CN102157399B - Automatic charging system of semiconductor packaging equipment - Google Patents
Automatic charging system of semiconductor packaging equipment Download PDFInfo
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- CN102157399B CN102157399B CN2011100292186A CN201110029218A CN102157399B CN 102157399 B CN102157399 B CN 102157399B CN 2011100292186 A CN2011100292186 A CN 2011100292186A CN 201110029218 A CN201110029218 A CN 201110029218A CN 102157399 B CN102157399 B CN 102157399B
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Abstract
The invention relates to an automatic charging system of semiconductor packaging equipment. The system mainly comprises a conveying device, a track adjusting device, a basket, an ejection device, a distribution device, a power device and a track sensor. Compared with the prior art, the automatic charging system which the invention requests to protect has the following beneficial effects: the ejection device is used for conveying the whole group of frames or carrier plates to the assigned positions and then the distribution device is used for realizing single separation of the frames or the carrier plates to realize full automatic charging of the equipment; the system has a simple structure, does not occupy space, is stable to operate, has low cost and greatly improves the production efficiency and the equipment utilization efficiency; and the structure of the system is easy to adjust when different products are processed.
Description
Technical field
The present invention relates to semiconductor technology, relate in particular to the semiconductor packaging device automatical feeding system.
Background technology
In the semiconductor packaging process process, product all will pass through the process of material loading, operation, blanking in each procedure.
Present fully automatic feeding equipment volume is huge, is difficult to for the high encapsulation factory of space availability ratio accomplish that the economy on the space uses; Simultaneously, existing automatic charging device structure is complicated, failure rate is high, and manufacturing cost, maintenance cost are all very high; In addition, because complex structural designs often needs the time of labor to change the material loading parts, production efficiency there is certain influence when the production products of different specifications.
Though traditional hand material-uploading style occupation of land space is few, efficient is low, and also sprains semiconductor-sealing-purpose framework or support plate easily in the manual transport process, and then has influence on subsequent handling and end product quality.
Summary of the invention
The technical problem that the present invention solves is: how to realize a kind of simple in structure, cost economy, take up an area of little automatical feeding system efficiently again.
For solving the problems of the technologies described above, the present invention provides the semiconductor packaging device automatical feeding system, comprises that five parts constitute: the one, and conveyer, the 2nd, rail adjustment device, the 3rd, material basket, the 4th, Lifting Device, the 5th, feeding-distribution device;
Said conveyer is a symmetrical structure, comprises track, conveyer belt and contiguous block, and said conveyer belt is fixed in the inboard of said track, and the outside of track is fixed on the said contiguous block;
Said rail adjustment device is provided with sole-plate and track slide block, is equipped with screw on said sole-plate and the track slide block, and sole-plate is fixed on the track slide block through screw, the lower ends of the contiguous block of sole-plate and said conveyer;
Said material basket is made up of the cylindricality draw-in groove, and an end of said cylindricality draw-in groove is fixed on the track of said conveyer;
Said Lifting Device is embedded in the centre of said conveyer and is positioned at the below of said material basket; Comprise liftout cylinder, die pad and liftout cylinder fixed block; Said die pad is connected in said liftout cylinder top; The liftout cylinder is fixed on the equipment by said liftout cylinder fixed block, and said conveyer is respectively in the both sides of the die pad of said Lifting Device;
Said feeding-distribution device is symmetrical structure and is fixed on the contiguous block of said conveyer both sides, comprises the sub-material cylinder and divides tablet, and tablet was connected on the sub-material cylinder in said minute.
Alternatively, said automatical feeding system also comprises supply unit, and said supply unit is provided with direct current machine and links to each other with said conveyer through shaft coupling.
Alternatively, said automatical feeding system also comprises rail sensor, and said rail sensor is fixed on the said track.
Alternatively, the cylindricality draw-in groove of said material basket is that four L shaped prisms and four rectangular horn shapes are arranged.
Compared with prior art; The semiconductor packaging device automatical feeding system that the present invention asks for protection; Utilize Lifting Device to put in order framing or support plate is delivered to assigned address; The fully automatic feeding that separates the equipment of realization again through the monolithic of feeding-distribution device implementation framework or support plate, native system is simple in structure, do not take up space, structure is prone to adjustment, stable, with low cost when processing different product, has improved production efficiency and equipment efficiency of usage greatly.
