CN102135425A - Leveling gauge - Google Patents

Leveling gauge Download PDF

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Publication number
CN102135425A
CN102135425A CN2010105630343A CN201010563034A CN102135425A CN 102135425 A CN102135425 A CN 102135425A CN 2010105630343 A CN2010105630343 A CN 2010105630343A CN 201010563034 A CN201010563034 A CN 201010563034A CN 102135425 A CN102135425 A CN 102135425A
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CN
China
Prior art keywords
light
level meter
bubble
window
photo detector
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Pending
Application number
CN2010105630343A
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Chinese (zh)
Inventor
纪祐司
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Disco Corp
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Disco Corp
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Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN102135425A publication Critical patent/CN102135425A/en
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  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

The invention provides a leveling gauge, which can be operated by one worker and has a simple structure and a low cost. The leveling gauge comprises a window forming a curved plane where liquids and bubbles are sealed. Through the window, the position of the bubbles can be ensured by the eyes. Thus the leveling can be ensured. The leveling gauge is characterized in that the leveling gauge comprises a luminous element equipped above the center of the window forming a curved plane, a light receiving element for receiving the light sent from the luminous element and reflected at the interface between the bubbles and the liquids, and an acoustical generator for sound generation when the light receiving element receives the reflected light.

Description

Level meter
Technical field
The present invention relates to be used for critically measuring the level meter of the degree of tilt of the precision machined processing unit (plant) that for example carries out wafer in the semiconductor workshop.
Background technology
Semiconductor wafer is formed with IC (integrated circuit: integrated circuit) on the surface, large scale integrated circuit) LSI (large-scale integration: a large amount of device such as, and each device comes by cutting apart preset lines (spacing track) division, utilizing grinding attachment the back side of this semiconductor wafer to be carried out after thereby grinding is processed into preset thickness with semiconductor wafer, thereby utilize cutter sweep to cut semiconductor wafer is divided into device one by one cutting apart preset lines, the device after cutting apart is used in mobile phone, electrical equipments such as personal computer.
Grinding attachment or cutter sweep possess at least: chuck table, and this chuck table has the maintenance face that is used to keep wafer; Tool member, this tool member are used for the wafer that remains in this chuck table is carried out grinding or cutting; And the working fluid supply member, this working fluid supply member is used for wafer is supplied with working fluid.
This processing unit (plant) is being arranged under the situation in workshop, level meter is being set, making the bolt that is provided with that is assemblied in foot in the mode that can rotate rotate the maintenance face of making level, thereby carry out horizontal adjustment at the maintenance face of chuck table.
The level meter that has as lower member in speciallyying permit No. 4325916 communique, Japan is disclosed: a plurality of inclination sensors, and described a plurality of inclination sensors are measured a plurality of degree of tilt respectively; Means of storage, this means of storage are used for storing predetermined degree of tilt data; And display member, this display member is used for display image.
This level meter constitutes: in display with circle and * mark shows the degree of tilt of ad-hoc location two-dimensionally, can to judge from which direction adjusting, hummer is rung intuitively to the degree of tilt of this ad-hoc location with the same sensation of the level meter that uses bubble.
Patent documentation 1: No. 4325916 communique of Japan's special permission
But, in level meter in the past, on one side the situation at the center of the bubble of Visual Confirmation level meter arrival is on one side carried out the horizontal adjustment of processing unit (plant), for the leveling (level goes out) of carrying out processing unit (plant), at least need two operators, have inefficient problem.
And, though patent documentation 1 disclosed level meter constitutes hummer is rung,, there are the complex structure and the expensive problem of level meter.
Summary of the invention
The present invention makes in view of this problem, and the simple in structure and cheap level meter that provides a kind of operator one people just can handle is provided its purpose.
According to the present invention, a kind of level meter is provided, wherein, in forming the window of flexure plane, enclose liquid to be arranged and enclose bubble is arranged, thereby level can be confirmed in the position that sees through this window Visual Confirmation bubble, it is characterized in that described level meter possesses: light-emitting component, this light-emitting component is provided in the top at the center of the described window that forms flexure plane; Photo detector, the reflected light that this photo detector obtains reflecting from the interface generation of light between described bubble and described liquid of described light-emitting component ejaculation receives; And acoustical generator, when described photo detector received described reflected light, this acoustical generator was sounded.
The sound that preferred acoustical generator sends changes according to the light quantity that photo detector receives, and acoustical generator is exported maximum sound when the center of bubble is consistent with the center of the window that forms flexure plane.
