CN102142423A - Circuit substrate and package of light emitting diode - Google Patents
Circuit substrate and package of light emitting diode Download PDFInfo
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- CN102142423A CN102142423A CN2011100388988A CN201110038898A CN102142423A CN 102142423 A CN102142423 A CN 102142423A CN 2011100388988 A CN2011100388988 A CN 2011100388988A CN 201110038898 A CN201110038898 A CN 201110038898A CN 102142423 A CN102142423 A CN 102142423A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
The invention relates to a package of a light emitting diode, which comprises a carrying device, a chip of the light emitting diode, and packaging colloid, wherein the carrying device comprises a carrying plate, a first electrode, a first pin, a second electrode and a second pin; the first electrode, the first pin, the second electrode and the second pin are all arranged on the carrying plate, and the carrying plate is provided with two counter bores to expose the first electrode and the second electrode respectively; the first pin is connected with the edge of the first electrode; the second pin is connected with the edge of the second electrode; the chip of the light emitting diode is arranged on the first pin, and is electrically connected with the first pin and the second pin; and the packaging colloid is arranged on the carrying plate, and covers the first pin, the second pin and the chip of the light emitting diode, the packaging colloid is provided with two counter bores to expose the first electrode and the second electrode respectively, both the first electrode and the second electrode have two cutting edges which are adjacent to each other and located at corners, and the two cutting edges are not in parallel to each other.
Description
This case is that application number is dividing an application of 200810100702.1 cases.
Technical field
The invention relates to a kind of circuit base plate and LED package, and particularly relevant for a kind of cost of manufacture lower circuit base plate and LED package.
Background technology
Compared to conventional bulb, light-emitting diode has characteristics such as volume is little, life-span length, power saving, no mercury pollution.Therefore, along with the luminous efficiency of light-emitting diode constantly promotes, light-emitting diode replaces fluorescent lamp (fluorescent lamp) and white heat bulb (incandescent lamp) gradually in some field.For instance, (liquid crystal display, the light source of backlight LCD), fascia (instrument panel), light source and some lighting device of traffic signal light have all adopted light-emitting diode for scanner light source, the LCD of reaction at a high speed.
Fig. 1 is the schematic perspective view of known a kind of LED package.Fig. 2 is the schematic diagram of known a kind of circuit base plate, and the circuit base plate of Fig. 2 can be distinguished into first pin, first electrode, second pin, second electrode of a plurality of Fig. 1.
Please refer to Fig. 1, LED package 100 comprises a support plate D, one first pin 110, one first electrode 120, one second pin 130, one second electrode 140, a light-emitting diode chip for backlight unit (LED chip) 150, one packing colloid (encapsulant) 160.First pin 110, first electrode 120, second pin 130 and second electrode 140 are disposed on the support plate D.
Please refer to Fig. 2, circuit base plate 200 can be distinguished into the carrier with support plate D, first pin 110, first electrode 120, second pin 130 and second electrode 140 of a plurality of Fig. 1 along many cutting path A1, A2.Circuit base plate 200 has a plurality of pin units 210.Each pin units 210 all has one first pin 110, one second pin 130 and share terminal 212, and each shared terminal 212 all is to be formed by connecting by one first electrode 120 and one second electrode 140.First pin 110 of each pin units 210 is connected with the edge of second electrode 140 with first electrode 120 all respectively with second pin 130.Each pin units 210 all can cut into two conductive structures, and wherein conductive structure for example is first pin 110 and first electrode 120 or second pin 130 and second electrode 140.
In known technology, provide substrate (not illustrating) mostly and metal level is carried out patterning to form circuit base plate 200 with comprehensive covering metal level.Yet the arranging density of the pin units 210 of circuit base plate 200 is low, so that the utilance of the substrate of unit are is low, and each pin units 210 only can cut into two conductive structures.In other words, the number of the base material of the unit are conductive structure that can make is less.Therefore, the cost of manufacture of conductive structure is higher.
