CN102138216A - Electronic device and method of manufacturing the same - Google Patents
Electronic device and method of manufacturing the same Download PDFInfo
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- CN102138216A CN102138216A CN2009801340417A CN200980134041A CN102138216A CN 102138216 A CN102138216 A CN 102138216A CN 2009801340417 A CN2009801340417 A CN 2009801340417A CN 200980134041 A CN200980134041 A CN 200980134041A CN 102138216 A CN102138216 A CN 102138216A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/84—Parallel electrical configurations of multiple OLEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/86—Series electrical configurations of multiple OLEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
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Abstract
An electronic device comprises a functional stack (10) and a cover (50) coupled thereto byan insulating adhesive layer (30). The functional stack (10) comprisesa first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer. The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electricallyinterconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).
Description
Technical field
The present invention relates to a kind of electronic device, especially a kind of photoelectric device and/or electro-optical device.
The present invention relates to a kind of method of making electronic device in addition.
Background technology
Photoelectric device is defined as (for example, visible light) radiation is transformed into the device of the electric power or the signal of telecommunication herein, and this device comprises for example photovoltaic cell, for example organic photovoltaic battery (OPVs).Electro-optical device is understood that to have the device of optical property, and it relies on the signal of telecommunication, and light-emitting diode for example is as Organic Light Emitting Diode (OLEDs) and Electrochromic Display spare.This device has the optical function structure that is clipped between first and second electrode layers usually.For photovoltaic cell, described optical function structure comprises that one deck at least is used for radiation is transformed into the photonic layer of electric current.For light-emitting diode, this functional structure comprises that one deck at least is used for current transitions is become the electrooptic layer of radiation.At least one deck electrode layer must be a relative thin, so that make radiation pass through functional layer or pass through from functional layer.Because the restriction of thickness, the conductance of the described electrode layer of one deck at least also is restricted.In photovoltaic cell, this has the shortcoming than higher ohmic loss.Organic assembly is more and more paid close attention to, because can make this device under low relatively temperature and relatively cheap creating conditions.Especially Organic Light Emitting Diode (OLEDs) becomes very important for the application of display and illumination purpose.In OLEDs, especially large-area OLEDs s be light-emitting area greater than several square centimeters OLEDS in, low conductivity another one shortcoming is to produce big voltage to descend on this area, this causes inhomogenous brightness on this area.
By the US 2006/0125383 known method of in volume to volume technology, making large-area OLEDs.According to this method, first, second and the 3rd component lamination are arrived together.First and second assemblies comprise the substrate that scribbles one or more layers OLED material.The 3rd assembly comprises the other substrate with one or more layers adhesive material.In one embodiment, second assembly has the opening that is basically perpendicular to second substrate.When making various types of electronic devices, during as photovoltaic cell and OLEDs,, then be very attractive if under the situation that a kind of such device is had unexpected demand, can promptly make above-mentioned device by semi-finished product.Known product is to make by adhesive being provided in the opening of second assembly and these three assemblies being combined into one.Wherein the 3rd assembly is adhered on first assembly by the adhesive in the opening.In the opening of intermediate module, apply adhesive thus simultaneously the method for these three assemblies of lamination are relative complex.And, before complete completed knocked down products, can not assess the proper operation of this device.
Summary of the invention
The purpose of this invention is to provide a kind of electronic device, the manufacture method of the enough improvement of its energy is made.Another object of the present invention provides a kind of improvement method of making electronic product.Another object of the present invention provides first assembly, and it can dress up electronic device with second component groups.
According to a first aspect of the invention, provide a kind of electronic device according to claim 1.With opposite, in electronic device of the present invention, between first parts and second parts, use the electric insulation tack coat, and the transverse electric conductor dbus is crossed the conductive layer of one deck at least that this tack coat extends to first parts by the known product of above-mentioned US patent application of quoting.
Make described electronic device by lamination first and second assemblies.Described first assembly comprises the function lamination, and it for example forms OLED or OPV on first substrate, and second assembly is a cover layer, and it forms bus plane on second substrate.Can in cheap volume to volume technology, make first and second assemblies.Opposite with known product, described first parts comprise the function lamination, for example OLED or OPV, and itself need not be formed but it can be finished on a substrate before these two tab laminates by lamination.
At least one conductive structure can support as one power supply among first conductive layer and second conductive layer.By this way the conductive layer of Zhi Chenging can relative thin so that make it have good transparency for radiation that in this device, produces or the radiation that enters into this device.Another layer that supports can not be thick relatively, and this depends on the lateral dimensions of this device.In advantageous embodiment, have at least the first and second conductive structures and first and second transverse conductor, wherein first and second transverse conductor make first and second conductive layers respectively with the first and second conductive structure electrical interconnections.In this embodiment, the lateral dimensions of the thickness of two conductive layers of this in first parts and first parts is irrelevant.Therefore in this embodiment, but first parts are scale fully, make to use identical manufacture process to make large-scale end product.
In making the process of first assembly, form the function lamination and cover with tack coat.For example pass at least one among first and second conductive layers of tack coat and form hole, and fill to form transverse conductor with electric conducting material with laser drilling.Can first and second assemblies be integrated into final products by lamination, and need not complicated in addition procedure of processing.
Before lamination, can test first and second assemblies, so that reduce manufacture process coming off in the later stage.
