CN102122199A - Method for manufacturing mainboard capable of being compatible with various specifications of computer systems - Google Patents

Method for manufacturing mainboard capable of being compatible with various specifications of computer systems Download PDF

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Publication number
CN102122199A
CN102122199A CN2011100231197A CN201110023119A CN102122199A CN 102122199 A CN102122199 A CN 102122199A CN 2011100231197 A CN2011100231197 A CN 2011100231197A CN 201110023119 A CN201110023119 A CN 201110023119A CN 102122199 A CN102122199 A CN 102122199A
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China
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mainboard
processing unit
central processing
cpu
district
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CN2011100231197A
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Chinese (zh)
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关建国
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Individual
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Individual
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Abstract

The invention discloses a method for manufacturing a mainboard capable of being compatible with various specifications of computer systems, comprising the following steps of: setting a size of a frame for limiting the mainboard; reserving a central processing unit region, a chip set unit region, an internal connecting slot region and an external connecting region on the mainboard and limiting respective positions and sizes; respectively allocating a central processing unit in the central processing unit region, a connecting slot in the internal connecting slot region and a connector in the external connecting region according to the requirements oneach computer manufacturer; and designing electronic circuits on the mainboard, which can be mutually connected to conduct the central processing unit region, the chip set unit region, the internal connecting slot region and the external connecting region, and detecting the mainboard, thus the mainboard is manufactured. By applying the method disclosed by the invention, the wide applicability of the mainboard can achieve the standardized specification, thus manpower and time for each computer manufacturer to continuously develop new mainboards can be saved.

