after-treatment device of heavy solder in the wiring board generation; With reference to Fig. 1, comprise successively first counter-infiltration washing cylinder 1 that connects, after soak cylinder 2, second counter-infiltration washing cylinder 3 and hot water wash cylinder 4, said first counter-infiltration washing cylinder 1 is divided into three sections; Second section and the 3rd section of said first counter-infiltration washing 1 is respectively equipped with two groups of jet pipes 6; With reference to Fig. 2, said jet pipe 6 is provided with a plurality of nozzles 7, and the nozzle number of last spray is 16/17; The nozzle number of following spray is 25/25, with stiffener face cleaning performance; Soak after said that to add two class frequencys in the cylinder 2 be 40KHz, power is 330KW ultrasonic unit 5, has strengthened the cleaning performance to liquid medicine in the consent plate hole; Said second ion washing cylinder 3 is divided into three sections, wherein is provided with two groups of jet pipes 6 in first, second section, and the nozzle number of last spray is 16/17, and the nozzle number of following spray is 25/25, with stiffener face cleaning performance; Said hot water wash cylinder 4 is divided into three sections; Wherein first section to add two class frequencys be 40KHz, power is 330KW ultrasonic unit 5, has strengthened the cleaning performance to liquid medicine in the consent plate hole; In second section and the 3rd section, be provided with two groups of jet pipes 6; The nozzle number of last spray is 16/17, and the nozzle number of following spray is 25/25, with stiffener face cleaning performance.
More than be that preferable enforcement of the present invention is specified; But the invention is not limited to said embodiment; Those of ordinary skill in the art make all equivalent variations or replacement under the prerequisite of spirit of the present invention, also can doing, and distortion that these are equal to or replacement all are included in the application's claim institute restricted portion.
Claims (2)
1. the heavy solder after-treatment device of a wiring board; Comprise successively first counter-infiltration washing cylinder (1) that connects, after soak cylinder (2), second counter-infiltration washing cylinder (3) and hot water wash cylinder (4); All be provided with at least one group of jet pipe (6) in said first, second counter-infiltration washing cylinder (1,3) and the hot water wash cylinder (4); Said jet pipe is provided with a plurality of nozzles (7) of going up spray and spraying down, it is characterized in that: soak after said and install ultrasonic unit (5) in cylinder (2) and the hot water wash cylinder (4) additional; Said first counter-infiltration washing cylinder (1) is divided into three sections, and said jet pipe (6) is positioned at second section and the 3rd section of first counter-infiltration washing cylinder (1); Said second counter-infiltration washing cylinder (3) is divided into three sections, and said jet pipe (6) is positioned at first section and second section of second counter-infiltration washing cylinder (3); Said hot water wash cylinder (4) is divided into three sections, and said ultrasonic unit (5) is positioned at first section, and said jet pipe is positioned at second section and the 3rd section.
2. a kind of wiring board according to claim 1 sinks the solder after-treatment device; It is characterized in that: the said quantity that is provided with every section inner nozzle (6) of jet pipe (6) is 2; The number that every group of jet pipe (6) gone up the spray nozzle is 16 or 17, and the number of following spray nozzle is 25.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110147706 CN102166573B (en) | 2011-06-03 | 2011-06-03 | Device for immersion tin wire post-treatment of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110147706 CN102166573B (en) | 2011-06-03 | 2011-06-03 | Device for immersion tin wire post-treatment of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102166573A CN102166573A (en) | 2011-08-31 |
| CN102166573B true CN102166573B (en) | 2012-12-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110147706 Active CN102166573B (en) | 2011-06-03 | 2011-06-03 | Device for immersion tin wire post-treatment of circuit board |
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| CN (1) | CN102166573B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686904B (en) * | 2017-02-15 | 2019-01-01 | 深圳市景旺电子股份有限公司 | A method of reducing pcb board ionic contamination after heavy tin surfaces processing |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6118511A (en) * | 1998-04-23 | 2000-09-12 | Kabushiki Kaisha Advanced Display | Manufacturing method of liquid crystal display panel and cleaning apparatus for use therein |
| CN1485150A (en) * | 2002-08-19 | 2004-03-31 | 大日本屏影象制造株式会社 | Substrate processing device and rinsing apparatus |
| CN1504556A (en) * | 2002-11-30 | 2004-06-16 | ���µ�����ҵ��ʽ���� | Washing agent, washing unit and washing process |
| CN101990363A (en) * | 2010-08-06 | 2011-03-23 | 雷玉菡 | Gold plating method for electronic circuit board |
| CN202137145U (en) * | 2011-06-03 | 2012-02-08 | 开平依利安达电子第三有限公司 | Postprocessing device for immersion tin lines of circuit boards |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008212862A (en) * | 2007-03-06 | 2008-09-18 | Hitachi High-Technologies Corp | Method and device for cleaning panel and method for manufacturing flat panel display |
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2011
- 2011-06-03 CN CN 201110147706 patent/CN102166573B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6118511A (en) * | 1998-04-23 | 2000-09-12 | Kabushiki Kaisha Advanced Display | Manufacturing method of liquid crystal display panel and cleaning apparatus for use therein |
| CN1485150A (en) * | 2002-08-19 | 2004-03-31 | 大日本屏影象制造株式会社 | Substrate processing device and rinsing apparatus |
| CN1504556A (en) * | 2002-11-30 | 2004-06-16 | ���µ�����ҵ��ʽ���� | Washing agent, washing unit and washing process |
| CN101990363A (en) * | 2010-08-06 | 2011-03-23 | 雷玉菡 | Gold plating method for electronic circuit board |
| CN202137145U (en) * | 2011-06-03 | 2012-02-08 | 开平依利安达电子第三有限公司 | Postprocessing device for immersion tin lines of circuit boards |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2008-212862A 2008.09.18 |
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| CN102166573A (en) | 2011-08-31 |
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Effective date of registration: 20180809 Address after: 529235 -01, 318 West Temple Road, Shuikou Town, Kaiping, Jiangmen, Guangdong. Patentee after: Kaiping anda Electronics Co. Ltd. Address before: 529235 No. 318, West Temple Road, Sha Gang District, Kaiping, Jiangmen, Guangdong Patentee before: Kaiping Elec&Eltek E&E Magnetic Products Limited |