Description of drawings
Fig. 1 is the sketch map of disassembling of semiconductor packaging device automatical feeding system in the embodiment of the invention;
Fig. 2 is the partial schematic diagram of conveyer in the semiconductor packaging device automatical feeding system in the embodiment of the invention;
Fig. 3 is the sketch map of Lifting Device in the semiconductor packaging device automatical feeding system in the embodiment of the invention;
Fig. 4 is the partial schematic diagram of feeding-distribution device in the semiconductor packaging device automatical feeding system in the embodiment of the invention;
Fig. 5 is the sketch map that piles up framework of waiting to drop into the material basket;
Fig. 6 is the sketch map of semiconductor packaging device automatical feeding system in the embodiment of the invention.
Embodiment
A lot of details have been set forth in the following description so that make much of the present invention.But the present invention can implement much to be different from alternate manner described here, and those skilled in the art can do similar popularization under the situation of intension of the present invention, so the present invention does not receive the restriction of following disclosed practical implementation.
Secondly, the present invention utilizes sketch map to be described in detail, and when the embodiment of the invention was detailed, for ease of explanation, said sketch map was an instance, and it should not limit the scope of the present invention's protection at this.
Do detailed explanation below in conjunction with the accompanying drawing specific embodiments of the invention.
As shown in Figure 1, semiconductor packaging device automatical feeding system provided by the invention comprises conveyer, rail adjustment device, material basket, Lifting Device, feeding-distribution device, supply unit and rail sensor 4.
Said conveyer is a symmetrical structure, is respectively in the both sides of said Lifting Device die pad 1; Conveyer comprises track 3, conveyer belt 6 and contiguous block, and conveyer belt 6 is fixed in the inboard of said track 3, and the outside of track 3 is fixed on the said contiguous block; Said supply unit is provided with direct current machine 7, and links to each other with conveyer through shaft coupling 8, and is for system transmissions provides the electric power support, as shown in Figure 2.
The lower ends of the contiguous block of said rail adjustment device and said conveyer; The rail adjustment device is provided with sole-plate 14 and track slide block 11; Be equipped with screw on sole-plate 14 and the track slide block 11; Sole-plate 14 is fixed on the track slide block 11 through screw; When framework or the support plate change width of processing need be adjusted track 3 width, only need the corresponding screwhole position locking that sole-plate 14 slides on the track slide block 11 is got final product.
Said material basket is made up of cylindricality draw-in groove 5, and an end of said cylindricality draw-in groove 5 is fixed on the track 3 of said conveyer; The cylindricality draw-in groove 5 of said material basket is that four L shaped prisms and four rectangular horn shapes are arranged, can with fall into pile up framework 12 fitly frame the material basket.
Transferred framework or support plate are carried in the below that said Lifting Device is embedded in the centre of said conveyer and is positioned at said material basket; As shown in Figure 3; Lifting Device comprises liftout cylinder 15, die pad 1 and liftout cylinder fixed block 13; Liftout cylinder 15 is fixed on the equipment by liftout cylinder fixed block 13; Die pad 1 is connected in liftout cylinder 15 tops and the effect through liftout cylinder 15 moves up and down, so that framework or support plate are pushed up the height of needs, for next step sub-material is prepared.
Said feeding-distribution device is symmetrical structure and is fixed on the contiguous block of said conveyer both sides; As shown in Figure 4, feeding-distribution device comprises sub-material cylinder 9, divides tablet 10 and sub-material linear bearing 2, divides tablet 10 to be connected on the sub-material cylinder 9, and sub-material linear bearing 2 is used for fixing sub-material cylinder 9; Owing to be symmetrical structure; When sub-material cylinder 9 is done the time spent; The branch tablet 10 that is arranged in conveyer track 3 both sides stretches out and is inserted into to track 3 inside and piles up framework 12, and the bottom tailpiece framework or the support plate that will pile up in framework 12 or the support plate are dialled from whole folding from going out, dialled from tailpiece framework that goes out or support plate to be sent to the operations that assigned address carries out this operation immediately; Divide this moment tablet 10 kept in the center by sub-material cylinder 9 effect and prepare so cycle operation for sub-material next time.
As shown in Figure 5 piling up in framework 12 sketch mapes is not difficult to draw, and because of the thickness factor of product packaging body itself, it is unsettled to pile up 12 of frameworks outside reality, and then the branch tablet 10 of being convenient to feeding-distribution device inserts and dials from the tailpiece framework that piles up framework 12 bottoms.
In addition, this automatical feeding system also comprises rail sensor 4, and said rail sensor 4 is fixed on the track 3, in order to whether product is arranged in the detection track, for the accurate instruction of equipment provides safeguard.
