CN102135505A - Non-destructive detection method of soldering crack - Google Patents
Non-destructive detection method of soldering crack Download PDFInfo
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- CN102135505A CN102135505A CN2010103008238A CN201010300823A CN102135505A CN 102135505 A CN102135505 A CN 102135505A CN 2010103008238 A CN2010103008238 A CN 2010103008238A CN 201010300823 A CN201010300823 A CN 201010300823A CN 102135505 A CN102135505 A CN 102135505A
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- scolding tin
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Abstract
The invention discloses a non-destructive detection method of soldering cracks, comprising the following steps: cleaning samples: dipping a cleaned sample into solvent containing high-absorbency material; putting the dipped sample into a vacuum drying oven to vacuumize to cause the solvent to seep into the soldering crack of the sample; according to preset time, drying the sample in the vacuum drying oven; completely removing the solvent containing high-absorbency material on the soldering crack; and irradiating the sample by x ray to detect the soldering crack. According to the non-destructive detection method of soldering cracks, the soldering crack of the sample under the condition that the solder ball crack is not damaged can be detected.
Description
Technical field
The present invention relates to a kind of detection method, relate in particular to the nondestructive testing method in a kind of scolding tin crack.
Background technology
At present, the method in observation scolding tin crack generally has two kinds, and first method is: observe the scolding tin crack with the red ink detection method.Particularly, earlier sample is steeped in red ink, with mechanical force position to be detected is separated from sample again, for example, assembly is separated with mainboard to obtain having the aspect of scolding tin, then, utilize the infiltration situation of observation by light microscope red ink, and then judge that scolding tin has non-cracking to exist.The method that detects scolding tin with red ink is irreversible destruction methods, that is to say, the sample of observing with the method can't be detected repeatedly, and can produce extra-pay because sample is destroyed.Second method is: utilize x rayed sample, (detected pore emptying aperture as depicted in figs. 1 and 2 a) in the observation tin ball whether pore and crack, when identical material sample thickness is thick more, the x light that sponges can be many more, can't on image, produce contrast because the volume in scolding tin crack is minimum, therefore, as shown in Figure 2, the crack in the tin ball is difficult to be detected.
Summary of the invention
In view of above content, be necessary to provide the nondestructive testing method in a kind of scolding tin crack, its can be under the situation of not destroying tin ball crack the crack at test sample scolding tin place, reduce the expense that sample produced of destroying.
The nondestructive testing method in a kind of scolding tin crack comprises the steps: to clean sample; Sample after cleaning is immersed in the solution that contains high-absorbent material; Sample after soaking inserted in the vacuum drying oven vacuumize, make solution infiltrate in the scolding tin crack of sample; According to Preset Time the above-mentioned sample of vacuum drying oven that places is dried; The described solution removal that contains high-absorbent material outside the scolding tin crack is clean; And utilize x rayed sample to detect the scolding tin crack.
Compared to prior art, the nondestructive testing method in described scolding tin crack, the characteristic of utilizing high-absorbent material to cover x light, it can be when not destroying the scolding tin crack, but butt welding solder crack seam detects, and can clearly tell pore and crack in the tin ball.
Description of drawings
Fig. 1 and Fig. 2 utilize the pore at x rayed sample scolding tin place and the synoptic diagram in crack in the prior art.
Fig. 3 is the operation process chart of the nondestructive testing method preferred embodiment in scolding tin of the present invention crack.
Fig. 4 is the present invention infiltrates a synoptic diagram from solution to place, scolding tin crack.
Fig. 5 utilizes the pore that method test sample shown in Figure 3 observed and the synoptic diagram in scolding tin crack.
The main element symbol description
| Pore | a |
| The scolding |
100 |
Embodiment
As shown in Figure 3, be the operation process chart of the nondestructive testing method preferred embodiment in scolding tin of the present invention crack, below describe and will carry out in conjunction with Fig. 4 and Fig. 5.
Step S1 cleans sample.In the present embodiment, this step utilizes the scaling powder scavenger to clean sample.
Step S2 is immersed in sample after cleaning in the solution that contains high-absorbent material according to one first Preset Time.This first Preset Time was as two minutes or three minutes, and this first Preset Time is not limited to the cited time of present embodiment, and it can be set up on their own by the user till only being used for the described solution that contains high-absorbent material infiltrated the scolding tin crack of described sample.In the present embodiment, described high-absorbent material is meant the material with high absorption coefficient, promptly absorbs the higher material of x light intensity.
Step S3 inserts in the vacuum drying oven and vacuumizes soaking sample later, makes above-mentioned solution infiltrate preferably in the scolding tin crack of sample, and as shown in Figure 4, described solution infiltrates 100 li in scolding tin crack.
Step S4 is dried the above-mentioned sample of vacuum drying oven that places according to one second Preset Time.In the present embodiment, this second Preset Time is three hours, and the temperature in the vacuum drying oven can be set to 100 degrees centigrade.In other embodiments, this second Preset Time was not limited to three hours, and the temperature of vacuum drying oven also can be configured to other temperature, and the purpose that need reach the oven dry sample gets final product.
