CN102127663A - 键合金丝及其制备方法 - Google Patents

键合金丝及其制备方法 Download PDF

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CN102127663A
CN102127663A CN2010106223607A CN201010622360A CN102127663A CN 102127663 A CN102127663 A CN 102127663A CN 2010106223607 A CN2010106223607 A CN 2010106223607A CN 201010622360 A CN201010622360 A CN 201010622360A CN 102127663 A CN102127663 A CN 102127663A
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master alloy
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CN102127663B (zh
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郑康定
郑芳
李采莲
郑磊
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NINGBO KANGQIANG ELECTRONICS CO Ltd
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Abstract

本发明提供了一种键合金丝,其材料配方重量百分比为:铍0.0005%~0.001%,铜或锗0.0008%~0.002%,铈0.001%~0.003%,其余为金,金的纯度≥99.996wt%。本发明还提供了该键合金丝的制备方法,它包括:用纯度为99.99wt%的金电解提纯出纯度为99.999wt%的高纯金;将高纯金进行熔炼,铸锭成金板,将金板轧制成薄金片;制作中间合金;竖式熔炼;拉丝;退火;分卷;真空包装。该键合金丝具有高强度、低长弧度的特性,产品成材率高,收线轴的缠绕长度长。

Description

键合金丝及其制备方法
技术领域
本发明涉及键合丝领域,尤其涉及一种键合金丝及其制备方法。
背景技术
键合金丝是用于集成电路或晶体管芯片管芯与引线框架连接的关键引线材料。近年来随着半导体行业的迅速发展,集成电路的集成化程度越来越高,电路板厚度越来越小,器件上的电极数越来越多,电极间距越来越窄,封装密度也相应变得越来越小,客观要求作为引线的键合金丝具有高强度、低长弧度和非常高的弧形稳定性等性能。而目前键合金丝主要以铍、铈、银等元素为合金的微量元素,这些微量元素具有细化晶粒、强化金的作用,但添加这些元素的合金材料很难满足引线对高强度、低长弧度的高要求。
而在现有的键合金丝的制备过程中,一般需要将其加热到300~600℃进行退火,退火后直接缠绕于收线轴进行分卷,这时键合金丝之间容易产生自扩散的粘结效应,导致下一道工序使用时放不出线来,产生大量的断线,产品成材率不高,因此限制了收线轴的缠绕长度。
发明内容
本发明所要解决的技术问题是克服以上现有技术问题的不足,提供一种高强度、低长弧度的键合金丝。
本发明所采用的技术方案为提供一种键合金丝,其材料配方重量百分比为:铍0.0005%~0.001%(即铍5~10ppm,一个ppm为一百万分之一,下同),铜或锗0.0008%~0.002%(即铜8~20ppm或锗8~20ppm),铈0.001%~0.003%(即铈10~30ppm),其余为金,金的纯度≥99.996wt%。