Though the present invention discloses as above with preferred embodiment, the present invention is defined in this.Any those skilled in the art are not breaking away from the spirit and scope of the present invention, all can do various changes and modification, so protection scope of the present invention should be as the criterion with claim institute restricted portion.
Claims (3)
1. the semiconductor packaging device automatical feeding system is characterized in that, said automatical feeding system comprises that following five parts constitute: the one, and conveyer, the 2nd, rail adjustment device, the 3rd, material basket, the 4th, Lifting Device, the 5th, feeding-distribution device;
Said conveyer is a symmetrical structure, comprises track, conveyer belt and contiguous block, and said conveyer belt is fixed in the inboard of said track, and the outside of track is fixed on the said contiguous block;
Said rail adjustment device is provided with sole-plate and track slide block, is equipped with screw on said sole-plate and the track slide block, and sole-plate is fixed on the track slide block through screw, the lower ends of the contiguous block of sole-plate and said conveyer;
Said material basket is made up of the cylindricality draw-in groove, and an end of said cylindricality draw-in groove is fixed on the track of said conveyer, and the cylindricality draw-in groove of said material basket is that four L shaped prisms and four rectangular horn shapes are arranged;
Said Lifting Device is embedded in the centre of said conveyer and is positioned at the below of said material basket; Comprise liftout cylinder, die pad and liftout cylinder fixed block; Said die pad is connected in said liftout cylinder top; The liftout cylinder is fixed on the equipment by said liftout cylinder fixed block, and said conveyer is respectively in the both sides of the die pad of said Lifting Device;
Said feeding-distribution device is symmetrical structure and is fixed on the contiguous block of said conveyer both sides, comprises the sub-material cylinder and divides tablet, and tablet was connected on the sub-material cylinder in said minute.
2. semiconductor packaging device automatical feeding system as claimed in claim 1 is characterized in that: also comprise supply unit, said supply unit is provided with direct current machine and links to each other with said conveyer through shaft coupling.
3. semiconductor packaging device automatical feeding system as claimed in claim 1 is characterized in that: also comprise rail sensor, said rail sensor is fixed on the said track.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100292186A CN102157399B (en) | 2011-01-27 | 2011-01-27 | Automatic charging system of semiconductor packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100292186A CN102157399B (en) | 2011-01-27 | 2011-01-27 | Automatic charging system of semiconductor packaging equipment |
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| Publication Number | Publication Date |
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| CN102157399A CN102157399A (en) | 2011-08-17 |
| CN102157399B true CN102157399B (en) | 2012-07-04 |
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| CN2011100292186A Active CN102157399B (en) | 2011-01-27 | 2011-01-27 | Automatic charging system of semiconductor packaging equipment |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103236957A (en) * | 2013-04-27 | 2013-08-07 | 刘伟雄 | Network quality monitoring method based on self-similarity model |
| CN104882397B (en) * | 2015-05-28 | 2017-08-25 | 先进光电器材（深圳）有限公司 | A kind of pair of soldering tip automatic loading and unloading device |
| CN104907790A (en) * | 2015-06-23 | 2015-09-16 | 吴中区横泾博尔机械厂 | Material ejecting device of pressing fit mechanism of fully-automatic electric material pressing fit machine |
| CN105032837A (en) * | 2015-08-23 | 2015-11-11 | 华东交通大学 | Plate separation type automatic plate insertion device |
| CN107443804A (en) * | 2017-08-31 | 2017-12-08 | 何芬 | A kind of outer packing automatic placement machine |
| CN116387218B (en) * | 2023-06-01 | 2023-08-18 | 苏州双远电子科技有限公司 | Etching device for photovoltaic diode |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2982097A (en) * | 1996-07-12 | 1998-02-09 | Fico B.V. | Device for separate removal from a holder or placing into a holder of stackable carriers of electronic components |
| CN201063335Y (en) * | 2007-04-06 | 2008-05-21 | 均豪精密工业股份有限公司 | Device with multiple feeding guide rails for installing semiconductor chip |
| CN201117644Y (en) * | 2007-09-20 | 2008-09-17 | 中国电子科技集团公司第二研究所 | Full-automatic silicon chip charging-discharging machine |
| CN101477959B (en) * | 2009-01-08 | 2010-09-29 | 上海交通大学 | Loading device for multiple standard chip kit supply unit |
| CN201994273U (en) * | 2011-01-27 | 2011-09-28 | 南通富士通微电子股份有限公司 | Automatic material charging system of semiconductor packaging equipment |
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| CN102157399A (en) | 2011-08-17 |
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Address after: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee before: Fujitsu Microelectronics Co., Ltd., Nantong |