If the function lamination is finished in the formation hole, comprise that it is favourable that tack coat and possible barrier liner (releaseliner) are filled with electric conducting material afterwards subsequently.Such advantage is to apply all layers by blanket deposit, and this has simplified manufacture process.Yet this is optional.Can in any of these layer, form any pattern in any stage of this manufacture process.For example can perhaps can after applied layer, apply pattern by boring or etching immediately by using the patterned deposition method in deposition process as the pattern in the printing applied layer.Should be appreciated that barrier liner is paper or plastic base support fabric, scribbles release agent in its one or both sides, this release agent provides the isolation effect to the cohesive material of any kind such as adhesive or adhesive.
According to the supply and the needs of various types of devices, can determine whether to use cover sheet to make the photovoltaic product at any time by it being combined with first assembly that comprises the electro-optical activity layer make luminous product or it is combined with first assembly with photoelectric active layer.Before contact shaping and lamination, just determine the final size and the shape of OPV and OLED product.
In advantageous embodiment, finish the function lamination, comprise that tack coat forms the hole afterwards.Form the function lamination by the blanket deposit functional layer in this embodiment and this function lamination has barrier liner.This blanket deposit is convenient to easily make and the semi-finished product of so acquisition are general for all products.In addition, any fragment that forms during boring and filling has in this embodiment been stayed on the barrier liner.With the cover layer lamination before can immediately this barrier liner be peeled off.Horizontal first and second electric conductors are contacted with supratectal first and second conductive structures.
In another advantageous embodiment, first conductive layer has first section (segment) of mutual electric insulation and second section, these two sections are arranged in the second common plane, wherein first of first conductive layer section is electrically connected with first conductive structure, and wherein second conductive layer second section by second electric conductor and first conductive layer is electrically connected with second conductive structure.Owing to formed the electrical interconnection of second conductive structure and horizontal conductor by the first conduction interval in this embodiment, thus second conductive layer can be relative thin and have a higher transparency of ratio.Therefore can form the OLED of two-sided radiation, condition is to keep sufficiently high Free Surface part at tectal conductive structure.In fact, have been found that then conductive structure still has enough conductances if conductive structure covers the surface of about 10% cover layer substrate.
For Electrochromic Display spare, the Electrochromic Display spare that for example is used for window, the application of first and second horizontal conductors is relevant especially, and described first and second horizontal conductors make first and second conductive layers be connected with first and second conductive structures respectively and first and second conductive structures covering surface of this cover layer 10% at the most wherein.
In another embodiment, first horizontal conductor that links with first conductive layer with insulating tape around, described insulating tape insulate these conductors and second conductive layer.Can directly be close to first horizontal conductor and apply this insulating tape, but or also can apply this insulating tape with a certain distance from horizontal conductor.For example, in one embodiment, second conductive layer has the hole, and described hole has inside that is used for first horizontal conductor and the annular exterior that separates with inside.If insulating tape is between first horizontal conductor and second conductive layer, this is just enough.For the purpose of making, preferably insulating tape is dispersed throughout on first horizontal conductor, so that just can make this insulating tape in a step after applying all layers of function lamination.Can apply insulating tape by the annular volume of after all layers that apply the function lamination, removing first transverse conductor material on every side.Perhaps, can get out first hole that extends to first conductive layer, the electricity consumption filling insulating material.Can get out less hole in this electrical insulating material inside subsequently, arrange first transverse conductor therein.Insulating tape can not contain material maybe can use filling insulating material.If the horizontal conductor that uses anisotropic material to be used for only conducting electricity in the horizontal, then insulating tape may be unnecessary.
Can comprise first and second conductive structures according to electronic device of the present invention, wherein first conductive structure is electrically connected with whole first conductive layer by first transverse conductor, and second conductive structure is electrically connected with whole second conductive layer by second transverse conductor.In this shunting means, can use low relatively driven OLED, perhaps OPV has low relatively voltage output.In another device, the function lamination is divided into function lamination section, each function lamination section comprises the first conduction interval and the second conduction interval, these function lamination section sequence arrangement, and at least one section of first conductive layer conducts electricity interval by supratectal conductive structure and second and is electrically connected.In this tandem arrangement, can use than higher voltage but low drive current driving OLED.Therefore, the requirement to the conductivity of first and second conductive structures is not strict.OPV can have than higher voltage output by this way similarly, and the current loading of first and second conductive layers is appropriate.
Description of drawings
Illustrate in greater detail these and other aspect with reference to the accompanying drawings.Wherein:
Fig. 1 has shown first embodiment according to electronic device of the present invention,
Fig. 2 has shown first parts of the electronic device of Fig. 1,
Fig. 3 has shown second parts of the electronic device of Fig. 1,
Fig. 4 A-4C is the method for the electronic device of shop drawings 1,
Fig. 5 has shown second embodiment according to electronic device of the present invention,
Fig. 6 A-6G has shown the method for the electronic device of shop drawings 5,
Fig. 7 has shown the 3rd embodiment according to electronic device of the present invention,
Fig. 8 A-8H has shown the method for the electronic device of shop drawings 7,
Fig. 9 has shown the 4th embodiment according to electronic device of the present invention,
Figure 10 has shown the part according to Fig. 9 electronic device of the bottom view X among Fig. 9,
Figure 11 has shown the sectional view of the other part of the electronic device of Fig. 9 according to the XI among Fig. 9,
Figure 12 has shown the 4th embodiment according to electronic device of the present invention,
Figure 13 has shown the stepped cross-section figure according to the XIII-XIII among Figure 12,
Figure 14 has shown the 5th embodiment according to electronic device of the present invention,
Figure 15 A has illustrated the method for making the electronic device of Figure 14 to 15D,
Figure 16 has shown the 6th embodiment according to electronic device of the present invention,
Figure 17 shown be integrated into assembly commonly used according to a plurality of electronic devices of the present invention.
