CN108181342B - Flexible plate detection method - Google Patents
Flexible plate detection method Download PDFInfo
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- CN108181342B CN108181342B CN201711311688.5A CN201711311688A CN108181342B CN 108181342 B CN108181342 B CN 108181342B CN 201711311688 A CN201711311688 A CN 201711311688A CN 108181342 B CN108181342 B CN 108181342B
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- copper foil
- foil layer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
Abstract
The invention discloses a flexible plate detection method, which comprises the following steps: processing a flexible board to obtain a test board, wherein the test board comprises a copper foil layer and a substrate layer which are sequentially arranged, and the area of the copper foil layer is smaller than that of the substrate layer; placing the test board in a heating and humidifying environment; and heating the copper foil layer of the test board. According to the detection method of the flexible board, the flexible board is processed into the test board and placed in a heating and humidifying environment, the substrate layer absorbs moisture, then the copper foil layer of the test board is heated, and quality defects such as layering or cavities and the like can be generated at the joint of the substrate layer and the copper foil layer if the heat resistance of the flexible board is poor. Compared with the traditional test method, the flexible plate detection method can detect the heat resistance of the flexible plate under the condition of moisture absorption, and judge whether the flexible plate has the defects of layering, cavities and the like due to poor heat resistance under the condition of moisture absorption.
Description
Technical Field
The invention relates to the technical field of circuit board detection, in particular to a flexible plate detection method.
Background
With the rapid development of electronic products toward miniaturization, densification, high integration and multi-functionalization, the requirements on the used flexible sheet materials are higher and higher, and the updating speed of the flexible materials is higher and higher.
Before the flexible sheet is applied to electronic products, the flexible sheet needs to be tested, but the traditional testing method is not comprehensive in testing the flexible sheet, and quality risks such as layering and cavities caused by heat resistance problems can occur after the flexible sheet is applied to production.
Disclosure of Invention
Based on this, the present invention provides a flexible sheet material detection method capable of detecting the heat resistance of a flexible sheet material, which overcomes the defects of the prior art.
The technical scheme is as follows:
a flexible sheet material detection method comprises the following steps:
processing a flexible board to obtain a test board, wherein the test board comprises a copper foil layer and a substrate layer which are sequentially arranged, and the area of the copper foil layer is smaller than that of the substrate layer;
placing the test board in a heating and humidifying environment;
and heating the copper foil layer of the test board.
According to the flexible plate detection method, the flexible plate is processed into the test plate containing the copper foil layer and the substrate layer, the area of the copper foil layer is smaller than that of the substrate layer, the test plate is placed in a heating and humidifying environment, so that the substrate layer absorbs moisture, only one side of the substrate layer is provided with the copper foil layer, the area of the substrate layer is larger than that of the copper foil layer, both sides of the substrate layer can absorb moisture, the moisture absorption of the substrate layer is more sufficient, the copper foil layer of the test plate is heated later, quality defects such as layering or cavities can be generated at the joint of the substrate layer and the copper foil layer if the heat resistance of the flexible plate is poor, otherwise, the heat resistance of the flexible plate is better if the layering, the cavities and the like do not. Therefore, compared with the traditional test method, the flexible plate detection method can detect the heat resistance of the flexible plate under the condition of moisture absorption, and judge whether the flexible plate has the defects of layering, cavities and the like due to poor heat resistance under the condition of moisture absorption.
Further, the heating of the copper foil layer of the test board specifically includes the following steps:
and carrying out tin immersion treatment on the copper foil layer of the test board.
Further, a minimum distance between an outer edge of the copper foil layer and an outer edge of the substrate layer is greater than or equal to 25.4 mm.
Further, before the copper foil layer of the test board is heated, the method further comprises the following steps:
and coating the soldering flux on the copper foil layer.
Further, in the above-mentioned immersion tin treatment, the temperature of tin is 285 to 291 ℃.
Further, the step of performing wicking treatment on the copper foil layer of the test board specifically includes the following steps:
and (3) tin dipping the copper foil layer of the test plate for three times, wherein the duration time of each tin dipping is 10 s.
