CN102119587B - Method of manufacturing printed wiring board with surface-mount component mounted thereon - Google Patents
Method of manufacturing printed wiring board with surface-mount component mounted thereon Download PDFInfo
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- CN102119587B CN102119587B CN200980131288.3A CN200980131288A CN102119587B CN 102119587 B CN102119587 B CN 102119587B CN 200980131288 A CN200980131288 A CN 200980131288A CN 102119587 B CN102119587 B CN 102119587B
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- electrode
- pad
- wiring board
- printed wiring
- surface mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A method of manufacturing a printed wiring board (107) on which a surface-mount component (100) is mounted. The surface-mount component includes a plurality of electrodes (100a, 100b). The printed wiring board includes a plurality of lands (103, 103a, 103b). The lands are provided correspondingly to the electrodes. Each of the lands is soldered to the corresponding electrode. The manufacturing method includes a step of applying solder (104a, 104b) to the printed wiring board, a step of mounting the surface-mount component on the printed wiring board after the application of the solders, a step of detecting an inferior electrode such that the adhesion with the land by the surface tension of the molten solder is weaker than that between the other electrodes and the corresponding lands, and a step of shining a light beam so that the solder on the side for the detected inferior electrode can melt faster than the solder for the other superior electrodes. By the method, it is possible to prevent the inferior electrode from separating from the land.
Description
Technical field
The manufacture method that the present invention relates to be provided with the printed wiring board of surface mounting assembly, specifically, relates to the method for manufacturing printed wiring board on the printed wiring board that is coated with scolding tin by utilizing light beam to be welded on surface mounting assembly.
Background technology
Along with the high performance of portable phone, game machine, musical instruments, video camera etc., need the super-high density of surface mounting technology.More specifically, begin one's study and adopt thin base installation, flexible printing wiring board (FPC:Flexible Printed Circuits) installation, the installation of 0402 (0.4mm * 0.2mm) parts, POP (Package On Package) to install.
As the factor that affects quality in install on surface, have: (1) substrate and design, (2) metal mask, (3) scolding tin solder printing, (4) scolding tin are stuck with paste the quality of (scolding tin ペ mono-ス ト), (5) electronic unit, the installation of (6) parts, (7) backflow etc.
In the design of common operation, consider the deviation of parts, the installation accuracy of the printing precision of scolding tin, parts, to avoid the position skew etc. of parts bad.Yet, because surface mounting assembly is very little, in reflow process, easily produce the failure welding that is known as " parts perk ", " parts skew ".Parts perk refers to: when the surface tension of the molten tin between two electrodes that produce surface mounting assembly is poor, the electrode of one side floats from the pad (land) of a side, only have the electrode welding of opposite side on the pad of opposite side, thereby the phenomenon of surface mounting assembly perk is commonly referred to as Manhattan phenomenon, tomb stone effect (Tombstone Phenomenon) etc.Below, the electrode of the side departing from from pad due to parts perk is called to " inferior position electrode ", the electrode of opposite side is called " advantage electrode ".Parts skew refers to that the position of surface mounting assembly has produced the phenomenon of skew with respect to the position of pad.Parts perk and parts skew all cause the bad connection that electrode departs from from pad, cause fabrication yield to reduce.Below, parts perk and parts skew are generically and collectively referred to as to " parts perk etc. ".
Japanese documentation JP 2003-69203 communique discloses the tolerance computational methods of the installation site of surface mounting assembly.The method, based on suppressing Manhattan the phenomenon moment occurring and the moment that promotes that Manhattan phenomenon occurs, calculates the tolerance of correct installation site.But this communique does not openly prevent the concrete reflow method of Manhattan phenomenon completely.
Summary of the invention
The present invention puts in view of the above-mentioned problems and completes, and its object is, provides a kind of and prevents that electrode from departing from the manufacture method of the printed wiring board that surface mounting assembly is installed of pad.
Manufacturing method according to the invention is a kind of manufacture method that the printed wiring board of surface mounting assembly is installed.Surface mounting assembly comprises a plurality of electrodes.Printed wiring board has a plurality of pads.A plurality of pads and a plurality of electrode arrange accordingly.And each in a plurality of pads should be respectively and corresponding electrode welding.Manufacture method comprises the following steps: on printed wiring board, be coated with scolding tin, after coating scolding tin, surface mounting assembly is put on printed wiring board, determine the electrode (inferior position electrode) that electrode that the surface tension due to molten tin causes and the adhesive force between pad are less than the adhesive force between other electrodes and pad, illumination beam, makes the scolding tin of the electrode side determined than the more Zao melting of the scolding tin of other electrode sides.
According to the present invention, the early melting of the scolding tin of inferior position electrode side, so the adhesive force of inferior position electrode grow early.Consequently, can prevent that inferior position electrode from departing from from pad.