Embodiment
In the detailed description below,, many details have been set forth in order to understand the present invention up hill and dale.Yet it will be understood by those skilled in the art that does not have these details can put into practice the present invention yet.In other cases, do not explain known method, operation and parts, in order to avoid make aspect of the present invention fuzzy.
The purpose of term as used herein only is in order to describe specific execution mode, rather than is intended to limit the present invention.Singulative " a kind of " is intended to comprise plural form equally as used herein, unless context clearly illustrates that in addition.What it is also understood that is, the term of Shi Yonging " comprises " existence of feature, integer, step, operation, element and/or parts that narration has been described in this manual, but does not get rid of one or more other existence or increases of feature, integer, step, operation, element, parts and/or its cohort.In addition, unless narration is clearly arranged on the contrary, " or " be comprising property " or " but not removing property " or ".For example, be that true (or existence) and B are false (or non-existent) by satisfy condition A or B:A of following any one mode, A is that false (or non-existent) and B are true (or existence), perhaps A and B all are very (or existence).
Below with reference to accompanying drawing the present invention is described more completely, in these accompanying drawings, has shown embodiment of the present invention.Yet, the present invention can be many different forms implement and the present invention should be interpreted as the embodiment that is confined to set forth herein.It is of the present invention open thorough and complete in order to make that these embodiments are provided, and has fully passed on scope of the present invention for those skilled in the art.In these accompanying drawings,, may amplify the size and the relative size in layer and zone for clear.
It being understood that when describing an element or layer " on another element or layer ", " being connected with another element or layer ", it can be connected with another element or layer, perhaps can have insertion element or layer directly on another element or layer.On the contrary, when element of description is " directly on another element or layer ", " directly being connected with another element or layer ", there are not insertion element or layer.Identical numeral is represented components identical from start to finish.Here employed term " and/or " comprise one or more relevant list arbitrarily and all combinations.
Although it being understood that can use the term first, second, third, etc. to wait describes various elements, parts, zone, layer and/or part herein, these elements, parts, zone, layer and/or part should not be limited to these terms.These terms only are used to distinguish an element, parts, zone, layer and/or part and another zone, layer or part.Therefore, first element discussed below, parts, zone, layer and/or part also can be called as second element, parts, zone, layer and/or part under the situation that does not break away from instruction of the present invention.
Herein can the usage space relative terms as " ... under ", " ... following ", " lower floor ", " ... on ", " top " or the like, be convenient to illustrate between an element or feature and other element or the feature as illustrated in the drawings relation.It being understood that the space relative terms is intended to comprise other different directions of the device in using or operating the direction of describing except accompanying drawing.For example, if with the upset of the device among the figure, the element that then is described as " under other element or feature " will be oriented " on other element or feature ".Therefore, exemplary term " ... under " can be included in ... on and ... under both direction.Can be in addition device be orientated (revolve and turn 90 degrees or other direction) and correspondingly explains space as used herein relative terms.
Here describe embodiment of the present invention with reference to sectional view, described profile is the schematic diagram of the Utopian embodiment of the present invention (and intermediate structure).Similarly, can expect cause owing to for example manufacturing process and/or admissible error with the variform variation of illustration.Therefore, should not be limited to the specific region shape of explanation herein to embodiment of the present invention, but comprise for example by making the form variations that is produced.
Unless otherwise defined, employed herein all terms (comprising technology and scientific term) have with those skilled in the art the conventional identical meanings of understanding.Should also be understood that term as in the dictionary that routine is used defined those, should be interpreted as consistently with the implication in the association area can not being interpreted as idealized or exceedingly formal meaning, unless regulation clearly herein.With mentioned herein to all publications, patent application, patent, and other list of references integral body be incorporated herein by reference.Under the situation of conflict,, comprise that definition is as the criterion with this specification.In addition, material, method and embodiment only are illustrative, but not are intended to restriction.
Fig. 1 has shown electronic device first embodiment, comprise function lamination 10 as first assembly and cover layer 50 as second assembly.Fig. 2 has shown according to first assembly 10 of the vertical view II among Fig. 1 and Fig. 3 and has shown second assembly 50 according to the bottom view III in Fig. 1.
With insulation adhesive layer 28 cover layer 50 is connected with function lamination 10.Thickness is that the tack coat 28 of 15-100 μ m is bonding with function lamination 10 and cover layer 50.After applying, the adhesive of tack coat 28 can be solidified.Suitable bonding is for example acrylate, epoxy resin and silicones.And can use the thermoplastic adhesives of hot melt (for example EVA yl).Function lamination 10 comprises first transparency conducting layer 22, and this conductive layer is applied on the substrate 12 with first barrier structure, and described first barrier structure is the form of barrier laminate.As substrate, can use material as PET (polyethylene terephthalate) or PEN (PEN) or PC (Merlon).Described substrate can for example have the thickness of 50-250 μ m, for example 125 μ m.Described barrier laminate comprises that thickness is 1-500nm, preferred first inorganic layer 16 of about 300nm, and thickness is that first organic layer 18 and the thickness of 0.1-100 μ m, preferred about 20 μ m is second inorganic layer 20 of 1-500nm, preferred 300nm.Layer 18 is separated inorganic layer 16,20 and can be used as complanation layer (planarization layer) in addition.On the substrate 12 that can have (choosing wantonly) complanation layer 14, apply this barrier laminate.Organic complanation layer 14 has the thickness of 0.1-100 μ m, preferred about 20 μ m.First transparency conducting layer 22 for example is transparent conductive metal oxide layer, for example tin indium oxide (ITO) layer, zinc oxide (ZnO) layer or tin oxide (SnO) layer.First transparency conducting layer 22 has the thickness of 50-300nm, for example 150nm.As selecting or in addition, can using transparent organic material such as the PEDOT or the thin metal (thinmetal) of enough conductions.This function lamination comprises second conduction but not necessarily transparent layer 24, is the barium layer of the thickness that combines of the aluminium lamination of 100-400nm for about 5nm with thickness for example.