本发明所要解决的另一技术问题是,提供本发明键合金丝的制备方法,用该方法制备的键合金丝产品成材率高,收线轴的缠绕长度长。
一种键合金丝的制备方法,包括以下工艺步骤:
①用纯度为99.99wt%的金电解提纯出纯度为99.999wt%的高纯金。电解时控制电解槽的槽压在0.6V,电解析出的金依次经水煮、氨水煮、水煮、3mol/L硝酸煮、水洗,烘干得高纯金。
②将高纯金进行熔炼,铸锭成金板,将金板轧制成薄金片。
③制作中间合金,所述中间合金指铍-金中间合金、铜-金中间合金、锗-金中间合金和铈-金中间合金中的一种。
所述制作中间合金,包括以下顺序的工艺步骤:
a.按重量百分比称取步骤②得到的薄金片99.43%~99.50%和铍或铜或锗或铈0.50%~0.57%。
b.投料,用薄金片将铍或铜或锗或铈捆包成小包,并将此小包放入坩埚中。
c.真空熔炼:真空熔炼的熔炼功率为10kW,待完全熔化后保持温度精炼10min。
d.浇铸,金液倒入石墨锭模中。
e.酸洗:将生成的中间合金先用纯水冷却,然后放到烧杯中并加入浓盐酸,将烧杯放到电炉上加热15min,煮完后再用纯水洗,最后用压缩空气吹干。
以上步骤制作出一种中间合金,按同样的工艺步骤制作出另外几种中间合金。
④竖式熔炼:将步骤③得到的中间合金在惰性气体氩气的保护下进行熔炼,拉铸,形成金棒。熔炼温度为1150±50℃,完全熔化后保持温度,精炼15min。
⑤拉丝:将熔铸的金棒在拉丝机上逐步拉细,直至要求的直径。其拉丝过程中的模具延伸率为5%~18%,拉丝速度为3~15m/s。
⑥退火:退火温度为300~600℃,退火速度为0.3~1.2m/s,退火后进行表面处理。退火后的表面处理指在键合金丝表面附上一层高分子化合物,高分子化合物由10%表面活性剂、10%无水乙醇及80%双蒸水组成。
⑦分卷:将键合金丝缠绕于收线轴。其绕丝张力为5~20g,绕丝速度为400~800rpm。
⑧真空包装。
与现有技术相比,本发明的键合金丝具有以下显著优点和有益效果:本发明的微量元素选用铍、铜或锗、铈,铜能提高金属强度,提高材料的高温强度,锗主要是提高材料的断裂负荷,并降低键合金丝的弧度,铜元素和锗元素的添加与合理配比使制备出的键合金丝在保证高强度的同时具有较好的低长弧度,满足半导体行业对键合金丝的高需要。
本发明的键合金丝的制备方法中在退火后进行一个表面处理,即在键合金丝表面附上一层高分子化合物,高分子化合物由10%表面活性剂、10%无水乙醇及80%双蒸水组成,能在键合金丝表面形成一层很薄很致密的保护层,这层保护层有效防止了键合金丝之间产生自扩散的粘结效应,使制备出的键合金丝之间不容易粘结在一起,从而大大提高了产品成材率,防止了放线时大量断线的产生,增大了收线轴的缠绕长度。
具体实施方式
下面结合具体实施例对本发明作进一步详细说明,但并不仅限于以下实施例。
实施例1
本发明键合金丝按以下工艺步骤制备:
①用纯度为99.99wt%的金电解提纯出纯度为99.999wt%的高纯金。原料纯度为99.99wt%的金为市售的普通纯度的金材料,将此原料通过电解的方式提纯到99.999wt%,具体方法为:
将市售的金作为阳极,挂于阳极导电棒上,惰性碳材料作为阴极,挂于阴极导电棒上,保持阳极和阴极平行。在电解槽中加入氯金酸溶液作为电解液,电解过程中控制槽压在0.6V,保证电解液液面高度(保证阴极片的95%体积浸入电解液中)。电解析出的金用纯水洗净,然后用纯水煮20min,煮完后用纯水洗净,再用氨水煮40min,煮完后水洗至中性,接着再用纯水煮20min,用3mol/L硝酸加热煮沸40min,煮完纯水冲洗至中性,最后放入烘箱中,烘干的99.999wt%的高纯金。