Summary of the invention
The present invention proposes a kind of circuit base plate, and the arranging density of its pin units is bigger, and its each pin units can cut into more conductive structure.
The present invention proposes a kind of LED package in addition, and its cost of manufacture is lower.
The present invention proposes a kind of circuit base plate, and it comprises a basic unit and a plurality of pin units arranged into an array, and basic unit has a plurality of counterbores, and described pin units is disposed in the basic unit.Each pin units comprises share terminal and at least three pins.Shared terminal region is divided into a plurality of electrodes connected to one another.Described pin stretches out from the edge of sharing terminal, and each pin stretches out from the edge of one of them electrode respectively.Described counterbore exposes the shared terminal of described pin units respectively.
In one embodiment of this invention, the number of pins in each pin units is four.
In one embodiment of this invention, the pattern of pin units is identical in fact.
In one embodiment of this invention, the pattern of each pin units is essentially some symmetrical patterns, and the pin in each pin units comprises 2 first pins and 2 second pins, and the pattern of each first pin is different with the pattern of each second pin.
In one embodiment of this invention, each first pin has a chip bearing portion, and each second pin does not have a chip bearing portion.
In one embodiment of this invention, each first pin also has a routing junction surface, and each first pin has at least one anti-overflow glue breach between chip bearing portion and routing junction surface.
In one embodiment of this invention, each first pin also has a routing junction surface, and each first pin has an anti-overflow glue opening between chip bearing portion and routing junction surface.
In one embodiment of this invention, the each point symmetrical pattern is a symmetrical centre with a central point of each shared terminal.
In one embodiment of this invention, the pattern of each pin units is essentially a line symmetric graph case, and the pin in each pin units comprises 2 first pins and 2 second pins, and the pattern of each first pin is different with the pattern of each second pin.
In one embodiment of this invention, each first pin has a chip bearing portion, and each second pin does not have a chip bearing portion.
In one embodiment of this invention, each first pin also has a routing junction surface, and each first pin has at least one anti-overflow glue breach between chip bearing portion and routing junction surface.
In one embodiment of this invention, each first pin also has a routing junction surface, and each first pin has an anti-overflow glue opening between chip bearing portion and routing junction surface.
In one embodiment of this invention, each line symmetric graph case is symmetrical in a symmetry axis, and symmetry axis is parallel to column direction, and passes through a central point of each shared terminal.
In one embodiment of this invention, the pin units that is arranged in same row comprises a plurality of first pin units and a plurality of second pin units, each first pin units has one first pattern, and each second pin units has one second pattern, first pattern is different with second pattern, and wherein first pin units and second pin units are alternately arranged along column direction.
In one embodiment of this invention, the pattern of each first pin units and each second pin units is essentially a line symmetric graph case, pin in each first pin units comprises 2 first pins and 2 second pins, and the pin in each second pin units comprises 2 first pins and 2 second pins, and the pattern of each first pin is different with the pattern of each second pin.
In one embodiment of this invention, each first pin has a chip bearing portion, and each second pin does not have a chip bearing portion.
In one embodiment of this invention, each first pin also has a routing junction surface, and each first pin has at least one anti-overflow glue breach between chip bearing portion and routing junction surface.
In one embodiment of this invention, each first pin also has a routing junction surface, and each first pin has an anti-overflow glue opening between chip bearing portion and routing junction surface.
In one embodiment of this invention, each line symmetric graph case is symmetrical in a symmetry axis, and symmetry axis is parallel to line direction, and passes through a central point of each shared terminal.
In one embodiment of this invention, the pattern of each first pin units can be consistent with the pattern of each second pin units after the Rotate 180 degree.
In one embodiment of this invention, the pattern of each first pin units and each second pin units is essentially some symmetrical patterns, pin in each first pin units comprises four first pins, and the pin in each second pin units comprises four second pins, and the pattern of each first pin is different with the pattern of each second pin.