Furthermore, the temperature range of the heating and the humidifying is 21-35 ℃, and the humidity range is 45-65%.
Further, the duration of the heating and humidifying is 5-30 days.
Further, the copper foil layer is a circular plate or a square plate.
Further, when the copper foil layer is a circular plate, the diameter of the copper foil layer is greater than or equal to 50.8 mm; or when the copper foil layer is a square plate, the length and the width of the copper foil layer are both larger than or equal to 50.8 mm.
Drawings
Fig. 1 is a first schematic flow chart of a flexible board detection method according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a test board according to an embodiment of the present invention;
fig. 3 is a schematic flow chart illustrating a flexible board detection method according to an embodiment of the present invention;
FIG. 4 is a schematic view of the combination of the test board and the tin furnace according to the embodiment of the present invention.
Description of reference numerals:
100. test panel, 110, copper foil layer, 120, substrate layer, 200, tin furnace.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The terms "first" and "second" used herein do not denote any particular order or quantity, but rather are used to distinguish one element from another.
In an embodiment, as shown in fig. 1 and 2, the method for detecting a flexible board includes the following steps:
processing the flexible board to obtain a test board 100, wherein the test board 100 comprises a copper foil layer 110 and a substrate layer 120 which are sequentially arranged, and the area of the copper foil layer 110 is smaller than that of the substrate layer 120;
placing the test board 100 in a heating and humidifying environment;
the copper foil layer 110 of the test panel 100 was heated.
The flexible board detection method comprises the steps of processing the flexible board into a test board 100 containing a copper foil layer 110 and a substrate layer 120, wherein the area of the copper foil layer 110 is smaller than that of the substrate layer 120, placing the test board 100 in a heating and humidifying environment, and enabling the substrate layer 120 to absorb moisture, wherein the copper foil layer 110 is arranged on only one side of the substrate layer 120, the area of the substrate layer 120 is larger than that of the copper foil layer 110, both sides of the substrate layer 120 can absorb moisture, the moisture absorption of the substrate layer 120 is more sufficient, and then the copper foil layer 110 of the test board 100 is heated, at the moment, if the heat resistance of the flexible board is poor, quality defects such as layering or cavities can be generated at the joint of the substrate layer 120 and the copper foil layer 110, and if the conditions such as layering and cavities do not occur, the heat. Therefore, compared with the traditional test method, the flexible plate detection method can detect the heat resistance of the flexible plate under the condition of moisture absorption, and judge whether the flexible plate has the defects of layering, cavities and the like due to poor heat resistance under the condition of moisture absorption.
In addition, as the copper foil layer 110 on the flexible board is rarely provided with a circuit at the outer edge, in the processing process of the flexible board, the situation of delamination, voids and the like at the joint of the outer edge of the copper foil layer 110 and the substrate layer 120 can be allowed, but the situation can interfere with the heat resistance test of the flexible board, so that the area of the copper foil layer 110 is smaller than that of the substrate layer 120, that is, the area of the copper foil layer 110 is reduced, the joint of the copper foil layer 110 and the substrate layer 120 is ensured to have no quality defect before the test, and the heat resistance of the flexible board can be better detected.
Alternatively, if the flexible board is a multi-layer board, the flexible board can be first disassembled to obtain the test board 100 having only the substrate layer and the copper foil layer.
Further, as shown in fig. 3 and 4, the heating of the copper foil layer 110 of the test board 100 includes the following steps:
the copper foil layer 110 of the test panel 100 was subjected to a wicking process.
At this time, the copper foil layer 110 can be heated, and meanwhile, the production environment of the flexible board can be simulated, so that whether the production process of the flexible board influences the heat resistance of the flexible board or not can be conveniently known.
Specifically, as shown in fig. 4, the copper foil layer 110 of the test board 100 may be subjected to a wicking process using a tin furnace 200, and the tin furnace 200 maintains tin in a liquid state by heating the tin furnace 200.
