CN102140037A - Method for realizing self-assembly of zinc oxide nanometer wires - Google Patents
Method for realizing self-assembly of zinc oxide nanometer wires Download PDFInfo
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- CN102140037A CN102140037A CN2011100719162A CN201110071916A CN102140037A CN 102140037 A CN102140037 A CN 102140037A CN 2011100719162 A CN2011100719162 A CN 2011100719162A CN 201110071916 A CN201110071916 A CN 201110071916A CN 102140037 A CN102140037 A CN 102140037A
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Abstract
The invention relates to a method for realizing the self-assembly of zinc oxide nanometer wires in the field of nanometer processing, which comprises the following steps of: performing hydroxylation and amination on the surfaces of silicon wafers sequentially, and immersing the silicon wafers in dispersion liquid of the zinc oxide nanometer wires, which is subjected to surface modification by lauryl sodium sulfate, to realize the self-assembly. The method is simple, convenient and efficient, and the prepared zinc oxide nanometer wire membranes are suitable for preparing high-quality devices.
Description
Technical field
What the present invention relates to is the method in a kind of nano processing technology field, specifically is a kind of method that realizes the zinc oxide nanowire self-assembly.
Background technology
Zinc oxide nanowire has remarkable characteristic of semiconductor, optical characteristics, piezoelectric property, has been subjected to paying close attention to widely, and has obtained further investigation.Zinc oxide nanowire can be used to prepare field-effect transistor, ultraviolet light detector, gas sensor, solar cell, nano generator and feds etc.The prerequisite of preparation zinc oxide nanowire thin-film device is to obtain the good film of nano wire uniform distribution.And for zinc oxide nanowire, also lacking effectively, method prepares nano wire film.Prepare one deck gold nano grain film as catalyzer at silicon chip surface, can make nano wire film, but because the existence of catalyzer can influence the thin-film device performance, even can't come fabricate devices with this film, so the nano wire film that makes with this method is not suitable for making device.
Find through retrieval prior art, Ko S H, et al.ZnO nanowire network transistor fabrication on a polymer substrate by low-temperature, all-inorganic nanoparticle solution process.APPLIED PHYSICS LETTERS, 2008,92:154102 (Gao Chenghuan, Deng. utilizing low temperature full-inorganic nanoparticle prepared is the zinc oxide nanowire network of transistors of substrate with the polymkeric substance, the Applied Physics wall bulletin, 2008, put down in writing 92:154102): utilize hydrothermal method, with Zinc oxide nanoparticle as seed, it is immersed in the aqueous solution that contains zinc nitrate and vulkacit H, can make the zinc oxide nanowire film, but the nano wire in this film is not to be tiled in the substrate yet, but is tiltedly standing, therefore with this nano wire film fabricate devices, channel current can be smaller.Therefore, be necessary to develop a kind of technology simple, with low cost, easy to operate, prepare the method for high-quality zinc oxide nano wire film efficiently, this will be a key of making the nano wire film device.
Summary of the invention
The present invention is directed to the prior art above shortcomings, a kind of method that realizes the zinc oxide nanowire self-assembly is provided, this method is simple, convenient, efficient, the suitable preparation of the zinc oxide nanowire film for preparing high quality device.
The present invention is achieved by the following technical solutions, and the present invention is soaked in the zinc oxide nanowire dispersion liquid after sodium lauryl sulphate is carried out finishing by after silicon chip surface being carried out successively hydroxylation and amination processing, realizes self-assembly.
Described hydroxylation is meant: the mixing solutions of the hydrogen peroxide solution of compound concentration 30wt% sulphuric acid soln and concentration 98wt%, its volume ratio is 2.5: 1, cleaned silicon chip is put into this solution, under 90 ℃, boiled 2～3 hours, after having boiled silicon chip is taken out and clean repeatedly with deionized water, at last silicon chip is put into deionized water, after boiling 20～30 minutes under 80 ℃ of conditions, taking-up dries up with nitrogen.
Described amination is meant: add 3-aminopropyl diethoxy silane in deionized water, and carried out supersound process 10 minutes, afterwards hydroxylated silicon chip is put into and wherein left standstill 10～15 hours, leave standstill and finish post-heating to 80 ℃ and kept 1～2 hour, then take out silicon chip and cleaning, at last with the silicon chip vacuum annealing.