In one embodiment of this invention, each first pin has a chip bearing portion, and each second pin does not have a chip bearing portion.
In one embodiment of this invention, each first pin also has a routing junction surface, and each first pin has at least one anti-overflow glue breach between chip bearing portion and routing junction surface.
In one embodiment of this invention, each first pin also has a routing junction surface, and each first pin has an anti-overflow glue opening between chip bearing portion and routing junction surface.
In one embodiment of this invention, the number of pins in each pin units is three.
In one embodiment of this invention, the pin units that is arranged in same row comprises a plurality of first pin units and a plurality of second pin units, each first pin units has one first pattern, and each second pin units has one second pattern, first pattern is different with second pattern, and wherein first pin units and second pin units are alternately arranged along column direction.
In one embodiment of this invention, each first pin units comprises one first pin and 2 second pins, and each second pin units comprises 2 first pins and one second pin, and the pattern of each first pin is different with the pattern of each second pin.
In one embodiment of this invention, each first pin units comprises 3 first pins, and each second pin units comprises 3 second pins, and the pattern of each first pin is different with the pattern of each second pin.
In one embodiment of this invention, each first pin has a chip bearing portion, and each second pin does not have a chip bearing portion.
In one embodiment of this invention, each first pin also has a routing junction surface, and each first pin has at least one anti-overflow glue breach between chip bearing portion and routing junction surface.
In one embodiment of this invention, each first pin also has a routing junction surface, and each first pin has an anti-overflow glue opening between chip bearing portion and routing junction surface.
The present invention proposes a kind of LED package, and it comprises a carrier, a light-emitting diode chip for backlight unit and a packing colloid, and wherein carrier comprises a support plate, one first electrode, one first pin, one second electrode and one second pin.First electrode, first pin, second electrode and second pin all are disposed on the support plate, and support plate has two counterbores to expose first electrode and second electrode respectively.First pin is connected with the edge of first electrode.Second pin is connected with the edge of second electrode.Light-emitting diode chip for backlight unit is disposed on first pin and with first pin and second pin and electrically connects.Packing colloid is disposed on the support plate and coats first pin, second pin and light-emitting diode chip for backlight unit, wherein packing colloid has two counterbores to expose first electrode and second electrode respectively, and that first electrode and second electrode all have is two adjacent one another are and be positioned at the edge that cuts in corner, and two to cut the edge not parallel each other.
In one embodiment of this invention, two angles that cut between the edge that first electrode is had are 90 degree, and two angles that cut between the edge that second electrode is had are 90 degree.
In one embodiment of this invention, first electrode had two cut that edge and second electrode had two cut the edge and all trim with the edge of packing colloid.
In one embodiment of this invention, first pin has a chip bearing portion and a routing junction surface, and light-emitting diode chip for backlight unit is disposed in the chip bearing portion and with the routing junction surface and electrically connects.
In one embodiment of this invention, first pin has at least one anti-overflow glue breach between chip bearing portion and routing junction surface.
In one embodiment of this invention, each first pin has an anti-overflow glue opening between chip bearing portion and routing junction surface.
In one embodiment of this invention, the material of packing colloid comprises a printing opacity colloid.
In sum, pin units arranging density of the present invention is higher, and each pin units can be divided at least three conductive structures.Therefore, the substrate of unit are can make more pin units, and each pin units can be divided into more conductive structure.In other words, the number of the substrate of the unit are conductive structure that can make is more.Therefore, the cost of manufacture of conductive structure of the present invention is lower.
Description of drawings
For above and other objects of the present invention, feature and advantage can be become apparent, embodiment cited below particularly, and conjunction with figs. are described in detail below, wherein:
Fig. 1 is a kind of schematic perspective view of known luminescence diode package.
Fig. 2 is a kind of schematic diagram of known line substrate, and the circuit base plate of Fig. 2 can be distinguished into first pin, first electrode, second pin, second electrode of a plurality of Fig. 1.