According to the present invention, when utilizing level meter to detect level, owing in level meter, be assembled with acoustical generator, this acoustical generator receives the reflection of light light time that light-emitting component sends at photo detector and sounds, therefore, though simple in structure and cheap, operator one people just can confirm level according to sound, can efficiently processing unit (plant) be adjusted into level.
Description of drawings
Fig. 1 is the summary structural drawing of topping machanism.
Fig. 2 is the summary structural drawing of grinding attachment.
Fig. 3 is the stereographic map of the related level meter of embodiments of the present invention.
Fig. 4 is the stereographic map that level meter is arranged on the state on the chuck table of topping machanism.
Fig. 5 is the one-piece construction figure that the effect to the related level meter of embodiment describes.
Fig. 6 is based on the key diagram of the leveling of level meter, Fig. 6 (A) expression situation about tilting slightly from level wherein, the situation after the complete leveling of (B) expression of Fig. 6.
Label declaration
2: topping machanism; 18: chuck table; 28: cutting tool; 30: foot; 31: bolt is set; 32: grinding attachment; 40: the grinding unit; 66: chuck table; 74: foot; 75: bolt is set; 76: level meter; 80: the window that forms flexure plane; 82: cross curve; 82a: the intersection point of cross curve; 84: bubble; 88: optical sensor; 90: hummer; 92: light-emitting component; 94: photo detector.
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are elaborated.Can use the outward appearance of the topping machanism 2 of level meter of the present invention when Fig. 1 represents to be provided with, thereby this topping machanism 2 can be divided into chip (device) one by one to semiconductor wafer cutting.
Front surface side at topping machanism 2 is provided with control member 4, and this control member 4 is used for importing the indication to device such as processing conditions by the operator.Cathode-ray tube (CRT)) be provided with the CRT that is used to show the image of taking to operator's guide picture or by shooting member described later (Cathode Ray Tube: display member 6 such as on device top.
Wafer W is pasted on the cutting belt T as splicing tape, and the outer peripheral edges portion of cutting belt T is pasted on ring-shaped frame F.Thus, wafer W forms the state that is supported on framework F via cutting belt T, has taken in multi-disc (for example 25) wafer in wafer case shown in Figure 18.Wafer case 8 is positioned on the box lifter 9 that can move up and down.
Be equipped with to take out of at the rear of wafer case 8 and move into member 10, this is taken out of the wafer W of moving into before member 10 will cut from wafer case 8 and takes out of, and the wafer after will cutting is moved into wafer case 8.In wafer case 8 and take out of to move into and be provided with interim put area 12 between the member 10, this interim put area 12 is to be used for interim mounting as the zone of taking out of the wafer of moving into object, is equipped with the paraposition components 14 of the position that makes the wafer W secured in alignment at interim put area 12.
Near interim put area 12, be equipped with conveyance member 16, this conveyance member 16 has the revoliving arm of the framework F that is used to adsorb also conveyance and wafer W one, the wafer W of being taken out of to interim put area 12 is adsorbed also conveyance to chuck table 18 by conveyance member 16, this wafer W is attracted by chuck table 18, and framework F is fixed by a plurality of fixed components 19, and wafer W is maintained on the chuck table 18 thus.
Chuck table 18 constitutes and can rotate and can move back and forth in X-direction, is equipped with calibrated component 20 above the mobile route of the X-direction of chuck table 18, and this calibrated component 20 is used to detect the spacing track that should cut of wafer W.
Calibrated component 20 possesses and is used for shooting member 22 that the surface of wafer W is taken, and this calibrated component 20 can detect the spacing track that should cut according to the image of being obtained by shooting by processing such as pattern match.The image that utilizes shooting member 22 to obtain is shown in display member 6.
Be equipped with the cutting member 24 that is used for the wafer W that remains in chuck table 18 is implemented cut in the left side of calibrated component 20.Cutting member 24 constitutes one with calibrated component 20, and the two moves in Y direction and Z-direction in linkage.
The end that cutting member 24 constitutes at the main shaft 26 that can rotate is equipped with cutting tool 28, and this cutting member 24 can move in Y direction and Z-direction.Cutting tool 28 is positioned on the extended line of X-direction of shooting member 22.
Label 25 is conveyance members that the wafer after being used for cut finished carries out conveyance, the wafer W after cut finishes by 25 conveyances of conveyance member to rotary cleaning device 27.In rotary cleaning device 27, wafer W is cleaned and Rotary drying.
Topping machanism 2 is by 4 foots (only illustrating 3), 30 supportings.Bolt 31 is set is assemblied in each foot 30, bolt 31 is set screws togather with the nut that is formed at the housing 5 of topping machanism 2 in the mode that can rotate.
Under situation about topping machanism 2 being arranged in the semiconductor workshop, carry out Precision Machining in order to allow cutting tool 28, need correctly carry out after the leveling topping machanism 2 being set to chuck table 18.Therefore, as the back describes in detail, level meter mounting of the present invention on chuck table 18, is provided with the horizontal adjustment that bolt 31 carries out chuck table 18 thereby rotate each.
With reference to Fig. 2, be illustrated in the summary structure that to use the grinding attachment 32 of level meter of the present invention in the leveling operation when being provided with.Label 34 is housings of grinding attachment 32, erects at the rear of housing 34 and is provided with column 36.Be fixed with the pair of guide rails 38 of extending at above-below direction at column 36.
Grinding unit (grinding member) 40 is assembled into and can moves at above-below direction along this a pair of guide rail 38.Grinding unit 40 has main spindle box 42 and is used to keep the support 44 of main spindle box 42, and support 44 is installed on the mobile foundation 46 that moves at above-below direction along pair of guide rails 38.
Grinding unit 40 comprises: main shaft 48, and this main shaft 48 is accommodated in the main spindle box 42 in the mode that can rotate; Motor 50, these motor 50 drive shaft 48 rotations; Emery wheel mount pad 52, this emery wheel mount pad 52 is fixed on the end of main shaft 48; And emery wheel 54, this emery wheel 54 is screwed to emery wheel mount pad 52, and has a plurality of grinding grinding tools that set in the form of a ring.
Grinding attachment 32 possesses the grinding unit feed mechanism 62 that is made of ball-screw 58 and pulse motor 60, and this grinding unit feed mechanism 62 makes grinding unit 40 move at above-below direction along pair of guide rails 38.When driving pulse motor 60, ball-screw 58 rotation, mobile foundation 46 moves at above-below direction.
Upper surface at housing 34 is formed with recess 34a, and chuck table mechanism 64 is equipped on this recess 34a.Chuck table mechanism 64 has chuck table 66, and this chuck table mechanism 64 by not shown travel mechanism wafer loading position A and and grinding unit 40 opposed grinding position B between move in Y direction.Label 68,70 is a corrugated cover.Be equipped with the guidance panel 72 that operator for grinding attachment 32 imports grinding condition etc. at the front side of housing 34.
Grinding attachment 32 is by 4 foots (only illustrating 3), 74 supportings.Bolt 75 is set is assemblied in each foot 74, bolt 75 is set screws togather with the nut that is fixed in housing 34 in the mode that can rotate.
For wafer W similarly is ground to tens microns thickness, need carry out tight leveling to the chuck table 66 of grinding attachment 32.Therefore, level meter mounting of the present invention on chuck table 66, is provided with the horizontal adjustment that bolt 75 carries out chuck table 66 thereby rotate each.
Below, with reference to Fig. 3 to Fig. 6 the related level meter 76 of embodiments of the present invention is elaborated.With reference to Fig. 3, Fig. 3 represents the stereographic map of level meter 76, and level meter 76 has the window 80 that forms flexure plane at the central portion of the upper surface 78a of main body 78.
Enclosing in window 80 has liquid, and inclosure has bubble 84.Window 80 has cross curve 82, when the intersection point 82a of the center of bubble 84 and this cross curve 82 on time, level meter 76 and mounting have the carrying plane of level meter 76 to be in level.
Erect the support unit 86 that is provided with L shaped shape from the main body 78 of level meter 76, optical sensor 88 is installed opposed to each other at the end of support unit 86 and the intersection point 82a of cross curve 82.As shown in Figure 5, optical sensor 88 is made of light-emitting component 92 and photo detector 94.
Light-emitting component 92 is connected with power supply 100, photo detector 94 is connected with voltage detection department 96, utilize these voltage detection department 96 detected voltages to amplify, ring so that be equipped on the hummer 90 of the main body 78 of level meter 76 by the voltage amplification portion 98 that is connected with power supply 100.
Below, the situation of horizontal adjustment of using the related level meter 76 of embodiments of the present invention to carry out the chuck table 18 of topping machanism shown in Figure 12 is described.At first, as shown in Figure 4, level meter 76 is positioned on the chuck table 18.Under this state, bolt 31 is set so that the center of bubble 84 is consistent with highly adjusting with the intersection point 82a of cross curve 82 thereby rotate each.
Shown in Fig. 6 (A), overlapping but under the not on all four situation at bubble 84 with the intersection point 82a of cross curve 82, the interface of the light that penetrates from light-emitting component 92 between the liquid in bubble 84 and the window 80 that is enclosed in curved shape is reflected, and a catoptrical part is by photo detector 94 receptions.
Photo detector 94 produces photocurrent accordingly with light income, and this photocurrent converts voltage to by voltage detection department 96, thereby detects the voltage corresponding with photocurrent.Utilize voltage detection department 96 detected voltages to amplify, thereby hummer 90 is rung by voltage amplification portion 98.But under the situation shown in (A) of Fig. 6, the light income of photo detector 94 is little, so hummer 90 is rung with smaller sound.
The adjustment of bolt 31 further is set as the operator, when thereby the center that makes bubble 84 is consistent with the intersection point 82a of cross curve 82, shown in Fig. 6 (B), the light that penetrates from light-emitting component 92 between bubble 84 and liquid reflection takes place at the interface and the catoptrical major part that obtains is all received by photo detector 94.Therefore, photo detector 94 produces the bigger photocurrent corresponding with light income, thereby hummer 90 is rung with bigger sound.
Like this, because constituting the intensity of the sound that makes hummer 90 changes according to the light quantity that photo detector 94 receives, therefore, the operator can judge whether the center of bubble 84 is consistent with the intersection point 82a of cross curve 82 by the sound of differentiating hummer 90, thereby people just can implement the installation setting of topping machanism 2.In the present embodiment, adopted hummer 90, still, also can adopt other acoustical generator such as electronics sound as acoustical generator.
In the above-described embodiment, to in the horizontal adjustment operation of the chuck table 18 of topping machanism 2, adopting the structure of level meter 76 of the present invention to be illustrated, but, in the horizontal adjustment operation of the chuck table 66 of grinding attachment shown in Figure 2 32, can use level meter 76 of the present invention too.And level meter 76 of the present invention equally also can be applied to other processing unit (plant) such as lapping device.

