CN102126764B - Etching waste water processing method of silicon wafer and processing device - Google Patents
Etching waste water processing method of silicon wafer and processing device Download PDFInfo
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- CN102126764B CN102126764B CN201010577683.9A CN201010577683A CN102126764B CN 102126764 B CN102126764 B CN 102126764B CN 201010577683 A CN201010577683 A CN 201010577683A CN 102126764 B CN102126764 B CN 102126764B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W10/00—Technologies for wastewater treatment
- Y02W10/30—Wastewater or sewage treatment systems using renewable energies
- Y02W10/37—Wastewater or sewage treatment systems using renewable energies using solar energy
Abstract
A task of the invention is realize the following functions in a method of adding acid in etching waste water of silicon wafer for precipitating silicon dioxide and performing solid liquid separation for the precipitated silicon dioxide: reducing a necessary adding amount of flocculant, reducing the volume of the generated sludge, reducing water content of the sludge, improving dehydration property and realizing water quality stability of the processed water. For settling the task, after the acid is combined with partial solid liquid separation sludge, the mixture is added into the etching waste water of the silicon wafer. Through adding acid into the sludge and mixing, the surface of the sludge is modified by the acid therefore the silicon dioxide is precipitated from the surface of the sludge. As a result, the amount of the water absorbed by the sludge can be maximumly restrained. Therefore, the sludge with low water content and excellent dehydration property can be obtained. Furthermore the necessary adding amount of the flocculant is little, and therefore the amount of the generated sludge is reduced. Furthermore solid-liquid separation performance of the sludge is improved, and therefore the quality of the processed water is stable.
Description
Technical field
The present invention relates to a kind for the treatment of process and treatment unit of waste water of discharging during with aqueous sodium hydroxide solution etching silicon wafer, particularly to adding acid in the etching waste water of this silicon wafer, separate out silicon-dioxide (SiO
2) and to this silicon-dioxide (SiO
2) carry out in the method for solid-liquid separation, can realize and reduce necessary addition, volume (minimizing of sludge creation amount), the reduction moisture percentage in sewage sludge of minimizing generation mud of flocculation agent and improve dehydration property and realize treatment process and the treatment unit that water quality treatment is stable.
Background technology
Silicon wafer manufacturing process for individual pieces of semiconductor elements such as unicircuit, transistor or diode such as IC, LSI, in utilizing, all sword stapling machines or scroll saw cut off by vertical pulling method (CZ method) or float and melt the monocrystalline that method (FZ method) obtains, then periphery is carried out to chamfer machining, and in order to improve Flatness, utilize free abrasive to carry out after attrition process major surfaces, carry out Wet-type etching and in these operations, put on the machining deformation of wafer to remove, then carry out mirror polish.
With regard to removing the Wet-type etching of above-mentioned machining deformation, for example, by the acid etching of using the mixing acid being formed by hydrofluoric acid, nitric acid, acetic acid, with the alkaline etching that utilizes the alkali such as sodium hydroxide, potassium hydroxide, but consider the good advantage of wafer Flatness after etching, be widely used in recent years alkaline etching always, particularly, extensively utilize the etching (patent documentation 1) that adopts aqueous sodium hydroxide solution.
In the alkaline etching of silicon wafer that utilizes aqueous sodium hydroxide solution, containing the Si of silicon wafer and the resultant of reaction water glass (Na of sodium hydroxide
2siO
3) and the waste water of residual hydrogen sodium oxide be discharged from.
In the past, the etching waste water of this silicon wafer (former water) was to process by following method as shown in Figure 2: acid from sulfuric acid etc. to reactive tank 1 that add in order in and sodium hydroxide in waste water, by following reaction, make silicon-dioxide (SiO simultaneously
2) from water glass, separate out, next toward collection surface 2, add polymer coagulant and the solids component of separating out is carried out to agglomeration process, then at settling bath 3, carry out solid-liquid separation.
Na
2SiO
3+H
2SO
4→SiO
2+H
2O+Na
2SO
4
In addition, as containing SiO
2method of wastewater treatment, disclose and a kind ofly in waste water, added the aluminum compounds such as poly aluminium chloride and sulfuric acid carries out after agglomeration process, by adding alkali, pH value is adjusted to 6～8, then adds the treatment process (patent documentation 2) that polymer coagulant carries out coagulative precipitation separation.