Step S5 is clean with the described solution removal that contains high-absorbent material outside the scolding tin crack.In the present embodiment, this step can be utilized acetone or have other compositions and clean-out system that absorption coefficient is lower than described high-absorbent material is removed described solution.
Step S6 utilizes x rayed sample to detect the scolding tin crack.Particularly, known materials absorption x light intensity formula is that (dx/C), wherein, I (0) is the x light intensity of incident material to I=I (0) * A (Z) * Exp, and A (Z) is the absorption coefficient of material, and dx is the penetration depth of x light, and C is the attenuation coefficient of x light.Formula can draw thus, and the intensity that x light penetrates behind the sample is " I (0)-I ".When the material of the different absorption coefficients of x rayed, the material high to the x absorption coefficient of light can absorb more x light, so image can present dark.Characteristic if high-absorbent material is filled into 100 li in scolding tin crack, utilizes x light can detect the scolding tin crack thus, and as the dark part 100 among Fig. 5, part that color is the most shallow such as emptying aperture a are pore.
It should be noted that at last, above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although the present invention is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement technical scheme of the present invention, and not break away from the spirit and scope of technical solution of the present invention.
Claims (5)
1. the nondestructive testing method in a scolding tin crack is characterized in that, this method comprises the steps:
Clean sample;
Sample after cleaning is immersed in the solution that contains high-absorbent material;
Sample after soaking inserted in the vacuum drying oven vacuumize, make solution infiltrate in the scolding tin crack of sample;
According to Preset Time the above-mentioned sample of vacuum drying oven that places is dried;
The described solution removal that contains high-absorbent material outside the scolding tin crack is clean; And
Utilize x rayed sample to detect the scolding tin crack.
2. the nondestructive testing method in scolding tin as claimed in claim 1 crack is characterized in that, described Preset Time is three hours.
3. the nondestructive testing method in scolding tin as claimed in claim 1 crack is characterized in that, the temperature of described vacuum drying oven is 100 degrees centigrade.
4. the nondestructive testing method in scolding tin as claimed in claim 1 crack is characterized in that, described cleaning sample is meant and utilizes the scaling powder scavenger to clean sample.
5. the nondestructive testing method in scolding tin as claimed in claim 1 crack is characterized in that, the described solution that utilizes outside the acetone removing scolding tin crack that the described solution removal that contains high-absorbent material outside the scolding tin crack totally is meant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010103008238A CN102135505A (en) | 2010-01-27 | 2010-01-27 | Non-destructive detection method of soldering crack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010103008238A CN102135505A (en) | 2010-01-27 | 2010-01-27 | Non-destructive detection method of soldering crack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102135505A true CN102135505A (en) | 2011-07-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010103008238A Pending CN102135505A (en) | 2010-01-27 | 2010-01-27 | Non-destructive detection method of soldering crack |
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| CN (1) | CN102135505A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103185736A (en) * | 2012-01-03 | 2013-07-03 | 宏恒胜电子科技（淮安）有限公司 | Testing method for circuit board hole solder |
| CN110702684A (en) * | 2019-09-12 | 2020-01-17 | 江苏吉星新材料有限公司 | Method for detecting defects of sapphire wafer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4172224A (en) * | 1978-10-24 | 1979-10-23 | The United States Of America As Represented By The United States Department Of Energy | Process for the detection of micro-cracks |
| US6342400B1 (en) * | 2000-04-05 | 2002-01-29 | Advanced Micro Devices, Inc. | Dye penetrant test for semiconductor package assembly solder joints |
| CN201051084Y (en) * | 2007-06-05 | 2008-04-23 | 中国工程物理研究院应用电子学研究所 | Pipeline welding seam detection device |
| CN201060173Y (en) * | 2007-07-28 | 2008-05-14 | 大庆石油管理局 | Protecting device of welding line digital image-forming fault detection |
-
2010
- 2010-01-27 CN CN2010103008238A patent/CN102135505A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4172224A (en) * | 1978-10-24 | 1979-10-23 | The United States Of America As Represented By The United States Department Of Energy | Process for the detection of micro-cracks |
| US6342400B1 (en) * | 2000-04-05 | 2002-01-29 | Advanced Micro Devices, Inc. | Dye penetrant test for semiconductor package assembly solder joints |
| CN201051084Y (en) * | 2007-06-05 | 2008-04-23 | 中国工程物理研究院应用电子学研究所 | Pipeline welding seam detection device |
| CN201060173Y (en) * | 2007-07-28 | 2008-05-14 | 大庆石油管理局 | Protecting device of welding line digital image-forming fault detection |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103185736A (en) * | 2012-01-03 | 2013-07-03 | 宏恒胜电子科技（淮安）有限公司 | Testing method for circuit board hole solder |
| TWI465715B (en) * | 2012-01-03 | 2014-12-21 | Zhen Ding Technology Co Ltd | Method for testing the solder in through hole of printed circuit board |
| CN103185736B (en) * | 2012-01-03 | 2015-05-27 | 宏恒胜电子科技（淮安）有限公司 | Testing method for circuit board hole solder |
| CN110702684A (en) * | 2019-09-12 | 2020-01-17 | 江苏吉星新材料有限公司 | Method for detecting defects of sapphire wafer |
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Application publication date: 20110727 |