The consumption of described 3-aminopropyl diethoxy silane is to add 1～4 milliliter 3-aminopropyl diethoxy silane in per 100 ml deionized water.
The temperature of described vacuum annealing is 120～180 ℃, and annealing time is 10～20 hours.
Described finishing is meant: zinc oxide nanowire is put into deionized water, in deionized water, add simultaneously sodium lauryl sulphate, and carry out supersound process, make zinc oxide nanowire homodisperse in solution, and make nano wire wear negative electricity in the modification following table of sodium lauryl sulphate.
The consumption of described zinc oxide nanowire is that per 100 ml deionized water add 1～3 milligram.
The consumption of described sodium lauryl sulphate is to add 0.01～0.10 gram sodium lauryl sulphate in per 100 ml deionized water.
The time of described supersound process is 2～4 hours.
Principle of work of the present invention is: zinc oxide nanowire is modified negative electricity on the band of rear surface through sodium lauryl sulphate.Silicon chip surface is after 3-aminopropyl diethoxy silane is handled, and there is amino functional group in the surface, and amino functional group becomes positively charged in water.Therefore, in deionized water, the electrostatic attraction that electronegative zinc oxide nanowire is subjected to silicon chip surface positively charged amino functional group has realized the self-assembly of zinc oxide nanowire at silicon chip surface.
The invention has the beneficial effects as follows: utilize self-assembly to realize the uniform distribution of zinc oxide nanowire at silicon chip surface, equally distributed nano wire can be used for preparing high-quality thin-film device.
Description of drawings
Fig. 1 is the scanning electron microscope picture of the zinc oxide nanowire self-assembly of the embodiment of the invention 1.
Embodiment
Below embodiments of the invention are elaborated, present embodiment is being to implement under the prerequisite with the technical solution of the present invention, provided detailed embodiment and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
Embodiment 1
The first step, silicon chip cleans.At first, the silicon chip that will have silicon dioxide insulating layer is put into 50 milliliters of ethanol, carries out ultrasonic cleaning 10 minutes, takes out to dry up with nitrogen; Then, silicon chip is put into 50 milliliters of acetone, carried out ultrasonic cleaning 10 minutes, taking-up dries up with nitrogen; At last silicon chip is put into 100 ml deionized water, carried out ultrasonic cleaning 10 minutes, taking-up dries up with nitrogen.
Second step, the hydroxylation of silicon chip surface.Preparation sulfuric acid (concentration 98%) and hydrogen peroxide (concentration 30%) volume ratio are 2.5: 1 solution, and cleaned silicon chip is put into this solution, boil 2.5 hours under 90 ℃ of conditions, after having boiled silicon chip are taken out and clean repeatedly with deionized water.At last, silicon chip is put into deionized water, after boiling 20 minutes under 80 ℃, taking-up dries up with nitrogen.
The 3rd step, the amination of silicon chip surface.In 50 ml deionized water, add 1 milliliter of 3-aminopropyl diethoxy silane, and carried out supersound process 10 minutes, hydroxylated silicon chip is put into wherein left standstill 10 hours afterwards.Leave standstill and finish post-heating to 80 ℃ and kept 1 hour, then take out silicon chip and it is cleaned repeatedly, dry up with nitrogen with ethanol; At last, silicon chip under 150 ℃ of hot conditionss, was carried out vacuum annealing 10 hours.
The 4th step, the finishing of zinc oxide nanowire.5 milligrams of zinc oxide nanowires are put into 250 ml deionized water, in deionized water, add 100 milligrams of sodium lauryl sulphate simultaneously, carried out supersound process afterwards 3 hours, make zinc oxide nanowire homodisperse in solution.
The 5th step, the self-assembly of zinc oxide nanowire.After the aqueous solution of above-mentioned zinc oxide nanowire leaves standstill 40 minutes, get 180 milliliters of its supernatant liquors.The silicon chip of surface amination is put into this supernatant liquor, leave standstill under 20 ℃ after 10 hours and take out, and, dry up with nitrogen at last with deionized water cleaning silicon chip repeatedly.Figure one is the scanning electron microscope picture of zinc oxide nanowire in the silicon chip surface self-assembly.