In addition, thereby in containing the waste water of metal, adding alkaline agent carries out in the wastewater treatment of solid-liquid separation to the solids component of separating out, as acquisition, be rich in the method for the high density metal hydroxides mud of concentrated property and dehydration property excellence, there is HDS method (high-density slurry method, High Density Solid method).The method is not toward directly adding alkaline agent in the waste water that contains metal, but with the method for adding after part mud separated in wastewater treatment mixes mutually, the method is also referred to as alkaline sludge method (for example, patent documentation 3).
Patent documentation 1: Japanese kokai publication hei 11-171693 communique
Patent documentation 2: No. 3340029 communique of Japanese Patent
Patent documentation 3: Japanese kokai publication hei 7-241572 communique
The acid of adding sulfuric acid etc. in the etching waste water of silicon wafer with in and sodium hydroxide in waste water, make silicon-dioxide (SiO simultaneously
2) silicon-dioxide of separating out and this being separated out carries out in the previous methods of agglomeration separation, because separated mud is gel as a rule, so the water ratio of separated sludge is high, cannot obtain the mud of dehydration property excellence.In order to address the above problem, increase the necessary addition of flocculation agent, its result exists that mud generating capacity increases, the unsettled problem of water quality treatment.
Summary of the invention
In order to solve above-mentioned existing problem, the object of the invention is to, provide a kind of and in the etching waste water of silicon wafer, add acid and separate out silicon-dioxide (SiO
2) and the silicon-dioxide of separating out is carried out in the method for solid-liquid separation, can realize and reduce necessary addition, volume, the reduction moisture percentage in sewage sludge of minimizing generation mud of flocculation agent and improve dehydration property and realize treatment process and the treatment unit that water quality treatment is stable.
The inventor etc. attentively study in order to solve above-mentioned problem, and it found that, by adding the acid of waste water to, as the mixture with solid-liquid separation mud, adds, and can solve above-mentioned problem thus.
The present invention is the invention completing on the basis of above-mentioned viewpoint, is below main points of the present invention.
[1] a kind of etching method of wastewater treatment of silicon wafer, it is while utilizing aqueous sodium hydroxide solution to carry out etching to silicon wafer, to add acid in waste water that discharge, that contain water glass and sodium hydroxide and separate out silicon-dioxide, and the silicon-dioxide that this is separated out carries out the treatment process of solid-liquid separation, it is characterized in that, the described sour mixture as the part mud with by solid-liquid separation is added in described waste water.
[2] the etching method of wastewater treatment of the silicon wafer as described in [1], is characterized in that, described mixture is added to after described waste water, adds polymer coagulant and carries out agglomeration process, and agglomeration process water is carried out to solid-liquid separation.
[3] the etching method of wastewater treatment of the silicon wafer as described in [1] or [2], is characterized in that, described mixture is added in described waste water, thereby pH value is adjusted to 7～8.
[4] the etching method of wastewater treatment of the silicon wafer as described in any one in [1]～[3], it is characterized in that, mix described solid-liquid separation mud and acid, so that according to SS (Suspended Solid, the suspended solids) concentration of the sludge quantity (returned sluge flow) mixing with described acid and sludge concentration (returned sluge concentration), described waste water (former water) flow and the generation of former water, and the return sludge ratio R calculating according to following formula reaches 5～80.
Return sludge ratio R=(returned sluge flow * returned sluge concentration)/(the SS concentration that raw water flow * former water generates)
[5] a kind of etching wastewater treatment equipment of silicon wafer, it is while utilizing aqueous sodium hydroxide solution to carry out etching to silicon wafer, to add acid in waste water that discharge, that contain water glass and sodium hydroxide and separate out silicon-dioxide, and described silicon-dioxide of separating out is carried out to the treatment unit of solid-liquid separation, it is characterized in that, comprise: mixing device, it mixes described acid and by the part mud of solid-liquid separation; And, adding set, it adds the mixture from described mixing device in described waste water to.