Fig. 3 A and Fig. 3 B are the schematic diagram of the circuit base plate of one embodiment of the invention.
Fig. 4～Figure 11 is the schematic diagram of multiple variation kenel of the circuit base plate of Fig. 3 A.
Figure 12 A is the schematic perspective view of the LED package of one embodiment of the invention.
Figure 12 B is by the view on the indicated direction of arrow V among Figure 12 A.
Embodiment
Fig. 3 A and Fig. 3 B are the schematic diagram of the circuit base plate of one embodiment of the invention, and Fig. 4～Figure 11 is the schematic diagram of multiple variation kenel of the circuit base plate of Fig. 3 A.
Please refer to Fig. 3 A, the circuit base plate L of present embodiment comprises a F of basic unit and a plurality of pin units arranged into an array 300, wherein pin units 300 all is disposed on the F of basic unit, and the pin units 300 of arrayed is meant that described pin units 300 is arranged in multiple lines and multiple rows on the F of basic unit.The F of basic unit has a plurality of counterbore F1.Each pin units 300 comprises share terminal 310 and at least three pins 320, and in present embodiment, each pin units 300 has four pins 320.Share terminal 310 and divide into a plurality of electrode E connected to one another.Described pin 320 stretches out from the edge of sharing terminal 310, and each pin 320 stretches out from the edge of one of them electrode E respectively.Each counterbore F1 that the F of basic unit is had exposes one of them shared terminal 310 of described pin units 300 respectively.
In addition, Fig. 3 A schematically illustrates many cutting path A1, A2 with the cutting path during line of cut base board L after the representative, by Fig. 3 A as can be known, each pin units 300 of circuit base plate L can be divided into four conductive structures with a cutting path A2 wherein by cutting path A1 wherein, and each conductive structure is made of an electrode E and a connected pin 320.
It should be noted that compared to known technology pin units 300 arranging densities of present embodiment are higher, and each pin units 300 can be divided at least three conductive structures.Therefore, the substrate of unit are can make more pin units, and each pin units can be divided into more conductive structure.In other words, the number of the substrate of the unit are conductive structure that can make is more.Therefore, the cost of manufacture of the conductive structure of present embodiment is lower.
In present embodiment, the pattern of each pin units 300 is identical in fact.The pattern of each pin units 300 can be some symmetrical patterns in fact, and four pins 320 of each pin units 300 can be divided into 2 first pins 322 and 2 second pins 324, and the pattern of each first pin 322 is different with the pattern of each second pin 324.For instance, each first pin 322 has a 322a of chip bearing portion, and each second pin 324 does not have a 322a of chip bearing portion.And the each point symmetrical pattern for example is that the central point C with each shared terminal 310 is a symmetrical centre.In present embodiment, first pin 322 of each pin units 300 and second pin 324 for example are to arrange along 312 compartment of terrains, edge of sharing terminal 310.In other words, wherein one first pin 322 can be between 2 second pins 324, and wherein one second pin 324 can be between 2 first pins 322, and right the present invention is not exceeded with this kind arrangement mode.
In addition, first pin 322 also can have a routing junction surface 322b, routing junction surface 322b be suitable for be disposed at the 322a of chip bearing portion afterwards on chip (not illustrating) engage by routing.And, for the colloid overflow of joint chip after avoiding and the 322a of chip bearing portion influences the yield of routing processing procedure to routing junction surface 322b, present embodiment is at least one anti-overflow glue breach B of formation (Fig. 3 A illustrates two anti-overflow glue breach B as representing) between the 322a of chip bearing portion of first pin 322 and routing junction surface 322b.Thus, but aforementioned colloid overflow to anti-overflow glue breach B, and can overflow to routing junction surface 322b.In addition, please refer to Fig. 3 B,, also can between the 322a of chip bearing portion of first pin 322 and routing junction surface 322b, form an anti-overflow glue opening 0 for preventing the colloid overflow.
