CN102138216A - Electronic device and method of manufacturing the same - Google Patents

Electronic device and method of manufacturing the same Download PDF

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CN102138216A
CN102138216A CN2009801340417A CN200980134041A CN102138216A CN 102138216 A CN102138216 A CN 102138216A CN 2009801340417 A CN2009801340417 A CN 2009801340417A CN 200980134041 A CN200980134041 A CN 200980134041A CN 102138216 A CN102138216 A CN 102138216A
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layer
conductive
conductive layer
structure
functional
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CN2009801340417A
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Chinese (zh)
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CN102138216B (en
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A·H·迪策尔
E·W·A·扬
E·德科姆佩内尔
H·利夫卡
J·范登布兰德
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皇家飞利浦电子股份有限公司
荷兰应用科学研究会(Tno)
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Priority to EP08159929A priority patent/EP2144290A1/en
Application filed by 皇家飞利浦电子股份有限公司, 荷兰应用科学研究会(Tno) filed Critical 皇家飞利浦电子股份有限公司
Priority to PCT/NL2009/050407 priority patent/WO2010005301A1/en
Publication of CN102138216A publication Critical patent/CN102138216A/en
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Publication of CN102138216B publication Critical patent/CN102138216B/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3202OLEDs electrically connected in parallel
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3204OLEDs electrically connected in series
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0024Processes specially adapted for the manufacture or treatment of devices or of parts thereof for forming devices by joining two substrates together, e.g. lamination technique
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5203Electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2251/00Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
    • H01L2251/50Organic light emitting devices
    • H01L2251/53Structure
    • H01L2251/5361OLED lamp
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/42Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for sensing infra-red radiation, light, electro-magnetic radiation of shorter wavelength or corpuscular radiation and adapted for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation using organic materials as the active part, or using a combination of organic materials with other material as the active part; Multistep processes for their manufacture
    • H01L51/44Details of devices
    • H01L51/448Passivation, containers, encapsulations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/524Sealing arrangements having a self-supporting structure, e.g. containers

Abstract

An electronic device comprises a functional stack (10) and a cover (50) coupled thereto byan insulating adhesive layer (30). The functional stack (10) comprisesa first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer. The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electricallyinterconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).

Description

电子器件及其制造方法 Electronic device and method

技术领域 FIELD

[0001] 本发明涉及一种电子器件,尤其是一种光电器件和/或电光器件。 [0001] The present invention relates to an electronic device, in particular a photovoltaic device and / or electro-optical devices.

[0002] 本发明另外涉及一种制造电子器件的方法。 [0002] The present invention further relates to a method of manufacturing an electronic device.

背景技术 Background technique

[0003] 在此处光电器件定义为将(例如,可见光)辐射转变成电力或电信号的器件,这种器件包括例如光伏电池,例如有机光伏电池(OPVs)。 [0003] In the photovoltaic device is herein defined as the (e.g., visible) radiation into an electric signal or electric power devices, such devices include for example a photovoltaic cell, for example, organic photovoltaic cells (OPVs). 电光器件被理解为具有光学性质的器件,其依赖电信号,例如发光二极管,如有机发光二极管(OLEDs)和电色显示器件。 Electro-optic device is understood to have the optical properties of the devices, which rely on electrical signals, such as light emitting diodes, such as organic light emitting diode (the OLEDs) and electrochromic display devices. 这种器件通常具有夹在第一和第二电极层之间的光学功能结构。 Such devices generally have sandwiched between the first electrode layer and the second optically functional configuration. 对于光伏电池,所述光学功能结构包括至少一层用于将辐射转变成电流的光电层。 For the photovoltaic cell, the optically functional structure comprises at least one means for radiation into the photoelectric current layer. 对于发光二极管,该功能结构包括至少一层用于将电流转变成辐射的电光层。 For a light emitting diode, the functional structure comprises at least one current for the electro-optic layer into radiation. 至少一层电极层必须是相对薄的,以便使辐射通过功能层或从功能层通过。 At least one electrode layer must be relatively thin so that the radiation passes through the functional layer or the functional layer. 由于厚度的限制,所述至少一层电极层的导电率也受到限制。 Due to the limitation of the thickness, conductivity of at least one electrode layer is also limited. 在光伏电池中,这具有比较高的电阻损失的缺点。 In photovoltaic cells this has the disadvantages of relatively high ohmic losses. 有机器件得到越来越多的关注,因为可以在相对低的温度和相对便宜的制造条件下制造这种器件。 Organic devices get more and more attention as such devices can be manufactured at relatively low temperatures and relatively cheap manufacturing conditions. 尤其是有机发光二极管(OLEDs)对于显示器和照明目的的应用来说变得很重要。 Especially organic light emitting diode (the OLEDs) become important for use in displays and for illumination purposes. 在OLEDs中,尤其是在大面积OLEDs即发光面积大于几个平方厘米的OLEDS中,低导电率另外一个缺点是在该面积上产生大的电压下降,这导致在该面积上不均一的亮度。 In OLEDs, in particular in large area OLEDs i.e. OLEDS light emitting area larger than a few square centimeters, the low conductivity Another drawback is that a large voltage drop in the area, which results in the area of ​​non-uniform luminance.

[0004] 由US 2006/0125383已知在卷对卷工艺中制造大面积OLED的方法。 [0004] A method for manufacturing a large area OLED in a roll process known in the volume of US 2006/0125383. 根据这种方法,将第一、第二和第三组件层压到一起。 According to this method, the first, second, and third component are laminated together. 第一和第二组件包括涂有一层或多层OLED材料的衬底。 The first and second components comprises a substrate coated with one or more layers of OLED materials. 第三组件包括具有一层或多层粘合剂材料的另外的衬底。 The third component comprises a further substrate having one or more layers of adhesive material. 在一个实施方案中,第二组件具有基本垂直于第二衬底的开口。 In one embodiment, the second assembly having an opening substantially perpendicular to the second substrate. 当制造各种类型的电子器件,如光伏电池和OLEDs 时,如果在对一种这样的器件有突然的需求的情况下可以迅速地由半成品制造上述器件, 则是很有吸引力的。 When manufacturing various types of electronic devices, such as a photovoltaic cell and the OLEDs, if the above device can be rapidly manufactured by a semi-finished product in the presence of a sudden demand for one such device case, it is very attractive. 已知的产品是通过在第二组件的开口内提供粘合剂并且使这三个组件结合成一体来制造的。 It is known products by providing an adhesive within the opening and the second component of the three components combined into integrally manufactured. 其中通过开口中的粘合剂将第三组件粘合到第一组件上。 Wherein the adhesive through the opening in the third component bonded to the first component. 在中间组件的开口内施加粘合剂由此同时层压这三个组件的方法是相对复杂的。 Applying adhesive within the opening while the intermediate assembly thus a method of laminating three components is relatively complex. 而且,在完全组装产品之前不可能评估该器件的正确操作。 Further, prior to full assembly of the product impossible to evaluate the correct operation of the device.

发明内容 SUMMARY

[0005] 本发明的目的是提供一种电子器件,其能够用改善的制造方法来制造。 Objective [0005] The present invention is to provide an electronic device which can be manufactured with an improved manufacturing method. 本发明的另外一个目的是提供一种制造电子产品的改善方法。 Another object of the present invention is to provide an improved method of manufacturing an electronic product. 本发明的另一个目的是提供第一组件,其能够与第二组件组装成电子器件。 Another object of the present invention is to provide a first component, a second component which can be assembled into an electronic device.

[0006] 根据本发明的第一方面,提供一种根据权利要求1的电子器件。 [0006] According to a first aspect of the present invention, there is provided an electronic device according to claim 1. 与由上述引用的US专利申请已知的产品相反,在本发明的电子器件中,在第一部件和第二部件之间应用电绝缘粘结层,并且横向电导体通过该粘结层延伸至第一部件的至少一层导电层。 And by the US patent applications cited known products contrary, in an electronic device according to the present invention, the application of the electrically insulating adhesive layer between the first member and the second member, and the transverse electric conductors extend through the adhesive layer to at least one conductive layer of the first member.

[0007] 通过层压第一和第二组件来制造所述电子器件。 [0007] By laminating the first and second components of the electronic device is manufactured. 所述第一组件包括功能叠层,其例如在第一衬底上形成OLED或0PV,而第二组件是覆盖层,其在第二衬底上形成电源层。 The first assembly comprises a functional stack, forming an OLED or 0PV for example on the first substrate and the second component is a cover layer, power supply layer is formed on the second substrate. 可以在便宜的卷对卷工艺中制造第一和第二组件。 It can be produced first and second components in a cheap roll-to-roll process. 与已知的产品相反,所述第一部件包括功能叠层,例如OLED或0PV,它本身无须由层压形成但是其可以在这两个薄片层压之前在一个衬底上来完成。 In contrast, the first member comprises a functional stack, such as an OLED or 0PV, but which itself need not be formed prior to the two sheets laminated onto a substrate is done by lamination with known products.

[0008] 至少一个导电结构可以用作第一导电层和第二导电层之中的一个的供电支撑。 [0008] at least one electrically conductive structure may serve as a first conductive layer and a second conductive layer among the supply support. 以这种方式支撑的导电层可以相对薄以便使其对于在这个器件中产生的辐射或进入到这个器件的辐射具有优良的透明度。 In this manner, the conductive layer may be relatively thin so support having excellent transparency so as for the radiation generated in the device or radiation entering the device. 没有支撑的另一层可以是相对厚的,这取决于这个器件的侧向尺寸。 No other layer support may be relatively thick, depending on the lateral dimensions of the device. 在有利的实施方案中,存在至少第一和第二导电结构以及第一和第二横向导电体,其中第一和第二横向导电体使第一和第二导电层分别与第一和第二导电结构电互连。 In an advantageous embodiment, at least a first and a second conductive structure and first and second transverse electrical conductors, wherein the first and second transverse electrical conductors of the first and second conductive layers respectively with the first and second interconnect structure is electrically conductive. 在这个实施方案中,在第一部件中的这两个导电层的厚度与第一部件的侧向尺寸无关。 In this embodiment, regardless of the thickness of the two lateral dimensions of the first member in a first part of the conductive layer. 因此在这个实施方案中,第一部件完全是可规模化的,使得可以使用相同的制造过程来制造大型的终端产品。 Therefore, in this embodiment, the first member is fully scalable, so that the same manufacturing process may be used to manufacture large end product.

[0009] 在制造第一组件的过程中,形成功能叠层并用粘结层覆盖。 [0009] In the process of manufacturing the first component, the functional stack is formed and covered with an adhesive layer. 例如用激光打孔穿过粘结层朝着第一和第二导电层之中的至少一个形成孔,并用导电材料填充以形成横向导电体。 For example, towards the first and at least one aperture formed in a second conductive layer, and a conductive filler material to form a transverse electrical conductors through the adhesive layer by laser drilling. 可以通过层压将第一和第二组件集成为最终产品,而无需另外复杂的加工步骤。 The first and second components may be integrated by lamination of the final product, without further complicated processing steps.

[0010] 在层压之前可以测试第一和第二组件,以便减少制造过程后期中的脱落。 [0010] In the laminate may be tested before the first and second components to reduce shedding post-production process.

