CN102142419A - Two-sided lead frame structure - Google Patents
Two-sided lead frame structure Download PDFInfo
- Publication number
- CN102142419A CN102142419A CN2010101198685A CN201010119868A CN102142419A CN 102142419 A CN102142419 A CN 102142419A CN 2010101198685 A CN2010101198685 A CN 2010101198685A CN 201010119868 A CN201010119868 A CN 201010119868A CN 102142419 A CN102142419 A CN 102142419A
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- China
- Prior art keywords
- frame structure
- load bearing
- connecting rod
- conducting wire
- wire frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention discloses a two-sided lead frame structure. The two-sided lead frame structure comprises a first connecting rod and a second connecting rod which are parallel to each other, a plurality of first lead frames, a plurality of second lead frames, a plurality of first supporting columns and a plurality of second supporting columns, wherein the first lead frames are provided with a first bearing seat and two first lead pins respectively; the first bearing seats are arranged outside the first connecting rod; the first lead pins are arranged between the first connecting rod and the second connecting rod; the second lead frames are provided with a second bearing seat and two second lead pins respectively; the second bearing seats are arranged outside the second connecting rod; the second lead pins are arranged between the first connecting rod and the second connecting rod; the first supporting columns and the first bearing seats are arranged on a same side of the first connecting rod; the first supporting columns are longer than the first bearing seats; the second supporting columns and the second bearing seats are arranged on the same side of the second connecting rod; and the second supporting columns are longer than the second bearing seats.
Description
Technical field
The invention relates to a kind of conducting wire frame structure, and particularly about a kind of bilateral conducting wire frame structure.
Background technology
Electronic industry is in the epoch of small profits now, the manufacturer that can control cost more, could under Limited resources, earn a profit, yet, keep falling in the price of product and to keep certain profit again, have only and reduce Material Cost and promote process capability, can make the production gross profit maintain certain level.
Yet, being subjected to the influence of product relevant design and technological factor thereof, the material cost of product is controlled, fine ratio of product also is difficult for improving, and jointly, makes the adjustment space of cost of goods manufactured very limited, ideal as the profit that is obtained also is not so good as to expect.Be with, how to set about to reduce production costs from product itself or its technology, be the real primary problem that solves of each tame manufacturer that is.
Summary of the invention
The purpose of this invention is to provide a kind of bilateral conducting wire frame structure, is to design support column in conducting wire frame structure, produces friction to prevent to overlap gold thread and the magazine finished in operation, and then the structure of protection gold thread.In addition, bilateral staggered lead pin increases the configuration density of lead frame, effectively reduces the material cost of product.
According to an aspect of the present invention, propose a kind of bilateral conducting wire frame structure, it comprises head rod and second connecting rod, several first lead frames, several second lead frames, several first support columns and several second support columns that is parallel to each other.First lead frame has first load bearing seat and two first lead pins, and wherein, first load bearing seat is arranged on the outside of head rod, and the first lead pin is arranged between the head rod and second connecting rod.Second lead frame has second load bearing seat and two second lead pins, and wherein, second load bearing seat is arranged on the outside of second connecting rod, and the second lead pin is arranged between the head rod and second connecting rod.First support column and first load bearing seat are arranged on the homonymy of head rod, and wherein, the length of first support column is greater than the length of first load bearing seat.Second support column and second load bearing seat are arranged on the homonymy of second connecting rod, and wherein, the length of second support column is greater than the length of second load bearing seat.
The present invention compared to the useful technique effect of prior art is: bilateral conducting wire frame structure of the present invention, the lead pin of its first lead frame and second lead frame is to be staggered, two space availability ratio between the connecting rod are increased, and improve the configuration density of lead frame; So, Material Cost is effectively reduced, and can increase the operation production capacity; In addition, the support column of bilateral conducting wire frame structure is the distance that can keep gold thread and magazine, is not destroyed with the protection gold thread, more can promote operation yield and productive profit.