Multiple variation kenel with the pin units of the next circuit base plate that will introduce Fig. 3 A in detail.
Please refer to Fig. 4, in present embodiment, the pattern of each pin units 300a is essentially a line symmetric graph case, and the pin 320 among each pin units 300a comprises 2 first pins 322 and 2 second pins 324.And in present embodiment, each line symmetric graph case is symmetrical in a symmetry axis X, and symmetry axis X is parallel to column direction, and passes through the central point C of each shared terminal 310.In present embodiment, 2 first pins 322 of each pin units 300a are along the edge 312 adjacent arrangements of sharing terminal 310 and all be positioned at the left side of sharing terminal 310,2 second pins 324 are along the edge 312 adjacent arrangements of sharing terminal 310 and all be positioned at the right side of sharing terminal 310, and right the present invention is not exceeded with this kind arrangement mode.
It should be noted that, in each embodiment of following Fig. 5～Figure 11, the pin units that is arranged in same row comprises a plurality of first pin units and a plurality of second pin units, each first pin units has one first pattern, and each second pin units has one second pattern, and first pattern is different with second pattern.Wherein, first pin units and second pin units are for example alternately arranged along column direction.In addition, in present embodiment, following Fig. 5～Figure 11 illustrates a plurality of first pin units arranged into an array and second pin units, and the pin units that is arranged in delegation can be all first pin units or be all second pin units.Certainly, in other embodiment, also can be first pin units and second pin units alternately arranges along column direction, and first pin units and second pin units are along alternately arrangement of line direction.
Please refer to Fig. 5, in present embodiment, the pattern of each first pin units 300b and each second pin units 300c is essentially a line symmetric graph case.And each line symmetric graph case is symmetrical in a symmetry axis Y in this way, and symmetry axis Y is parallel to line direction, and passes through the central point C of each shared terminal 310.In addition, in present embodiment, the pattern of each first pin units 300b can be consistent with the pattern of each second pin units 300c after the Rotate 180 degree.
Pin among each first pin units 300b comprises 2 first pins 322 and 2 second pins 324, and the pin among each second pin units 300c comprises 2 first pins 322 and 2 second pins 324.Particularly, 2 first pins 322 of each first pin units 300b for example be along the adjacent arrangement of edge 312a of the first half of sharing terminal 310 and lay respectively at share terminal 310 about two sides, 2 second pins 324 along the adjacent arrangement of edge 312b of the Lower Half of sharing terminal 310 and lay respectively at share terminal 310 about two sides.And, 2 first pins 322 of each second pin units 300c for example be along the adjacent arrangement of edge 312b of the Lower Half of sharing terminal 310 and lay respectively at share terminal 310 about two sides, 2 second pins 324 along the adjacent arrangement of edge 312a of the first half of sharing terminal 310 and lay respectively at share terminal 310 about two sides.Arrangement mode that it should be noted that first pin 322 of aforementioned each first pin units 300b and each second pin units 300c and second pin 324 is not in order to qualification the present invention only for illustrating.
Please refer to Fig. 6, in present embodiment, the pattern of each first pin units 300d and each second pin units 300e is essentially some symmetrical patterns.Pin among each first pin units 300d for example has four first pins 322, and the pin among each second pin units 300e for example has four second pins 324.Specifically, four first pins 322 among each first pin units 300d are connected with edge 312c, 312d, 312e, the 312f of right lower quadrant with upper left quarter, lower left quarter, the upper right quarter of shared terminal 310 respectively.Similarly, four second pins 324 of each second pin units 300e are connected with edge 312c, 312d, 312e, the 312f of right lower quadrant with upper left quarter, lower left quarter, the upper right quarter of shared terminal 310 respectively.Arrangement mode that it should be noted that first pin 322 of aforementioned each first pin units 300d and each second pin units 300e and second pin 324 is not in order to qualification the present invention only for illustrating.