[0011] 如果形成孔,在完成功能叠层,包括粘结层和可能的隔离衬垫(releaseliner)之后随后用导电材料填充是有利的。 [0011] If the holes are formed, then filled with a conductive material after the completion of the functional stack, including the adhesive layer and possibly a release liner (releaseliner) is advantageous. 这样的优势是可以通过均厚沉积来施加所有层,这简化了制造过程。 This has the advantage that all layers can be applied by blanket deposition, which simplifies the manufacturing process. 然而,这不是必需的。 However, this is not required. 可以在这个制造过程的任何阶段在任何这些层中形成任何图案。 Any pattern may be formed in any of these layers at any stage of the manufacturing process. 例如可以在沉积过程中通过使用图案化沉积方法如印刷施加层中的图案,或者可以在施加层之后立即通过钻孔或蚀刻施加图案。 For example, by printing a pattern layer is applied using a patterned deposition process, or may be applied immediately patterned by drilling or etching process after the deposition layer is applied. 应该理解,隔离衬垫是纸或塑料基载体织物,在其一侧或两侧涂有脱模剂,该脱模剂提供了对任何类型的粘性材料如粘合剂或胶粘剂的隔离效果。 It should be understood that the release liner is a paper or plastic based carrier web, a release agent coated on one or both sides thereof, a release agent which provides a viscous material for any type of adhesive or adhesive insulating effect.

[0012] 根据各种类型的器件的供应和需要,可以随时决定是否使用覆盖薄片通过将其与包括电光活性层的第一组件结合来制造发光产品或将其与具有光电活性层的第一组件结合来制造光伏产品。 [0012] The supply and the need of various types of devices, can always decide whether to use it with the cover sheet by the first photovoltaic assembly having a light emitting active layer of product will be produced in combination with a first assembly includes electro-optically active layer, or binding to the manufacture of photovoltaic products. 在接触成形和层压之前就决定OPV和OLED产品的最终尺寸和形状。 Prior to contact and lamination molding the final decisions on the size and shape of the OPV and OLED products.

[0013] 在有利的实施方案中,在完成功能叠层,包括粘结层之后形成孔。 [0013] In an advantageous embodiment, the holes are formed after the completion of the functional stack, including the adhesive layer. 在这个实施方案中通过均厚沉积功能层来形成功能叠层并且该功能叠层具有隔离衬垫。 In this embodiment the functional stack is formed by depositing the functional layer are thick and the functional stack having a release liner. 这个均厚沉积便于容易地制造并且如此获得的半成品对于所有产品来说是通用的。 This blanket deposition facilitates ease of manufacturing and semifinished products thus obtained for all is common. 此外,在这个实施方案中在钻孔和填充期间形成的任何碎片留在了隔离衬垫上。 Further, in this embodiment any debris formed during drilling and filling is left on the release liner. 在与覆盖层层压之前可立即将该隔离衬垫剥离。 The release liner can be peeled off immediately prior to pressing of the cover layer. 在层压过程中使横向第一和第二导电体与覆盖层上的第一和第二导电结构接触。 The first contact and the lateral first and second conductive structures on a second conductive layer and the coating during lamination manipulation.

[0014] 在另一个有利的实施方案中,第一导电层具有互相电绝缘的第一段(segment)和第二段,这两段布置在第二共同的平面中,其中第一导电层的第一段与第一导电结构电连接,而且其中第二导电层通过第二导电体和第一导电层的第二段与第二导电结构电连接。 [0014] In a further advantageous embodiment, the first conductive layer has mutually electrically insulated first section (segment) and a second section, the two sections arranged in a second common plane, wherein the first conductive layer, the first segment is electrically connected to the first conductive structure, and wherein the second conductive layer is electrically connected to the second conductive structure via the second section of the second conductor and the first conductive layer. 由于在这个实施方案中通过第一导电层段形成了第二导电结构与横向导体的电互连,因此第二导电层可以是相对薄的并且具有比较高的透明度。 In this embodiment, since the segment is formed by a first conductive layer electrically interconnecting the second conductive structure to the transverse conductor, so that the second conductive layer may be relatively thin and have a relatively high transparency. 因此可以形成双面辐射的0LED,条件是在覆盖层的导电结构保留足够高的自由表面部分。 It can be formed of a double-sided radiation 0LED, high enough to retain that part of the free surface of the conductive structure of the cover layer. 实际上,已经发现,如果导电结构覆盖约10%的覆盖层衬底的表面,则导电结构仍然具有足够的导电率。 Indeed, it has been found that, if the surface of the conductive structure covers about 10% of the cover layer of the substrate, the electrically conductive structures still have a sufficient conductivity.

[0015] 对于电色显示器件而言,例如用于窗口的电色显示器件,第一和第二横向导体的应用是特别相关的,所述第一和第二横向导体分别使第一和第二导电层与第一和第二导电结构连接并且其中第一和第二导电结构覆盖至多该覆盖层10%的表面。 [0015] For the electrochromic display device, for example, electrochromic window, a display device, the first and second transverse conductor applications is particularly related to, the first and second conductors, respectively, of the first lateral section and second conductive layer and the second conductive structure and the first connector and wherein the first and second electrically conductive structure covers at most 10% of the surface of the cover layer.

[0016] 在另一个实施方案中,与第一导电层连结的第一横向导体用绝缘带环绕,所述绝缘带使这些导体与第二导电层绝缘。 [0016] In another embodiment, the first transverse conductors coupled to the first conductive layer is surrounded by an insulating tape, the insulating tape that these conductor insulating the second conductive layer. 可以直接邻近第一横向导体来施加该绝缘带,但是或者也可以离横向导体一定距离来施加该绝缘带。 Adjacent the first transverse conductor may be directly applied to the insulating tape, or it may be applied to the insulating tape laterally a distance from the conductor. 例如,在一个实施方案中,第二导电层具有孔,所述孔具有用于第一横向导体的内部和与内部隔开的环状外部。 For example, in one embodiment, the second conductive layer having a hole having an inner conductor and a first lateral annular spaced external and internal. 如果绝缘带位于第一横向导体与第二导电层之间,这就足够了。 If the insulating tape located between the first transverse conductor and the second conductive layer, which is enough. 为了制造的目的,可优选绝缘带遍布于第一横向导体上,以便在施加功能叠层的所有层之后在一个步骤中就可制造该绝缘带。 For manufacturing purposes, it may be preferably formed on the first insulating tape around the transverse conductor, so that after the application of all layers of the functional stack of insulating tape can be manufactured in one step. 可以通过在施加功能叠层的所有层之后去除第一横向导电体周围的材料的环形体积来施加绝缘带。 By removing the material of the annular volume around the first transverse electrical conductor after all layers of the functional stack is applied to the insulating tape is applied. 或者,可以钻出延伸至第一导电层的第一孔,用电绝缘材料填充。 Alternatively, drilling a first hole extending to the first conductive layer, electrically insulating filler material. 随后可以在该电绝缘材料内部钻出较小的孔,在其中布置第一横向导电体。 Smaller pores may then be drilled in the interior of the electrically insulating material, in which the first transverse electrical conductor is arranged. 绝缘带可以不含材料或可以用绝缘材料填充。 With insulating material may be free or may be filled with an insulating material. 如果使用各向异性材料用于仅仅在横向上导电的横向导体,则绝缘带可能是多余的。 If anisotropic material is used only in the transverse direction electrically conductive transverse conductor, the insulating tape may be superfluous.

[0017] 根据本发明的电子器件可以包括第一和第二导电结构,其中第一导电结构通过第一横向导电体与整个第一导电层电连接,而且第二导电结构通过第二横向导电体与整个第二导电层电连接。 [0017] The electronic device according to the present invention may comprise a first and a second conductive structure, wherein the first conductive structure by a first transverse electrical conductors electrically connected to the entire first conductive layer and the second conductive structure via the second transverse electrical conductors electrically connected to the entire second conductive layer. 在这个并联装置中,可以用相对低的电压驱动0LED,或者OPV具有相对低的电压输出。 In this parallel arrangement can be driven with a relatively low voltage 0LED, or OPV having a relatively low voltage output. 在另一个装置中,功能叠层被分割成功能叠层段,每个功能叠层段包括第一导电层段和第二导电层段,这些功能叠层段顺序排列,第一导电层的至少一段通过覆盖层上的导电结构与第二导电层段电连接。 In another device, the functional stack is partitioned into functional stack segments, each functional stack segment comprising a first segment and a second conductive layer, conductive layer segments, the functional stack segments sequentially arranged, at least the first conductive layer, a second section connected to the electrically conductive layer by a conductive structure on the section layer. 在这个串联装置中,可以用比较高的电压但是低的驱动电流驱动0LED。 In this series arrangement can be used, but a relatively high voltage low driving current driving 0LED. 因此,对第一和第二导电结构的电导率的要求不是严格的。 Thus, the requirements for electrical conductivity of the first and second conductive structures is not critical. 类似地以这种方式OPV可以具有比较高的电压输出,而第一和第二导电层的电流负载是适度的。 Similarly in this way OPV can have a relatively high voltage output, while the current load of the first and the second conductive layer is modest.

附图说明 BRIEF DESCRIPTION

[0018] 参考附图来更详细地说明这些及其他方面。 [0018] Referring These and other aspects will be described in more detail with the accompanying drawings. 其中: among them:

[0019] 图1显示了根据本发明的电子器件的第一实施方案, [0019] FIG. 1 shows a first embodiment of an electronic device according to the present invention,

[0020] 图2显示了图1的电子器件的第一部件, [0020] FIG. 2 shows a first part of the electronic device of FIG. 1,

[0021] 图3显示了图1的电子器件的第二部件, [0021] FIG. 3 shows a second part of the electronic device of FIG. 1,

[0022] 图4A-4C是制造图1的电子器件的方法, [0022] Figures 4A-4C is a method of manufacturing the electronic device of FIG. 1,

[0023] 图5显示了根据本发明的电子器件的第二实施方案, [0023] FIG. 5 shows a second embodiment of an electronic device according to the present invention,

[0024] 图6A-6G显示了制造图5的电子器件的方法, [0024] FIGS. 6A-6G show a method of manufacturing the electronic device of FIG. 5,

[0025] 图7显示了根据本发明的电子器件的第三实施方案, [0025] FIG. 7 shows a third embodiment of an electronic device according to the present invention,

[0026] 图8A-8H显示了制造图7的电子器件的方法, [0026] FIGS. 8A-8H show a method of manufacturing an electronic device of FIG 7,

[0027] 图9显示了根据本发明的电子器件的第四实施方案, [0027] FIG. 9 shows a fourth embodiment of an electronic device according to the present invention,

[0028] 图10显示了根据图9中的底视图X的图9电子器件的一部分, [0028] FIG. 10 shows a part of an electronic device according to FIG. 9 in FIG. 9 is a bottom view of the X,

[0029] 图11显示了图9的电子器件另外部分根据图9中的XI的截面图, [0029] FIG. 11 shows another part of the electronic device of FIG. 9 in a sectional view according to XI in FIG. 9,

[0030] 图12显示了根据本发明的电子器件的第四实施方案, [0030] FIG. 12 shows a fourth embodiment of an electronic device according to the present invention,

[0031] 图13显示了根据图12中的XIII-XIII的阶梯形截面图, [0031] Figure 13 shows a stepped cross-sectional view of the XIII-XIII in FIG. 12,

[0032] 图14显示了根据本发明的电子器件的第五实施方案, [0032] FIG. 14 shows a fifth embodiment of an electronic device according to the present invention,

[0033] 图15A到15D说明了制造图14的电子器件的方法, [0033] FIGS. 15A to 15D illustrate a method of manufacturing an electronic device 14 of FIG,

[0034] 图16显示了根据本发明的电子器件的第六实施方案,[0035] 图17显示了集成为常用的组件的根据本发明的多个电子器件。 [0034] FIG. 16 shows a sixth embodiment of an electronic device according to the present invention, [0035] FIG. 17 shows the integration of a plurality of common components of electronic devices according to the present invention.