Embodiment 2
The first step, silicon chip cleans.At first, the silicon chip that will have silicon dioxide insulating layer is put into 50 milliliters of ethanol, carries out ultrasonic cleaning 10 minutes, takes out to dry up with nitrogen; Then, silicon chip is put into 50 milliliters of acetone, carried out ultrasonic cleaning 10 minutes, taking-up dries up with nitrogen; At last silicon chip is put into 100 ml deionized water, carried out ultrasonic cleaning 10 minutes, taking-up dries up with nitrogen.
Second step, the hydroxylation of silicon chip surface.Preparation sulfuric acid (concentration 98%) and hydrogen peroxide (concentration 30%) volume ratio are 2.5: 1 solution, and cleaned silicon chip is put into this solution, boil 2 hours under 90 ℃ of conditions, after having boiled silicon chip are taken out and clean repeatedly with deionized water.At last, the silicon chip that cleans is put into deionized water, after boiling 25 minutes under 80 ℃ of conditions, taking-up dries up with nitrogen.
The 3rd step, the amination of silicon chip surface.In 50 ml deionized water, add 0.5 milliliter of 3-aminopropyl diethoxy silane, and carried out supersound process 10 minutes, hydroxylated silicon chip is put into wherein left standstill 12 hours afterwards.Leave standstill and finish post-heating to 80 ℃ and kept 1.5 hours, then take out silicon chip and it is cleaned repeatedly, dry up with nitrogen with deionized water; At last, silicon chip under 180 ℃ of hot conditionss, was carried out vacuum annealing 12 hours.
The 4th step, the finishing of zinc oxide nanowire.2 milligrams of zinc oxide nanowires are put into 200 ml deionized water, in deionized water, add 20 milligrams of sodium lauryl sulphate simultaneously, carried out supersound process afterwards 2 hours, make zinc oxide nanowire homodisperse in solution.
The 5th step, the self-assembly of zinc oxide nanowire.After the aqueous solution of above-mentioned zinc oxide nanowire leaves standstill 35 minutes, get 150 milliliters of its supernatant liquors.The silicon chip of surface amination is put into this supernatant liquor, take out silicon chip after leaving standstill 24 hours, and spend Virahol and clean repeatedly, dry up with nitrogen at last at 45 ℃.
Embodiment 3
The first step, silicon chip cleans.At first, the silicon chip that will have silicon dioxide insulating layer is put into 50 milliliters of ethanol, carries out ultrasonic cleaning 10 minutes, takes out to dry up with nitrogen; Then, silicon chip is put into 50 milliliters of acetone, carried out ultrasonic cleaning 10 minutes, taking-up dries up with nitrogen; At last silicon chip is put into 100 ml deionized water, carried out ultrasonic cleaning 10 minutes, taking-up dries up with nitrogen.
Second step, the hydroxylation of silicon chip surface.Preparation sulfuric acid (concentration 98%) and hydrogen peroxide (concentration 30%) volume ratio are 2.5: 1 solution, and cleaned silicon chip is put into this solution, boil 3 hours under 90 ℃ of conditions, after having boiled silicon chip are taken out and clean repeatedly with deionized water.At last, the silicon chip that cleans is put into deionized water, after boiling 30 minutes under 80 ℃ of conditions, taking-up dries up with nitrogen.
The 3rd step, the amination of silicon chip surface.In 50 ml deionized water, add 2 milliliters of 3-aminopropyl diethoxy silanes, and carried out supersound process 10 minutes, hydroxylated silicon chip is put into wherein left standstill 15 hours afterwards.Leave standstill and finish post-heating to 80 ℃ and kept 2 hours, then take out silicon chip and it is cleaned repeatedly, dry up with nitrogen with acetone; At last, silicon chip under 120 ℃ of hot conditionss, was carried out vacuum annealing 20 hours.
The 4th step, the finishing of zinc oxide nanowire.6 milligrams of zinc oxide nanowires are put into 200 ml deionized water, in deionized water, add 200 milligrams of sodium lauryl sulphate simultaneously, carried out supersound process afterwards 4 hours, make zinc oxide nanowire homodisperse in solution.