" scolding tin " in the present invention comprising: for example, take leaded scolding tin, argentiferous scolding tin, gold plumbous and that tin is principal component is scolding tin and the Pb-free solder that tin, silver and copper or tin and bismuth etc. are principal component of take." scolding tin " also can comprise: for example, and anti-oxidation and make to connect the additives such as being easy to scaling powder that becomes." scolding tin " also can comprise: for example, scolding tin is stuck with paste, solder(ing) paste.
Other feature, key element, step, characteristic and advantage of the present invention becomes clearer and more definite by what carry out with reference to accompanying drawing about following detailed description preferred embodiment of the present invention.
Accompanying drawing explanation
Fig. 1 is the functional block diagram that the integral body formation of the preferred embodiment manufacturing installation of the related printed wiring board that surface mounting assembly is installed of the present invention is shown;
Fig. 2 is the plane graph that the formation of the welder in Fig. 1 is shown;
Fig. 3 is the ideograph that the formation of laser head in Fig. 2 and periphery thereof is shown;
Fig. 4 is the ideograph that the example outside the laser head shown in Fig. 3 is shown;
Fig. 5 is the flow chart that the action of the manufacturing installation shown in Fig. 1 is shown;
Fig. 6 is the end view for the reason of surface mounting assembly production part perk shown in key diagram 3 etc.;
Fig. 7 A is that the electrode position due to the surface mounting assembly putting on printed wiring board does not produce skew, is therefore difficult to the surface mounting assembly of generation part perk and the end view of printed wiring board;
Fig. 7 B is the electrode position generation skew due to the surface mounting assembly putting on printed wiring board, the therefore easy surface mounting assembly of generation part perk and the end view of printed wiring board;
Fig. 8 is that the electrode that the welder effects on surface installing component utilizing shown in Fig. 3 is shown irradiates the stereogram of the method for single laser beam successively;
Fig. 9 illustrates to utilize the welder shown in Fig. 4 to irradiate the stereogram of the method for 2 laser beams with the electrode of different intensity or timing effects on surface installing component;
Figure 10 A does not produce skew owing to being printed on the position of the scolding tin on pad, is therefore difficult to the surface mounting assembly of generation part perk and the end view of printed wiring board;
Figure 10 B produces skew, the therefore easy surface mounting assembly of generation part perk and the end view of printed wiring board owing to being printed on the position of the scolding tin on pad;
Figure 11 A is offset to the right owing to putting the position of the electrode of the surface mounting assembly on printed wiring board and be offset to the right and be printed on the position of the scolding tin on pad, therefore easily the surface mounting assembly of generation part perk and the end view of printed wiring board;
Figure 11 B is offset to the right owing to putting the position of the electrode of the surface mounting assembly on printed wiring board and be offset to the left and be printed on the position of the scolding tin on pad, therefore easily the surface mounting assembly of generation part perk and the end view of printed wiring board;
Figure 12 A produces skew owing to putting the position of electrode of the surface mounting assembly on printed wiring board and the position that is printed on the scolding tin on pad, is therefore difficult to the surface mounting assembly of generation part skew and the plane graph of printed wiring board;
Although Figure 12 B is owing to being printed on that the position of the scolding tin on pad does not produce skew but the position that puts the electrode of the surface mounting assembly on printed wiring board has produced skew, the therefore easily surface mounting assembly of generation part skew and the plane graph of printed wiring board;
Figure 12 C both produces skew to identical direction owing to putting the position of electrode of the surface mounting assembly on printed wiring board and the position that is printed on the scolding tin on pad, therefore easily the surface mounting assembly of generation part skew and the plane graph of printed wiring board;
Figure 12 D both produces skew to different directions owing to putting the position of electrode of the surface mounting assembly on printed wiring board and the position that is printed on the scolding tin on pad, therefore easily the surface mounting assembly of generation part skew and the plane graph of printed wiring board;
Figure 13 A is the plane graph with the printed wiring board of earthy pad;
Figure 13 B is the plane graph that has formed scolding tin anticorrosion layer on the printed wiring board shown in Figure 13 A;
Figure 13 C has printed the plane graph that scolding tin is stuck with paste on the printed wiring board shown in Figure 13 B;
Figure 13 D has put the plane graph of surface mounting assembly on the printed wiring board shown in Figure 13 C;
Figure 14 be illustrate when utilize shown in LASER BEAM WELDING Figure 13 D surface mounting assembly time the plane graph of diffusion of heat;
Figure 15 A is temperature temporal evolution and the Laser output time history plot that the common pad in Figure 14 is shown;
Figure 15 B is temperature temporal evolution and the Laser output time history plot that the earthy pad in Figure 14 is shown.
Embodiment
Below, present invention will be described in detail with reference to the accompanying preferred embodiment.In the drawings to identical or considerable part mark same-sign, and do not repeat its description.