具体实施方式 Detailed ways

[0036] 在下面的详细说明中,为了彻底地了解本发明,阐述了许多细节。 [0036] In the detailed description below, for a thorough understanding of the present invention, numerous details are set forth. 然而,本领域技术人员应该理解的是,没有这些细节也可以实践本发明。 However, those skilled in the art will appreciate that the present invention may be practiced without these details be practiced. 在其它的情况下,没有详细地说明公知的方法、工序和部件,以免使本发明的方面模糊。 In other instances, well-known methods described, and a step member in detail so as not to blur aspect of the present invention.

[0037] 此处所使用的术语的目的仅仅是为了描述特定的实施方式,而不是意欲限制本发明。 [0037] The object of the terms used herein are merely for describing particular embodiments only and is not intended to limit the present invention. 如此处所使用的单数形式“一种”同样意欲包括复数形式,除非上下文另外清楚地表明。 As used herein, the singular forms "a" is also intended to include the plural forms as well, unless the context clearly indicates otherwise. 还要理解的是,在本说明书中使用的术语“包括”说明了叙述的特征、整数、步骤、操作、 元件、和/或部件的存在,但是不排除一个或多个其它的特征、整数、步骤、操作、元件、部件和/或其组群的存在或增加。 It is also understood that, as used in this specification, the term "comprising" stated features recited, integers, steps, operations, elements, and / or components, but do not preclude one or more other features, integers, steps, operations, elements, components, and / or the presence or addition of groups. 此外,除非明确有相反地叙述,“或”是包括性的“或”而非排除性的“或”。 In addition, unless explicitly described to the contrary, "or" Yes "or" rather than an exclusive inclusive "or." 例如,通过以下任意一个方式来满足条件A或B :A是真(或存在)和B是假(或不存在的),A是假(或不存在的)和B是真(或存在),或者A和B均是真(或存在)。 For example, to satisfy the condition A or B by any of the following ways: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), or A and B are true (or present).

[0038] 以下参考附图更完整地说明本发明,在这些附图中显示了本发明的实施方案。 [0038] The following description with reference to the accompanying drawings of the present invention more fully, embodiments of the invention shown in these figures. 然而,本发明可以许多不同的形式实施并且不应将本发明理解为局限于此处阐述的实施方案。 However, the present invention can be in many different forms and embodiments of the present invention should not be construed as limited to the embodiments set forth herein. 提供这些实施方案是为了使本发明的公开透彻和完全,并且为本领域技术人员完全地传达了本发明的范围。 These embodiments are provided so that this disclosure will be thorough and complete disclosure, and those skilled fully convey the scope of the invention. 在这些附图中,为了清楚,可能放大了层和区域的尺寸和相对尺寸。 In the drawings, for clarity, it may be exaggerated size and relative sizes of layers and regions.

[0039] 要理解的是,当描述一个元件或层“在另一个元件或层上”、“与另一个元件或层连接”时,其可以直接在另一个元件或层之上,与另一个元件或层连接,或者可以存在插入元件或层。 [0039] is to be understood that when an element or layer is described "another element or layer on," "connected to the other element or layer", it can be directly on the other element or layer, another connecting element or layer, or intervening elements or layers may be present. 相反,当描述一个元件是“直接在另一个元件或层上”、“直接与另一个元件或层连接”时,不存在插入元件或层。 In contrast, when an element is described as being "directly on another element or layer," "directly connected to another element or layer", insert elements or layers present. 相同的数字自始至终表示相同的元件。 Like numbers refer to like elements throughout. 这里所使用的术语“和/或”包括一个或多个相关列出项的任意和全部组合。 As used herein the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0040] 要理解的是,尽管此处可以使用术语第一、第二、第三等等来描述各种元件、部件、 区域、层和/或部分,但是这些元件、部件、区域、层和/或部分不应该限于这些术语。 [0040] to be understood that, to describe various elements, components, regions, layers and / or sections may be used herein, although the terms first, second, third, etc., these elements, components, regions, layers and / or sections should not be limited by these terms. 这些术语仅仅用于区别一个元件、部件、区域、层和/或部分与另一个区域、层或部分。 These terms are only used to distinguish one element, component, region, layer and / or section from another region, layer or section. 因此,以下讨论的第一元件、部件、区域、层和/或部分在没有脱离本发明的教导的情况下也可以被称为第二元件、部件、区域、层和/或部分。 Thus, a first element discussed below, components, regions, layers and / or sections without departing from the teachings of the present invention may also be termed a second element, component, region, layer and / or section.

[0041] 在此处可以使用空间相对术语如“在...之下”、“在...下面”、“下层的”、 “在...之上”、“上部的”等等,便于说明一个元件或特征与另外的元件或特征之间如在图中所说明的关系。 [0041] Spatially relative terms may be used herein such as "beneath ...", "... in the below", "lower", "over ...", "upper" and the like, to facilitate the relationship between one element or feature's relationship to another element or feature as illustrated in FIG. 要理解的是,空间相对术语意欲包含除了附图描述的方向之外在使用或操作中的器件的其它不同方向。 It is to be understood that the spatially relative terms are intended to encompass in addition to the orientation depicted in different directions or other operation of the device. 例如,如果将图中的器件翻转,则描述为“在其它的元件或特征之下”的元件将被定向为“在其它元件或特征之上”。 For example, if the device in the figures is turned over, elements described as "beneath other elements or features" would be oriented "above the other elements or features." 因此,示范性的术语“在...之下” 可以包含在...之上和在...之下的两个方向。 Thus, the exemplary term "below ..." ... may be included above and below in two directions .... 可以另外对器件进行取向(旋转90度或其它的方向)并且相应地解释此处所使用的空间相对术语。 Further the device can be oriented (rotated 90 degrees or at other orientations) and the space interpreted accordingly relative terms as used herein.

[0042] 这里参考截面图来描述本发明的实施方案,所述剖面图是本发明理想化的实施方案(和中间结构)的示意图。 [0042] Referring to FIG sectional herein described embodiments of the invention, the cross-sectional illustrations that are schematic idealized embodiments of the present invention (and intermediate structures). 同样地,能够预期由于例如制造工艺和/或容许误差而导致的与例证形状不同的变化。 Likewise, it is contemplated that various changes and due to the shape of illustrative example, of manufacturing techniques and / or tolerances caused. 因此,不应该把本发明的实施方案限于在此处说明的特定的区域形状,而是包括例如由制造所产生的形状偏差。 Thus, embodiments should not be limited to the particular embodiment of the present invention, shapes of regions illustrated herein but are to include deviations in shapes that result, for example by the manufacture.

[0043] 除非另外定义,在此处所使用的所有术语(包括技术和科学名词)具有与本领域技术人员所常规理解的相同含义。 [0043] Unless defined otherwise, all terms used herein (including technical and scientific terms) have the same meaning in the art as commonly understood in the art. 还应该理解的是,术语如在常规使用的词典中所定义的那些,应该解释为与相关领域中的含义相一致并不能解释为理想化或过度地正式意义,除非此处明确地规定。 It should also be understood that the term as used in conventional dictionaries as those defined, should be interpreted as consistent with the related fields of meaning and can not be interpreted in an idealized or overly formal sense, unless explicitly stated here. 将此处所提到的所有出版物、专利申请、专利、及其他参考文献整体引入作为参考。 All publications referred to herein, patent applications, patents, and other references incorporated by reference in entirety. 在冲突的情况下,以本说明书,包括定义为准。 In case of conflict, the present specification, including definitions, will prevail. 另外,材料、方法、和实施例仅仅是说明性的,而非意欲限制。 Further, the materials, methods, and examples are illustrative only and not intended to be limiting.

[0044] 图1显示了电子器件第一实施方案,包括功能叠层10作为第一组件和覆盖层50 作为第二组件。 [0044] Figure 1 shows a first embodiment of an electronic device, comprising a functional stack 10 as a first component and a second component 50 as a clad layer. 图2显示了根据图1中的俯视图II的第一组件10,和图3显示了根据在图1中的底视图III的第二组件50。 Figure 2 shows a plan view of a first component II of FIG 10, and FIG. 3 shows a bottom view of the second component III in FIG 50.

[0045] 用绝缘粘结层观将覆盖层50与功能叠层10连接。 [0045] The concept of the adhesive layer with an insulating cover layer 50 and the functional stack 10 is connected. 厚度为15-100 μ m的粘结层观将功能叠层10与覆盖层50粘合。 15-100 μ m thick adhesive layer of the functional stack 10 and the concept of covering the adhesive layer 50. 在施加之后可以将粘结层观的粘合剂固化。 After applying the adhesive layer of the adhesive may be cured concept. 合适的粘合剂是例如丙烯酸酯、环氧树脂和硅树脂。 Suitable binders are, for example acrylates, epoxies and silicones. 而且也可以使用热熔(例如EVA基)的热塑性粘合剂。 And a hot melt thermoplastic adhesive may be used (e.g. EVA group). 功能叠层10包括第一透明导电层22,该导电层施加在具有第一阻挡结构的衬底12上,所述第一阻挡结构是阻挡叠层的形式。 Functional stack 10 comprises a first transparent conductive layer 22, the conductive layer is applied on a substrate having a first barrier structure 12, the first barrier structure in the form of a barrier stack. 作为衬底,可以使用如PET(聚对苯二甲酸乙二酯)或PEN(聚萘二甲酸乙二醇酯)或PC(聚碳酸酯)的材料。 As the substrate, may be used such as PET (polyethylene terephthalate) material or PEN (polyethylene naphthalate polyethylene terephthalate) or PC (polycarbonate) is. 所述衬底可以例如具有50-250 μ m的厚度,例如125 μ m。 The substrate may for example have a thickness of 50-250 μ m, for example, 125 μ m. 所述阻挡叠层包括厚度为l_500nm、优选约300nm的第一无机层16,厚度为0. 1-100 μ m、优选约20 μ m的第一有机层18,和厚度为l_500nm、优选300nm 的第二无机层20。 The thickness of the barrier laminate comprises l_500nm, preferably the first inorganic layer 16 of about 300nm, a thickness of 0. 1-100 μ m, the first organic layer is preferably from about 18 to 20 μ m, and a thickness of l_500nm, preferably of 300nm second inorganic layer 20. 层18使无机层16,20分隔并且可以另外用作平面化层(planarization layer)。 Layer 18 of the inorganic spacer layers 16, 20 and may additionally function as a planarization layer (planarization layer). 在可以具有(任选的)平面化层14的衬底12上施加该阻挡叠层。 In the barrier laminate may have a (optionally) applied to the substrate 12 on the planarization layer 14. 有机平面化层14具有0. 1-100 μ m、优选约20 μ m的厚度。 The organic planarization layer 14 having 0. 1-100 μ m, μ m thickness is preferably about 20. 第一透明导电层22例如是透明的导电金属氧化物层,例如氧化铟锡(ITO)层、氧化锌(SiO)层或氧化锡(SnO)层。 A first transparent conductive layer 22, for example, a transparent conductive metal oxide layer, such as indium tin oxide (ITO) layer, a zinc oxide (SiO) layer or a tin oxide (SnO) layer. 第一透明导电层22 具有50-300nm、例如150nm的厚度。 A first transparent conductive layer 22 have 50-300nm, for example, a thickness of 150nm. 作为选择或另外,可以使用足够导电的透明有机材料如PEDOT或薄金属(thinmetal)。 Alternatively or additionally, use may be sufficiently transparent conductive organic material such as PEDOT or a thin metal (thinmetal). 该功能叠层包括第二导电但不一定透明的层对,例如与厚度为100-400nm的铝层结合的厚度为约5nm的钡层。 The functional stack comprises a second electrically conductive layer, but not necessarily transparent, for example with a thickness of 100-400nm aluminum layer having a thickness of about 5nm bonded barium layer.