Claims (2)

1. level meter, wherein, enclosing in forming the window of flexure plane has liquid and inclosure that bubble is arranged, thus level can be confirmed in the position that sees through this window Visual Confirmation bubble, described level meter is characterised in that,
Described level meter possesses:
Light-emitting component, this light-emitting component is provided in the top at the center of the described window that forms flexure plane;
Photo detector, the reflected light that this photo detector obtains reflecting from the interface generation of light between described bubble and described liquid of described light-emitting component ejaculation receives; And
Acoustical generator, when described photo detector received described reflected light, this acoustical generator was sounded.
2. level meter according to claim 1, wherein,
The sound that described acoustical generator sends changes according to the light quantity that described photo detector receives, and described acoustical generator is exported maximum sound when the center of described bubble is consistent with the center of the described window that forms flexure plane.
CN2010105630343A 2009-12-24 2010-11-25 Leveling gauge Pending CN102135425A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009292948A JP2011133346A (en) 2009-12-24 2009-12-24 Level
JP2009-292948 2009-12-24

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CN102135425A true CN102135425A (en) 2011-07-27

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CN2010105630343A Pending CN102135425A (en) 2009-12-24 2010-11-25 Leveling gauge

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108871269B (en) * 2018-03-15 2021-04-06 大族激光科技产业集团股份有限公司 3D printing laser galvanometer horizontal detection method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990013792A1 (en) * 1987-11-09 1990-11-15 Metrum Oy Procedure and device for the detection of direction or angle
JPH08334493A (en) * 1995-06-07 1996-12-17 Shimadzu Corp Liquid chromatograph mass spectroscope
JP3075190U (en) * 2000-07-27 2001-02-09 チクシ電気株式会社 Level sensor
CN1624424A (en) * 1996-12-12 2005-06-08 杜安·朱格尔 Spirit level
CN1645070A (en) * 2003-12-11 2005-07-27 梅特勒-托莱多有限公司 Method and device for monitoring the alignment of a measuring instrument, and measuring instrument

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0648194B2 (en) * 1983-12-08 1994-06-22 名古屋市 Inclination detector
JPH06201381A (en) * 1992-12-28 1994-07-19 Taito Seiko Kk Level guide
JPH10227635A (en) * 1997-02-13 1998-08-25 Yazaki Corp Inclination sensor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990013792A1 (en) * 1987-11-09 1990-11-15 Metrum Oy Procedure and device for the detection of direction or angle
JPH08334493A (en) * 1995-06-07 1996-12-17 Shimadzu Corp Liquid chromatograph mass spectroscope
CN1624424A (en) * 1996-12-12 2005-06-08 杜安·朱格尔 Spirit level
JP3075190U (en) * 2000-07-27 2001-02-09 チクシ電気株式会社 Level sensor
CN1645070A (en) * 2003-12-11 2005-07-27 梅特勒-托莱多有限公司 Method and device for monitoring the alignment of a measuring instrument, and measuring instrument

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Application publication date: 20110727