(integral body of manufacturing installation forms)
Fig. 1 is the functional block diagram that the integral body formation of the preferred embodiment manufacturing installation of the related printed wiring board that surface mounting assembly is installed of the present invention is shown.With reference to Fig. 1, manufacturing installation 1 comprises: main frame 10, solder printing machine 20, scolding tin inspection machine 30, surface mounting apparatus (chipMounter, chip chip mounter) 40A, 40B, welder 50.Manufacturing installation 1 is by surface mounting assembly being arranged on to the device of manufacturing the printed wiring board that surface mounting assembly is installed on printed wiring board.
The main frame 10 of controlling each device connecting by HUB (multiport transponder) comprises: controller 10a, memory 10b, display 10c, input unit 10d.Application program from main frame 10 sends control command to each device.Printed wiring board that will mounting surface installing component is transported by the substrate carriage direction to representing with arrow in the drawings.
First, solder printing machine 20 is printed on solder(ing) paste on printed wiring board.Scolding tin inspection machine 30 checks the position of the scolding tin being printed.Check result sends to surface mounting apparatus 40A, 40B and welder 50 via main frame 10.Surface mounting apparatus 40A, 40B are arranged on surface mounting assembly on printed wiring board.For the efficiency of operation is used many surface mounting apparatus 40A, 40B side by side.Surface mounting apparatus is not 2, can arrange more than 3 yet.
Then, printed wiring board is transported to welder 50.Welder 50 is by laser beam is irradiated on the scolding tin on printed wiring board partly, and heating scolding tin makes its melting, thus surface mounting assembly is welded on printed wiring board.
Surface mounting apparatus 40A, 40B install take the small surface mounting assembly that 0402 parts are representative.Even the position of printing in solder printing operation produces skew or in parts installation procedure the position of surface mounting assembly produce skew, as long as skew in predetermined scope, welder 50 just by appropriate laser irradiating method illuminating laser beam so that this skew diminish.
(welder)
Fig. 2 is the plane graph that the outward appearance formation of welder 50 is shown.With reference to Fig. 2, welder 50 comprises printed wiring board conveyer 251, laser head 200, XYZ robot 271.Welder 50 is welded on surface mounting assembly 100 on printed wiring board 107 by laser beam.
Printed wiring board conveyer 251 is transported to preposition by the printed wiring board of input 107.Surface mounting assembly 100 is installed on printed wiring board 107.
Laser head 200 arrives the electrode of surface mounting assembly 100 and the pad of printed wiring board 107 by laser beam irradiation.XYZ robot 271 transports to the X on figure laser head 200 with Y-direction and Z direction (direction vertical with Y-direction with respect to X).
(laser head)
Fig. 3 illustrates the formation of laser head 200 and periphery thereof.With reference to Fig. 3, welder 50 also comprises: semiconductor laser 303, optical cable 305, image processing apparatus 325, controller 327.
Laser head 200 comprises: collimating lens 307, half-reflecting mirror 309, collector lens 321, coaxial video camera 323, current mirror 311,313, telecentric lens 315, lens driver 317a, 317b, determine position video camera 301.Thereby when laser head 200Bei XYZ robot 271 moves, above-mentioned all parts that laser head 200 comprises also move together.
Semiconductor laser 303 is the light sources for generation of laser beam.The laser beam producing is directed into collimating lens 307 by optical cable 305.Collimating lens 307 makes laser beam parallel.Half-reflecting mirror 309 makes that the laser beam of self-focus lens 307 is straight sees through and make the laser beam that returned by surface mounting assembly 100 and printed wiring board 107 reflections almost to meet at right angles to be reflected.
Current mirror 311,313 is by making the laser beam that sees through half-reflecting mirror 309 with vibration at high speed, thereby by electrode 100a, the 100b of laser beam flying surface mounting assembly 100 and the pad 103 of printed wiring board 107.Telecentric lens 315 makes from the laser beam of current mirror 311,313 under roughly.Lens driver 317a, 317b, by driving telecentric lens 315 to optical axis direction, make telecentric lens 315 focusings.Determine the reference mark (identification mark) that position video camera 301 is taken printed wiring board 107, detect position and the direction of surface mounting assembly 100.
(other examples of laser head)
Fig. 4 is the ideograph that the formation of the laser head 202 that replaces laser head 200 uses is shown.Laser irradiation device 467a is equivalent to current mirror 311,313 and the telecentric lens 315 shown in Fig. 3, the laser beam that output is reflected by half-reflecting mirror 309.Laser head 202 also has exhaust apparatus 357, the scolding tin paste that described exhaust apparatus 357 discharges dissolve and the mist of scaling powder.
Welder 50 also has another laser irradiation device 467b.This laser irradiation device 467b also has the formation identical with above-mentioned laser irradiation device 467a.Thus, can be by two electrode 100a, 100b of 2 laser beams while face of weld installing components 100.3 above laser irradiation devices also can be set.
(action of solder printing machine and welder)
Below, with reference to the flow chart of Fig. 5, the action of solder printing machine 20 and welder 50 is described.