At electronic device is under the situation of photovoltaic cell, and this functional structure can comprise the combination to electronic shell and electronics receiving layer.For example first conductive layer is that thickness is that the ITO layer and second conductive layer of 125nm is that thickness is the aluminium lamination of 100nm, is furnished with 75nm PEDOT and 100nm mixed layer (MDMO-PPV: PCBM 1: 4) between this is two-layer.
First electric conductor 32 transverse to first plane 61 makes first conductive layer 22 and first conductive structure 66 electrical interconnection in first plane 61.Second electric conductor 34 transverse to first plane 61 makes second conductive layer 24 and second conductive structure, 68 electrical interconnections.In advantageous embodiment, electric conductor 32,34 can by Cu, Ag or C base ink, paste or adhesive forms or formed by electric growth of the nothing of metallic conductor being filled with suitable seed material after.
Make first electric conductor 32 and 24 insulation of second conductive layer with endless belt 33.Endless belt 33 spreads all on first electric conductor 32 in this case.Yet, as long as this band that cathode layer (second conductive layer 24) is broken away from fill with first electric conductor 32 is just enough on every side.Can this endless belt 33 of electricity consumption filling insulating material, but also can not contain material.
The product that shows in Fig. 1 can be that the cover layer that the function lamination and second assembly 50 promptly have a conductive structure is made effectively by lamination first assembly 10.
With reference now to Fig. 4 A-4E explanation, makes the method for this function lamination.The method according to this invention provides substrate 12.Choose wantonly and can apply complanation layer 14.For example photogravure (under vacuum) or slit extrusion coated deposit this complanation layer.Then by providing first barrier structure with after-applied first inorganic layer 16, first organic layer 18 and second inorganic layer 20.Can be by applying inorganic layer 16,20 with for example PECVD deposition SiNx:H.Before deposition, can carry out surface treatment.Middle organic layer 18 can photogravure or the slit extrusion coated deposit.
Apply first transparency conducting layer 22 then, with the after-applied functional structure 26 that comprises one or more layers functional layer.Then apply second conductive layer 24.Can be by (rotatable) magnetron sputtering and apply for example ITO layer of conductive layer 22 in the annealing that is lower than under 150 ℃ the temperature subsequently.Can apply dual electric layer 24 by for example thermal evaporation.Conductive layer 24 has electric insulation tack coat 26, and is optional thereon with barrier liner 36 coverings.Described functional structure can comprise one or more layers active layer, for example electro-optical activity layer, photoelectric active layer, hole injection layer, electron transfer layer or the like.Can be for example apply one or more active layers by one or more in spin coating, heliogravure/aniline printing and the slit pressurization coating process.Need not patterning with these steps, obtain result displayed in Fig. 4 A.
Fig. 4 B has shown how to pass tack coat 26 and barrier liner 36 to form diameters be first and second holes 38,40 of 25-250 μ m.Extend towards the direction of first transparency conducting layer 22 in first hole 38.Extend towards the direction of second conductive layer 24 in second hole 40.
Result displayed is by in the hole 38 in Fig. 4 C, forms electric conductor 32,34 and obtains so apply electric conducting material in 40.After applying electric conductor 32, in first hole 38, formed external diameter around the electric conducting material and be for example ring-type depression 33 of 50-275 μ m.With this ring-type depression 33 of filling insulating material, but also can be empty.First and second holes 38,40 and ring-type depression 33 are preferably formed by laser drilling.It should be noted that, as after the final layer that applies function lamination 10, in a step, forming hole 38,40 substitute, perhaps can form hole 38 by the layer and the laminated bonding layer 26 of patterned deposition function lamination 10,40 and depression 33, described tack coat has perforation in the position corresponding with hole and depression.
For long-term protection is provided to product, can take measures for example to use the side of barrier material sealing function lamination to protect this device to avoid making moist.
Can use with the lamination of applied layer 14,16,18,20 similar methods applied layer 54,56,58,60 on substrate 52 on substrate 12 and make cover layer 50.Subsequently, for example can use and to electroplate, the method for for example as above mentioning is come at lamination 54,56, applies the conductive structure 66,68 of first and second mutual insulatings on 58,60.The thickness that the conductive structure 66,68 of first and second mutual insulatings has depends on the size of required product.
On the one hand barrier structures that formed by the layer 16,18 and 20 of first parts 10 and the barrier structures protection moisture-sensitive that formed by the layer 56,58,60 of second parts 50 on the other hand layer avoids being subjected to influence from ambient humidity.In one embodiment, these two barrier structures all may reside in first parts 10.For example between cathode layer 24 and tack coat 28, can there be barrier structure.