In addition, each first pin units 300d that Fig. 6 illustrated and the pattern of each second pin units 300e can also be line symmetric graph cases, and aforementioned line symmetric graph case has two symmetry axis X, Y, wherein symmetry axis X is parallel to column direction, and symmetry axis Y is parallel to line direction, and all by the central point C of each shared terminal 310, so this is not in order to limit the present invention only for illustrating for two symmetry axis X, Y.
What deserves to be mentioned is that in each embodiment of following Fig. 7～Figure 10, each pin units can have three pins.And each first pin units comprises one first pin and 2 second pins, and each second pin units comprises 2 first pins and one second pin.Each embodiment of Fig. 7～Figure 10 introduces each first pin units and first pin of each second pin units and multiple arrangement mode of second pin, and right the present invention is not exceeded with described arrangement mode, knows this operator when doing various changes and retouching.
Please refer to Fig. 7, in present embodiment, first pin 322 of each first pin units 300f can be connected with edge 312c, 312d, the 312e of upper right quarter with upper left quarter, the lower left quarter of shared terminal 310 respectively with 2 second pins 324, and 2 first pins 322 of each second pin units 300g can be connected with edge 312c, 312f, the 312e of upper right quarter with upper left quarter, the right lower quadrant of shared terminal 310 respectively with one second pin 324.
Please refer to Fig. 8, in present embodiment, first pin 322 of each first pin units 300h and 2 second pins 324 can be respectively with the right lower quadrant of shared terminal 310, upper right quarter, lower left quarter with edge 312f, 312e, 312d be connected, and respectively 2 first pins 322 of second pin units 300i can be connected with edge 312c, 312f, the 312d of lower left quarter with upper left quarter, the right lower quadrant of shared terminal 310 respectively with one second pin 324.
Please refer to Fig. 9, in present embodiment, first pin 322 of each first pin units 300j and 2 second pins 324 can be respectively with the upper left quarter of shared terminal 310, upper right quarter, right lower quadrant with edge 312c, 312e, 312f be connected, and respectively 2 first pins 322 of second pin units 300k can be connected with edge 312c, 312d, the 312e of upper right quarter with upper left quarter, the lower left quarter of shared terminal 310 respectively with one second pin 324.
Please refer to Figure 10, in present embodiment, first pin 322 of each first pin units 300m and 2 second pins 324 can be respectively with the upper right quarter of shared terminal 310, upper left quarter, lower left quarter with edge 312e, 312c, 312d be connected, and respectively 2 first pins 322 of second pin units 300n can be connected with edge 312e, 312f, the 312c of upper left quarter with upper right quarter, the right lower quadrant of shared terminal 310 respectively with one second pin 324.
Please refer to Figure 11, in present embodiment, each pin units can have three pins, and wherein each first pin units 300p comprises 3 first pins 322, and each second pin units 300q comprises 3 second pins 324.For instance, 3 first pins 322 of each first pin units 300p can be respectively with the upper left quarter of shared terminal 310, upper right quarter, right lower quadrant with edge 312c, 312e, 312f is connected, and respectively 3 second pins 324 of second pin units 300q can be connected with edge 312c, 312d, the 312e of upper right quarter with upper left quarter, the lower left quarter of shared terminal 310 respectively.
Below will introduce in detail with the made LED package of the circuit base plate of Fig. 3 A or Fig. 4～Figure 11.
Figure 12 A is the schematic perspective view of the LED package of one embodiment of the invention, and Figure 12 B is by the view on the indicated direction of arrow V among Figure 12 A.
Please be simultaneously with reference to Figure 12 A and Figure 12 B, the LED package 500 of present embodiment comprises a light-emitting diode chip for backlight unit 410, a packing colloid 420 and a carrier 430, and wherein carrier 430 comprises a support plate 432, one first electrode E1, one first pin 322, one second electrode E2, one second pin 324.The first electrode E1, first pin 322, the second electrode E2 and second pin 324 all are disposed on the support plate 432, and support plate 432 has two counterbore 432a to expose the first electrode E1 and the second electrode E2 respectively.