Solder printing machine 20 is printed on (S101) on printed wiring board 107 by scolding tin paste (comprising scaling powder).Scolding tin inspection machine 30 measures the position of scolding tin that is printed, the skew in printing position, soldering tin amount (scolding tin height) (S103).Scolding tin inspection machine 30 sends to welder 50 (S105) by this check result.
On the other hand, in welder 50, controller 327 is controlled printed wiring board conveyer 251, makes it that printed wiring board of input 107 is transported to preposition (S201).
Determine that position video camera 301 reads the position (S205) of the reference mark of printed wiring board 107 (S203), identification printed wiring board 107 and surface mounting assembly 100.
Determine the surface mounting assembly 100 (S207) that position video camera 301 is taken on printed wiring board.The image of controller 327 based on being determined that position video camera 301 is taken and processed by image processing apparatus 325, the installment state of identified surface installing component 100 and from the position skew (S209) of pad 103.The check result of controller 327 based on scolding tin inspection machine 30 and the position skew of identifying, determine the parts of easy generation part perk etc., and determine the laser irradiating method (S211) that is applicable to these parts.; controller 327 receives for determining the information of inferior position electrode, and described inferior position electrode is that the surface tension due to molten tin causes adhesive force between the electrode of surface mounting assembly 100 and the pad of printed wiring board 107 to be less than the electrode of the adhesive force between other electrodes and pad.Controller 327 is also determined laser irradiating method, makes the scolding tin that passes through the definite inferior position electrode side of received information than the more Zao melting of the scolding tin of other advantage electrode sides.
Controller 327 is according to the selective sequential surface mounting assembly 100 being programmed in advance, and controls XYZ robot 271, so that it moves to laser head 200 top (S213) of this selecteed surface mounting assembly 100.Controller 327 is according to laser irradiating method definite in step S211, by laser beam irradiation to (S215) on selecteed surface mounting assembly 100.
Controller 327 judges whether the installation of all surface installing component 100 finishes (S219).When not finishing (being "No" in S219), controller 327, with the selective sequential surface mounting assembly 100 according to being programmed in advance, repeats the processing of above-mentioned steps S213～S215.
When being through with (being "Yes" in S219), controller 327 is controlled XYZ robot 271, makes laser head 200 get back to original position (S221).Finally, controller 327 is controlled printed wiring board conveyer 251, makes its discharge that the printed wiring board 107 (S223) of all surface mounting assemblies 100 is installed.Thus, manufacture the printed wiring board 107 that surface mounting assembly 100 is installed.
Welding by laser as above also can be performed after the welding in reflow ovens.More specifically, after the surface mounting assembly that heat resisting temperature is high welds in reflow ovens, by the low surface mounting assembly of laser welding heat resisting temperature.
(determining of the generation reason of parts perk etc. and laser irradiating method)
Next, describe the step (S211) of above-mentioned definite laser irradiating method in detail.
Fig. 6 is for the end view of the generation reason of parts perk etc. is described.As shown in Figure 6, on printed wiring board 107, be provided with pad 103a, 103b.Print solder 104a, 104b on pad 103a, 103b.Only has the scolding tin 104b on the right side in figure by laser beam melting.Electrode 100a and the 100b of surface mounting assembly 100 are soldered to respectively on pad 103a and 103b.
The weight of supposing surface mounting assembly 100 be m, length be L, highly for H, width are that W, acceleration of gravity are that the surface tension of g, molten tin is γ.And the fulcrum of surface mounting assembly 100 rotations while representing scolding tin melting with P in the drawings.
Distance till supposing from the right-hand member of pad 103b to fulcrum P is a, and the distance till from the left end of pad 103b to fulcrum P is b.
The straight line of topmost of side and the side angulation of the electrode 100b of surface mounting assembly 100 of supposing the right-hand member of connection pad 103b and the electrode 100b of surface mounting assembly 100 are α.The side angulation of α and molten tin 104b and electrode 100b is almost equal.The bottom surface of electrode 100b and the upper surface angulation of pad 103b of supposing surface mounting assembly 100 are β.
Now, according to the moment T1 of surface tension γ (make surface mounting assembly 100 take fulcrum P and turn clockwise as axle, so that the power that surface mounting assembly 100 erects), with following formula (1), represent.
Several 1
At the lower surface of surface mounting assembly 100, according to the moment T2 of surface tension γ (with the power of the power acting in opposition that parts are erected), can use following formula (2) to represent.
T2＝γcosβ·Wb...(2)
When β=0, cos β=1, so moment T2 can use following formula (3) to represent.
T2＝γWb...(3)
According to the moment T3 of the deadweight of surface mounting assembly 100 (with the power of the power acting in opposition that parts are erected), can use following formula (4) to represent.
T3＝mgLcosβ/2...(4)
Cos β=1 when β=0, so moment T3 can use following formula (5) to represent.
