AU2982097A - Device for separate removal from a holder or placing into a holder of stackable carriers of electronic components - Google Patents

Device for separate removal from a holder or placing into a holder of stackable carriers of electronic components

Info

Publication number
AU2982097A
AU2982097A AU29820/97A AU2982097A AU2982097A AU 2982097 A AU2982097 A AU 2982097A AU 29820/97 A AU29820/97 A AU 29820/97A AU 2982097 A AU2982097 A AU 2982097A AU 2982097 A AU2982097 A AU 2982097A
Authority
AU
Australia
Prior art keywords
holder
placing
electronic components
separate removal
stackable carriers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU29820/97A
Inventor
Wilhelmus Geertruda Richardus Maria Derde
Wilhelmus Hendrikus Johannes Harmsen
Henricus Jozephus Marinus Lemmers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fico BV
Original Assignee
Fico BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico BV filed Critical Fico BV
Publication of AU2982097A publication Critical patent/AU2982097A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
AU29820/97A 1996-07-12 1997-06-06 Device for separate removal from a holder or placing into a holder of stackable carriers of electronic components Abandoned AU2982097A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL1003577 1996-07-12
NL1003577 1996-07-12
PCT/NL1997/000321 WO1998002903A1 (en) 1996-07-12 1997-06-06 Device for separate removal from a holder or placing into a holder of stackable carriers of electronic components

Publications (1)

Publication Number Publication Date
AU2982097A true AU2982097A (en) 1998-02-09

Family

ID=19763195

Family Applications (1)

Application Number Title Priority Date Filing Date
AU29820/97A Abandoned AU2982097A (en) 1996-07-12 1997-06-06 Device for separate removal from a holder or placing into a holder of stackable carriers of electronic components

Country Status (2)

Country Link
AU (1) AU2982097A (en)
WO (1) WO1998002903A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102157399B (en) * 2011-01-27 2012-07-04 南通富士通微电子股份有限公司 Automatic charging system of semiconductor packaging equipment

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710940A (en) * 1980-06-25 1982-01-20 Toshiba Corp Supplying method for lead frame
US4524601A (en) * 1983-05-13 1985-06-25 Bernardi Carl E Automatic apparatus for downsetting lead frame strips
JP2627191B2 (en) * 1989-06-26 1997-07-02 株式会社新川 Lead frame separation device

Also Published As

Publication number Publication date
WO1998002903A1 (en) 1998-01-22

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