Description of drawings
For foregoing of the present invention can be become apparent, below in conjunction with accompanying drawing preferred embodiment of the present invention is elaborated, wherein:
Figure 1A is the schematic diagram according to a kind of bilateral conducting wire frame structure of preferred embodiment of the present invention.
Figure 1B, Fig. 1 C are the partial enlarged drawings of the bilateral conducting wire frame structure of Figure 1A.
Embodiment
Please refer to Figure 1A to Fig. 1 C, Figure 1A is the schematic diagram according to a kind of bilateral conducting wire frame structure of preferred embodiment of the present invention, and Figure 1B, Fig. 1 C are the partial enlarged drawings of the bilateral conducting wire frame structure of Figure 1A.Shown in Figure 1A, bilateral conducting wire frame structure 10 comprises head rod 110, second connecting rod 120, several first lead frames 130 and several second lead frames 140.The head rod 110 and second connecting rod 120 are arranged in parallel, and wherein, head rod 110 is in order to couple together first lead frame 130, and second connecting rod 120 is in order to couple together second lead frame 140.Bilateral conducting wire frame structure 10 more comprises several first support columns 150 and several second support columns 160, and wherein, first support column 150 and second support column 160 are arranged at the outside of the head rod 110 and second connecting rod 120 respectively.
In the present embodiment, head rod 110, second connecting rod 120, first lead frame 130, second lead frame 140, first support column 150 and second support column 160 of bilateral conducting wire frame structure 10 are integrally formed, its length L t can set according to technological ability, and the quantity of said elements does not also limit.
Shown in Figure 1B, first lead frame 130 has first load bearing seat 132 and two first lead pins 134, and wherein, first load bearing seat 132 is arranged on the outside of head rod 110.The first lead pin 134 is arranged between the head rod 110 and second connecting rod 120 (seeing Figure 1A), and the preferably vertical head rod 110 and second connecting rod 120.First load bearing seat 132 has first bowl of cup 136, in order to carry at least one light-emitting component, as the crystal grain of light-emitting diode.First support column 150 and first load bearing seat, the 132 adjacent homonymies that are arranged on head rod 110, wherein, the length L 1 of first support column 150 is greater than the length L 2 of first load bearing seat 132.
Shown in Fig. 1 C, second lead frame 140 has second load bearing seat 142 and two second lead pins 144, and wherein, second load bearing seat 142 is arranged on the outside of second connecting rod 120.The second lead pin 144 is arranged between the head rod 110 (seeing Figure 1A) and second connecting rod 120, and the preferably vertical head rod 11 and second connecting rod 120.Second load bearing seat 142 has second bowl of cup 146, and wherein, second bowl of cup 146 and first bowl of cup 136 (seeing Figure 1B) are back-to-back settings.Second support column 160 and second load bearing seat, the 142 adjacent homonymies that are arranged on second connecting rod 120, wherein, the length L 3 of second support column 160 is greater than the length L 4 of second load bearing seat 142.
Preferably, the second lead pin 144 and the first lead pin 134 are staggered between the head rod 110 and second connecting rod 120, with the space between two connecting rods of abundant use, the lead frame configuration density of bilateral conducting wire frame structure 10 are more improved.For instance, compare with habitual monolateral conducting wire frame structure, see Figure 1A, in the conducting wire frame structure of identical total length L t, the bilateral conducting wire frame structure of present embodiment can have more 2 times quantity, and the width W of total only is about 1.3 times of habitual its width W ' of conducting wire frame structure.