T3＝mgL/2...(5)
When the condition of T1 > T2+T3 is set up, the possibility of generation part perk etc. increases.; when α is greater than predetermined critical value (surface mounting assembly 100 to the left side skew in figure, a < < b time); once the electrode 100b of face of weld installing component 100; surface mounting assembly 100 be take fulcrum P and is turned clockwise as axle, easily generation part perk etc.
As mentioned above, the electrode of one side of floating from printed wiring board 107 due to parts perk etc. in welding (being electrode 100a among Fig. 6) is called to " inferior position electrode ", and the electrode of its opposition side (being electrode 100b in Fig. 6) is called to " advantage electrode ".Inferior position electrode easily departs from from pad, and advantage electrode is difficult to depart from from pad.This be because: because the surface tension γ of molten tin 104a acts on the surface tension γ that the adhesive force (inferior position electrode 100a wants to be attached to the power on pad 103a) between inferior position electrode 100a and pad 103a is less than due to molten tin 104b, act on the adhesive force (advantage electrode 100b wants to be attached to the power of pad 103b) between advantage electrode 100b and pad 103b.
In the situation that soldering tin amount is many, also become large, therefore easy generation part perk etc. with above-mentioned similarly moment T1.
(the vertical skew of surface mounting assembly)
In Fig. 7 A, surface mounting assembly 100 is not put on printed wiring board 107 from pad 103a, 103b skew quilt.Scolding tin 104a, 104b are not yet offset and are printed from pad 103a, 103b.In this case, be judged as not production part perk etc.
In Fig. 7 B, surface mounting assembly 100 is put on printed wiring board 107 to the left side skew in figure.But scolding tin 104a, 104b can not be printed from pad 103a, 103b skew.When surface mounting assembly 100 is offset to the left side in figure, right side in the drawings, is greater than preset distance apart from a, and distance b is less than preset distance.Therefore,, although moment T1 becomes greatly, moment T2 diminishes.Thereby the condition of T1 > T2+T3 is set up.Now, be judged as production part perk etc.When observing the distance a of electrode 100b side, be more than or equal to predetermined distance when above, judge that this electrode 100b is advantage electrode, the electrode 100a that judges its opposition side is inferior position electrode.
(1) light beam moves
Utilize the single laser irradiation device 467a shown in Fig. 4, make as shown in Figure 8 single laser beam LB move.More specifically, first, laser irradiation device 467a is irradiated to inferior position electrode 100a and pad 103a by laser beam LB.Next, laser irradiation device 467a makes laser beam LB move to advantage electrode 100b from inferior position electrode 100a.Then, laser irradiation device 467a is irradiated to advantage electrode 100b and pad 103b by laser beam LB.
Laser beam LB is first irradiated to inferior position electrode 100a side compared with advantage electrode 100b side, so the scolding tin 104a of inferior position electrode 100a side is than the more Zao melting of scolding tin 104b of advantage electrode 100b side.Therefore, the adhesive force between inferior position electrode 100a and pad 103a increases, and inferior position electrode 100a does not float from pad 103a.Consequently, not generation part perk etc.
(2) beam intensity
Also can utilize 2 laser irradiation device 467a, 467b shown in Fig. 4, irradiate as shown in Figure 92 laser beam LBa, LBb simultaneously, and make the intensity of laser beam Lba be greater than the intensity of laser beam LBb.More specifically, 1 laser irradiation device 467a is irradiated to inferior position electrode 100a and pad 103a by the laser beam Lba with intensity Wa.Meanwhile, another laser irradiation device 467b is irradiated to advantage electrode 100b and pad 103b by the laser beam LBb with intensity Wb (Wa > Wb).
Because the intensity Wa of laser beam Lba is greater than the intensity Wb of laser beam LBb, the scolding tin 104a of inferior position electrode 100a side is than the more Zao melting of scolding tin 104b of advantage electrode 100b side.Consequently, with above-mentioned similarly not generation part perk etc.
(3) irradiation sequence
Similarly, also can utilize 2 laser irradiation device 467a, 467b to start successively the irradiation of laser beam LBa, LBb.More specifically, 1 laser irradiation device 467a starts the irradiation to the laser beam LBa of inferior position electrode 100a and pad 103a constantly at t1.Another laser irradiation device 467b starts the irradiation to the laser beam LBb of advantage electrode 100b and pad 103b constantly at t2, and t2 is constantly constantly late than t1.
Laser beam LBa first irradiates compared with laser beam LBb, so inferior position electrode 100a side obtains scolding tin 104a than the more Zao melting of scolding tin 104b of advantage electrode 100b side.Consequently, with above-mentioned similarly not generation part perk etc.
(the vertical skew of scolding tin)
In Figure 10 A, there is not skew and put on printed wiring board 107 in surface mounting assembly 100.Scolding tin 104a, 104b do not occur to be offset and to be printed on pad 103a, 103b yet.In this case, judge not generation part perk etc.
In Figure 10 B, scolding tin 104a, the 104b right side from pad 103a, 103b to figure is offset and is printed.But surface mounting assembly 100 is not put on printed wiring board 107 from pad 103a, 103b skew quilt.