The 5th step, the self-assembly of zinc oxide nanowire.After the aqueous solution of above-mentioned zinc oxide nanowire leaves standstill 50 minutes, get 150 milliliters of its supernatant liquors.The silicon chip of surface amination is put into this supernatant liquor, take out silicon chip after leaving standstill 30 minutes, and spend ethanol and clean repeatedly, dry up with nitrogen at last at 70 ℃.
Embodiment 4
The first step, silicon chip cleans.At first, the silicon chip that will have silicon dioxide insulating layer is put into 50 milliliters of ethanol, carries out ultrasonic cleaning 10 minutes, takes out to dry up with nitrogen; Then, silicon chip is put into 50 milliliters of acetone, carried out ultrasonic cleaning 10 minutes, taking-up dries up with nitrogen; At last silicon chip is put into 100 ml deionized water, carried out ultrasonic cleaning 10 minutes, taking-up dries up with nitrogen.
Second step, the hydroxylation of silicon chip surface.Preparation sulfuric acid (concentration 98%) and hydrogen peroxide (concentration 30%) volume ratio are 2.5: 1 solution, and cleaned silicon chip is put into this solution, boil 2.5 hours under 90 ℃ of conditions, after having boiled silicon chip are taken out and clean repeatedly with deionized water.At last, the silicon chip that cleans is put into deionized water, after boiling 30 minutes under 80 ℃ of conditions, taking-up dries up with nitrogen.
The 3rd step, the amination of silicon chip surface.In 50 ml deionized water, add 1.5 milliliters of 3-aminopropyl diethoxy silanes, and carried out supersound process 10 minutes, hydroxylated silicon chip is put into wherein left standstill 15 hours afterwards.Leave standstill and finish post-heating to 80 ℃ and kept 2 hours, then take out silicon chip and it is cleaned repeatedly, dry up with nitrogen with Virahol; At last, silicon chip under 160 ℃ of hot conditionss, was carried out vacuum annealing 13 hours.
The 4th step, the finishing of zinc oxide nanowire.4 milligrams of zinc oxide nanowires are put into 200 ml deionized water, in deionized water, add 160 milligrams of sodium lauryl sulphate simultaneously, carried out supersound process afterwards 4 hours, make zinc oxide nanowire homodisperse in solution.
The 5th step, the self-assembly of zinc oxide nanowire.After the aqueous solution of above-mentioned zinc oxide nanowire leaves standstill 40 minutes, get 150 milliliters of its supernatant liquors.The silicon chip of surface amination is put into this supernatant liquor, take out silicon chip at 60 ℃ after leaving standstill 6 hours, and clean repeatedly, dry up with nitrogen at last with deionized water.
Claims (8)
1. a method that realizes the zinc oxide nanowire self-assembly is characterized in that, by after silicon chip surface being carried out successively carboxylated and amination and handling, is soaked in the zinc oxide nanowire dispersion liquid after sodium lauryl sulphate is carried out finishing, realizes self-assembly.
2. the method for realization zinc oxide nanowire according to claim 1 self-assembly, it is characterized in that, described hydroxylation is meant: the mixing solutions of the hydrogen peroxide solution of compound concentration 30wt% sulphuric acid soln and concentration 98wt%, its volume ratio is 2.5: 1, cleaned silicon chip is put into this solution, under 90 ℃, boiled 2～3 hours, after having boiled silicon chip is taken out and clean repeatedly with deionized water, at last silicon chip is put into deionized water, after boiling 20～30 minutes under 80 ℃ of conditions, taking-up dries up with nitrogen.
3. the method for realization zinc oxide nanowire according to claim 1 self-assembly, it is characterized in that, described amination is meant: add 3-aminopropyl diethoxy silane in deionized water, and carried out supersound process 10 minutes, afterwards hydroxylated silicon chip is put into and wherein left standstill 10～15 hours, leave standstill and finish post-heating to 80 ℃ and kept 1～2 hour, then take out silicon chip and clean, at last with the silicon chip vacuum annealing.
4. the method for realization zinc oxide nanowire according to claim 3 self-assembly is characterized in that, the consumption of described 3-aminopropyl diethoxy silane is to add 1～4 milliliter 3-aminopropyl diethoxy silane in per 100 ml deionized water.