The manufacturing that can finish electronic device as described in Figure 1 by the semi-finished product that will obtain and cover layer 50 laminations in Fig. 4 E now, described cover layer 50 comprises substrate 52 and at least one conductive structure 66 in first plane 61 as shown in Figure 3.So make first plane 61 first and second mutual insulatings conductive structure 66,68 and electric conducting material 32,34 respectively the opening part in first hole in tack coat 28 and second hole contact.Before this step,, can remove if there is barrier liner 36.In this manufacture process, barrier liner 36 plays two effects.It is caught at the fragment that forms hole 38,40, ring-type depression 33 and discharge in the process of the slit of barrier material 30 to be filled around the device on the one hand.Barrier liner 36 helps lamination fast on the other hand.In case remove barrier liner 36, this tack coat 28 can be used for function lamination 10 and cover layer laminated together.Under the situation of demand, this specific products can be by making function associated lamination 10 and cover layer 50 laminations outside specific products is had a mind to.Can not cause postponing by applying tack coat.
Fig. 5 has shown another embodiment according to electronic device of the present invention.Wherein being equivalent to those parts among Fig. 1 has and is higher than 100 reference number.In Fig. 5, reference number 113 and 155 expressions comprise the barrier structure of a plurality of organic layers that replace and inorganic layer, for example as with reference to figure 1 described lamination 14,16,18,20.
In the embodiment of as shown in Figure 5 electronic device, first conductive layer 122 has first and second sections 122a, 122b.Section 122a, 122b be mutual electric insulation and be arranged in the second common plane.First section 122a of first conductive layer 122 is electrically connected with first conductive structure 166.Second section 122b by second electric conductor 134 and first conductive layer 122 makes second conductive layer 124 and second conductive structure, 168 electrical interconnections.
Fig. 6 A-6E has illustrated the method for making embodiment as shown in Figure 5.As shown in Figure 6A, in the first step of this method, apply the patterned layer 122 of transparent conductive material.This layer comprises at least one first section 122a and second section 122b of mutual insulating.Pattern in this layer can for example directly apply by printing process, perhaps can at first apply pantostrat patterning then.
Shown in Fig. 6 B, on patterned layer 122, apply the lamination 126 of one or more active layers, for example it comprises the one layer or more in luminescent layer, hole transport layer or the electron transfer layer.
In step subsequently, shown in Fig. 6 C, remove lamination 126 from second section 122b (or its part).Perhaps, can for example directly apply lamination 126 with the form of patterning by printing process.
In shown in Fig. 6 D next step, apply one deck at least 124 of electric conducting material.This at least at least one section 122b of one deck 124 and first conductive layer 122 form electric contact.As Fig. 6 E with according to shown in Fig. 6 F of the view F among Fig. 6 E, in second conductive layer 124, form hole 137, it extends to first conductive layer 122 by lamination 126.The annular exterior 137b that this hole 137 has circular interior 137a and separates with inside.
In shown in Fig. 6 G next step, at least one conductive layer 124, apply tack coat 128.This tack coat 128 and possible separator have first hole 138 that the circular interior 137a with hole 137 meets.Apply one or more second holes 140, it extends to second section of first conductive layer 122.Adhesive material can filler opening 137 annular exterior 137b.Perhaps this outside can not contain material, perhaps can fill with independent insulating material.
In next step, in hole 138,140, apply conductor 132,134 respectively.The inside 137a that first horizontal conductor 138 passes this hole extends to first conductive layer 122.In one embodiment, filling insulating material is used in hole 137, if necessary it is solidified, and the internal volume at insulating material gets out aperture 137a subsequently, fills this aperture with electric conducting material subsequently, forms horizontal conductor.
Subsequently can be with the semi-finished product shown in Fig. 6 G that produced and cover layer as shown in Figure 3 cover layer 50 laminations for example.In this embodiment, around first transverse conductor 132, apply insulating tape every certain distance.Perhaps insulating tape can be directly and first transverse conductor, 132 adjacency, shown in the embodiment of Fig. 1.Same in the embodiment of Fig. 1, wherein second transverse conductor 34 directly is connected with second conductive layer 24, can apply first transverse conductor insulating tape on every side with the form of the endless belt of separating with the hole that comprises first transverse conductor 32 every certain distance.
Fig. 7 has shown another embodiment.Wherein have and be higher than 200 reference number corresponding to those parts among Fig. 1.Wherein have and be higher than 100 reference number corresponding to the parts of Fig. 5.In the embodiment of Fig. 7, functional structure 226 and second conductive layer 224 have the space consistent with first transverse conductor 232.The space of functional structure 236 less than and within the space of second conductive layer 224.Electronic device as shown in Figure 7 comprises the membrane structure 225 between second conductive layer 224 and tack coat 228, and this membrane structure 225 comprises organic and inorganic layer alternately.Having described in the previous application EP08156493.2 that submits to is suitable for organic and material inorganic layer.The benefit that the existence of this membrane structure has is: do not have the semi-finished product of barrier liner to have longer useful life and there is no need to exist barrier structure in cover layer.Fig. 7 has shown the space that membrane structure 225 has been filled in functional structure 226 and formed in second conductive layer 224.
With reference now to Fig. 8 A-8H explanation, makes the method for electronic device as shown in Figure 7.Wherein Fig. 8 A and 8B have shown the first step of manufacture process, and wherein first transparency conducting layer 222 with patterning is applied on the barrier structure 213 of substrate 212.In the embodiment as shown in Figure 5, first transparency conducting layer 222 of patterning has first and second sections 222a, 222b, this two sections mutual electric insulations and being arranged in the second common plane.Fig. 8 B has shown the vertical view of Fig. 8 A according to arrow B.For example shown three sections, yet, also applicable any other multistage.