②将高纯金放入中频感应炉内进行熔炼,在10kW的功率下使之化成金液,保温继续精炼10min;之后倒入石墨坩埚内进行铸锭,形成单晶结构的金板;再将铸锭成的金板在压片机上轧制成0.03mm厚、50mm宽的薄金片。
③制作中间合金,本实施例的中间合金包括铍-金中间合金、锗-金中间合金和铈-金中间合金,其制作方法及过程完全相同,下面以铍-金中间合金为例:
铍-金中间合金的制作过程包括以下工艺步骤:
a.按重量百分比称取步骤②得到的薄金片99.43%~99.50%,铍0.50%~0.57%。
b.用薄金片将铍捆包成小包,并将此小包放入坩埚中,小包上面再放薄金片,将小包放到坩埚中心位置(制备铜-金中间合金、锗-金中间合金和铈-金中间合金时,将小包放到坩埚底部位置)。
c.在中频感应炉内在10kW的熔炼功率下进行真空熔炼,待完全熔化后保持温度精炼10min,使高纯金与添加元素充分混合均匀。
d.浇铸,将金液缓慢倒入石墨锭模中,保持真空。待炉内完全冷却下来后,开启注气阀门,并打开炉盖。
e.将生成的中间合金用纯水冷却,然后放到烧杯中并加入浓盐酸(浓盐酸浓度为38%),将烧杯放到电炉上加热15min以去除金锭表面氧化物,煮完后用纯水洗净合金表面残留酸液,再用压缩空气吹干。
然后,再按同样的重量百分比及同样的工艺步骤制作出锗-金中间合金和铈-金中间合金。
铍、锗、铈及下述的铜元素均为市售商品,购买纯度为99.99wt%的产品。
④采用竖式熔炼对中间合金进行进一步的熔炼:
将部分高纯金放入坩埚内,将中间合金放入合金槽内,装好石英罩加上盖,用密封胶将石英罩及上盖密封好。
开启真空泵,打开抽气阀门,开始抽真空,当压力表显示为-0.1Pa,数字表显示为50Pa以下时,关闭真空阀门,再关闭真空泵,并迅速打开氩气阀往炉内充氩气。
设定加热温度为1150±50℃,开始升温,待高纯金完全熔化后,投入中间合金并搅拌1min,完全熔化后保持温度,精炼15min,保证高纯金和合金充分混合均匀。
启动按钮开始拉铸,形成金棒。
⑤将熔铸的金棒在拉丝机上逐步拉细,直至要求的直径。拉丝过程中的模具延伸率为5%~18%,拉丝速度为3~15m/s。
⑥拉丝的成品线传导退火工序退火,根据炉温参考值设定退火炉加热温度,打开润湿液开关使润湿液缓慢滴出,根据直径要求设定相应的退火速度,退火温度为300~600℃,退火速度为0.3~1.2m/s。退火后进行一个表面处理,即在键合金丝表面附上一层高分子化合物,高分子化合物由10%表面活性剂、10%无水乙醇及80%双蒸水组成。具体方式为使键合金丝通过浸湿了高分子化合物的布料,使高分子化合物均匀涂布于键合金丝表面。
⑦将退火后的键合金丝缠绕于收线轴进行分卷,根据不同客户的要求选择不用绕线的程序,设置相应的张力,其中绕丝张力为5~20g,绕丝速度为400~800rpm。
⑧将贴好标签的金丝,低轴每10轴、高轴每6轴放入塑料袋中进行真空包装,用塑封封口机封好袋口,封口应平整、牢固,放入包装盒内。
此所得键合金丝的产品的性能测试参数列于表1。
实施例2
按以下表1中指定的各组分含量重复实施例1的方法,在表1中列出了性能测试参数。
实施例3
按以下表2中指定的各组分含量重复实施例1的方法,但用铜代替锗,在表2中列出了性能测试参数。
实施例4
按以下表2中指定的各组分含量重复实施例1的方法,但用铜代替锗,在表2中列出了性能测试参数。
表1
Figure BSA00000410335400051
表2
表1、2各实施例的性能测试参数都说明,本发明的键合金丝都可以达到指标,具有高强度和低长弧度的特性。
本发明的上述实施例是对本发明的说明而不能用于限制本发明,与本发明的权利要求书相当的含义和范围内的任何改变,都应认为是包括在权利要求书的范围内。