In present embodiment, for the colloid overflow of avoiding engaging light-emitting diode chip for backlight unit 410 and the 322a of chip bearing portion to routing junction surface 322b, first pin 322 can have at least one anti-overflow glue breach B between 322a of chip bearing portion and routing junction surface 322b.In other embodiment, each first pin 322 can have an anti-overflow glue opening (not illustrating) between 322a of chip bearing portion and routing junction surface 322b.
The first electrode E1 that it should be noted that present embodiment divides one of them of four electrode E forming along a cutting path A1 and cutting path A2 with the share terminal 310 of Fig. 3 A.Similarly, the second electrode E2 is divided one of them of four electrode E forming along another cutting path A1 and cutting path A2 as hereinbefore by another shared terminal 310.Therefore, compared to known technology, first electrode E1 of present embodiment and the area of the second electrode E2 are respectively less than the first known electrode 120 and the area (please refer to Fig. 1) of second electrode 140.Thus, the volume of the LED package 500 of present embodiment can be less than the volume of known LED package 100.
The first electrode E1 and the second electrode E2 all have two adjacent one another are and be positioned at packing colloid 420 the corner cut edge R1, R2, and two to cut edge R1, R2 not parallel each other.In present embodiment, two angles that cut between edge R1, the R2 that the first electrode E1 is had for example are 90 degree, and two angles that cut between edge R1, the R2 that the second electrode E2 is had for example are 90 degree.Certainly, in other embodiment, two angles that cut between edge R1, the R2 that the first electrode E1 and the second electrode E2 are had also can be other angles.
In addition, the first electrode E1 had two cut that edge R1, R2 and the second electrode E2 had two cut edge R1, R2 and all trim with the edge of packing colloid 420.For instance, what the first electrode E1 was had two cuts edge R1, R2 and trims with two edges 422,424 of packing colloid 420 respectively, and what the second electrode E2 was had two cuts edge R1, R2 and trim with two edges 426,424 of packing colloid 420 respectively.
In sum, pin units arranging density of the present invention is higher, and each pin units can be divided at least three conductive structures.Therefore, the substrate of unit are can make more pin units, and each pin units can be divided into more conductive structure.In other words, the number of the substrate of the unit are conductive structure that can make is more.Therefore, the cost of manufacture of conductive structure of the present invention is lower.In addition, also dispose anti-overflow glue breach or anti-overflow glue opening between the chip bearing portion of first pin of the present invention and the routing junction surface, influence the yield of routing processing procedure with the colloid overflow of avoiding joint chip and chip bearing portion to the routing junction surface.Moreover because the area of first and second electrode of LED package of the present invention is less, therefore the volume of LED package of the present invention is less.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; any person with usual knowledge in their respective areas; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when looking being as the criterion that claim scope of the present invention defined.
Claims (7)
1. a LED package is characterized in that, comprising:
One carrier comprises:
One support plate has two counterbores;
One first electrode is disposed on this support plate, and described counterbore one of them expose this first electrode;
One first pin is disposed on this support plate and with the edge of this first electrode and is connected;
One second electrode is disposed on this support plate, and wherein another of described counterbore exposes this second electrode;
One second pin is disposed on this support plate and with the edge of this second electrode and is connected;
One light-emitting diode chip for backlight unit is disposed on this first pin and electrically connects with this first pin and this second pin; And
One packing colloid, be disposed on this support plate and coat this first pin, this second pin and this light-emitting diode chip for backlight unit, wherein this first electrode and this second electrode all have two adjacent one another arely and be positioned at the edge that cuts in corner, and two to cut the edge not parallel each other.
2. LED package as claimed in claim 1 is characterized in that, wherein this first electrode had two to cut angles between the edge be 90 degree, and two angles that cut between the edge that this second electrode is had are 90 degree.
3. LED package as claimed in claim 1 is characterized in that, wherein this first electrode had two cut that edge and this second electrode had two cut the edge and all trim with the edge of this packing colloid.