Description

A kind of mainboard manufacture method that can compatible various computing systems specification
Technical field
The present invention relates to a kind of mainboard manufacture method that can compatible various computing systems specification.
Background technology
The design of each tame its mainboard of computer vendors and manufacturing now often all is to make earlier after the functional specification demand of various computer systems, designs and develops each module and the spare part of computer system again; In other words, the various computer system of tradition must be after stipulating the functional specification framework of computer system requirements earlier, go out each module and spare part according to required functional specification structural design again, also therefore existing computer system has most module and spare part all must change design separately, causes in the computer system the no exception needs of most important mainboard to change design separately.
The design and the manufacturing process of existing mainboard, at first be after the functional specification requirement validation of each its computer system of computer vendors is drawn up, be only at mainboard then and develop design, and after treating that the mainboard sample confirms that test is finished, carry out the topological design of circuit on the mainboard and the development and Design of other module and spare part again, the design and the manufacturing of hence one can see that existing mainboard, often all must be by the functional specification demand of electronic design engineering teacher according to computer system, the mainboard pattern developed manufacture and design.
Yet because science and technology progress now is very fast, be directed at very fast of speed that electronic product and various computer system weed out the old and bring forth the new, cause function and the usefulness continuous requirement of consumer at computer system, and add the most important central processing unit of computer system (Central Process Unit again, be called for short CPU) spare part different and version continual renovation because of each label, cause designing and developing also must constantly eliminate and changing renewal of mainboard, with in response to new computer system requirements and computer module and spare part, also owing to work as the generation of each new edition computer module and spare part, the capital causes on the mainboard at the configuration of spare part and the design thereby the change of configuration, cause each tame computing machine factory for the designing and developing of mainboard, must constantly drop into exploitation funds and manpower time cost.
Summary of the invention
Problem in view of prior art, the invention provides a kind of mainboard manufacture method and mainboard thereof that can compatible various computing systems specification, can make the broad applicability of mainboard reach its standardized standard, continually develop the spent and manpower time of new mainboard to save each computer vendors.Disclose a kind of mainboard manufacture method and mainboard thereof that can compatible various computing systems specification according to the present invention, its mainboard manufacture method comprises: after the housing size of design limiting mainboard; On mainboard, be reserved with again CPU (central processing unit) district, chipset cellular zone, in connect slot zone and external bonding pad and limit its position and size; And according to the required mainboard specification of each computer vendors respectively at the required central processing unit of CPU (central processing unit) district configuration, in connect required connection slot of slot zone configuration and the required connector of external bonding pad configuration; Again on mainboard design can interlink conducting CPU (central processing unit) district, chipset cellular zone, in connect the electronic circuit of slot zone and external bonding pad, the detection of mainboard is finished, to manufacture.
The present invention disclosed mainboard manufacture method and mainboard thereof that can compatible various computing systems specification, system is used in and is reserved with the CPU (central processing unit) district on the mainboard, the chipset cellular zone, in connect slot zone and external bonding pad and limit its position and size, to provide each computer vendors to dispose required central processing unit respectively at the CPU (central processing unit) district according to required mainboard specification, in connect required connection slot of slot zone configuration and the required connector of external bonding pad configuration, on mainboard, design the conducting CPU (central processing unit) district that to interlink again, the chipset cellular zone, in connect the electronic circuit of slot zone and external bonding pad, the detection of mainboard is finished, to manufacture, so make the broad applicability of mainboard reach its standardized standard, continually develop the spent and manpower time of new mainboard to save each computer vendors.
About detailed features of the present invention and real the work, now cooperate to be shown in the embodiment and be described in detail as follows, its content is enough to make any related art techniques person of haveing the knack of to understand technology contents of the present invention and implements according to this, and according to the disclosed content of this instructions and graphic, any related art techniques person of haveing the knack of can understand purpose and the advantage that the present invention is correlated with easily.
Description of drawings
Fig. 1 is a mainboard manufacture method process flow diagram that can compatible various computing systems specification of the present invention;