[6] the etching wastewater treatment equipment of the silicon wafer as described in [5], is characterized in that, comprising: coacervation device, adds polymer coagulant and carries out agglomeration process to being added with in the waste water of described mixture; And equipment for separating liquid from solid, carries out solid-liquid separation to agglomeration process water.
[7] the etching wastewater treatment equipment of the silicon wafer as described in [5] or [6], is characterized in that, adds described mixture, thereby pH value is adjusted to 7～8 in described waste water.
[8] the etching wastewater treatment equipment of the silicon wafer as described in any one in [5]～[7], it is characterized in that, in described mixing device, mix described solid-liquid separation mud and described acid, so that according to the SS concentration of the sludge quantity (returned sluge flow) mixing with described acid and sludge concentration (returned sluge concentration), described waste water (former water) flow and the generation of former water, and the return sludge ratio R calculating according to following formula reaches 5～80.
Return sludge ratio R=(returned sluge flow * returned sluge concentration)/(the SS concentration that raw water flow * former water generates)
According to the present invention, in the etching waste water of silicon wafer, add acid and separate out silicon-dioxide (SiO
2) and the described silicon-dioxide of separating out is carried out in the method for solid-liquid separation, after being mixed with part solid-liquid separation mud, acid adds in waste water, can reduce thus the necessary addition of flocculation agent, volume, reduction moisture percentage in sewage sludge and the raising dehydration property that minimizing generates mud and the stability that realizes water quality treatment, can effectively process.
Accompanying drawing explanation
Fig. 1 is the system diagram of an embodiment of the embodiment of the etching wastewater treatment equipment of expression silicon wafer of the present invention;
Fig. 2 represents the system diagram for the treatment of process in the past.
The explanation of Reference numeral
1 reactive tank
2 collection surfaces
3 settling baths
4 tempering tanks
Embodiment
Below, with reference to accompanying drawing, the etching method of wastewater treatment of silicon wafer of the present invention and the embodiment for the treatment of unit are elaborated.
Fig. 1 is the system diagram of an embodiment of the embodiment of the etching wastewater treatment equipment of expression silicon wafer of the present invention.
The invention is characterized in, in the etching waste water to silicon wafer, add acid and separate out silicon-dioxide (SiO
2), and when this silicon-dioxide of separating out is carried out to solid-liquid separation, acid is added in the etching waste water of silicon wafer as the mixture (below, sometimes this mixture being called to " modified sewage sludge ") of the part mud with by solid-liquid separation.
In the device of Fig. 1, former water (the etching waste water of silicon wafer) is imported to the rear interpolation of reactive tank 1 to be mixed and is carried out neutralizing treatment from the modified sewage sludge of tempering tank 4, neutralizing treatment water is imported to collection surface 2 and add polymer coagulant to be mixed and carry out agglomeration process, agglomeration process water is imported to settling bath 3 and carry out solid-liquid separation, and by pump P
1part separated sludge is back in tempering tank 4.
In tempering tank 4, by the mud and the H that reflux
2sO
4deng acid, mixed and prepare modified sewage sludge, this modified sewage sludge is fed into reactive tank 1, carries out thus the neutralizing treatment of former water.
In settling bath 3, the lingering section of separated sludge is discharged to outside system by pump P2.In addition, in settling bath 3, the Separation of Water of solid-liquid separation is discharged to outside system as processing water.
In the device of Fig. 1, on the backflow pipe arrangement of separated sludge, be provided with under meter FC and sludge concentration meter SS, according to the SS of these observed values and raw water flow and former water (Suspended Solid, suspended solids) growing amount, control pump P
1sludge back flow quantity so that return sludge ratio R reaches prescribed value.
[mechanism of action]
In the present invention, by adding the acid of former water to, as the modified sewage sludge mixing with part solid-liquid separation mud, add in former water, can realize thus and reduce the necessary addition of flocculation agent, the volume that minimizing generates mud, the dehydration property that improves separated sludge, raising sludge concentration and reduce sludge moisture content, and then can realize the excellent effect that water quality treatment is stable, for being described as follows of this mechanism of action.