Fig. 8 C and 8D have shown further step in the manufacture process, wherein apply functional structure 226, and patterning is to provide space 226o therein subsequently.Perhaps, functional structure 226 can apply with its patterning form in a step by patterned deposition.
In the step shown in Fig. 8 E and 8F, the same with space 226o in the functional structure, second conductive layer 224 has space 224o.The space 226o of functional structure 226 less than and within the space 224o of second conductive layer 224.Fig. 8 F has shown in Fig. 8 E the vertical view according to F.
In next step, shown in Fig. 8 G, apply membrane structure 225, it comprises organic and inorganic layer alternately.The space that membrane structure 225 has been filled in functional structure 226 and formed in second conductive layer 224.As applying hole 238 and 240 in Fig. 8 membrane structure that H is shown in 225.The space 226o of these holes and functional structure 226 and the space 224o of second conductive layer 224 are consistent.The semi-finished product of Fig. 8 H can be similar to subsequently to finish and be final products with as shown in Figure 5 product.
Fig. 9,10 and 11 has shown another embodiment.Wherein have and be higher than 300 reference number corresponding to the parts of Fig. 1.Figure 10 has shown the bottom view according to the cover layer 350 of the X among Fig. 9.Figure 11 has shown the sectional view according to the function lamination 310 of the XI among Fig. 9.In this embodiment, first and second conductive layers 322 and 324 are separated.Wherein the first conduction interval 322a ..., each section 324a of 322e and second conductive layer 324 ..., 324e is relative.Every couple of relative section 322a, 324a, 322b, 324b or the like and function lamination section 310a ..., the 310e correspondence.Function lamination section 310a ..., the 310e sequence arrangement, every section 322b (except first section 322a) of first conductive layer 322 is electrically connected with the section 324a of second conductive layer 324 of subsequently function lamination section 310a.Being electrically connected between the section 322b of first conductive layer 322 and section 324a of second conductive layer 324 of subsequently function lamination section 310a is to be formed by the first transverse conductor 332b, the conductive structure 366b and the second transverse conductor 334a on cover layer 350.By the first conductive structure 366a on cover layer 350 first section 322a of first conductive layer 322 is electrically connected with first terminals 362.The final stage 324e of second conductive layer 324 is electrically connected with second terminals 364.
Can also obtain high light output homogeneity in this embodiment, first conductive layer can be a relative thin simultaneously, so have good transparency.This embodiment allows to have the high voltage drive of weak current.
Figure 12 and 13 has shown another embodiment of the device that is connected in series.Wherein have and be higher than 400 reference number corresponding to those parts of Fig. 1.Figure 13 has shown that device by Figure 12 is according to the stepped cross-section figure of line XIII-XIII.
In example according to the device that is connected in series of Figure 12 and 13, every section 422a of first conductive layer ..., 422e have island 422a1 ..., 422e1, its with correspondent section 424a in second conductive layer 424 ..., 424e connects.This embodiment allows big tolerance when boring faces toward the direction of second conductive layer 434.If it is just enough that these holes extend to second conductive layer 434, if but because this hole of admissible error in the boring procedure further extends in the lamination, for example up to first conductive layer 422, this will not be a problem because the section 424a of second conductive layer 424 ..., 424e still with the island 422a1 of first conductive layer ..., 422e1 is connected.Therefore, the second transverse conductor 434c, 434d, 434e can extend to second conductive layer 424, shown in Figure 12 and 13, but they or can further extend in the lamination, for example facing to first conductive layer 422, with shown in Figure 5 similar.In this embodiment of the variant that is connected in series, allowing second conductive layer 424 is relative thin, therefore has good transparency.
Figure 14 has shown according to the present invention another embodiment of electronic device.Wherein have and be higher than 500 reference number corresponding to the parts of Fig. 1.This device comprises optical function structure 526, for example before one or more layers lamination of the described organic material of embodiment.Perhaps this optical function structure can comprise one or more layers of inorganic material, and it is applied on the thick relatively metal substrate 524.The latter serves as second conductive layer.Apply first conductive layer 522 of transparent metal for example or transparent metal oxide such as ITO at the opposite side of optical functional layer 526.First conductive layer 522 for example has the thickness of 10-100nm.Device as shown in figure 14 is top emission LED.(visible light) radiation that produces in the functional structure that is formed by optical functional layer 526 is by first transparency conducting layer 522, by tack coat 528 with by having cover layer 550 transmissions of the conductive structure 566 on substrate 552.For this reason, be that the grid of the line of 10-100 μ m applies this conductive structure to have width, wherein the line of grid covers 10% cover surface at the most.If width is much smaller than 10 μ m, 5 μ m for example, then it is difficult to for electronic device provides enough electric power, especially for high-power LEDs.If width is much larger than 100 μ m, for example 200 μ m then this structure become as seen, this is a shortcoming for decorative product.The thickness of line for example is 10-50 μ m, for example 25 μ m.Device perhaps shown in Figure 14 can be (organic) photovoltaic cell.Optical function structure 526 can have inorganic character, for example comprises for example silicon layer of single inorganic layer, but or can comprise multilayer laminated as CIS lamination (copper, indium, selenium).Under the situation of organic photovoltaic devices, can comprise for example polymer or micromolecule OPV lamination in the OPV of the dye sensitization battery as functional structure 526 or functional structure 526 are set.
For example shown the method for making Figure 14 device to 15D at Figure 15 A.