The advantage of the bilateral conducting wire frame structure 10 of present embodiment further is described with material area utilance (plain conductor frame area occupied).Suppose under the condition of the wide W ' of material (width of habitual structure), length overall L and lead frame quantity S, to calculate the habitual monolateral conducting wire frame structure and the material area utilance of the bilateral conducting wire frame structure of present embodiment:
Habitual: W ' * Lt/S
Present embodiment: 1.3W ' * Lt/2S
Compared as can be known by above-listed two formulas, the material area utilization rate of the bilateral conducting wire frame structure of present embodiment is about 65% of habitual structure, that is the shared material area of the plain conductor frame of present embodiment is less, therefore can reduce material cost.In addition, compared to habitual structure, the bilateral conducting wire frame structure of present embodiment is to hold more lead frame quantity under the identical materials area, is therefore promoted the production capacity of operation.
Shown in Figure 1A, preferably, first support column 150 is equally spaced to be arranged between first load bearing seat 132 for another example, and second support column 160 is equally spaced to be arranged between second load bearing seat 142.In addition, first support column 150 and second support column 160 are preferably up-narrow and down-wide structure, that is first support column 150 is connected the root broad of the head rod 110 and second connecting rod 120 with second support column 160.
On be set forth in first load bearing seat 132 and the 142 adjacent side settings of second load bearing seat first support column 150 and second support column 160 have bigger length, mainly be the gold thread on the guardwire frame in operation.Illustrate; in the operation of gold thread overlap joint; must be with bilateral conducting wire frame structure 10 whole being erected in the magazine; suppose wherein on one side; overlapped as the gold thread (not illustrating) of first lead frame 130 among Figure 1A and to have finished; in the time will carrying out the gold thread overlap joint operation of second lead frame 140; be bound to earlier that whole bilateral conducting wire frame structure 10 is invertedly; at this moment; not only can in magazine, support whole bilateral conducting wire frame structure 10 by first support column 150 of first load bearing seat, 132 adjacent sides; and the spacing that can keep first load bearing seat 132 and gold thread and magazine prevents that gold thread and magazine from producing friction, is not destroyed in operation with the protection gold thread.
The disclosed bilateral conducting wire frame structure of the above embodiment of the present invention has two head rods that be arranged in parallel and second connecting rod, in order to a plurality of first lead frames and second lead frame are coupled together.The lead pin of first lead frame and second lead frame is to be staggered, and two space availability ratio between the connecting rod is increased, and improve the configuration density of lead frame.So, Material Cost is effectively reduced, and can increase the operation production capacity.In addition, the support column of bilateral conducting wire frame structure is the distance that can keep gold thread and magazine, is not destroyed with the protection gold thread, more can promote operation yield and productive profit.
In sum, though the present invention with the preferred embodiment exposure as above, yet it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when doing various changes that are equal to or replacement.Therefore, protection scope of the present invention is when looking accompanying being as the criterion that the application's claim scope defined.
Claims (10)
1. a bilateral conducting wire frame structure is characterized in that, comprising:
A head rod that is parallel to each other and one second connecting rod;
A plurality of first lead frames respectively have one first load bearing seat and two first lead pins, and wherein, these first load bearing seats are arranged on the outside of this head rod, and these first lead pins are arranged between this head rod and this second connecting rod;
A plurality of second lead frames respectively have one second load bearing seat and two second lead pins, and wherein, these second load bearing seats are arranged on the outside of this second connecting rod, and these second lead pins are arranged between this head rod and this second connecting rod;
A plurality of first support columns are arranged on the homonymy of this head rod with these first load bearing seats, and wherein, the length of these first support columns is greater than the length of these first load bearing seats; And
A plurality of second support columns are arranged on the homonymy of this second connecting rod with these second load bearing seats, and wherein, the length of these second support columns is greater than the length of these second load bearing seats.
2. bilateral conducting wire frame structure according to claim 1 is characterized in that, these first support columns and the adjacent setting of these first load bearing seats.
3. bilateral conducting wire frame structure according to claim 2 is characterized in that, these first support columns equally spaced are arranged between these first load bearing seats.
4. bilateral conducting wire frame structure according to claim 2 is characterized in that, these second support columns and the adjacent setting of these second load bearing seats.
5. bilateral conducting wire frame structure according to claim 4 is characterized in that, these second support columns equally spaced are arranged between these second load bearing seats.