4. LED package as claimed in claim 1 is characterized in that, wherein this first pin has a chip bearing portion and a routing junction surface, and this light-emitting diode chip for backlight unit is disposed in this chip bearing portion and electrically connect with this routing junction surface.
5. LED package as claimed in claim 4 is characterized in that, wherein this first pin has at least one anti-overflow glue breach between this chip bearing portion and this routing junction surface.
6. LED package as claimed in claim 4 is characterized in that, wherein respectively this first pin has an anti-overflow glue opening between this chip bearing portion and this routing junction surface.
7. LED package as claimed in claim 1 is characterized in that, wherein the material of this packing colloid comprises a printing opacity colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110038898.8A CN102142423B (en) | 2008-05-16 | 2008-05-16 | Circuit substrate and package of light emitting diode |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110038898.8A CN102142423B (en) | 2008-05-16 | 2008-05-16 | Circuit substrate and package of light emitting diode |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200810100702A Division CN101582402B (en) | 2008-05-16 | 2008-05-16 | Circuit base plate |
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| CN102142423A true CN102142423A (en) | 2011-08-03 |
| CN102142423B CN102142423B (en) | 2014-11-26 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6383835B1 (en) * | 1995-09-01 | 2002-05-07 | Canon Kabushiki Kaisha | IC package having a conductive material at least partially filling a recess |
| CN1380702A (en) * | 2001-04-09 | 2002-11-20 | 株式会社东芝 | Luminescent device |
| US6534799B1 (en) * | 2000-10-03 | 2003-03-18 | Harvatek Corp. | Surface mount light emitting diode package |
| US20070216274A1 (en) * | 2006-03-17 | 2007-09-20 | 3M Innovative Properties Company | Illumination assembly with enhanced thermal conductivity |
| CN101051665A (en) * | 2006-04-05 | 2007-10-10 | 三星电机株式会社 | Light emitting diode package having anodized insulation layer and fabrication method therefor |
| TWM328674U (en) * | 2007-08-02 | 2008-03-11 | Everlight Electronics Co Ltd | Light emitting diode |
-
2008
- 2008-05-16 CN CN201110038898.8A patent/CN102142423B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6383835B1 (en) * | 1995-09-01 | 2002-05-07 | Canon Kabushiki Kaisha | IC package having a conductive material at least partially filling a recess |
| US6534799B1 (en) * | 2000-10-03 | 2003-03-18 | Harvatek Corp. | Surface mount light emitting diode package |
| CN1380702A (en) * | 2001-04-09 | 2002-11-20 | 株式会社东芝 | Luminescent device |
| US20070216274A1 (en) * | 2006-03-17 | 2007-09-20 | 3M Innovative Properties Company | Illumination assembly with enhanced thermal conductivity |
| CN101051665A (en) * | 2006-04-05 | 2007-10-10 | 三星电机株式会社 | Light emitting diode package having anodized insulation layer and fabrication method therefor |
| TWM328674U (en) * | 2007-08-02 | 2008-03-11 | Everlight Electronics Co Ltd | Light emitting diode |
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| Publication number | Publication date |
|---|---|
| CN102142423B (en) | 2014-11-26 |
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Address after: China Taiwan New Taipei city forest region of the road 6 No. 8 Applicant after: Everlight Electronics Co.,Ltd. Address before: The central road Tucheng Chinese Taiwan New Taipei City three lane 76 No. 25 Applicant before: Everlight Electronics Co.,Ltd. |
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Effective date of registration: 20180118 Address after: Wujiang economic and Technological Development Zone, Suzhou City, Jiangsu, Jiangsu Province, Zhongshan North Road No. 2135 Patentee after: Everlight Electronics (China) Co.,Ltd. Address before: China Taiwan New Taipei city forest region of the road 6 No. 8 Patentee before: Everlight Electronics Co.,Ltd. |