[0046] 将功能结构沈夹在所述第一和第二导电层22J4之间。 [0046] The functional configuration of the sink is sandwiched between the first and second conductive layers 22J4. 根据它的功能,功能结构沈可以包括一层或多层功能层。 According to its function, the functional configuration sink may comprise one or more functional layers. 例如在电子器件是OLED时,该功能结构包括至少一层发光材料如聚合PPV或叠层和包括发射体如IrPy的小分子的混合物。 For example when the electronic device is an OLED, the functional structure comprises at least one layer of a mixture of luminescent materials such as polymeric PPV or a laminate comprising an emitter and small molecules such as IrPy. 另外该功能结构可以在发光材料层与导电层之间包括形成阳极的空穴注入层(HIL),和/或在发光材料层与导电层之间的包括形成阴极的电子传递层。 In addition, this functional configuration may include forming an anode hole injection layer (HIL) between the luminescent material layer and the conductive layer, and / or a cathode comprising an electron transport layer formed between the light emitting material layer and the conductive layer. 合适的材料例如是铝、铜或银。 Suitable materials are for example aluminum, copper or silver.

[0047] 在电子器件是光伏电池的情况下,该功能结构可以包括给电子层和电子接受层的组合。 [0047] In the electronic device is a photovoltaic cell, the functional configuration of the electron donating layer and may include a combination of electron-accepting layer. 例如第一导电层是厚度为125nm的ITO层和第二导电层是厚度为IOOnm的铝层,在这两层之间布置有75nm PEDOT和IOOnm混合层(MDM0-PPV : PCBM 1:4)。 For example the first conductive layer is an ITO layer having a thickness of 125nm and the second conductive layer is an aluminum layer having a thickness of IOOnm, arranged between the two layers and 75nm PEDOT IOOnm mixed layer (MDM0-PPV: PCBM 1: 4).

[0048] 覆盖层50包括衬底52和施加在衬底52上的第一和第二互相绝缘的导电结构66, 68。 [0048] The cover layer 50 comprises a substrate 52 and a substrate 52 applied to the first and second conductive structures insulated from each other 66, 68. 作为衬底,可以使用如PET(聚对苯二甲酸乙二酯)或PEN(聚萘二甲酸乙二醇酯)或PC (聚碳酸酯)的材料。 As the substrate, may be used such as PET (polyethylene terephthalate) material or PEN (polyethylene naphthalate polyethylene terephthalate) or PC (polycarbonate) is. 该衬底可以例如具有50-250 μ m的厚度,例如125 μ m。 The substrate may for example have a thickness of 50-250 μ m, for example, 125 μ m. 将第一和第二互相绝缘的导电结构66,68布置在粘结层观与衬底52之间。 The first and second conductive structures 66, 68 are insulated from each other disposed between the substrate 52 and the adhesive layer concept. 第一和第二互相绝缘的导电结构66,68由此可以埋在粘结层观的表面中。 First and second mutually insulated conductive structure 66, 68 can thus be buried in the surface of the adhesive layer in the View. 适用于导电结构66,68的材料是铜、银和铝。 Suitable materials for the conductive structures 66, 68 are copper, silver and aluminum. 在铜的情况下,合适的导电结构可以由电镀法形成,例如EP1843383中所描述的。 In the case of copper, suitable conductive structures can be formed by a plating method, for example as described in EP1843383. 导电结构66,68可以具有约10-50 μ m的厚度,例如25 μ m。 The conductive structure 66, 68 may have a thickness of about 10-50 μ m, for example, 25 μ m. 该结构可以具有100-300 μ m宽的支路(branches)。 The structure may have a width of 100-300 μ m branch (branches). 为了具有使该器件优良操作的足够低的电阻,导电结构66,68覆盖约10%的衬底表面是足够的。 In order to make the device having good operation of sufficiently low resistance, 66, 68 cover about 10% of the surface of the substrate is sufficiently conductive structure. 这样覆盖层仍然具有优良的透明度。 Such covering layer still has excellent transparency. 例如,如果导电结构后续的支路间隔距离为l_3mm,则可以实现这个目的。 For example, if a subsequent branch conductive structures spaced apart a distance l_3mm, this object can be achieved. 然而,如果仅仅要求功能叠层在该器件的一侧能透射辐射,则导电结构可以覆盖基本上整个衬底52。 However, if the functional stack is only required in one side of the radiation transmitting device, the conductive structures may cover substantially the entire substrate 52.

[0049] 覆盖层50还具有阻挡结构,所述阻挡结构包括第三无机层56、第二有机层58和第四无机层60。 [0049] The cover layer 50 also has a barrier structure, the barrier structure comprises a third inorganic layer 56, a second organic layer 58 and the fourth inorganic layer 60. 阻挡结构56,58,60布置在衬底52与第一和第二互相绝缘的导电结构66,68 之间。 66,68 barrier between the substrate 52 and the first and second conductive structures arranged structures 56, 58 in mutually insulated. 在早先提交的欧洲专利申请EP08156493. 2中描述了适用于本发明的这些及其它实施方案中的该阻挡结构的材料。 In the earlier filed European Patent Application EP08156493. 2 describes a material suitable for the present invention, these and other embodiments of the barrier structure of the embodiment. 覆盖层还具有第一和第二主线导体62,64,其为第一和第二互相绝缘的导电结构66,68与器件外部的另外的导体提供电连接。 The cover layer further having first and second main conductors 62, 64 to provide an electrical connector and a first conductive structure 66, 68 and the outer conductor of the second device further insulated from each other. 或者,可以在功能叠层10中提供这种主线导体62',64'。 Alternatively, such main conductors 62 may be provided in the functional laminate 10 ', 64'.

[0050] 横向于第一平面61的第一导电体32使第一导电层22与第一导电结构66在第一平面61中电互连。 [0050] transverse to the first plane of the first conductor 61 32 with the first conductive layer 22 electrically interconnects the first conductive structure 66 in a first plane 61. 横向于第一平面61的第二导电体34使第二导电层M与第二导电结构68电互连。 The second conductive member 34 transverse to the first plane 61 of the second conductive layer and the second conductive structure M 68 electrically interconnected. 在有利的实施方案中,导电体32,34可以由Cu、Ag或C基墨水、糊剂或粘合剂形成或在填有合适的种子材料之后由金属导体的无电生长形成。 After an advantageous embodiment, the conductive material 32, 34 may be formed of Cu, Ag or C-based inks, pastes or adhesives or filled with a suitable seed material formed from electroless metal conductor growth.

[0051] 用环状带33使第一导电体32与第二导电层M绝缘。 [0051] The endless belt 33 of the first conductor 32 and the second conductive layer insulated M. 在这种情况下环状带33在第一导电体32上遍布。 In this case, the annular band 33 around the first conductor 32. 然而,只要使阴极层(第二导电层24)脱离用第一导电体32填充的该带的周围就足够了。 However, as long as the cathode layer (second conductive layer 24) departing from the periphery of the tape is filled with a first conductive 32 is sufficient. 可以用电绝缘材料填充该环状带33,但是也可以不含材料。 It can filled with an electrically insulating material, the annular band 33, but may also contain materials.

[0052] 在图1中显示的产品可以通过层压第一组件10即功能叠层与第二组件50即具有导电结构的覆盖层有效地制造。 [0052] Products shown in FIG. 1 by laminating the first component 10 i.e. the second functional stack assembly 50 and a cover layer that is electrically conductive structure manufactured efficiently.

[0053] 现在参考图4A-4E说明制造该功能叠层的方法。 [0053] Referring now to FIGS. 4A-4E illustrate a method of manufacturing the functional stack. 根据本发明的方法,提供衬底12。 The method of the present invention, there is provided a substrate 12. 任选可以施加平面化层14。 Optionally a planarization layer 14 may be applied. 例如用照相凹版印刷(在真空下)或狭缝式挤压涂布沉积该平面化层。 For example, with gravure printing (in vacuum), or slot-die coating deposition of the planarization layer. 接着通过随后施加第一无机层16、第一有机层18和第二无机层20来提供第一阻挡结构。 Next a first barrier structure 20 is provided by a first inorganic layer 16, a first organic layer 18 and the second inorganic layer is then applied. 可以通过用例如PECVD沉积SiNx:H来施加无机层16,20。 PECVD deposition can be obtained by, for example, SiNx: an inorganic layer applied 16,20 H. 在沉积之前可进行表面处理。 Prior to the deposition can be surface treated. 中间有机层18可以用照相凹版印刷或狭缝式挤压涂布来沉积。 The organic intermediate layer 18 may be a gravure printing or slot-die coating is deposited.

[0054] 然后施加第一透明导电层22,随后施加包括一层或多层功能层的功能结构26。 [0054] Then a first transparent conductive layer 22 is applied, followed by application of functional structure 26 comprising one or more functional layers. 接着施加第二导电层M。 The second conductive layer is then applied M. 可以通过(可旋转)磁控溅射和随后在低于150°C的温度下的退火来施加导电层22例如ITO层。 22, for example, ITO conductive layers may be applied by (rotatable) magnetron sputtering and subsequent annealing at a temperature of less than of 150 ° C. 可以通过例如热蒸发施加双导电层M。 It can be applied by thermal evaporation double conductive layer e.g. M. 导电层对具有电绝缘粘结层26,在其上任选用隔离衬垫36覆盖。 A conductive layer, which covers the release liner 36 pairs of selected office having electrically insulating adhesive layer 26. 所述功能结构可以包括一层或多层活性层, 例如电光活性层、光电活性层、空穴注入层、电子传递层等等。 The functional structure may comprise one or more active layers, such as electro-optically active layer, a photovoltaic active layer, a hole injection layer, electron transport layer and the like. 可以例如通过旋涂、照相凹版/苯胺印刷、和狭缝式加压涂布方法中的一个或多个来施加一个或多个活性层。 For example, by spin coating, one or more gravure / flexographic printing, and slit coating method, pressure is applied to the one or more active layers. 用这些步骤而无需图案化,获得在图4A中显示的结果。 With these step without patterning, obtained results are shown in Figure 4A.