Specifically, the wicking process is to place the test board 100 in the tin furnace 200 such that at least the copper foil layer 110 of the test board 100 is immersed in the liquid tin. At this time, the liquid tin can sufficiently heat the copper foil layer and the joint between the copper foil layer and the substrate layer, so that the quality defect of the test board 100 can be conveniently found. Alternatively, the substrate layer 120 may be partially immersed in liquid tin.
Further, the minimum distance between the outer edge of the copper foil layer 110 and the outer edge of the substrate layer 120 is greater than or equal to 25.4 mm. Can further guarantee that both sides face of base plate layer 120 can fully absorb moisture this moment, be favorable to better under the condition that flexible panel absorbed moisture, detect flexible panel's heat resistance, the heat that copper foil layer 110 received can be sealed to 360 degrees to the contact that base plate layer 120 and tin can be better simultaneously for copper foil layer 110 and tin effective contact, the effect is more obvious. In addition, the structure facilitates the completion of the tin immersion operation by clamping the substrate layer 120 through the tool, and the position of clamping the substrate layer 120 by the tool is far away from the substrate layer 120 and the copper foil layer 110, so that the conditions of layering, cavities and the like of the substrate layer 120 and the copper foil layer 110 due to clamping cannot affect the detection result.
Further, as shown in fig. 3, before the copper foil layer 110 of the test board 100 is heated, the method further includes the following steps:
flux is applied to the copper foil layer 110.
The soldering flux enables the copper foil layer 110 to be in contact with the liquid tin more fully, and detection of heat resistance of the flexible plate is facilitated.
Further, in the above-mentioned immersion tin treatment, the temperature of tin is 285 to 291 ℃. The production environment of the flexible plate can be simulated, so that whether the flexible plate has quality defects such as layering and cavities due to the influence of the production environment and the production process after the flexible plate passes through the whole production process can be conveniently known.
Specifically, the temperature of tin in the above-mentioned immersion tin treatment was 288 ℃.
Further, the step of performing the wicking treatment on the copper foil layer 110 of the test board 100 includes the following steps:
the copper foil layer 110 of the test panel 100 was tinned three times for 10s each.
Can guarantee copper foil layer 110 and tin full contact this moment, guarantee to the heating effect of copper foil layer 110, be favorable to judging the heat resistance of flexible sheet.
Furthermore, the temperature range of the heating and the humidifying is 21-35 ℃, and the humidity range is 45-65%. At the moment, the production environment of the flexible plate can be simulated, and whether the production environment influences the heat resistance of the flexible plate or not in the production process of the flexible plate can be known.
Alternatively, the humidity may also be set to be higher than 65%, in which case sufficient moisture absorption of the substrate layer may be ensured.
Further, the duration of the heating and humidifying is 5-30 days. At this time, the substrate layer 120 can be ensured to absorb moisture sufficiently, and the probability of quality problems occurring in the test board 100 is improved by improving the duration of heating and humidifying, so that the heat resistance of the flexible board can be judged better.
Optionally, the duration of the heating and humidifying is 15 days. When the test board 100 is in the heating and humidifying environment for more than 15 days, the moisture absorption effect of the substrate layer 120 is greatly reduced, and thus the heating and humidifying duration may be set to 15 days to improve the testing efficiency.
Further, as shown in fig. 2, the copper foil layer 110 is a circular plate or a square plate. At this time, within the range of the copper foil layer 110, the copper foil layer 110 is completely contacted with the substrate layer 120, so that it is convenient to know whether the quality defect occurs at the joint of the copper foil layer 110 and the substrate layer 120 due to the heat resistance of the flexible board material.
Alternatively, the substrate layer 120 may be processed so that the substrate layer 120 has a square plate shape, a circular plate shape, or the like.