Figure 15 A has shown first manufacturing step, is wherein applying optical functional layer 526 on the metal substrate 524 and is being applied to first transparency conducting layer on the optical functional layer 526.
Figure 15 B has shown second manufacturing step, wherein applies the adhesive sheet 528 with barrier liner 536 on first conductive layer.Described barrier liner is a polymer flake for example, and for example thickness is that about 5 μ m are to about 100 μ m, for example the PET thin slice of 12.5 μ m or PEN thin slice.This barrier liner is as the support of electric insulation tack coat.The method shown with embodiment before is opposite, has the adhesive sheet porose 533 of barrier liner 536.Perhaps after adhesive sheet 528 being adhered to layer 522, form hole 533, but, can determine that the hole just in time extends to first conductive layer 522 by hole 533 is provided in advance.Wherein this method that adhesive sheet just has a hole before the remainder that adhesive sheet is applied to the function lamination also can be used for the manufacturing of other embodiment, for example device shown in Fig. 1,5,7,9 and 12.
In shown in Figure 15 C next step, hole 533 usefulness electric conducting materials 532 are filled.Remove barrier liner (Figure 15 D) subsequently.
The cover layer 550 that will have conductive structure 566 at last on substrate 552 is surperficial bonding so that the product of acquisition Figure 14 with the insulation adhesive layer 528 of function lamination 510.
Figure 16 has shown another embodiment.Wherein have and be higher than 600 reference number corresponding to those parts of Fig. 1.In the embodiment of Figure 16, optical functional layer 626 is that photovoltaic cell and its doped region are used as first transparency conducting layer 622.Second conductive layer 624 is formed by metal forming, and it is set to the back contact with optical functional layer 626.
The mode that is used for Figure 14 device shown in Figure 15 A-D that can be similar to is made the electronic device of Figure 16.According to described method, on metal forming 624, apply optical functional layer 626 with doped region 622.Subsequently, described as Figure 15 B for the product of Figure 14, on the surface of the doped region 622 of optical functional layer 626, apply the have barrier liner tack coat 628 of (not having to show).Similar to the step shown in Figure 15 C, in the hole of tack coat 628, apply electric conducting material to form horizontal conductor 632.Similar with the step shown in Figure 15 D, remove barrier liner, with after-applied cover layer 650, obtain the product of Figure 16 with conductive structure.
Can the random order manufacturing or make the various parts that are used to make electronic device according to the present invention simultaneously.For example in the embodiment of Fig. 1, these parts are function lamination 10 and cover layer 50.In the embodiment of Figure 16, these parts are the metal forming 624 with optical functional layer 626, the tack coat 628 with barrier liner and cover layer 650.
Can there be other layer between the layer that offers some clarification on herein, for example complanation layer, filter course, protective layer.
As shown in figure 17, can lamination on the cover layer 550a of routine or between common a pair of cover layer 550a, 550b the many function laminations 510 of lamination.This can be applied in other electronic device of the present invention similarly.But many function laminations 610 of lamination in this way for example.
In the claims, word " comprises " element or the step of not getting rid of other, and indefinite article " a kind of " is not got rid of multiple.Single component or other unit can be implemented in the function of the several projects described in the claim.Some measure of narrating in different claims does not show, can not use the combination of these measures.Any reference marker in the claim should not thought the restriction to protection range.
Claims (16)
1. electronic device, it comprises function lamination (10; 110; 210; 310; 410; 510; 610) with insulation adhesive layer (28; 128; 228; 328; 428; 528; 628) cover layer (50 that is connected with described function lamination; 150; 250; 350; 450; 550; 650), this function lamination comprises first transparency conducting layer (22; 122; 222; 322; 422; 522; 622), second conductive layer (24; 124; 224; 324; 424; 524; 624) and be clipped in functional structure (26 between described first and second conductive layers; 126; 226; 326; 426; 526; 626), described functional structure comprises one deck optical functional layer at least, described cover layer (50; 150; 250; 350; 450; 550; 650) comprise having at least the first conductive structure (66; 166; 266; 366a; 466a; 566; 666) substrate (52; 152; 252; 352; 452; 552; 652), described first conductive structure is arranged in described tack coat (28; 128; 228; 328; 428; 528; 628) with substrate (52; 152; 252; 352; 452; 552; 652) in first plane between, and wherein with first plane (61; 161; 261; 361; 461; 561; 661) horizontal first transverse conductor (32; 132; 232; 332; 432; 532; 632) with described first and second conductive layers (22; 122; 222; 322; 422; 522; 622) one of with described first conductive structure (66; 166; 266; 366a; 466a; 566; 666) be electrically connected.
2. according to the electronic device of claim 1, comprise and described first conductive structure (66; 166; 266) electric insulation on first plane (61; 161; 261) second conductive structure (68 in; 168; 268) with transverse to first plane (61; 161; 261) second transverse conductor (34; 134; 234), wherein said first and second transverse conductor are respectively with first conductive structure (66; 166; 266) with first conductive layer (22; 122; 222) connect and with second conductive structure (68; 168; 268) with second conductive layer (24; 124; 224) connect.
3. according to the electronic device of claim 2, wherein first conductive layer (122) has first section and second section (122a, 122b), this two sections mutual electric insulations and being arranged in the second public plane, wherein first section (122a) of first conductive layer (122) is electrically connected with first conductive structure (166), and wherein second conductive layer (124) by second section (122b) electrical interconnection of second electric conductor (134) and second conductive structure (168) and first conductive layer (122).