[0055] 图4B显示了如何穿过粘结层沈和隔离衬垫36形成直径为25-250 μ m的第一和第二孔38,40。 [0055] FIG. 4B shows how the sink through the adhesive layer and release liner first and second holes having a diameter of 38, 40 36 25-250 μ m is formed. 第一孔38朝着第一透明导电层22的方向延伸。 The first bore 38 extends in the direction of the first transparent conductive layer 22. 第二孔40朝着第二导电层24的方向延伸。 The second hole 40 extends in the direction of the second conductive layer 24.

[0056] 在图4C中显示的结果是通过在孔38,40中施加导电材料于是形成导电体32, 34而获得的。 [0056] The results are shown in FIG. 4C conductor 32 is then formed, by applying a conductive material 34 in hole 38, 40 is obtained. 在施加导电体32之后,在第一孔38内导电材料周围形成了外径为例如50-275 μ m的环状凹穴33。 After applying the conductors 32, 38 around the hole formed in the first conductive material, for example, an outer diameter of 50-275 μ m in an annular recess 33. 用绝缘材料填充该环状凹穴33,但是也可以是空的。 The annular cavity 33 is filled with an insulating material, but may be empty. 第一和第二孔38,40以及环状凹穴33优选由激光打孔形成。 And first and second holes 38, 40 is preferably an annular recess 33 is formed by laser drilling. 人们注意到,作为在施加功能叠层10 的最后层之后在一个步骤中形成孔38,40的替代,或者可以通过图案化沉积功能叠层10的层以及层压粘结层26来形成孔38,40和凹穴33,所述粘结层在与孔和凹穴对应的位置具有穿孔。 It is noted that by depositing a patterned functional layer laminate 10 and the laminate adhesive layer 26 is formed as an alternative to apertures 38, 40 in a step after the last layer is applied to the functional stack 10, or to form a hole 38 , recesses 40 and 33, the adhesive layer at positions corresponding to holes and recesses with perforations.

[0057] 为了给产品提供长期的保护,可以采取措施以保护该器件免于受潮,例如用防渗透材料密封功能叠层的侧面。 [0057] In order to provide long-term protection to the product, measures may be taken to protect the device from moisture, for example, a barrier material sealing function of the stack sides.

[0058] 可以使用与在衬底12上施加层14,16,18,20类似的方法在衬底52上施加层54, 56,58,60的叠层来制造覆盖层50。 [0058] can be applied on the substrate layer 52 and the layers 14, 16, similar to the method applied on the substrate 1254, the stack 56, 58, 50 of the cover layer is manufactured. 随后,可以使用例如电镀,例如如上提到的方法来在叠层54,56,58,60上施加第一和第二互相绝缘的导电结构66,68。 Subsequently, a plating may be used, for example, such a method as mentioned above to the first and second conductive structures insulated from each other 66, 68 is applied over the stack 54,56,58,60. 第一和第二互相绝缘的导电结构66,68具有的厚度取决于所需产品的尺寸。 First and second mutually insulated conductive structure 66, 68 have a thickness depending on the desired size of the product.

[0059] 一方面由第一部件10的层16,18和20形成的阻挡结构和另一方面由第二部件50 的层56,58,60形成的阻挡结构保护易受潮的层免于受到来自环境湿度的影响。 [0059] In one aspect the barrier structure formed by the layers 16, 18 and 20, a first member 10 and on the other hand the structure of the protective barrier layers 58 and 60 formed in the second member 50 is easily protected from the damp layers from environmental humidity. 在一个实施方案中,这两个阻挡结构均可以存在于第一部件10中。 In one embodiment, both barrier structures may be present in both the first member 10. 例如在阴极层对和粘结层28之间可以存在阻挡结构。 For example there may be a barrier layer between the cathode structure and an adhesive layer 28.

[0060] 现在可以通过将在图4E中获得的半成品与覆盖层50层压来完成如图1所述的电子器件的制造,所述覆盖层50包括衬底52和在如图3所示的第一平面61中的至少一个导电结构66。 FIG 50 [0060] You can now be accomplished by the cover layer 50 and the semi-finished product obtained laminate in FIG. 4E manufacturing an electronic device, the cover layer comprises a substrate 52 in FIG. 3 and at least one electrically conductive structure 66 in a first plane 61. 于是使第一平面61的第一和第二互相绝缘的导电结构66,68与导电材料32, 34分别在粘结层观中的第一孔和第二孔的开口处接触。 So that the first and second conductive structures insulated from each other in a first plane 66, 68 61 32, 34, respectively, the opening of the first and second holes in the adhesive layer in contact with the concept of a conductive material. 在这个步骤之前,如果存在隔离衬垫36,可以去除。 Before this step, a release liner 36, if present, may be removed. 在这个制造过程中,隔离衬垫36起两个作用。 In this manufacturing process, the isolation pad 36 serves two functions. 一方面其捕捉在形成孔38,40、环状凹穴33和在器件周围待填充防渗透材料30的狭缝的过程中释放的碎片。 In one aspect it captures debris released during the formation of the hole 38, the slit 33 and the annular cavity around the barrier material 30 of the device to be filled in. 另一方面隔离衬垫36有助于快速的层压。 On the other hand contribute to the rapid release liner 36 is laminated. 一旦除去隔离衬垫36,该粘结层观可用于将功能叠层10与覆盖层层压在一起。 Upon removal of the release liner 36, the adhesive layer may be used Concept functional stack 10 and the covering layers laminated together. 在对特定产品有意外需求的情况下,该特定产品可以通过将有关的功能叠层10与覆盖层50层压来制造。 In the case of an unexpected demand for a particular product, the product can be produced by the particular relevant functional stack 10 and the cover layer laminate 50 is manufactured. 通过施加粘结层不会导致延迟。 By applying the adhesive layer does not cause a delay.

[0061] 图5显示了根据本发明的电子器件的另一个实施方案。 [0061] FIG. 5 shows another embodiment of an electronic device of the present invention. 其中相当于图1中的那些部件具有高于100的参考数字。 Having reference numerals 100 higher than those corresponding to component 1 in FIG. 在图5中,参考数字113与155表示包括多个交替的有机层与无机层的阻挡结构,例如如参考图1所述的叠层14,16,18,20。 In FIG. 5, reference numerals 113 and 155 denotes a barrier structure of the organic and inorganic layer comprises a plurality of alternating, for example as described with reference to FIG 1, the laminate 14, 16.

[0062] 在如图5所示的电子器件的实施方案中,第一导电层122具有第一和第二段122a, 122b。 [0062] In an embodiment of the electronic device shown in Figure 5, the first conductive layer 122 having first and second segments 122a, 122b. 段12¾, 122b是互相电绝缘的并且布置在第二共同的平面中。 Segment 12¾, 122b are electrically insulated from each other and disposed in a second common plane. 第一导电层122的第一段12¾与第一导电结构166电连接。 A first conductive layer 122 is connected to the first section 12¾ first electrically conductive structure 166. 通过第二导电体134和第一导电层122的第二段122b使第二导电层124与第二导电结构168电互连。 By a second segment 122b of the second conductor 134 and the first conductive layer 122 and the second conductive layer 124 electrically interconnects the second conductive structure 168.

[0063] 图6A-6E说明了制造如图5所示的实施方案的方法。 [0063] Figures 6A-6E illustrate a method of manufacturing the embodiment shown in Fig 5. 如图6A所示,在该方法的第一步中,施加透明导电材料的图案化层122。 6A, the first step of the method, applying a patterned layer of transparent conductive material 122. 该层包括互相绝缘的至少一个第一段12¾和一个第二段122b。 The insulating layer comprises at least a first section of each 12¾ and a second section 122b. 在该层中的图案可例如通过印刷方法直接施加,或者可以首先施加连续层然后图案化。 The pattern in the layer may be applied directly, for example, by a printing method, or may be applied first continuous layer and then patterned.

[0064] 如图6B所示,在图案化层122上施加一个或多个活性层的叠层126,例如其包括发光层、空穴传递层或电子传递层中的一或多层。 [0064] As shown in Fig. 6B, applying one or more layers in the active layer 122 on the patterned stack 126, for example, includes a light emitting layer, a hole transport layer or electron transport layer or a multilayer.

[0065] 在随后的步骤中,如图6C所示,从第二段122b(或其一部分)上去除叠层126。 [0065] In a subsequent step, as shown in FIG. 6C, the stack 126 is removed from the second segment 122b (or a portion thereof). 或者,可以例如通过印刷方法直接以图案化的形式施加叠层126。 Alternatively, the laminate 126 may for example be applied in a pattern by a printing method of directly.

[0066] 在图6D所示的下一步中,施加导电材料的至少一层124。 [0066] In the next step shown in FIG. 6D, 124 applying at least one electrically conductive material. 该至少一层124与第一导电层122的至少一段122b形成电触点。 At least one layer 124 and the first conductive layer 122 forming an electrical contact at least a section 122b. 如图6E和根据图6E中的视图F的图6F所示, 在第二导电层124中形成孔137,其通过叠层1¾延伸到第一导电层122。 And as shown in FIG. 6E, holes 137 are formed in the second conductive layer 124 in a view according to F of FIG. FIG. 6E 6F, which extends through the stack to the first conductive layer 122 1¾. 该孔137具有圆形内部137a和与内部隔开的环状外部137b。 The bore 137 has a circular inner 137a and 137b and the inner annular outer spaced. [0067] 在如图6G所示的下一步中,在至少一个导电层124上施加粘结层128。 [0067] In the next step shown in FIG. 6G, the adhesive layer 128 is applied on the at least one conductive layer 124. 该粘结层128和可能的隔离层具有与孔137的圆形内部137a符合的第一孔138。 The adhesive layer 128 and barrier layer may have a first aperture 137 and the circular inner bore 137a in line 138. 施加一个或多个第二孔140,其延伸至第一导电层122的第二段。 Applying one or more second holes 140, which extends to the second section of the first conductive layer 122. 粘合剂材料可以填充孔137的环状外部137b。 Binder material may be an annular hole 137 is filled with external 137b. 或者该外部可以不含材料,或者可以用单独的绝缘材料来填充。 Or the outer material may be free, or may be filled with a separate insulating material.

[0068] 在下一步中,分别在孔138,140中施加导体132,134。 [0068] In the next step, the conductors 132, 134 are applied in the holes 138,140. 第一横向导体138穿过该孔的内部137a延伸至第一导电层122。 Inner first transverse conductors 137a through the aperture 138 extends to a first conductive layer 122. 在一个实施方案中,孔137用绝缘材料填充,如有必要将其固化,随后在绝缘材料的体积内部钻出小孔137a,随后用导电材料填充该小孔,形成横向导体。 In one embodiment, the hole 137 is filled with an insulating material, if necessary, it is cured, and then drilled holes 137a in the interior volume of the insulating material, and then filling the holes with a conductive material to form a transverse conductor.

[0069] 随后可以将所产生的如图6G所示的半成品与覆盖层例如如图3所示的覆盖层50 层压。 FIG. [0069] may then be generated, for example, the cover layer 50 and the semi-finished cover layer laminate 3 as shown in FIG. 6G. 在这个实施方案中,隔一定的距离在第一横向导电体132周围施加绝缘带。 In this embodiment, the spacer insulating tape is applied to a distance around the first transverse electrical conductors 132. 或者绝缘带可以直接与第一横向导电体132邻接,如图1的实施方案所示。 Or an insulating tape may be directly adjacent to the first transverse electrical conductors 132, as shown in FIG. 1 embodiment. 同样在图1的实施方案中,其中第二横向导电体;34直接与第二导电层M连接,可以隔一定的距离以与包括第一横向导电体32的孔分离的环形带的形式施加第一横向导电体周围的绝缘带。 Also in the embodiment of Figure 1, wherein the second transverse electrical conductors; 34 directly connected to the M second conductive layer, can be separated a distance and to apply a second form comprises a first transverse bore 32 isolated conductive endless belt a lateral insulating tape around the conductor.

[0070] 图7显示了另一个实施方案。 [0070] FIG. 7 shows another embodiment. 其中相应于图1中的那些部件具有高于200的参考数字。 Wherein corresponding to those in FIG. 1 above the member having reference numeral 200. 其中相应于图5的部件具有高于100的参考数字。 Parts therein corresponding to Figure 5 with reference numerals 100 higher. 在图7的实施方案中,功能结构226和第二导电层2¾具有与第一横向导电体232 —致的空间。 In the embodiment of Figure 7, the functional structure 226 and the second conductive layer 232 having a first transverse 2¾ conductor - consistent space. 功能结构236的空间小于并且在第二导电层224的空间之内。 Functional configuration space 236 is smaller than and within the space of the second conductive layer 224. 如图7所示的电子器件包括在第二导电层2M与粘结层2¾之间的薄膜结构225,该薄膜结构225包括交替的有机和无机层。 The electronic device as shown in FIG. 7 comprises a thin film structure 225 between the second conductive layer 2M 2¾ the adhesive layer, the thin film structure 225 comprising alternating organic and inorganic layers. 在早先提交的申请EP08156493.2中描述了适合用于有机和无机层的材料。 In the earlier filed application EP08156493.2 describes suitable for organic and inorganic material layer. 这个薄膜结构的存在具有的好处是:没有隔离衬垫的半成品具有比较久的使用寿命而且在覆盖层中没有必要存在阻挡结构。 The presence of the thin film structure has the advantage that: a semifinished product is no release liner has a relatively long service life and there is not necessarily a barrier structure in the cover layer. 图7显示了薄膜结构225填充了在功能结构2¾中和在第二导电层2M中形成的空间。 7 shows a thin film structure 225 fills the spaces formed in the functional structure of 2¾ in 2M in the second conductive layer.

[0071] 现在参考图8A-8H说明制造如图7所示的电子器件的方法。 [0071] Referring now to FIGS. 8A-8H illustrate a method of manufacturing the electronic device shown in FIG. 7. 其中图8A和8B显示了制造过程的第一步,其中将图案化的第一透明导电层222施加在衬底212的阻挡结构213上。 Wherein FIGS. 8A and 8B show the first step in the manufacturing process, wherein a patterned first transparent conductive layer 222 is applied on the barrier structure 213 of the substrate 212. 如图5所示的实施方案中,图案化的第一透明导电层222具有第一和第二段22¾, 222b,这两段互相电绝缘而且布置在第二共同的平面内。 Embodiment shown in Figure 5, the patterned first transparent conductive layer 222 having first and second segments 22¾, 222b, these two mutually electrically insulated and disposed in a second common plane. 图8B显示了图8A根据箭头B的俯视图。 FIG 8B shows a top view according to arrow B in FIG. 8A. 例如显示了三段,然而,还可适用任何其它的多段。 For example, it shows a three-stage, however, is also applicable to any other multi-segment.

[0072] 图8C和8D显示了制造过程中进一步的步骤,其中施加功能结构226,随后图案化以在其中提供空间226ο。 [0072] FIGS. 8C and 8D shows a further step in the manufacturing process, wherein a functional structure 226 is applied, which is then patterned to provide space 226ο. 或者,功能结构2¾可以通过图案化沉积在一个步骤中以其图案化形式来施加。 Alternatively, the functional configuration of 2¾ applied in its patterned form in one step may be deposited by patterning.

[0073] 在如图8E和8F所示的步骤中,与功能结构内的空间226ο —样,第二导电层2Μ 具有空间224ο。 [0073] In the step shown in FIG. 8E and 8F, the functional configuration of the inner space 226ο - like the second conductive layer has a space 2Μ 224ο. 功能结构226的空间226ο小于并且在第二导电层224的空间224ο之内。 226ο functional configuration space is less than 226 and the inner space of the second 224ο conductive layer 224. 图8F显示了在图8Ε中根据F的俯视图。 Figure 8F shows a top view of the 8Ε F in FIG.

[0074] 在下一步中,如图8G所示,施加薄膜结构225,其包括交替的有机和无机层。 [0074] In the next step, as shown in FIG 8G, the thin film structure 225 is applied comprising alternating organic and inorganic layers. 薄膜结构225填充了在功能结构226中和在第二导电层224中形成的空间。 Thin film structure 225 and fills the space formed in the second conductive layer 224 in the functional structure 226. 如图8Η所示在薄膜结构225中施加孔238和Μ0。 As shown in FIG 8Η hole 238 and is applied to the thin film structure 225 Μ0. 这些孔与功能结构226的空间226ο以及第二导电层2Μ 的空间224ο—致。 These holes 226 and a functional configuration space 226ο space and the second conductive layer 2Μ 224ο- induced. 随后可以将图8Η的半成品类似于与如图5所示的产品完成为最终产品。 FIG 8Η subsequent semifinished product may be similar to that shown in Figure 5 is completed as a final product.

[0075] 图9、10和11显示了另一个实施方案。 [0075] Figures 9, 10 and 11 show another embodiment. 其中相应于图1的部件具有高于300的参考数字。 Wherein parts corresponding to Figure 1 with reference numerals higher than 300. 图10显示了根据图9中的X的覆盖层350的底视图。 10 shows a bottom view of the cover layer X in accordance with FIG 9350. 图11显示了根据图9中的XI 的功能叠层310的截面图。 Figure 11 shows a cross section of the functional stack 310 according to FIG. 9 XI. 在这个实施方案中,第一和第二导电层322和3Μ被分隔。 In this embodiment, the first and second conductive layers 322 and 3Μ are separated. 其中第一导电层段32加、...,322e与第二导电层324的各段32如、...,324e相对。 Wherein the first conductive layer is added to section 32, ..., 322e and the second conductive layer 32, such as segments 324, ..., 324e opposite. 每对相对的段322a、324a、322b、324b等等与功能叠层段310a、· · ·、310e对应。 Each pair of opposing segments 322a, 324a, 322b, 324b and the like functional stack segment 310a, · · ·, 310e correspond. 功能叠层段310a、· · ·、 310e顺序排列,使第一导电层322的每段322b (除了第一段32¾之外)与随后的功能叠层段310a的第二导电层324的段32½电连接。 Functional stack segment 310a, · · ·, 310e order, the first conductive layer 322b 322 of each segment (except the first segment 32¾) conductive layer and a second segment 32½ subsequent functional stack segment 310a 324 the electrical connection. 第一导电层322的段322b与随后的功能叠层段310a的第二导电层324的段32½之间的电连接是由第一横向导电体332b、在覆盖层350上的导电结构366b和第二横向导电体33½形成的。 32½ electrical connection between the conductive layer of the first segment of the second conductive layer 322b 322 segment and a subsequent functional stack segment 310a 324 by a first transverse electrical conductor 332b, a conductive structure on the cover layer 350 and 366b 33½ two transverse electrical conductors formed. 通过在覆盖层350上的第一导电结构366a使第一导电层322的第一段32¾与第一接线端362电连接。 Through the first conductive layer 350 on the cover structure of the first conductive layer 366a first segment 32¾ 322 is connected to a first terminal 362 electrically. 通过在覆盖层350 上的第六导电结构使第二导电层324的最后一段32½与第二接线端364电连接。 Sixth conductive structure by the cover layer 350 on the second conductive layer 324 is connected to the second last paragraph 32½ terminal 364 electrically.

[0076] 在这个实施方案中还可以获得高的光输出均一性,同时第一导电层可以是相对薄的,于是具有优良的透明度。 [0076] In this embodiment can also be obtained with high uniformity of light output, while the first conductive layer may be relatively thin, thus having excellent transparency. 这个实施方案允许具有弱电流的高电压驱动。 This embodiment allows for high voltage driving with a low current.

[0077] 图12和13显示了串联连接器件的另一个实施例。 [0077] Figures 12 and 13 show another embodiment of the device in series connection. 其中相应于图1那些的部件具有高于400的参考数字。 Wherein components corresponding to those of FIG. 1 having reference numerals greater than 400. 图13显示了通过图12的器件根据线XIII-XIII的阶梯形截面图。 Figure 13 shows the device of FIG. 12 by a stepped cross-section according to line XIII-XIII of FIG.

[0078] 在根据图12和13的串联连接器件的例子中,第一导电层的每段42¾.....422e [0078] In the example of FIG 12 in series and connecting means 13, the first conductive layer each segment 42¾ ..... 422e

具有岛状物42加1.....422el,其与在第二导电层4M中的相应段424a.....42½连接。 Having 42 islands plus 1 ..... 422el, which is connected to the corresponding segment of the second conductive layer 4M 424a ..... 42½. when

钻孔对着第二导电层434的方向时这个实施方案允许大的公差。 When the direction of the second conductive layer 434 facing the bore hole of this embodiment allows a large tolerance. 如果这些孔延伸至第二导电层434就足够了,但是如果由于钻孔过程中的容许误差该孔进一步延伸到叠层内,例如 If these holes extend to the second conductive layer 434 is sufficient, but if during drilling because the allowable error of the aperture extends further into the stack, e.g.

直到第一导电层422,这将不是问题,因为第二导电层424的段42½.....424e仍然与第一 Until the first conductive layer 422, this is not a problem, as the segments of the second conductive layer 424 remains in the first 42½ ..... 424e

导电层的岛状物422al、. . .、422el相连接。 Islands conductive layer 422al ,..., 422el connected. 因此,第二横向导电体43如、4;34(1、43如可以延伸至第二导电层424,如图12和13所示,但是它们或者可以进一步延伸到叠层内,例如对着第一导电层422,与图5所示的类似。在串联连接变体的这个实施方案中,允许第二导电层424是相对薄的,因此具有优良的透明度。 Thus, as the second transverse electrical conductors 43, 4; 34 (eg, 43 may extend to the second conductive layer 424, as shown in FIG. 12 and 13, or they may extend further into the stack, for example against the first a conductive layer 422, similar to that shown in FIG. 5. in this embodiment of the serially connected variant, it allows the second conductive layer 424 is relatively thin, thus having excellent transparency.