Further, when the copper foil layer 110 is a circular plate, the diameter of the copper foil layer 110 is greater than or equal to 50.8 mm; or when the copper foil layer 110 is a square plate, the length and width of the copper foil layer 110 are both greater than or equal to 50.8 mm. The larger the area of the copper foil layer 110 is, the larger the area of contact between the copper foil layer 110 and the substrate layer 120 is, and it is more likely that delamination, voids, etc. will occur in the joint between the copper foil layer 110 and the substrate layer 120 when the substrate layer 120 is moisture-absorbing, whereas if delamination, voids, etc. do not occur, the better the heat resistance of the flexible board material will be.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A method for detecting a multilayer flexible plate is characterized by comprising the following steps:
splitting the multilayer flexible board to form a test board only having a substrate layer and a copper foil layer, wherein the area of the copper foil layer is smaller than that of the substrate layer, and the minimum distance between the outer edge of the copper foil layer and the outer edge of the substrate layer is greater than or equal to 25.4 mm;
placing the test board in a heating and humidifying environment;
and carrying out tin immersion treatment on the copper foil layer of the test board, wherein the tin immersion treatment is to horizontally place the test board in a tin furnace, at least to immerse the copper foil layer of the test board into liquid tin, so that the copper foil layer is sealed by the tin at 360 degrees, and the substrate layer is not immersed or partially immersed in the liquid tin.
2. The method for detecting the multilayer flexible sheet material as claimed in claim 1, wherein the step of performing the wicking treatment on the copper foil layer of the test sheet material comprises the following steps:
the tin furnace keeps tin in the tin furnace in a liquid state by heating.
3. The method for inspecting a multilayer flexible sheet material as claimed in claim 1, wherein before the step of performing the wicking treatment on the copper foil layer of the test sheet material, the method further comprises the steps of:
and coating the soldering flux on the copper foil layer.
4. The method for detecting the multilayer flexible sheet material as claimed in claim 1, wherein the temperature of tin during the tin immersion treatment is 285 ℃ to 291 ℃.
5. The method for detecting the multilayer flexible sheet material as claimed in claim 1, wherein the step of performing the wicking treatment on the copper foil layer of the test sheet material comprises the following steps:
and (3) tin dipping the copper foil layer of the test plate for three times, wherein the duration time of each tin dipping is 10 s.
6. The method for detecting the multilayer flexible sheet material as claimed in any one of claims 1 to 5, wherein the temperature range of the heating and humidifying is 21 ℃ to 35 ℃, and the humidity range is 45% to 65%.
7. The method for detecting the multilayer flexible sheet material as claimed in any one of claims 1 to 5, wherein the duration of the heating and humidifying is 5 to 30 days.
8. The method as claimed in any one of claims 1 to 5, wherein the copper foil layer is a circular plate or a square plate.
9. The method for detecting the multilayer flexible sheet material as claimed in claim 8, wherein when the copper foil layer is a circular plate, the diameter of the copper foil layer is greater than or equal to 50.8 mm; or when the copper foil layer is a square plate, the length and the width of the copper foil layer are both larger than or equal to 50.8 mm.
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| CN201711311688.5A CN108181342B (en) | 2017-12-11 | 2017-12-11 | Flexible plate detection method |
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| CN201711311688.5A CN108181342B (en) | 2017-12-11 | 2017-12-11 | Flexible plate detection method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103819215A (en) * | 2014-03-20 | 2014-05-28 | 李磊 | Preparation method of aluminium nitride base ceramic copper-clad plate |
| CN104245306A (en) * | 2012-04-24 | 2014-12-24 | Sk新技术株式会社 | Flexible metal clad laminate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202770793U (en) * | 2012-08-22 | 2013-03-06 | 广东生益科技股份有限公司 | Automatic test material soldering- resistance tin time-stratification device |
| CN103265810B (en) * | 2013-05-29 | 2015-09-23 | 苏州生益科技有限公司 | A kind of resin combination for high-frequency high-speed substrate and use its prepreg made and veneer sheet |
| CN105196649A (en) * | 2015-09-02 | 2015-12-30 | 铜陵翔宇商贸有限公司 | Copper-clad plate manufacturing method |
| CN107365476B (en) * | 2016-05-12 | 2019-11-08 | 中山台光电子材料有限公司 | Resin combination and finished product as made from it |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104245306A (en) * | 2012-04-24 | 2014-12-24 | Sk新技术株式会社 | Flexible metal clad laminate |
| CN103819215A (en) * | 2014-03-20 | 2014-05-28 | 李磊 | Preparation method of aluminium nitride base ceramic copper-clad plate |
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