4. according to the electronic device of claim 1, wherein second conductive layer (124) has hole (137), the annular exterior (137b) that described hole has inside (137a) and separates with inside, and wherein first horizontal conductor (138) passes described inside (137a).
5. according to the electronic device of claim 4, wherein use the described outside of filling insulating material (137b).
6. according to the electronic device of claim 1, wherein said functional structure (226) has and the consistent interval of first transverse conductor (232) with second conductive layer (224), and wherein functional structure (226) the interval less than and within the interval of second conductive layer (224).
7. according to the electronic device of claim 1, it also is included in the membrane structure (225) between second conductive layer (224) and the tack coat (228), and described membrane structure (225) comprises barrier structure.
8. according to the electronic device of claim 1, wherein functional structure (226) has and the consistent interval of first transverse conductor (232) with second conductive layer (224), and wherein the interval of functional structure (226) less than and within the interval of second conductive layer (224), described device also is included in the membrane structure (225) between second conductive layer (224) and the tack coat (228), described membrane structure (225) comprises organic layer and inorganic layer alternately, and wherein membrane structure (225) is filled in functional structure (226) and the interval of formation in second conductive layer (224).
9. electronic device according to Claim 8, wherein function lamination (310) is divided into function lamination section (310a ..., 310e), each function lamination section (310a ..., 310e) comprise first conductive layer (322) section (322a ..., 322e) and second conductive layer (324) section (324a ..., 324e), with function lamination section (310a ..., 310e) be disposed in order, at least one section (322b) that makes first conductive layer (322) is electrically connected with second conductive layer (324) section (324a) by the conductive structure (366b) on the cover layer (350).
10. first assembly, it comprises function lamination (10) and the barrier liner (36) that is connected with described function lamination by insulation adhesive layer (30), described function lamination (10) comprises first transparency conducting layer (22), second conductive layer (24) and is clipped in functional structure (26) between described first and second conductive layers, described functional structure comprises one deck optical functional layer at least, wherein with first and second conductive layers (22,24) one of at least the first electric conductor (32,34) that is electrically connected extends to the Free Surface of described barrier liner.
11. the manufacture method of electronic device, it may further comprise the steps:
A) provide first transparency conducting layer,
B) provide the functional structure that comprises one or more layers functional layer,
C) provide second conductive layer,
D) provide the electric insulation tack coat,
E) form the hole of passing described insulation adhesive layer,
F) apply electric conducting material in described hole, described material extends at least one in described first conductive layer and second conductive layer,
G) apply cover layer, described cover layer comprises the substrate with at least the first conductive structure, and the opening part in the described hole in described tack coat makes described first conductive structure contact with described electric conducting material.
12. according to the manufacture method of the electronic device of claim 11, it is included between step e) and the step f) in addition, and the step of barrier liner is provided on the Free Surface of described insulation adhesive layer, and the step of removing described barrier liner before step g).
13. according to the manufacture method of claim 11, wherein said functional structure (226) has (226o) at interval, and forms and these first consistent at interval holes.
14. manufacture method according to claim 13, wherein the same with the interval (226o) in the described functional structure, second conductive layer (224) has at interval (224o), and wherein functional structure (226) interval (226o) less than and within the interval of second conductive layer (224) (224o).
15. according to the manufacture method of claim 13, wherein apply membrane structure (225) before afterwards and applying tack coat (228) applying second conductive layer (224), described membrane structure comprises barrier structure.
16., wherein apply barrier structure (225) before afterwards and applying tack coat (228) applying second conductive layer (224) according to the manufacture method of claim 11.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08159929.2 | 2008-07-08 | ||
| EP08159929A EP2144290A1 (en) | 2008-07-08 | 2008-07-08 | Electronic device and method of manufacturing the same |
| PCT/NL2009/050407 WO2010005301A1 (en) | 2008-07-08 | 2009-07-07 | Electronic device and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102138216A true CN102138216A (en) | 2011-07-27 |
| CN102138216B CN102138216B (en) | 2014-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980134041.7A Expired - Fee Related CN102138216B (en) | 2008-07-08 | 2009-07-07 | Electronic device and method of manufacturing same |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8759884B2 (en) |
| EP (2) | EP2144290A1 (en) |
| JP (1) | JP5584880B2 (en) |
| CN (1) | CN102138216B (en) |
| WO (1) | WO2010005301A1 (en) |
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| CN105358643A (en) * | 2013-04-26 | 2016-02-24 | 德山Sg株式会社 | Adhesive member and display unit for touch screen comprising same |
| CN106663744A (en) * | 2014-08-08 | 2017-05-10 | 欧司朗Oled股份有限公司 | Optoelectronic component and method for producing same |
| CN106663744B (en) * | 2014-08-08 | 2018-10-26 | 欧司朗Oled股份有限公司 | Opto-electronic device and its manufacturing method |
| WO2023226079A1 (en) * | 2022-05-25 | 2023-11-30 | 武汉华星光电半导体显示技术有限公司 | Display apparatus |
Also Published As
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| CN102138216B (en) | 2014-03-12 |
| EP2304800A1 (en) | 2011-04-06 |
| US20110297996A1 (en) | 2011-12-08 |
| JP5584880B2 (en) | 2014-09-10 |
| US8759884B2 (en) | 2014-06-24 |
| WO2010005301A1 (en) | 2010-01-14 |
| EP2144290A1 (en) | 2010-01-13 |
| JP2011527816A (en) | 2011-11-04 |
| EP2304800B1 (en) | 2013-09-04 |
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