CN101082825A - Host board structure having super transmission interface - Google Patents
Host board structure having super transmission interface Download PDFInfo
- Publication number
- CN101082825A CN101082825A CNA200610027236XA CN200610027236A CN101082825A CN 101082825 A CN101082825 A CN 101082825A CN A200610027236X A CNA200610027236X A CN A200610027236XA CN 200610027236 A CN200610027236 A CN 200610027236A CN 101082825 A CN101082825 A CN 101082825A
- Authority
- CN
- China
- Prior art keywords
- connector
- super
- interface
- transmission
- transmission interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a motherboard structure with hypertransport interface, which comprises the following parts: motherboard with a slot, hypertransport device, wherein the hypertransport device contains first hypertransport connector with hypertransport test interface on the motherboard, expansion card to connect the motherboard through slot, second hypertransport connector and third hypertransport connector, wherein the second connector has hypertransport test interface; the third connector has a hypertransport expansion interface; the first and second hypertransport connectors connect electrically. Therefore, the motherboard can provide compatible structure with hypertransport test interface and hypertransport expansion interface under minimum on-board space and the least connecting interface condition.
Description
Ji Intraoperative field
The present invention provides a kind of host board structure, particularly applies to have concurrently super transmission (HyperTransport) test interface and the super host board structure that transmits extended interface.
Bei Jing Ji Intraoperative
Motherboard factories are when producing the motherboard (Main board) of the super transmission of tool (HyperTransport) interface, need carry out the super-transmission interface test earlier to obtain the monitoring of yield, and the super-transmission interface test mode is that the utilization outer testing system carries out from board test now, promptly, super transmission compatibility test plate sees through super test transmission interface ((HyperTransport Device-Under-Test, HT-DUT) connector is to surpass the transmission compatibility test, and when the motherboard of actual production tool super-transmission interface, then original super test transmission interface (HT-DUT) connector is removed, and with super transmission extended interface (HyperTransport Expansion, HTX) connector connector replacement.
Yet aforesaid way is to very inconvenience of motherboard factories, this be since when test employed motherboard be the motherboard of the super test transmission interface of tool (HT-DUT) connector, then be the super motherboard that transmits extended interface (HTX) connector connector of tool when producing, so need design and produce above-mentioned two kinds of different motherboards simultaneously, after to be tested the finishing, then abandon the motherboard of the super test transmission interface of tool (HT-DUT) connector connector, manpower and cost waste in the motherboard design that causes the super test transmission interface of tool (HT-DUT) connector and the production run.
Or there are motherboard factories to try super transmission extended interface connector (HTX) and super test transmission interface (HT-DUT) connector are designed simultaneously on a motherboard, though so can avoid wasting manpower and the cost of test with motherboard, the electric appliance component and the circuit institute cost accumulated that increase super test transmission interface (HT-DUT) connector at each motherboard are rather huge.Therefore under cost consideration, motherboard factories still adopt now and aforementionedly design and produce two kinds of different motherboard modes simultaneously and carry out the motherboard manufacturing.
Being relevant to super transmission extended interface and super test transmission interface in the known technology is to adopt the mode of being located at single motherboard respectively, but possibly can't provide comprehensively and total solution for saving processing procedure manpower and production cost now.Therefore, provide a kind of host board structure of perfect super-transmission interface to have very active demand.
Summary of the invention
Fundamental purpose of the present invention is the host board structure that is to provide a kind of tool super-transmission interface, be that the super transmission connector that sees through expansion board and motherboard surpasses the host board structure of transmission extended interface and super test transmission interface to form the while tool, and then make things convenient for motherboard factories in processing procedure, to save design manpower and production cost.
Another object of the present invention is to be to reach under the condition of super transmission extended interface and super test transmission interface, the utilization expansion board combines with motherboard, and be located at first connector of motherboard and being connected of second connector of being located at expansion board, minimum to form at the host board structure of board space (on-board space) with minimum connecting interface, and then meet the optimum utilization in computer rack space.
The invention relates to a kind of host board structure of tool super-transmission interface, include: a motherboard includes a slot; Reach and one surpass transmission (HyperTransport) device.Wherein, this super transmitting device further comprises: one first connector, be arranged at this motherboard, and have one first transmission interface, this first transmission interface provides information transmission; An and expansion board, by this slot to be connected in this motherboard, comprise one second connector and one the 3rd connector, wherein, this second connector has this first transmission interface, the 3rd connector has one second transmission interface, and this first connector and this second connector have electric connecting relation.
Description of drawings
Fig. 1 is the schematic side view for a preferred embodiment of the present invention.