[0079] 图14显示了根据本发明电子器件的另一个实施方案。 [0079] FIG. 14 shows another embodiment of an electronic device according to the present invention. 其中相应于图1的部件具有高于500的参考数字。 Wherein parts corresponding to Figure 1 with reference numerals higher than 500. 这个器件包括光学功能结构526,例如之前实施方案所述的有机材料的一层或多层叠层。 This device comprises an optically functional structure 526, for example, one or more embodiments stacked organic material prior to the program. 或者该光学功能结构可以包括无机材料的一层或多层,其施加在相对厚的金属衬底5M上。 Alternatively the optically functional structure may comprise one or more layers of inorganic material, which is applied on a relatively thick metal substrate 5M. 后者充当第二导电层。 The latter acts as a second conductive layer. 在光学功能层526的另一侧施加例如透明金属或透明金属氧化物如ITO的第一导电层522。 A first conductive layer 522 is applied, for example, a transparent metal or a transparent metal oxide such as ITO on the other side of the optically functional layer 526. 第一导电层522例如具有IO-IOOnm的厚度。 The first conductive layer 522 having a thickness of, for example, the IO-IOOnm. 如图14所示的器件是顶发射LED。 Device shown in FIG. 14 is a top-emitting LED. 在由光学功能层5¾形成的功能结构中产生的(可见光)辐射通过第一透明导电层522、通过粘结层5¾和通过具有在衬底552上的导电结构566的覆盖层550透射。 Generated in the functional structure of the optical function layer formed 5¾ (visible) radiation through a first transparent conductive layer 522, via an adhesive layer and by 5¾ on the substrate 552 having a conductive layer 566 of the structure 550 covering the transmission. 为此,以具有宽度为10-100 μ m的线的栅格形式施加该导电结构,其中栅格的线覆盖至多10%的覆盖层表面。 For this reason, to have a width of 10-100 μ m is applied in the form of a grid line of the conductive structure, which covers the surface of the grid lines at most 10% of the cover layer. 如果宽度远小于10 μ m,例如5 μ m,则它难以为电子器件提供足够的电力,尤其对于高功率的LEDs。 If the width is much smaller than 10 μ m, for example, 5 μ m, it is difficult to provide sufficient power to electronic devices, especially for high-power LEDs. 如果宽度远大于100 μ m,例如200 μ m则该结构变得可见,这对于装饰性产品来说是个缺点。 If the width is much larger than 100 μ m, 200 μ m, for example, the structures become visible, which is a disadvantage for decorative products,. 线的厚度例如为10-50 μ m, 例如25 μ m。 The thickness of the lines, for example 10-50 μ m, for example, 25 μ m. 或者图14所示的器件可以是(有机)光伏电池。 Or the device shown in FIG 14 may be an (organic) photovoltaic cells. 光学功能结构5¾可以具有无机的性质,例如包括单个无机层例如硅层,但是或者可以包括多层叠层如CIS叠层(铜、 铟、硒)。 The optical functional configuration 5¾ may have inorganic properties, for example, comprise a single inorganic layer, such as a silicon layer, but may comprise a multilayer stack or laminate such as CIS (copper, indium, selenium). 在有机光伏器件的情况下,可以如在染料敏化的OPV电池中那样设置功能结构5¾ 或者功能结构5¾可以包括例如聚合物或小分子OPV叠层。 In the case of an organic photovoltaic device, may be provided as a functional configuration 5¾ or functional structure may comprise e.g. 5¾ polymer or small molecule OPV stack as in a dye sensitized OPV cell.

[0080] 例如在图15A到15D显示了制造图14器件的方法。 [0080] The example of FIG. 14 shows a method of manufacturing a device in FIGS. 15A to 15D.

[0081] 图15A显示了第一制造步骤,其中在金属衬底5M上施加光学功能层526以及施加在光学功能层5¾上的第一透明导电层。 [0081] FIG. 15A shows a first manufacturing step, wherein the optically functional layer 526 is applied on a metal substrate and a first transparent conductive layer 5M optically functional layer 5¾ applied. [0082] 图15B显示了第二制造步骤,其中在第一导电层上施加具有隔离衬垫536的粘合剂薄片528。 [0082] Figure 15B shows a second manufacturing step in which adhesive is applied to the sheet 528 having a release liner 536 on the first conductive layer. 所述隔离衬垫是例如聚合物薄片,例如厚度为约5μπι到约100 μ m,例如12. 5μπι的PET薄片或PEN薄片。 The release liner, for example, a polymer sheet, for example, a thickness of from about 5μπι to about 100 μ m, such as PET or PEN sheets of sheet 12. 5μπι. 该隔离衬垫用作电绝缘粘结层的支架。 The release liner is used as the electrically insulating adhesive layer scaffold. 与之前实施方案所显示的方法相反,具有隔离衬垫536的粘合剂薄片已经有孔533。 The method of the previous embodiments shown contrary, the release liner having a pressure-sensitive adhesive sheet 536 has holes 533. 或者在将粘合剂薄片5¾粘合到层522之后形成孔533,但是通过预先提供孔533,能够确定孔正好延伸至第一导电层522。 Or a hole 533 is formed after the adhesive sheet adhered to 5¾ layer 522, but through hole 533 is provided in advance, it is possible to determine a first conductive layer 522 extends to the right hole. 其中在将粘合剂薄片施加到功能叠层的其余部分之前粘合剂薄片就具有孔的这个方法还可用于其它实施方案的制造,例如如图1、5、7、9和12所示的器件。 Wherein prior to the rest of the adhesive sheet is applied to the functional adhesive sheet stack having a hole on this method can also be used for manufacturing other embodiments, as shown in FIG. 12 and 1,5,7,9 devices.

[0083] 在如图15C所示的下一步中,孔533用导电材料532填充。 [0083] In the next step shown in FIG. 15C, the hole 533 is filled with a conductive material 532. 随后去除隔离衬垫(图15D)。 Then the release liner is removed (FIG. 15D).

[0084] 最后将在衬底552上具有导电结构566的覆盖层550与功能叠层510的绝缘粘结层528的表面粘合以便获得图14的产品。 An insulating layer 550 covering the adhesive layer with functional stack 510. [0084] Finally, the substrate having a conductive structure on a surface of 552 566 to obtain a bonded product 528 of FIG. 14.

[0085] 图16显示了另一个实施方案。 [0085] FIG. 16 shows another embodiment. 其中相应于图1那些的部件具有高于600的参考数字。 Wherein parts corresponding to those in FIG 1 has a reference numeral 600 higher. 在图16的实施方案中,光学功能层拟6是光伏电池并且其掺杂区域用作第一透明导电层622。 In the embodiment of Figure 16, the optical functional layer 6 is a photovoltaic cell and intended doped region 622 serves as a first transparent conductive layer. 第二导电层624由金属箔形成,其设置为与光学功能层626的静合接点。 The second conductive layer 624 is formed of a metal foil, which is provided to force the optically functional layer 626 laminated contacts.

[0086] 可以类似于图15A-D所示的用于图14器件的方式制造图16的电子器件。 The electronic device for manufacturing the embodiment of the device of FIG. 14 [0086] 15A-D shown in FIG. 16 may be similar. 根据所述的方法,在金属箔拟4上施加具有掺杂区域622的光学功能层626。 The method of, applying a metal foil doped region 622 on the optical function layer 626 intended to 4. 随后,如图15B对于图14的产品所描述的,在光学功能层626的掺杂区域622的表面上施加具有隔离衬垫(没有显示)的粘结层628。 Subsequently, as shown in FIG. 15B for the product 14 as described, is applied to the adhesive layer having a release liner (not shown) on the surface 628 of the optically functional layer 626 doped region 622. 与图15C所示的步骤相似,在粘结层拟8的孔内施加导电材料以形成横向导体632。 Step shown in FIG. 15C is similar to the electrically conductive material is applied to the adhesive layer in the hole 8 intended to form the transverse conductor 632. 与如图15D所示的步骤类似,去除隔离衬垫,随后施加具有导电结构的覆盖层650,获得图16的产品。 15D and the step shown in FIG. Similarly, the removal of the release liner, and then applying the cover layer 650 having a conductive structure, the product 16 is obtained.

[0087] 可以任意顺序制造或同时制造根据本发明用于制造电子器件的各种部件。 [0087] can be manufactured in any order or simultaneously manufacturing various components for manufacturing an electronic device according to the present invention. 例如在图1的实施方案中,这些部件是功能叠层10和覆盖层50。 For example, in the embodiment of Figure 1, these parts are the functional stack 10 and the cover layer 50. 在图16的实施方案中,这些部件是具有光学功能层626的金属箔624、具有隔离衬垫的粘结层628、和覆盖层650。 In the embodiment of FIG. 16, these parts are the metal foil 624 with the optically functional layer 626, the adhesive layer having a release liner 628, and a cover layer 650.

[0088] 在此处明确说明的层之间可以存在另外的层,例如平面化层、过滤层、保护层。 [0088] Additional layers may be present between layers expressly stated herein, for example, the planarization layer, a filter layer, a protective layer.

[0089] 如图17所示,可以在常规的覆盖层550a之上层压或在普通的一对覆盖层550a、 550b之间层压许多功能叠层510。 [0089] shown in Figure 17, many of the functions may be laminated or laminated stack 510 between the normal one pair of cover layers 550a, 550b on a conventional cover layer 550a. 这个可类似地应用到本发明的其它电子器件中。 This may be similarly applied to other electronic devices according to the present invention. 例如用这种方法可层压许多功能叠层610。 In this way, for example, many of the functional stack 610 may be laminated.

[0090] 在权利要求中,词语“包括”不排除其它的元件或步骤,不定冠词“一种”不排除多种。 [0090] In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "an" does not exclude a plurality. 单个组件或其它的单元可以实现在权利要求中所述的几个项目的功能。 Single component or other unit may fulfill the functions of several items claims. 在不同的权利要求中叙述的某些措施不表明,不能使用这些措施的组合。 That certain measures are recited in different claims does not indicate that a combination of these measures can not. 权利要求中的任何参考标记不应认为是对保护范围的限制。 Any reference signs in the claims should not be construed as limiting the scope of protection.