Distance in Figure 10 B is identical with Figure 10 A than a/b and a '/b '.But when scolding tin 104b starts melting, surface mounting assembly 100 be take the rotation of the clockwise direction of fulcrum P in axial view.Therefore,, when the skew of scolding tin is greater than predetermined value, welder 50 judgement is by generation part perk etc.When observing the skew of scolding tin and be greater than predetermined value, judgement electrode 100b is advantage electrode, and the electrode 100a that judges its opposition side is inferior position electrode.
According to above-mentioned, derive 2 rules below.
(1) when surface mounting assembly more than direction skew preset distance is put to certain, the electrode of the direction side of its skew becomes inferior position electrode.
(2), when scolding tin is printed above to certain direction skew preset distance, become inferior position electrode with the electrode of the opposite direction direction side of its skew.
Consider at least one in above-mentioned (1) and (2), welder 50 is determined the illuminating method of laser beam.
In Figure 11 A, surface mounting assembly 100 is put on printed wiring board 107 to right side skew the quilt in figure.Scolding tin 104a, 104b also from pad 103a, 103b to figure right side be offset and be printed.In this case, do not exist apart from a completely, on the other hand, have fully apart from a ', so surface mounting assembly 100 take fulcrum P as axle is in the drawings to counterclockwise rotation, and wants to float.Therefore, electrode 100a is judged as to advantage electrode, electrode 100b is judged as to inferior position electrode.
In Figure 11 B, surface mounting assembly 100 is put on printed wiring board 107 to left side skew the quilt in figure.Scolding tin 104a, the 104b right side from pad 103a, 103b to figure is offset and is printed.In this case, do not exist apart from a ' completely, on the other hand, have fully apart from a, so surface mounting assembly 100 take fulcrum P as axle is in the drawings to clockwise direction rotation, and wants to float.Therefore, electrode 100b is judged as to advantage electrode, electrode 100a is judged as to inferior position electrode.
(rotation offset of surface mounting assembly and scolding tin)
In Figure 12 A, surface mounting assembly 100 not skew is also put on printed wiring board 107.Scolding tin 104a, 104b are not also offset and are printed on pad.In this case, be judged as not generation part skew.
In Figure 12 B, scolding tin 104a, 104b are not offset and are printed from pad.But, surface mounting assembly 100 counter clockwise direction deviation angle θ from pad (be arranged in scolding tin 104a, 104b under) to figure being put in the surface of printed wiring board 107.In this case, surface mounting assembly 100 is wanted to the clockwise direction rotation in figure on the surface of printed wiring board 107.Therefore, electrode 100b is judged as to advantage electrode, electrode 100a is judged as to inferior position electrode.
In Figure 12 C, counter clockwise direction deviation angle θ from pad 103a, from 103b to figure of scolding tin 104a, 104b is also printed.Surface mounting assembly 100 is also offset identical angle θ and is put to the direction identical with scolding tin 104a, 104b.In this case, surface mounting assembly 100 is wanted to the clockwise direction rotation in figure on the surface of printed wiring board 107.Therefore, electrode 100b is judged as to advantage electrode, electrode 100a is judged as to inferior position electrode.
In Figure 12 D, clockwise drift angle θ from pad 103a, from 103b to figure of scolding tin 104a, 104b is also printed.Surface mounting assembly 100 is to the direction deviation angle θ contrary with scolding tin 104a, 104b and put.In this case, surface mounting assembly 100 is wanted to the clockwise direction rotation in figure on the surface of printed wiring board 107.Therefore, electrode 100b is judged as to advantage electrode, electrode 100a is judged as to inferior position electrode.
(earthy pad)
The size of above-mentioned pad 103a, 103b is almost identical.But as shown in FIG. 13A, earthy pad 103g is greater than common pad 103a.As shown in Figure 13 B, scolding tin anticorrosion layer 105 is applied on printed wiring board, and common pad 103a is exposed as pad 103b by a part of its former state exposure and earthy pad 103g.Solder printing machine 20 as shown in Figure 1 prints exposing scolding tin and stick with paste on pad 103a, the 103b of 104a, 104b shown in Figure 13 C.Finally, as shown in Figure 13 D, surface mounting apparatus 40A, 40B by surface mounting assembly 100 put pad 103a, 103b (be positioned at scolding tin stick with paste 104a, 104b under and not shown) on.
When for make pad 103a, 103b scolding tin melting and by laser beam irradiation to it on time, conduct heat shown in the arrow in Figure 14.The area of the earthy pad 103g that comprises pad 103b is greater than the area of common pad 103a, and the heat of pad 103b is around dispersed to it rapidly.On the other hand, the heat of pad 103a is difficult to disperse.
Figure 15 A illustrates the relation between the output of laser and the variations in temperature of common pad 103a.Figure 15 B illustrates the output of laser and as the variations in temperature of the pad 103b of a part of earthy pad 103g.Transverse axis represents the time, and the longitudinal axis represents the output of laser and the temperature of pad.