5. the method for realization zinc oxide nanowire according to claim 3 self-assembly is characterized in that, the temperature of described vacuum annealing is 120～180 ℃, and annealing time is 10～20 hours.
6. the method for realization zinc oxide nanowire according to claim 1 self-assembly, it is characterized in that, described finishing is meant: zinc oxide nanowire is put into deionized water, in deionized water, add simultaneously sodium lauryl sulphate, and carry out supersound process, make zinc oxide nanowire homodisperse in solution, and make nano wire wear negative electricity in the modification following table of sodium lauryl sulphate.
7. the method for realization zinc oxide nanowire according to claim 1 self-assembly is characterized in that, the consumption of described zinc oxide nanowire is that per 100 ml deionized water add 1～3 milligram.
8. the method for realization zinc oxide nanowire according to claim 1 self-assembly is characterized in that, the consumption of described sodium lauryl sulphate is to add 0.01～0.10 gram sodium lauryl sulphate in per 100 ml deionized water.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102916082A (en) * | 2012-10-22 | 2013-02-06 | 中国科学院上海技术物理研究所 | Method for sectionally assembling different quantum dots along one-dimensional nanowire |
| CN103147133A (en) * | 2013-02-25 | 2013-06-12 | 西南大学 | Three-dimensional carrier of microarray biochip and preparation method thereof |
| CN104034884A (en) * | 2014-07-01 | 2014-09-10 | 西南大学 | Method for preparing dendritic-polymer-based microarray antibody chip and product thereof |
| CN108071007A (en) * | 2017-11-08 | 2018-05-25 | 韩金玲 | It is a kind of to prepare nano silver wire and graphene-based calcium alginate compounded conductive fiber method |
| CN109301073A (en) * | 2018-10-23 | 2019-02-01 | 中国科学院重庆绿色智能技术研究院 | Zinc oxide nanowire/ferrocenyl polythiophene composite material, gold electrode and preparation method thereof |
| CN109813760A (en) * | 2019-02-28 | 2019-05-28 | 江苏理工学院 | A kind of zinc oxide nanowire gas sensor and preparation method thereof |
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| CN101186447A (en) * | 2007-12-14 | 2008-05-28 | 北京航空航天大学 | Method for preparing zinc oxide self-assembly particle film |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP0218746A1 (en) * | 1982-03-01 | 1987-04-22 | Yoshiyuki Ohgushi | Surface coating agent and method for using the same |
| CN101186447A (en) * | 2007-12-14 | 2008-05-28 | 北京航空航天大学 | Method for preparing zinc oxide self-assembly particle film |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916082A (en) * | 2012-10-22 | 2013-02-06 | 中国科学院上海技术物理研究所 | Method for sectionally assembling different quantum dots along one-dimensional nanowire |
| CN102916082B (en) * | 2012-10-22 | 2015-02-18 | 中国科学院上海技术物理研究所 | Method for sectionally assembling different quantum dots along one-dimensional nanowire |
| CN103147133A (en) * | 2013-02-25 | 2013-06-12 | 西南大学 | Three-dimensional carrier of microarray biochip and preparation method thereof |
| CN103147133B (en) * | 2013-02-25 | 2015-03-25 | 西南大学 | Three-dimensional carrier of microarray biochip and preparation method thereof |
| CN104034884A (en) * | 2014-07-01 | 2014-09-10 | 西南大学 | Method for preparing dendritic-polymer-based microarray antibody chip and product thereof |
| CN104034884B (en) * | 2014-07-01 | 2016-08-24 | 西南大学 | Preparation method of microarray antibody chip based on dendritic polymer and products thereof |
| CN108071007A (en) * | 2017-11-08 | 2018-05-25 | 韩金玲 | It is a kind of to prepare nano silver wire and graphene-based calcium alginate compounded conductive fiber method |
| CN109301073A (en) * | 2018-10-23 | 2019-02-01 | 中国科学院重庆绿色智能技术研究院 | Zinc oxide nanowire/ferrocenyl polythiophene composite material, gold electrode and preparation method thereof |
| CN109813760A (en) * | 2019-02-28 | 2019-05-28 | 江苏理工学院 | A kind of zinc oxide nanowire gas sensor and preparation method thereof |
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