Claims (9)

1.一种键合金丝,其特征在于:其材料配方重量百分比为:铍0.0005%~0.001%,铜或锗0.0008%~0.002%,铈0.001%~0.003%,其余为金,金的纯度≥99.996wt%。
2.根据权利要求1所述的键合金丝的制备方法,其特征在于:包括以下工艺步骤:
①用纯度为99.99wt%的金电解提纯出纯度为99.999wt%的高纯金;
②将高纯金进行熔炼,铸锭成金板,将金板轧制成薄金片;
③制作中间合金,所述中间合金指铍-金中间合金、铜-金中间合金、锗-金中间合金和铈-金中间合金中的一种;
所述制作中间合金,包括以下顺序的工艺步骤:
a.按重量百分比称取步骤②得到的薄金片99.43%~99.50%和铍或铜或锗或铈0.50%~0.57%;
b.投料,用薄金片将铍或铜或锗或铈捆包成小包,并将此小包放入坩埚中;
c.真空熔炼;
d.浇铸,金液倒入石墨锭模中;
e.酸洗;
以上步骤制作出一种中间合金,按同样的工艺步骤制作出另外几种中间合金;
④竖式熔炼:将步骤③得到的中间合金在惰性气体氩气的保护下进行熔炼,拉铸,形成金棒;
⑤拉丝:将熔铸的金棒在拉丝机上逐步拉细,直至要求的直径;
⑥退火:退火温度为300~600℃,退火速度为0.3~1.2m/s,退火后进行表面处理;
⑦分卷:将键合金丝缠绕于收线轴;
⑧真空包装。
3.根据权利要求2所述的键合金丝的制备方法,其特征在于:所述步骤①中电解时控制电解槽的槽压在0.6V,电解析出的金依次经水煮、氨水煮、水煮、3mol/L硝酸煮、水洗,烘干得高纯金。
4.根据权利要求2所述的键合金丝的制备方法,其特征在于:所述步骤③中真空熔炼的熔炼功率为10kW,待完全熔化后保持温度精炼10min。
5.根据权利要求2所述键合金丝的制备方法,其特征在于:所述步骤③中酸洗过程指将生成的中间合金先用纯水冷却,然后放到烧杯中并加入浓盐酸,将烧杯放到电炉上加热15min,煮完后再用纯水洗,最后用压缩空气吹干。
6.根据权利要求2所述键合金丝的制备方法,其特征在于:所述步骤④中熔炼温度为1150±50℃,完全熔化后保持温度,精炼15min。
7.根据权利要求2所述键合金丝的制备方法,其特征在于:所述步骤⑤中,其拉丝过程中的模具延伸率为5%~18%,拉丝速度为3~15m/s。
8.根据权利要求2所述键合金丝的制备方法,其特征在于:所述步骤⑥中退火后的表面处理指在键合金丝表面附上一层高分子化合物,高分子化合物由10%表面活性剂、10%无水乙醇及80%双蒸水组成。
9.根据权利要求2所述键合金丝的制备方法,其特征在于:所述步骤⑦中,其绕丝张力为5~20g,绕丝速度为400~800rpm。
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CN102776405A (zh) * 2012-07-25 2012-11-14 烟台招金励福贵金属股份有限公司 一种键合金银合金丝的制备方法
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CN109536770A (zh) * 2018-12-04 2019-03-29 有研亿金新材料有限公司 一种半导体器件用金铍合金材料及制备方法
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CN112680618A (zh) * 2020-12-29 2021-04-20 南昌航空大学 一种led键合金线的制备方法
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CN102776405A (zh) * 2012-07-25 2012-11-14 烟台招金励福贵金属股份有限公司 一种键合金银合金丝的制备方法
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CN109536770B (zh) * 2018-12-04 2020-10-16 有研亿金新材料有限公司 一种半导体器件用金铍合金材料及制备方法
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CN112680618A (zh) * 2020-12-29 2021-04-20 南昌航空大学 一种led键合金线的制备方法
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