Fig. 2 is a mainboard structure synoptic diagram that can compatible various computing systems specification of the present invention;
Fig. 3 is another implementing procedure of mainboard manufacture method figure that can compatible various computing systems specification of the present invention;
Fig. 4 is another embodiment synoptic diagram of mainboard structure that can compatible various computing systems specification of the present invention.
Accompanying drawing primary clustering symbol description:
10... mainboard 101... CPU (central processing unit) district 102... chipset cellular zone
103... in meet slot zone 104... and connect bonding pad 105... electronic circuit
Embodiment
Below in conjunction with the drawings and specific embodiments the present invention is further elaborated.
For the effect that makes convenient simple and direct understanding other features of the present invention of your auditor and advantage and reached can more manifest, now with conjunction with figs. of the present invention, be described in detail feature of the present invention and advantage, each following embodiment system further describes viewpoint of the present invention, but non-to limit category of the present invention anyways.
See also illustrated in figures 1 and 2ly, be mainboard manufacture method process flow diagram, mainboard structure synoptic diagram that can compatible various computing systems specification that can compatible various computing systems specification of the present invention.Mainboard manufacture method that can compatible various computing systems specification of the present invention, its step comprises:
Step 1: a mainboard 10 is provided, and the housing size of design limiting and standard mainboard 10.
Step 2: on mainboard 10, reserve again be provided with CPU (central processing unit) district 101, chipset cellular zone 102, in connect slot zone 103 and external bonding pad 104 and limit and its position of standard and area size.
Step 3: according to required mainboard 10 specifications of each computer vendors respectively at the required central processing unit of CPU (central processing unit) district 101 configurations, in connect required connection slot of slot zone 103 configurations and the required connector of external bonding pad 104 configurations.
Step 4: the layout conducting CPU (central processing unit) district 1 that can interlink on mainboard 10 again
01, chipset cellular zone 102, in connect the electronic circuit 105 of slot zone 103 and external bonding pad 104.
Step 5: with mainboard 10 test of drawing a design, finished the detection of mainboard 10, promptly manufactured.
So, the present invention is compared to existing mainboard manufacture, system is with the reverse manufacturing flow process, its main elder generation does the housing size of mainboard 10 to limit and standard, again on mainboard 10 with predetermined manner and limit fixed measure and the position, be respectively arranged with a CPU (central processing unit) district 101, one chipset cellular zone 102, connect a slot zone 103 and an external bonding pad 104 in one, for required mainboard 10 specifications of each computer vendors foundation, selectable at least one central processing unit (Central Process Unit respectively at the required label of CPU (central processing unit) district 101 configurations, be called for short CPU), in connect the required plural number of slot zone 103 configuration and connect slot and the required plural connector of external bonding pad 104 configurations, chipset cellular zone 102 then disposes a north bridge chips (North Bridge) and a South Bridge chip (South Bridge), on mainboard 10, design the conducting CPU (central processing unit) district 101 that to interlink again, chipset cellular zone 102, in connect the electronic circuit 105 of slot zone 103 and external bonding pad 104, make on the mainboard 10 each regional location can both make the controlling signal bi-directional, and after the computing machine spare part setting for the treatment of each regional location on the mainboard 10 is finished and electronic circuit 105 design arrangement finish, the test of just mainboard 10 being drawn a design, and after the detection of mainboard 10 is finished, can manufacture; By this, reaching can be with the pattern standardization and the broad applicability of mainboard 10, can promote simultaneously the tempo of development of computer system, avoid generation when each new edition computer module and spare part, the capital causes each tame computing machine factory for the designing and developing of mainboard, and must constantly drop into exploitation funds and manpower time cost.
Moreover the CPU (central processing unit) district 101 of acquiescence on the aforesaid mainboard 10 can be provided with at least one central processing unit (Central Process Unit is called for short CPU) of required label for each computer vendors according to required computer system specification; And the chipset cellular zone 102 of acquiescence is in order to a north bridge chips (North Bridge) and a South Bridge chip (South Bridge) to be set; Can be and connect slot zone 103 in default according to the required computer system specification of each computer vendors, the plural number that different size is set connects slot (as: memory bank, power supply slot for the connection of external power source supply, make IDE (Intelligent Drive Electronics) the specification slot or SATA (Serial Advanced Technology Attachment) the specification slot of transmission data-interface for the external access device, PCI (Peripheral Component Interconnect) slot that confession demonstration/sound card plugs or AGP (Acceleratde Graphics Port) slot etc.); And the external bonding pad 104 of acquiescence can be according to the required computer system specification of each computer vendors, and the plural connector of different size is set, and (as: connector, serial port (Serial Port) connector, parallel port (Parallel Port) connector, USB (universal serial bus) (being called for short USB) connector etc. are exported/gone into to source of sound connector, image signal.