Fig. 2 A is first stereographic map for a preferred embodiment of the present invention expansion board.
Fig. 2 B is second stereographic map for a preferred embodiment of the present invention expansion board.
Fig. 3 is the mainboard architecture synoptic diagram for a preferred embodiment of the present invention.
Fig. 4 is the information transmission of a preferred embodiment of the present invention expansion board and electric power supply synoptic diagram.
Embodiment
See also shown in Figure 1, Fig. 1 be for host board structure one preferred embodiment of tool super-transmission interface of the present invention schematic side view.The host board structure of tool super-transmission interface of the present invention mainly is to be provided with in the motherboard 1 one to surpass transmitting device 2 and constitute, relate to the super transmission of a kind of tool (HyperTransport, HT) host board structure of interface, wherein this motherboard 1 is that the electric binding of electronic package and the device of communication switching are provided in the computer system; And should super transmitting device 2 be electric interfaces with super transport communication protocol, and this super-transmission interface be meant high speed information by point-to-point (chip-to-chip interconnect) between the integrated circuit of institute of hyper transport technology alliance (HyperTransport TechnologyConsortium) standard transmit interconnection technique with and the communication protocol of connector technique.
See also Fig. 1 and also further consult shown in Fig. 2 A and Fig. 2 B, Fig. 2 A is first stereographic map for a preferred embodiment of the present invention expansion board, and Fig. 2 B is second stereographic map for a preferred embodiment of the present invention expansion board.Aforementioned super transmitting device 2 of the present invention is to have 1 the first to surpass a transmission connector 20 and an expansion board (Riser Card) 22, wherein this information transmission protocol and interface connector that the first surpasses transmission connector 20 is to define according to super-transmission interface, and be electrically connected in this motherboard 1, and be arranged in this motherboard 1, in order to form the attachment unit interface that gas is situated between and connects of to power; And this expansion board 22 is board structure of circuit, and this expansion board 22 is that the interface slot 14 that sees through this motherboard 1 reaches the purpose that is arranged at this motherboard 1, and by interface slot 14 to obtain electric power supply.
In aforesaid embodiment, this expansion board 22 has 1 and the second surpasses transmission connector 220 and several and three surpass transmission connector 222.Wherein this second to surpass transmission connector 220 are super-transmission interfaces, and the second surpassing transmission connector 220 and this, the first to surpass transmission connector 20 be to adopt super test transmission interface (HyperTransport Device-Under-Test, HT-DUT) definition, and this second surpasses transmission connector 220 and also the first surpasses transmission connector 20 with this simultaneously and form and be electrically connected; The three to surpass transmission connector 222 be to adopt super transmission extended interface (HyperTransport Expansion, HTX) Ding Yi interface connector for those.
The aforesaid transmission connector 220 that the second surpasses the first surpasses transmission connector 20 formed being electrically connected with this, be to see through a flexible printed circuit board (Flexible Printed Circuit, FPC) 3 pliability circuit is reached, and these flexible printed circuit board 3 two ends are to have respectively to cooperate this first to surpass transmission connector 20 and this second surpasses the interface connector of transmission connector 220, and carry out information transmission with the super-transmission interface specification.
In addition, this expansion board 22 is can select the first to surpass transmission connector 20 by this second to surpass being electrically connected of transmission connector 220, this expansion board 22 with this and directly be situated between and connect this interface slot 14 and a line of electric force directly is electrically connected in the arbitrary form in the power supply unit (Power Supply) and obtains electric power supply.
Aforesaid super transmission extended interface (HTX) connector is the mutual connecting interface (chip-to-chip interconnect) of a kind of tool super-transmission interface chip, and the extensible connecting interface that carries out the signal transmission each other for a kind of subsystem (subsystem) with super-transmission interface and adapter with super-transmission interface, and should the support of super transmission extended interface optionally eight super transmission link interfaces or the super transmission link interface of sixteen bit, in addition, this expansion board 22 is the communication interface Jie's access node structures with mutual corresponding matching with this interface slot 14, lift a concrete embodiment, this expansion board 22 is to adopt Peripheral Component Interconnect (Peripheral Component Interconnect with this interface slot 14, PCI), and tool should super transmission extended interface connector mechanism's specification can be applicable to rack-mount server (Rack-mounted server), knife edge type server (Blade server) or vertical type server (Pedestal server).Should super test transmission interface (HT-DUT) connector be a kind of connecting interface that the super-transmission interface chip carries out the signal transmission each other that has, outer testing system (external test system) is carried out from board test (off-boardtest), mat and super transmission compatibility test is provided.