That is, with HDS method in the past in the same manner, by adding acid and mixed in mud, utilize acid to carry out modification to Sludge Surface, thereby make silicon-dioxide (SiO
2) in Sludge Surface, separate out, its result can suppress the water yield of being drawn by mud by minimally.
Therefore, can access the mud that water ratio is low and dehydration property is excellent, and due to the necessary addition minimizing of flocculation agent, sludge creation amount also can reduce thus, the solid-liquid separation of mud is improved, thereby water quality treatment is also stable.
[the etching waste water of silicon wafer]
The etching waste water of the silicon wafer of processing in the present invention, is the waste water of discharging while utilizing aqueous sodium hydroxide solution to carry out etching to silicon wafer, conventionally contains the water glass (Na that silicon is generated with reacting of sodium hydroxide
2siO
3) and remaining sodium hydroxide, its water quality is according to the different treatment condition in etching work procedure etc. and different, but as a rule, the content of water glass be take Si scaled value as 50～5000mg/L left and right, and pH is 9～12 left and right.
As such silicon wafer etching waste water, can enumerate particularly solar cell and manufacture waste water, liquid crystal board manufacture waste water and silicon wafer manufacture waste water etc.
[acid]
The acid of using in neutralizing treatment as the etching waste water at this silicon wafer, can be used the mineral acids such as sulfuric acid, hydrochloric acid.Conventionally use sulfuric acid.
In the present invention, acid is added in the silicon wafer etching waste water as former water as the modified sewage sludge mixing with separated sludge, its addition is, neutralize the required acid amount of sodium hydroxide in former water and make silicon-dioxide from water glass, separate out the total amount of required acid amount by following reaction, can determine aptly according to the water quality of former water.
Na
2SiO
3+H
2SO
4→SiO
2+H
2O+Na
2SO
4
There are the treatment condition of etching work procedure in source and difference in the addition of acid, for example, when waste water is the common silicon wafer etching waste water of pH value 13, the necessary addition of sulfuric acid is about 20000mg/L according to former water.
As a rule, acid is the interpolation of modified sewage sludge, is that the mode that reaches 7～8 left and right according to the pH value of neutralizing treatment water after mixed and modified mud in former water is added.
[agglomeration process]
In the neutralizing treatment water that adds acid and be obtained by mixing in former water, add flocculation agent and carry out agglomeration process, can improve thus the solid-liquid separation of mud.
As the flocculation agent for agglomeration process, the polymer coagulant of the granulation effect excellence of preferred mud.
As polymer coagulant, can be any one in cationic polymer flocculant, anionic property polymer coagulant, Amphiphatic high polymer flocculation agent and nonionic polymer coagulant, but from the viewpoint of charge neutralization, anionic property polymer coagulant particularly preferably, for example, can use partial hydrolystate or acrylamide and acrylic acid multipolymer etc. of polyacrylamide.These polymer coagulants can be used separately a kind of, also can two or more mixing use.
Addition for polymer coagulant has no particular limits, and can select suitable addition can obtain good flocculating result, but is generally 3～8mg/L left and right.
[solid-liquid separation]
Agglomeration process water in Fig. 1 is by solid-liquid separation in settling bath 3, and Separation of Water is discharged to outside system as processing water, and a part for separated sludge is back to tempering tank 4, and nubbin is discharged to outside system as residual sludge simultaneously.
[return sludge ratio R]
In the present invention, preferably according to raw water quality, sludge concentration etc., adjust and in separated sludge, to mix with acid and add the sludge back flow quantity in former water to, and preferably by according to the SS concentration generating in the concentration of returned sluge flow, returned sluge, raw water flow and former water treatment (the SS concentration that former water generates) the return sludge ratio R that calculates by following formula, be controlled at 5～80, be particularly preferably controlled at 15～30.
Return sludge ratio R=(returned sluge flow * returned sluge concentration)/(the SS concentration that raw water flow * former water generates)
If return sludge ratio R is too small, cannot fully obtain the effect of the present invention of bringing by sludge reflux, if return sludge ratio R is excessive, the capacity in treatment system increases and causes the maximization of each treatment trough in rain, therefore not preferred.
In addition, the SS concentration (g/L) generating in former water treatment is by Si concentration (g/L) * Na
2siO
3/ Si and calculating.
[preparation of modified sewage sludge]
In the present invention, mixing portion separated sludge and acid and using it as modified sewage sludge, add in former water.For sour combined amount now, as mentioned above, according to the water quality of former water, be set as making the neutralization of residual hydrogen sodium oxide and silicon-dioxide from the amount of all fully carrying out of separating out of water glass.Conventionally, as shown in Figure 1, when mix returned sluge and acid in tempering tank 4, in adding former water after making modified sewage sludge to time, the acid of adding can make the pH value of this modified sewage sludge reach 4～6 left and right.
In addition, in the present invention, importantly thereby mixing sludge and acid are carried out adding in former water after modification to Sludge Surface by acid fully, therefore, as shown in Figure 1, tempering tank 4 is preferably set, with mixing acid and mud, and preferably this mixing time, be that detention time of mud in tempering tank 4 is 1～10 minute.If this mixing time is too short, cannot utilize acid to carry out fully modification to Sludge Surface, in addition, even if this mixing time is very long, above-mentioned effect also cannot be further improved, and brings the apprentice of mixing time to have increase, therefore unfavorable on the contrary.
In addition, Fig. 1 represents an embodiment of embodiment of the present invention, and the present invention is not limited to the device shown in any Fig. 1.
For example, as equipment for separating liquid from solid, except settling bath, can also use membrane separation unit etc.
In addition, can be also following manner: the leading portion at reactive tank arranges adjustment tank, by this adjustment tank, in advance the pH value of former water is adjusted, make its pH value that reaches regulation, for example, make pH value reach 9.5～11.5 and import to reactive tank afterwards.Now, no matter what kind of change is the water quality of former water have, and can make to keep constant to the sour addition of tempering tank, can carry out stable processing.
The present invention be while utilizing aqueous sodium hydroxide solution to carry out etching to silicon wafer waste water that discharge, that contain water glass and sodium hydroxide as processing object, but the effect obtaining by modified sewage sludge of the present invention is not limited to this waste water, and it is also effective to the wastewater treatment that contains alkaline silicate and alkali.
Embodiment
Below, enumerate embodiment and comparative example the present invention is carried out to more specific description.
Embodiment 1
The silicon wafer etching waste water of pH value 13.0, Si concentration 2000mg/L, as former water, is processed by the device shown in Fig. 1.The SS amount producing from this waste water is 4g/L.As acid, using sulfuric acid, as polymer coagulant, use Network リ Off ロ Star Network (registered trademark) PA823 (the acrylamide anionic property polymer coagulant that Kurita Water Industries Ltd manufactures), is 5mg/L with respect to the addition of the polymer coagulant of waste water.
The capacity of each groove (size) and pH condition are as follows.
< reactive tank 1>
Capacity: 1.0L
pH：7～8
< collection surface 2>
Capacity: 1.0L
pH：7～8
< settling bath 3>
Size: diameter 250mm, vertical tube part height 300mm
pH：7～8
< tempering tank 4>
Capacity: 0.3L
pH：4～6
Former water is to process according to the flow of 3.0L/hr.
The part solid-liquid separation sludge reflux of settling bath 3, to tempering tank 4, in this tempering tank 4, adds and mixes sulfuric acid to returned sluge, so that the pH value in groove reaches 4～6.The residence time that returned sluge is trapped in tempering tank 4 is 3 minutes.
Add the modified sewage sludge from tempering tank 4 to reactive tank 1, make the waste water ph in reactive tank 1 reach 7～8, and at collection surface 2, to the effluent liquid of reactive tank 1, add polymer coagulant to carry out agglomeration process, then at settling bath 3, carry out solid-liquid separation.In solid-liquid separation mud, except being back to the mud of tempering tank 4, the mud of nubbin is discharged to outside system.Separation of Water takes out as processing water.
Sludge back flow quantity to tempering tank 4 is that 1.0L/hr, returned sluge concentration are 100g/L.Therefore, return sludge ratio R=(1L/hr * 100g/L)/(3L/hr * 4g/L)=8.3.
Now, in resulting solid-liquid separation mud, utilize pressure filter to dewater to the solid-liquid separation mud being discharged to outside system, detect the concentration of dewatered sludge and the Si concentration of water ratio and processing water, and the results are shown in table 1.
Comparative example 1
Except not carrying out the backflow of solid-liquid separation mud in embodiment 1, sulfuric acid directly being added in reactive tank 1 so that the pH value in reactive tank 1 reaches 7～8, other and embodiment 1 process in the same manner, by pressure filter, resulting solid-liquid separation mud is dewatered equally, and detect the Si concentration of this dewatered sludge concentration and water ratio, processing water, the results are shown in table 1.
Comparative example 2
Except in embodiment 1, do not mix returned sluge and acid, but the sludge back flow quantity with the 1.0L/hr identical with embodiment 1 is directly back in reactive tank 1 by a part for solid-liquid separation mud, simultaneously toward the interior direct interpolation sulfuric acid of reactive tank 1 so that the pH value in reactive tank 1 reach beyond 7～8, other and embodiment 1 process in the same manner, by pressure filter, resulting solid-liquid separation mud is dewatered equally, and detect the Si concentration of dewatered sludge concentration and water ratio, processing water, the results are shown in table 1.
Table 1
Therefore as known from Table 1, according to the present invention, the dehydration property of solid-liquid separation mud is improved, and can obtain the mud of the low and high density of water ratio, can obtain the mud that volume is reduced thus, and the while can obtain the good processing water of water quality.
Claims (10)
1. the etching method of wastewater treatment of a silicon wafer, while utilizing aqueous sodium hydroxide solution to carry out etching to silicon wafer, in waste water that discharge, that contain water glass and sodium hydroxide, to add acid and separate out silicon-dioxide, and the silicon-dioxide that this is separated out carries out the treatment process of solid-liquid separation, it is characterized in that
By the part sludge reflux by solid-liquid separation, and add in described waste water as the mixture mixing with described acid.
2. the etching method of wastewater treatment of silicon wafer as claimed in claim 1, is characterized in that, described mixture is added to after described waste water, adds polymer coagulant and carries out agglomeration process, and agglomeration process water is carried out to solid-liquid separation.
3. the etching method of wastewater treatment of silicon wafer as claimed in claim 1, is characterized in that, described mixture is added in described waste water, thereby pH value is adjusted to 7～8.
4. the etching method of wastewater treatment of silicon wafer as claimed in claim 2, is characterized in that, described mixture is added in described waste water, thereby pH value is adjusted to 7～8.
5. the etching method of wastewater treatment of the silicon wafer as described in any one in claim 1～4, is characterized in that,
Mix described solid-liquid separation mud and acid, so that be the flow of former water and the SS concentration that former water generates according to the returned sluge flow mixing with described acid and returned sluge concentration, described waste water, and reach 5～80 according to the return sludge ratio R of following formula calculating,
Return sludge ratio R=(returned sluge flow * returned sluge concentration)/(the SS concentration that raw water flow * former water generates).
6. the etching wastewater treatment equipment of a silicon wafer, while utilizing aqueous sodium hydroxide solution to carry out etching to silicon wafer, in waste water that discharge, that contain water glass and sodium hydroxide, to add acid and separate out silicon-dioxide, and the silicon-dioxide that this is separated out carries out the treatment unit of solid-liquid separation, it is characterized in that, comprising:
Mixing device, mixes described acid and by the part mud of solid-liquid separation; And,
Adding set, adds the mixture from described mixing device in described waste water to.
7. the etching wastewater treatment equipment of silicon wafer as claimed in claim 6, is characterized in that, also comprises:
Coacervation device, adds polymer coagulant and carries out agglomeration process to being added with in the waste water of described mixture; And,
Equipment for separating liquid from solid, carries out solid-liquid separation to agglomeration process water.
8. the etching wastewater treatment equipment of silicon wafer as claimed in claim 6, is characterized in that, described mixture is added in described waste water, thereby pH value is adjusted to 7～8.