Claims (16)

1. 一种电子器件,其包括功能叠层(10 ;110 ;210 ;310 ;410 ;510 ;610)和用绝缘粘结层(28 ;128 ;228 ;328 ;428 ;528 ;628)与所述功能叠层连接的覆盖层(50 ;150 ;250 ;350 ;450 ; 550 ;650),该功能叠层包括第一透明导电层(22 ;122 ;222 ;322 ;422 ;522 ;622)、第二导电层(24 ;124 ;224 ;324 ;424 ;524 ;624)和夹在所述第一和第二导电层之间的功能结构(26 ; 126 ;226 ;326 ;426 ;526 ;6¾),所述功能结构包括至少一层光学功能层,所述覆盖层(50 ; 150 ;250 ;350 ;450 ;550 ;650)包括具有至少第一导电结构(66 ;166 ;266 ;366a ;466a ;566 ; 666)的衬底(52 ;152 ;252 ;352 ;452 ;552 ;652),所述第一导电结构布置在所述粘结层(28 ; 128 ;228 ;328 ;428 ;528 ;628)与衬底(52 ;152 ;252 ;352 ;452 ;552 ;652)之间的第一平面中,以及其中与第一平面(61 ;161 ;261 ;361 An electronic device, comprising a functional stack (10; 110; 210; 310; 410; 510; 610) and with an insulating adhesive layer (28; 128; 228; 328; 428; 528; 628) and the said cover layer connected to the functional stack (50; 150; 250; 350; 450; 550; 650), the functional stack comprising a first transparent conductive layer (22; 122; 222; 322; 422; 522; 622), a second conductive layer (24; 124; 224; 324; 424; 524; 624) sandwiched between said first and second conductive layers functional structure (26; 126; 226; 326; 426; 526; 6¾ ), the functional structure comprises at least one optically functional layer, said covering layer (50; 150; 250; 350; 450; 550; 650) comprises at least a first conductive structure (66; 166; 266; 366a; 466a ; 566; 666) of the substrate (52; 152; 252; 352; 452; 552; 652), said first conductive structure is disposed in said adhesive layer (28; 128; 228; 328; 428; 528; 628) and the substrate (52; 152; 252; 352; 452; 552; 652 between a first plane), and in which the first plane (61; 161; 261; 361 ;461 ;561 ;661)横向的第一横向导电体(32 ; 132 ;232 ;332 ;432 ;532 ;632)将所述第一和第二导电层(22 ;122 ;222 ;322 ;422 ;522 ;622) 之一与所述第一导电结构(66 ; 166 ;266 ;366a ;466a ;566 ;666)电连接。 ; 461; 561; 661) transverse to the first transverse electrical conductors (32; 132; 232; 332; 432; 532; 632) the first and second conductive layers (22; 122; 222; 322; 422; 522; 622) one of the first conductive structure (66; 166; 266; 366a; 466a; 566; 666) are electrically connected.
2.根据权利要求1的电子器件,包括与所述第一导电结构(66 ; 166 ;266)电绝缘的在第一平面(61 ;161 ;261)中的第二导电结构(68 ; 168 ;268)和横向于第一平面(61 ;161 ; 261)的第二横向导电体(34;134;234),其中所述第一和第二横向导电体分别将第一导电结构(66 ; 166 ;266)与第一导电层(22 ;122 ;222)连接以及将第二导电结构(68 ; 168 ;268) 与第二导电层(24 ;124 ;224)连接。 The electronic device according to claim 1, comprising the first conductive structure (66; 266; 166) electrically insulating the first plane (61; 261; 161) of the second conductive structure (68; 168; 268) and transverse to the first plane (61; 161; 261) a second transverse conductive member (34; 134; 234), wherein said first and second transverse electrical conductors respectively, the first conductive structure (66; 166 ; 266) with the first conductive layer (22; 122; 222) and connected to the second conductive structure (68; 168; 268) and a second conductive layer (24; 124; 224) is connected.
3.根据权利要求2的电子器件,其中第一导电层(12¾具有第一段和第二段(122a, 122b),这两段互相电绝缘并且布置在公共的第二平面中,其中第一导电层(12¾的第一段(122a)与第一导电结构(166)电连接,以及其中第二导电层(124)通过第二导电体(134) 与第二导电结构(168)和第一导电层(122)的第二段(122b)电互连。 The electronic device according to claim 2, wherein the first conductive layer (12¾ having first and second segments (122a, 122b), which two mutually electrically insulated and arranged in a common second plane, wherein the first a conductive layer (12¾ first section (122a) and the first conductive structure (166) is electrically connected, and wherein the second conductive layer (124) through the second conductive member and the second conductive structure (134) (168) and a first second section (122b) electrically conductive layer (122) is electrically interconnected.
4.根据权利要求1的电子器件,其中第二导电层(124)具有孔(137),所述孔具有内部(137a)以及与内部分离的环状外部(137b),并且其中第一横向导体(138)穿过所述内部(137a)。 The electronic device according to claim 1, wherein the second conductive layer (124) having a bore (137), said bore having an inner (137a) and an annular outer (137b) separated from the interior, and wherein the first transverse conductors (138) through the interior (137a).
5.根据权利要求4的电子器件,其中用绝缘材料填充所述外部(137b)。 The electronic device according to claim 4, wherein said material is filled with an insulating outer (137b).
6.根据权利要求1的电子器件,其中所述功能结构(226)和第二导电层(224)具有与第一横向导电体(232) —致的间隔,并且其中功能结构0¾)的间隔小于并且在第二导电层OM)的间隔之内。 The electronic device according to claim 1, wherein the functional structure (226) and second conductive layers (224) having a (232) with the first transverse electrical conductors - consistent intervals, and wherein a functional configuration 0¾) is smaller than the spacing and the second conductive layer OM) of the interval.
7.根据权利要求1的电子器件,其还包括在第二导电层(224)与粘结层(228)之间的薄膜结构025),所述薄膜结构(225)包括阻挡结构。 The electronic device according to claim 1, further comprising a thin film structure 025 between the second conductive layer (224) and the adhesive layer (228)), the thin film structure (225) comprising a barrier structure.
8.根据权利要求1的电子器件,其中功能结构(226)和第二导电层(224)具有与第一横向导电体(232) —致的间隔,并且其中功能结构0¾)的间隔小于并且在第二导电层(224)的间隔之内,所述器件还包括在第二导电层(224)与粘结层(228)之间的薄膜结构025),所述薄膜结构(225)包括交替的有机层和无机层,其中薄膜结构(225)填充在功能结构0¾)以及在第二导电层024)中形成的间隔。 The electronic device according to claim 1, wherein the functional structure (226) and second conductive layers (224) having a (232) with the first transverse electrical conductors - consistent intervals, and wherein a functional configuration 0¾) and smaller than an interval a second conductive layer within the spacer (224), the said device further comprising a thin film structure 025 between the second conductive layer (224) and the adhesive layer (228)), the thin film structure (225) comprises alternating the organic layer and the inorganic layer, wherein the thin film structure (225) filled in a functional configuration 0¾) and a spacer formed on) the second conductive layer 024.
9.根据权利要求8的电子器件,其中将功能叠层(310)分割成功能叠层段(310 a.....310e),每个功能叠层段(310a、· · ·、310e)包括第一导电层(322)段(322a、· · ·、322e)和第二导电层(324)段(324a.....32½),将功能叠层段(310a.....310e)顺序布置,使第一导电层(322)的至少一段(322b)通过覆盖层(350)上的导电结构(366b)与第二导电层(324)段(324a)电连接。 The electronic device according to claim 8, wherein the functional stack (310) is divided into functional stack segments (310 a ..... 310e), each functional stack segment (310a, · · ·, 310e) comprising a first conductive layer (322) section (322a, · · ·, 322e) and a second conductive layer segments (324a ..... 32½) (324), the functional stack segments (310a ..... 310e ) arranged in order, the first conductive layer (322) is electrically connected to at least one segment (322b) via a conductive structure (366b) on the covering layer (350) and the second conductive layer segment (324) (324a).
10.第一组件,其包括功能叠层(10)和通过绝缘粘结层(30)与所述功能叠层连接的隔离衬垫(36),所述功能叠层(10)包括第一透明导电层(22)、第二导电层04)和夹在所述第一和第二导电层之间的功能结构(26),所述功能结构包括至少一层光学功能层,其中与第一和第二导电层(22,24)之一电连接的至少第一导电体(32,34)延伸至所述隔离衬垫的自由表面。 10. The first component, which comprises a functional stack (10) and by an insulating adhesive layer (30) is connected to the functional stack release liner (36), the functional stack (10) comprising a first transparent 04) sandwiched between said first and second conductive layers of the functional structure of the conductive layer (22), a second conductive layer (26), the functional structure comprises at least one optically functional layer, wherein the first and a second conductive layer (22, 24) at least one first electrically conductive member (32, 34) connected to the spacer extending the free surface of the pad.
11.电子器件的制造方法,其包括以下步骤:a)提供第一透明导电层,b)提供包括一层或多层功能层的功能结构,c)提供第二导电层,d)提供电绝缘粘结层,e)形成穿过所述绝缘粘结层的孔,f)在所述孔中施加导电材料,所述材料延伸至所述第一导电层和第二导电层中的至少一个,g)施加覆盖层,所述覆盖层包括具有至少第一导电结构的衬底,在所述粘结层中的所述孔的开口处使所述第一导电结构与所述导电材料接触。 11. A method of manufacturing an electronic device, comprising the steps of: a) providing a first transparent conductive layer, b) providing a functional structure comprising one or more functional layers, c) providing a second conductive layer, d) providing an electrically insulating an adhesive layer, e) forming holes through the insulating adhesive layer, f) applying a conductive material in the holes, the conductive material extending to the first layer and the second conductive layer is at least one, g) applying a cover layer, the cover layer comprises a substrate having at least a first conductive structure, the opening of the hole in the adhesive layer of the first conductive material and the conductive contact structures.
12.根据权利要求11的电子器件的制造方法,其另外包括在步骤e)和步骤f)之间,在所述绝缘粘结层的自由表面上提供隔离衬垫的步骤,以及在步骤g)之前除去所述隔离衬垫的步骤。 12. A method of manufacturing an electronic device according to claim 11, which further comprises between steps e) and step F), the step of providing a release liner on the free surface of the insulating adhesive layer, and in step g) prior to the step of removing the release liner.
13.根据权利要求11的制造方法,其中所述功能结构(226)具有间隔(226ο),而且形成与这些间隔一致的第一孔。 13. A method of manufacturing according to claim 11, wherein the functional structure (226) having a spacing (226ο), and those formed with the first hole uniformly spaced.
14.根据权利要求13的制造方法,其中与所述功能结构中的间隔0沈0) —样,第二导电层(224)具有间隔(224ο),并且其中功能结构(226)的间隔0沈0)小于并且在第二导电层(224)的间隔(224ο)之内。 14. A method of manufacturing according to claim 13, wherein the interval 0 with the functional structure Shen 0) - like, a second conductive layer (224) having a spacing (224ο), and wherein the functional structure (226) spaced Shen 0 0) and less than the (224ο) of the spacer in the second conductive layer (224).
15.根据权利要求13的制造方法,其中在施加第二导电层(224)之后和在施加粘结层(228)之前施加薄膜结构025),所述薄膜结构包括阻挡结构。 15. A method of manufacturing according to claim 13, wherein after the second conductive layer (224) and applying a film structure 025 is applied prior to application of the adhesive layer (228)), the film structure comprises a barrier structure.
16.根据权利要求11的制造方法,其中在施加第二导电层(224)之后和在施加粘结层(228)之前施加阻挡结构(225)。 16. A method of manufacturing according to claim 11, wherein after the second conductive layer (224) and applying the adhesive layer is applied (228) applying a barrier structure (225) before.
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US20110297996A1 (en) 2011-12-08
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US8759884B2 (en) 2014-06-24
CN102138216B (en) 2014-03-12
EP2304800B1 (en) 2013-09-04
JP2011527816A (en) 2011-11-04
JP5584880B2 (en) 2014-09-10

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