In any in Figure 15 A and Figure 15 B, during illuminating laser beam, the temperature of pad rises.After the irradiation of laser beam finishes, the temperature of pad declines.But because the area of earthy pad 103g is greater than the area of common pad 103a, therefore earthy pad 103g is not easy heating easily cooling than common pad 103b.Therefore the electrode that, puts the surface mounting assembly on earthy pad 103g becomes inferior position electrode.
(effect of execution mode)
Above, according to a preferred embodiment of the invention, the skew of position based on surface mounting assembly and scolding tin, determines in reflow process the surface mounting assembly of easily generation part perk etc., and, determine its inferior position electrode.And by this feedforward of information (feedforward) to reflow process, utilize appropriate method illuminating laser beam, so that not generation part perk etc. in reflow process.Due to the early melting of molten tin of inferior position electrode side, large thereby the adhesive force of inferior position electrode early becomes, therefore can prevent that inferior position electrode from departing from from pad.Consequently, the printed wiring board of surface mounting assembly can be installed with high finished product rate manufacture.
(other execution modes)
Also can control according to size of the fusing point of scolding tin or amount, pad etc. sweep speed (translational speed) or the power of laser beam.Replace semiconductor laser, also can use for example xenon lamp, infrared lamp, carbon dioxide laser, Solid State Laser.
Above, embodiments of the present invention have been described.But above-mentioned execution mode is just for implementing illustration of the present invention.Therefore, the invention is not restricted to above-mentioned execution mode, in the scope that does not depart from its basic thought, can carry out suitable distortion to above-mentioned execution mode.
Claims (8)
1. a manufacture method for the printed wiring board of surface mounting assembly is installed, wherein,
Described surface mounting assembly comprises a plurality of electrodes,
Described printed wiring board has a plurality of pads, and described a plurality of pads and described a plurality of electrode arrange accordingly, and each in described a plurality of pad should be respectively and corresponding electrode welding,
Described manufacture method comprises the following steps:
On described printed wiring board, be coated with scolding tin,
After the described scolding tin of coating, described surface mounting assembly is put on described printed wiring board,
Determine the electrode that electrode that the surface tension due to molten tin causes and the adhesive force between pad are less than the adhesive force between other electrodes and pad,
Illumination beam, makes the scolding tin of the described electrode side of being determined than the more Zao melting of the scolding tin of other electrode sides,
Described manufacture method is further comprising the steps of: the position with respect to described pad is offset with respect to the position skew of described pad and/or the electrode of the described surface mounting assembly being put to observe described applied scolding tin,
And, described, carry out in definite step, according to the position of described observation, be offset the electrode of determining that described adhesive force is little.
2. a manufacture method for the printed wiring board of surface mounting assembly is installed, wherein,
Described surface mounting assembly comprises a plurality of electrodes,
Described printed wiring board has a plurality of pads, and described a plurality of pads and described a plurality of electrode arrange accordingly, and each in described a plurality of pad should be respectively and corresponding electrode welding,
Described manufacture method comprises the following steps:
On described printed wiring board, be coated with scolding tin,
After the described scolding tin of coating, described surface mounting assembly is put on described printed wiring board,
Determine the electrode that electrode that the surface tension due to molten tin causes and the adhesive force between pad are less than the adhesive force between other electrodes and pad,
Illumination beam, makes the scolding tin of the described electrode side of being determined than the more Zao melting of the scolding tin of other electrode sides,
Described a plurality of pad comprises:
The 1st pad; And
The 2nd pad, described the 2nd pad is broader than described the 1st pad,
And, described, carry out in definite step, the electrode corresponding with described the 2nd pad is defined as to the electrode that described adhesive force is little.
3. manufacture method as claimed in claim 1, wherein,
The step of described illumination beam comprises the following steps:
The 1st, start the electrode illumination beam of being determined described constantly,
The 2nd, constantly start other electrode illumination beams, the wherein said the 2nd is constantly constantly late than the 1st.
4. manufacture method as claimed in claim 2, wherein,
The light beam that is irradiated to the described electrode of being determined and other electrodes generates by single irradiation unit,
Described manufacture method is further comprising the steps of: control described single irradiation unit, so that described light beam moves to other electrodes from the described electrode of being determined.
5. manufacture method as claimed in claim 2, wherein,
The light beam that is irradiated to the described electrode of being determined generates by the 1st irradiation unit,
The light beam that is irradiated to other electrodes generates by the 2nd irradiation unit different from described the 1st irradiation unit.
6. manufacture method as claimed in claim 1, wherein,
The step of described illumination beam comprises the following steps:
To the described electrode of being determined with the 1st intensity illumination beam,
To other electrodes, with the 2nd intensity illumination beam, described the 2nd intensity is less than described the 1st intensity.