In addition, when aforementioned step 1 and step 2 are finished, the module and the spare part of required computer system specification are designed and developed synchronously, with reach when mainboard 10 in the stage of designing and developing, in the stage that the module of required computer system specification and spare part also can design in the same time, more can save the spent manpower time of performance history.
Please cooperate and consult Fig. 3 and shown in Figure 4, be another implementing procedure of mainboard manufacture method figure, another embodiment synoptic diagram of mainboard structure that can compatible various computing systems specification that can compatible various computing systems specification of the present invention, wherein, a north bridge chips (North Bridge) that aforesaid chipset cellular zone 102 is set and a South Bridge chip (South Bridge) are to integrate mutually with the set central processing unit (CPU) in CPU (central processing unit) district 101, becoming single central processing unit (CPU) module chip, and its step comprises:
Steps A: a mainboard 10 is provided, and the housing size of design limiting and standard mainboard 10.
Step B: on mainboard 10, reserve again be provided with CPU (central processing unit) district 101, in connect slot zone 103 and external bonding pad 104 and limit and its position of standard and area size.
Step C: according to required mainboard 10 specifications of each computer vendors respectively at the CPU (central processing unit) district required tool of 101 configurations integrate north bridge chips and South Bridge chip central processing unit, in connect required connection slot of slot zone 103 configurations and the required connector of external bonding pad 104 configurations.
Step D: again on mainboard 10 layout can interlink conducting CPU (central processing unit) district 101, in connect the electronic circuit 105 of slot zone 103 and external bonding pad 104.
Step e: with mainboard 10 test of drawing a design, finished the detection of mainboard 10, promptly manufactured.
So, the present invention also can be with predetermined manner and qualification fixed measure and position on mainboard 10, be provided with a CPU (central processing unit) district 101, connect a slot zone 103 and an external bonding pad 104 in one, for required mainboard 10 specifications of each computer vendors foundation, selectable tool respectively at the required label of CPU (central processing unit) district 101 configurations is integrated the central processing unit of north bridge chips and South Bridge chip, connect electronic circuit 105 designs of aforementioned chipset cellular zone 102 its north bridge chips and South Bridge chip with further omission, also can reach simultaneously the space of saving mainboard 10, again on mainboard 10 respectively at CPU (central processing unit) district 101, in connect between slot zone 103 and the external bonding pad 104, can the interlink electronic circuit 105 of conducting of design makes on the mainboard 10 each regional location can both make the controlling signal bi-directional.
So, technical characterictic of the present invention, system sees through the acquiescence mode, elder generation is with CPU (central processing unit) district 101 on mainboard 10, one chipset cellular zone 102, when connecing the chi of a slot zone 103 and an external bonding pad 104 in one and its fixed area of position divide out, after treating the selected required computer system specification of each computer vendors, for each computer vendors selectable module and spare part with required computer system specification, be relatively arranged on the CPU (central processing unit) district of having given tacit consent to 101, chipset cellular zone 102, in connect in the zone of slot zone 103 and external bonding pad 104, on mainboard 10, design the conducting CPU (central processing unit) district 101 that interlinks again, chipset cellular zone 102, in connect the electronic circuit 105 of slot zone 103 and external bonding pad 104, make on the mainboard 10 each regional location can both make the controlling signal bi-directional, make it finish the manufacturing of mainboard 10 fast, use in response to the computing machine spare part that constantly makes new advances, all configurable in the zone that mainboard 10 is given tacit consent to, and only need upgrade the design of electronic circuit 105, can finish the manufacturing of mainboard 10, can be and reach with the pattern standardization and the broad applicability of mainboard 10, can promote simultaneously the tempo of development of computer system, avoid generation when each new edition computer module and spare part, the capital causes each tame computing machine factory for the designing and developing of mainboard, and must constantly drop into exploitation funds and manpower time cost.
In sum, the present invention is breaking through under the previous technical pattern, really reached the effect that institute's desire is promoted, and also non-is to have in technical field under it to know that usually the knowledgeable complies with the preceding prior art of application and can finish easily, the whence proposes application for a patent for invention in accordance with the law and earnestly asks your office and check and approve this part application for a patent for invention case, to encourage creation, to feeling moral just.
Only above-listed detailed description system specifies at one of the present invention possible embodiments, and this embodiment is not in order to restriction the present invention, and all do not break away from skill spirit of the present invention institute for it equivalence implement or change, all should be contained in the claim of this case.

Claims (4)

  1. One kind can compatible various computing systems specification the mainboard manufacture method, it is characterized in that: described method includes the following step:
    Limit the housing size of mainboard;
    On mainboard, reserve be provided with CPU (central processing unit) district, chipset cellular zone, in connect slot zone and external bonding pad, and limit the position and the size in described four districts;
    According to required computer system specification respectively at the required central processing unit of CPU (central processing unit) district configuration, in connect required connection slot of slot zone configuration and the required connector of external bonding pad configuration;
    Again on mainboard design can interlink conducting CPU (central processing unit) district, chipset cellular zone, in connect the electronic circuit of slot zone and external bonding pad;
    Finish the detection of mainboard, and manufacture.
  2. 2. mainboard manufacture method that can compatible various computing systems specification as claimed in claim 1, it is characterized in that: the mainboard that described method is made, its housing size is fixed by system, and comprise CPU (central processing unit) district, chipset cellular zone, in connect slot zone and external bonding pad;
    Described CPU (central processing unit) fauna fixed measure and position are located on this mainboard, are provided with at least one central processing unit in the CPU (central processing unit) district;
    Described chipset unit fauna fixed measure and position are located on this mainboard, are provided with a north bridge chips and a South Bridge chip in the chipset cellular zone, and are provided with plural electronic circuit between chipset cellular zone and the CPU (central processing unit) district and are conducted;
    Patch groove fauna fixed measure and position in described and be located on this mainboard, be provided with plural number in the slot zone and connect slot in interior connecing, and in connect and be respectively equipped with plural electronic circuit between slot zone and CPU (central processing unit) district and the chipset cellular zone and be conducted;
    Described external bonding pad is that fixed measure and position are located on this mainboard, is provided with plural connector in the district in external connecing, and external bonding pad and in connect and be provided with plural electronic circuit between the slot zone and be conducted.
  3. One kind can compatible various computing systems specification the mainboard manufacture method, it is characterized in that: described method includes the following step:
    Limit the housing size of mainboard;
    On mainboard, reserve be provided with the CPU (central processing unit) district, in connect slot zone and external bonding pad, and limit the position and the size in described three districts;
    According to required computer system specification respectively at the required tool of CPU (central processing unit) district configuration integrate north bridge chips and South Bridge chip central processing unit, in connect required connection slot of slot zone configuration and the required connector of external bonding pad configuration;
    Again on mainboard design can interlink conducting CPU (central processing unit) district, in connect the electronic circuit of slot zone and external bonding pad;
    Finish the detection of mainboard, and manufacture.
  4. 4. mainboard manufacture method that can compatible various computing systems specification as claimed in claim 3, it is characterized in that: the mainboard that described method is made is to fix its housing size, and comprise the CPU (central processing unit) district, in connect slot zone and external bonding pad;
    Described CPU (central processing unit) fauna fixed measure and position are located on this mainboard, are provided with the central processing unit that at least one tool is integrated north bridge chips and South Bridge chip in the CPU (central processing unit) district;
    Connecing slot zone in described, is that fixed measure and position are located on this mainboard, be provided with plural number in the slot zone and connect slot in interior connecing, and in connect and be respectively equipped with plural electronic circuit between slot zone and the CPU (central processing unit) district and be conducted;
    Described external bonding pad is that fixed measure and position are located on this mainboard, is provided with plural connector in external bonding pad, and external bonding pad and in connect and be provided with plural electronic circuit between the slot zone and be conducted.
CN2011100231197A 2011-01-20 2011-01-20 Method for manufacturing mainboard capable of being compatible with various specifications of computer systems Pending CN102122199A (en)

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Application Number Priority Date Filing Date Title
CN2011100231197A CN102122199A (en) 2011-01-20 2011-01-20 Method for manufacturing mainboard capable of being compatible with various specifications of computer systems

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107273105A (en) * 2016-04-08 2017-10-20 龙芯中科技术有限公司 Firmware starts method and apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000052197A (en) * 1999-01-30 2000-08-16 구자홍 Apparatus for cooling chip of computer
CN1350216A (en) * 2000-10-19 2002-05-22 周先谱 Computer main board design and processing method
CN2651814Y (en) * 2003-09-15 2004-10-27 联想(北京)有限公司 Main board of computer
CN201477515U (en) * 2009-08-08 2010-05-19 苏州彭华信息技术有限公司 Computer main board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000052197A (en) * 1999-01-30 2000-08-16 구자홍 Apparatus for cooling chip of computer
CN1350216A (en) * 2000-10-19 2002-05-22 周先谱 Computer main board design and processing method
CN2651814Y (en) * 2003-09-15 2004-10-27 联想(北京)有限公司 Main board of computer
CN201477515U (en) * 2009-08-08 2010-05-19 苏州彭华信息技术有限公司 Computer main board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107273105A (en) * 2016-04-08 2017-10-20 龙芯中科技术有限公司 Firmware starts method and apparatus
CN107273105B (en) * 2016-04-08 2021-06-01 龙芯中科技术股份有限公司 Firmware starting method and device

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