9. the etching wastewater treatment equipment of silicon wafer as claimed in claim 7, is characterized in that, described mixture is added in described waste water, thereby pH value is adjusted to 7～8.
10. the etching wastewater treatment equipment of the silicon wafer as described in any one in claim 6～9, it is characterized in that, in described mixing device, mix described solid-liquid separation mud and described acid, so that be the SS concentration that raw water flow and former water generate according to the returned sluge flow mixing with described acid and returned sluge concentration, described waste water, and the return sludge ratio R calculating according to following formula reaches 5～80;
Return sludge ratio R=(returned sluge flow * returned sluge concentration)/(the SS concentration that raw water flow * former water generates).
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| CN108103585A (en) * | 2017-12-25 | 2018-06-01 | 湖州富优得膜分离科技有限公司 | A kind of processing method of fine-hair maring using monocrystalline silicon slice waste liquid |
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| CN103086555A (en) * | 2011-10-31 | 2013-05-08 | 库特勒自动化系统(苏州)有限公司 | Treatment system and treatment method for silicon wafer etching waste water |
| US9828263B2 (en) * | 2014-08-28 | 2017-11-28 | Infineon Technologies Ag | Method of removing particulate silicon from an effluent water |
| CN104649494B (en) * | 2015-01-30 | 2016-05-04 | 浙江奇彩环境科技股份有限公司 | A kind of method of processing of Ludox waste water and coproduction sodium salt |
| JP6912192B2 (en) * | 2016-12-09 | 2021-08-04 | オルガノ株式会社 | Silica-containing water treatment equipment and treatment method |
| JP6859123B2 (en) * | 2017-02-10 | 2021-04-14 | 株式会社クラレ | Silica-containing water treatment method and its treatment equipment |
| CN110104842A (en) * | 2019-06-06 | 2019-08-09 | 盛隆资源再生（无锡）有限公司 | A kind of processing method of the fluorine-containing etching waste water containing ammonium |
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| JP4554917B2 (en) * | 2003-12-09 | 2010-09-29 | 旭化成ケミカルズ株式会社 | Recovery method of caustic aqueous solution for silicon wafer etching and caustic aqueous solution recovered thereby |
| JP2006026543A (en) * | 2004-07-16 | 2006-02-02 | Kurita Water Ind Ltd | Apparatus and method for removing silica |
| JP2007029802A (en) * | 2005-07-25 | 2007-02-08 | Fuji Xerox Co Ltd | Discharge water treatment method |
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- 2010-01-19 JP JP2010009259A patent/JP5440199B2/en not_active Expired - Fee Related
- 2010-12-03 CN CN201010577683.9A patent/CN102126764B/en active Active
- 2010-12-16 TW TW099144157A patent/TWI560150B/en active
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| US3881704A (en) * | 1971-06-24 | 1975-05-06 | Lord Mayor Aldermen Cit | Water treatment apparatus |
| DD296471A5 (en) * | 1990-07-05 | 1991-12-05 | Veb Spurenmetalle Freiberg,De | METHOD FOR THE CONTINUOUS AND CONTROLLED EXTINGUISHING OF FINE-DISTRIBUTED SILICON FROM A CURRENT OF CORROSIVE GRINDING TRUE |
| JPH1157740A (en) * | 1997-08-25 | 1999-03-02 | Ebara Corp | Flocculating treatment of water |
| US6099748A (en) * | 1997-12-11 | 2000-08-08 | Shin-Etsu Handotai Co., Ltd. | Silicon wafer etching method and silicon wafer etchant |
| CN1317610A (en) * | 2001-05-30 | 2001-10-17 | 潍坊学院 | Alkaline pulping process of wheel straw without drainage of black liquid |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108103585A (en) * | 2017-12-25 | 2018-06-01 | 湖州富优得膜分离科技有限公司 | A kind of processing method of fine-hair maring using monocrystalline silicon slice waste liquid |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5440199B2 (en) | 2014-03-12 |
| TW201125825A (en) | 2011-08-01 |
| TWI560150B (en) | 2016-12-01 |
| CN102126764A (en) | 2011-07-20 |
| JP2011147847A (en) | 2011-08-04 |
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