7. surface mounting assembly is welded to a welder for printed wiring board, wherein
Described surface mounting assembly comprises a plurality of electrodes,
Described printed wiring board has a plurality of pads, described a plurality of pad arrange accordingly with described a plurality of electrodes and described a plurality of pad in each should be respectively and corresponding electrode welding, on described printed wiring board, be coated with scolding tin, described surface mounting assembly is put on described printed wiring board
Described welder comprises:
Position skew observation unit, it observes described applied scolding tin, and with respect to the position skew of described pad and/or the electrode of the described surface mounting assembly being put, the position with respect to described pad is offset;
Receiving element, it receives for determining because molten tin obtains the information that electrode that surface tension causes and the adhesive force between pad are less than the electrode of the adhesive force between other electrodes and pad; And
Illumination unit, its illumination beam, makes the information by being received by described receiving element come the scolding tin of definite electrode side than the more Zao melting of the scolding tin of other electrode sides,
Described receiving element is offset according to the position of observing by described position skew observation unit the electrode of determining that described adhesive force is little.
8. surface mounting assembly is welded to a welder for printed wiring board, wherein
Described surface mounting assembly comprises a plurality of electrodes,
Described printed wiring board has a plurality of pads, described a plurality of pad arrange accordingly with described a plurality of electrodes and described a plurality of pad in each should be respectively and corresponding electrode welding, on described printed wiring board, be coated with scolding tin, described surface mounting assembly is put on described printed wiring board
Described welder comprises:
Receiving element, it receives for determining because molten tin obtains the information that electrode that surface tension causes and the adhesive force between pad are less than the electrode of the adhesive force between other electrodes and pad; And
Illumination unit, its illumination beam, makes the information by being received by described receiving element come the scolding tin of definite electrode side than the more Zao melting of the scolding tin of other electrode sides,
Described a plurality of pad comprises:
The 1st pad; And
The 2nd pad, described the 2nd pad is broader than described the 1st pad,
And described receiving element, is defined as by the electrode corresponding with described the 2nd pad the electrode that described adhesive force is little.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-206896 | 2008-08-11 | ||
| JP2008206896 | 2008-08-11 | ||
| PCT/JP2009/003821 WO2010018679A1 (en) | 2008-08-11 | 2009-08-07 | Method of manufacturing printed wiring board with surface-mount component mounted thereon |
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| Publication Number | Publication Date |
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| CN102119587A CN102119587A (en) | 2011-07-06 |
| CN102119587B true CN102119587B (en) | 2014-10-08 |
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| CN200980131288.3A Active CN102119587B (en) | 2008-08-11 | 2009-08-07 | Method of manufacturing printed wiring board with surface-mount component mounted thereon |
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| Country | Link |
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| JP (1) | JP4575526B2 (en) |
| KR (1) | KR101163003B1 (en) |
| CN (1) | CN102119587B (en) |
| WO (1) | WO2010018679A1 (en) |
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| JP2012015477A (en) * | 2010-05-31 | 2012-01-19 | Tosei Electro Beam Kk | Laser soldering device |
| JP5760641B2 (en) * | 2011-04-22 | 2015-08-12 | カシオ計算機株式会社 | Component mounting method and board |
| US9768509B2 (en) * | 2013-08-09 | 2017-09-19 | Sumida Corporation | Antenna coil component, antenna unit, and method of manufacturing the antenna coil component |
| JP6528625B2 (en) * | 2015-09-29 | 2019-06-12 | 日本電気株式会社 | Component mounting apparatus, component mounting method and program. |
| JP6785650B2 (en) * | 2016-12-28 | 2020-11-18 | アズビル株式会社 | Component mounting device and component mounting method |
| JPWO2022091290A1 (en) * | 2020-10-29 | 2022-05-05 | ||
| EP4346341A1 (en) * | 2022-09-29 | 2024-04-03 | Infineon Technologies AG | Method for forming a power semiconductor module arrangement |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324424A (en) * | 2005-05-18 | 2006-11-30 | Omron Corp | Main cause of failure analyzing system |
| JP2008166489A (en) * | 2006-12-28 | 2008-07-17 | I-Pulse Co Ltd | Laser reflow apparatus |
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- 2009-08-07 CN CN200980131288.3A patent/CN102119587B/en active Active
- 2009-08-07 JP JP2010524291A patent/JP4575526B2/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324424A (en) * | 2005-05-18 | 2006-11-30 | Omron Corp | Main cause of failure analyzing system |
| JP2008166489A (en) * | 2006-12-28 | 2008-07-17 | I-Pulse Co Ltd | Laser reflow apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101163003B1 (en) | 2012-07-09 |
| JPWO2010018679A1 (en) | 2012-01-26 |
| WO2010018679A1 (en) | 2010-02-18 |
| JP4575526B2 (en) | 2010-11-04 |
| KR20100126596A (en) | 2010-12-01 |
| CN102119587A (en) | 2011-07-06 |
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