See also shown in Figure 3ly, it is the mainboard architecture synoptic diagram for another preferred embodiment of the present invention.Aforesaid information processing chip is a central processing element group 10, this central processing element group 10 comprises one first central processing element 100 and one second central processing element 102, this bridging chip group 12 comprises a north bridge chips 120 (North Bridge or title Graphics and Memory Controller Hub, MCH) and South Bridge chip a 122 (South Bridge, or claim Input and Output Controller Hub, ICH).
See also shown in Figure 4ly, Fig. 4 is the information transmission of a preferred embodiment of the present invention expansion board and electric power supply synoptic diagram.The host board structure of tool super-transmission interface of the present invention is when running, the information of a large amount of super-transmission interface specifications can directly see through this and the first surpass test transmission interface connector 20, this flexible printed circuit board 3 and this and the second surpass transmission connector 220 and be sent to this expansion board 22, and the second surpasses transmission connector 220 and the by this of this expansion board 22 and three surpass transmission connector 222 and have the super function that interconnects demand and super test transmission demand of transmitting concurrently to reach.Wherein, these expansion board 22 required electric power are to see through this interface slot 14 of this motherboard 1 to obtain electric power supply.
In addition, see through the combination of this expansion board 22 and this interface slot 14, this expansion board 22 is arranged on this motherboard 1, minimum to be formed in the structure of board space (on-board space) with minimum connecting interface (being single face slot 14), also meet the optimum utilization of minimum space.So mechanism of the present invention specification (mechanicai specification) can be applicable to rack-mount server (Rack-mounted server) or vertical type server (Pedestal server).
Moreover, based on aforesaid super transmitting device 2, this the first surpasses transmission connector 20 is first central processing element 100 or second central processing elements 102 that can select to be electrically connected in this central processing element group 10, therefore can see through and the first surpass the electric test that transmission connector 20 carries out this central processing element group 10 in the super transmitting device 2 of this usefulness, outer testing system is carried out from board test, mat and super transmission compatibility test is provided, and see through the in the super transmitting device 2 of this usefulness and three surpass transmission connector 222 and carry out the expansion of electronic packages such as internal memory.
In addition, based on aforesaid super transmitting device 2, this the first surpasses transmission connector 20 is north bridge chips 120 or the South Bridge chips 122 that can select to be electrically connected in this this bridging chip group 12, therefore can see through and the first surpass the electric test that transmission connector 20 carries out this this bridging chip group 12 in the super transmitting device 2 of this usefulness, outer testing system is carried out from board test, and see through the in the super transmitting device 2 of this usefulness and three surpass transmission connector 222 and carry out the expansion of electronic packages such as internal memory.
In sum, because the present invention is the host board structure of the combination of utilization expansion board and slot with super test transmission connector of formation tool and super transmission expansion connector, so when surpassing test transmission, can use the super test transmission connector of expansion board to surpass the transmission compatibility test, and then guarantee that the yield of the super transmission of tool motherboard is controlled.
In addition because the present invention is the combination of utilization expansion board and slot, so host board structure of the present invention can with minimum at board space and minimum connecting interface, satisfy super test transmission interface simultaneously and surpass the demand of transmitting extended interface.And produce two kinds of motherboards with design simultaneously in known technology, or so that super test transmission interface and the super mode of transmitting extended interface to be set on the motherboard, the present invention more can effectively save manpower required in the motherboard processing procedure and cost.
So the present invention not only can provide super test transmission interface and super transmission extended interface, and can be with the structure of minimum at board space and minimum connecting interface, reach the optimization environment for use in processing procedure manpower, production cost and host board structure space, so the present invention has progressive and meets the key element of applying for patent of invention.
Claims (10)
1. the host board structure of a tool super-transmission interface, it is to have in the motherboard one to surpass transmitting device, it is characterized in that: and this tool super-transmission interface comprises
One first connector, it is super test transmission interface, and is arranged on this motherboard;
One expansion board, it is to be arranged at this motherboard, and comprises one second connector and one the 3rd connector, this second connector is super test transmission interface, the super transmission of the 3rd connector extended interface;
Wherein this first connector and this second connector are to form to be electrically connected.
2. according to the host board structure of the described tool super-transmission interface of claim 1, it is characterized in that: this first connector and this second connector are to form by a flexible printed circuit board to be electrically connected.
3. according to the host board structure of the described tool super-transmission interface of claim 2, it is characterized in that: this expansion board directly by a power supply unit to obtain electric power supply.
4. according to the host board structure of the described tool super-transmission interface of claim 1, it is characterized in that: this expansion board is electrically connected to obtain electric power supply by this first connector and this second connector.