6. bilateral conducting wire frame structure according to claim 1 is characterized in that, these first lead pins and these second lead pins are staggered between this head rod and this second connecting rod.
7. bilateral conducting wire frame structure according to claim 1 is characterized in that, these first lead pins are vertical this head rod and this second connecting rod with these second lead pins.
8. bilateral conducting wire frame structure according to claim 1, it is characterized in that, these first load bearing seats respectively have one first bowl of cup, and these second load bearing seats respectively have one second bowl of cup, and these first bowl of cup and these second bowl of cup are respectively in order to carry at least one light-emitting component.
9. bilateral conducting wire frame structure according to claim 8 is characterized in that, these first bowl of cup and these second bowl of cup are back-to-back settings.
10. bilateral conducting wire frame structure according to claim 1 is characterized in that, these first support columns and these second support columns are respectively to be up-narrow and down-wide structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010119868 CN102142419B (en) | 2010-02-03 | 2010-02-03 | Two-sided lead frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010119868 CN102142419B (en) | 2010-02-03 | 2010-02-03 | Two-sided lead frame structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102142419A true CN102142419A (en) | 2011-08-03 |
| CN102142419B CN102142419B (en) | 2013-04-10 |
Family
ID=44409821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010119868 Expired - Fee Related CN102142419B (en) | 2010-02-03 | 2010-02-03 | Two-sided lead frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102142419B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2254186A (en) * | 1991-03-23 | 1992-09-30 | Samsung Electronics Co Ltd | Semiconductor lead frame |
| JPH11260992A (en) * | 1998-03-31 | 1999-09-24 | Rohm Co Ltd | Lead frame, semiconductor device and manufacture semiconductor device |
| CN1337743A (en) * | 2000-08-04 | 2002-02-27 | 台湾通用器材股份有限公司 | Package uith for semiconductor device and its manufacture |
| US20030071344A1 (en) * | 2001-10-16 | 2003-04-17 | Shinko Electric Industries Co., Ltd. | Leadframe and method of manufacturing a semiconductor device using the same |
| CN2805092Y (en) * | 2005-05-11 | 2006-08-09 | 慧高精密工业股份有限公司 | Improved structure for conducting wire erectin belt |
| CN201181700Y (en) * | 2008-04-03 | 2009-01-14 | 勤益股份有限公司 | Wire frame and electric connecting structure |
-
2010
- 2010-02-03 CN CN 201010119868 patent/CN102142419B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2254186A (en) * | 1991-03-23 | 1992-09-30 | Samsung Electronics Co Ltd | Semiconductor lead frame |
| JPH11260992A (en) * | 1998-03-31 | 1999-09-24 | Rohm Co Ltd | Lead frame, semiconductor device and manufacture semiconductor device |
| CN1337743A (en) * | 2000-08-04 | 2002-02-27 | 台湾通用器材股份有限公司 | Package uith for semiconductor device and its manufacture |
| US20030071344A1 (en) * | 2001-10-16 | 2003-04-17 | Shinko Electric Industries Co., Ltd. | Leadframe and method of manufacturing a semiconductor device using the same |
| CN2805092Y (en) * | 2005-05-11 | 2006-08-09 | 慧高精密工业股份有限公司 | Improved structure for conducting wire erectin belt |
| CN201181700Y (en) * | 2008-04-03 | 2009-01-14 | 勤益股份有限公司 | Wire frame and electric connecting structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102142419B (en) | 2013-04-10 |
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| PB01 | Publication | ||
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| C53 | Correction of patent of invention or patent application | ||
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Address after: The road Chinese Taiwan New Taipei City Forest District No. 6-8 Applicant after: Everlight Electronics Co.,Ltd. Address before: 25, Lane 76, three section, Central Road, Tu County, Taiwan, Taipei, China Applicant before: Everlight Electronics Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130410 Termination date: 20170203 |