5. according to the host board structure of the described tool super-transmission interface of claim 1, it is characterized in that: this motherboard further comprises a slot; And this expansion board is to be arranged at this slot.
6. according to the host board structure of the described tool super-transmission interface of claim 5, it is characterized in that: this expansion board further is electrically connected this slot, in order to see through this slot supply electric power to this expansion board.
7. according to the host board structure of the described tool super-transmission interface of claim 6, it is characterized in that: this first connector and this second connector by this flexible printed circuit board to carry out information transmission.
8. according to the host board structure of the described tool super-transmission interface of claim 5, it is characterized in that: this slot is to adopt Peripheral Component Interconnect.
9. according to the host board structure of the described tool super-transmission interface of claim 1, it is characterized in that: this motherboard comprises a driving component, and this driving component is to use super transport communication interface to be electrically connected this first connector.
10. according to the host board structure of the described tool super-transmission interface of claim 9, it is characterized in that: this driving component is to comprise an information processing chipset, and uses super transport communication interface to be electrically connected this first connector through this information processing chipset.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200610027236XA CN101082825A (en) | 2006-06-02 | 2006-06-02 | Host board structure having super transmission interface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA200610027236XA CN101082825A (en) | 2006-06-02 | 2006-06-02 | Host board structure having super transmission interface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101082825A true CN101082825A (en) | 2007-12-05 |
Family
ID=38912420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA200610027236XA Pending CN101082825A (en) | 2006-06-02 | 2006-06-02 | Host board structure having super transmission interface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101082825A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI711830B (en) * | 2019-10-09 | 2020-12-01 | 技嘉科技股份有限公司 | Computer system |
| WO2021114162A1 (en) * | 2019-12-12 | 2021-06-17 | Fci Usa Llc | Card-edge connector system with busbar connection for high-power applications |
-
2006
- 2006-06-02 CN CNA200610027236XA patent/CN101082825A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI711830B (en) * | 2019-10-09 | 2020-12-01 | 技嘉科技股份有限公司 | Computer system |
| WO2021114162A1 (en) * | 2019-12-12 | 2021-06-17 | Fci Usa Llc | Card-edge connector system with busbar connection for high-power applications |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1812693B (en) | Dual bus interface circuit board components and assemble method thereof | |
| CN100541444C (en) | The management system of multiple main board system | |
| US20150378958A1 (en) | Arbitrating usage of serial port in node card of scalable and modular servers | |
| TW201640366A (en) | USB Type-C connector module | |
| CN101499046A (en) | SPI equipment communication circuit | |
| CN102147781A (en) | Motherboard compatible with multiple versions of universal serial bus (usb) and related method | |
| CN110799007B (en) | Industrial control computer and industrial control computer communication protection method | |
| US20070032100A1 (en) | Replaceable input/output interface for circuit board | |
| CN104615572A (en) | Hot-plug processing system and method | |
| CN104881105A (en) | Electronic device | |
| CN212135411U (en) | IO module and OCP keysets | |
| CN1979460A (en) | Processor configuration frame of multi-processor system | |
| CN110554983A (en) | Exchange circuit board | |
| US20070218709A1 (en) | Computer system and main board equipped with hybrid hypertransport interfaces | |
| CN203133691U (en) | Server computation node based on CPCI framework | |
| CN101082825A (en) | Host board structure having super transmission interface | |
| US20120083212A1 (en) | Data transmitting system and data transmitting method | |
| US20090292849A1 (en) | Adaptable pci express controller core | |
| CN103869883B (en) | One kind extension mainboard and expansion system | |
| CN204189089U (en) | A kind of server | |
| CN107329863B (en) | General hardware platform of measuring instrument based on COMe | |
| CN213276462U (en) | Two-way server mainboard and two-way server | |
| CN201489526U (en) | Adapter card, computer device and single computer mainboard | |
| CN211293808U (en) | Multifunctional CPCIe industrial computer mainboard | |
| JP5326689B2 (en) | Adapter for bus connection |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: HUANDA COMPUTER (SHANGHAI) CO., LTD. Free format text: FORMER OWNER: TYAN COMPUTER TECHNOLOGY ( SHANGHAI ) CO., LTD.; APPLICANT Effective date: 20071228 |
|
| C10 | Entry into substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20071228 Address after: The postcode of No. three, Road 213, Zhabei District, Shanghai, China: 200436 Applicant after: MiTAC International Corp. Address before: 3 \/ F, building 3, 1486, Nanjing West Road, Shanghai, zip code: 200040 Applicant before: Tai'an computer technology (Shanghai) Co., Ltd. Co-applicant before: Tyan Computer Corporation |
|
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |