CN102118140A - Multi-variant united-row composite substrate, frequency device group and manufacturing method thereof - Google Patents
Multi-variant united-row composite substrate, frequency device group and manufacturing method thereof Download PDFInfo
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- CN102118140A CN102118140A CN2010101584685A CN201010158468A CN102118140A CN 102118140 A CN102118140 A CN 102118140A CN 2010101584685 A CN2010101584685 A CN 2010101584685A CN 201010158468 A CN201010158468 A CN 201010158468A CN 102118140 A CN102118140 A CN 102118140A
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Abstract
The invention relates to a substrate used for packaging a piece-type frequency device and a manufacturing method thereof. A multi-variant united-row composite substrate comprises a composite substrate with m*n concave pits; frequency pieces of the frequency device are placed in the concave pits; the composite substrate is formed by compositing an upper substrate and a lower substrate; the upper substrate is a porous substrate which is provided with m rows*n lines through holes in rectangular arrangement, wherein m is greater than 1 and n is greater than or equal to 1; the lower substrate is formed by horizontally bonding n rows of base strips with m depressions; one surface, provided with the depressions, of each row of the base strip is an inside surface and is provided with an inner electrode; the other surface is an outside surface and is provided with an outer electrode which is connected with the inner electrode; and the length of each depression is less than that of each frequency piece for supporting the frequency piece. A required packaging body is formed by assembling the frequency pieces, modulating frequency and covering, vacuum-heating and packaging; and a required single frequency device is formed after cutting. The substrate improves reliability, reduces cost, improves efficiency and completely meets a requirement on further miniaturization of the frequency devices.
Description
Technical field
The present invention relates to frequency device, be specifically related to be used to substrate that encapsulates the chip frequency device and preparation method thereof.
Background technology
At present, the chip frequency device is widely used in the every field of communication, audiovisual and automation control, relates to the every aspect of human being's production, life.But some core technologies extra small, ultra-thin, the employed encapsulation base of the surface-pasted frequency device of high reliability that are used for as everyone knows on mobile phone, notebook computer and the high accuracy electronic products such as other controlled in wireless and data transmission system are grasped abroad always.Though domestic spending huge sums introduced the production line and the correlation technique of many external chip frequency devices, but key components and parts still relies on limited external major companies of several families such as KYOCERA, Sumitomo, cause pedestal procurement price height, the pedestal cost has occupied more than 50% of whole manufacturing cost.
The used packing component of the chip frequency device of occuping market more than 99% all is that individual unit-promptly a base of ceramic is joined a metal or ceramic cover plate composition one cover packing component at present.In assembling encapsulation processs such as frequency chip assembling, frequency modulation, block, need high location technology thereafter: generic point glue, last slice and the performance accuracy of operation such as block require to be controlled at ± 0.1mm in, so many operations all will rely on CCD to assist camera positioning, camera positioning once, assemble one, also to customize high-precision metal form simultaneously, unit frequency device one by one is placed on the spacing unanimity that guarantees in the template pit between the unit frequency device.
Existing fairly simple manufacture method efficiently has the sheet type quartz crystal frequency device and the manufacture method thereof of CN1780141 monolithic sheet style quartz crystal frequency device and manufacture method and CN1015941 ceramic packaging, the both discloses the multiple unit assembling of m*n array, encapsulation technology, by being divided into the manufacture method of unit component after the encapsulation of sheet assembling frequency modulation again, improved production efficiency, reduced production cost, adopted the anti-overflow pit simultaneously, the electrode pit, measures such as the arc chamfering of termination seamed edge improve reliability, but technique scheme still has three defectives and deficiency:
1. there is the hidden danger of aspects such as reliability in the conducting of internal and external electrode in the technique scheme.The internal and external electrode conducting is to encapsulate and cut into unit product at sheet to adopt the method for vacuum evaporation or sputter to make its internal and external electrode conducting at the cutting end face coating of single product later in the technique scheme.Minimum because of its thickness of the formed metallic film of metal deposition, adhesive force is also poor.Therefore in the moist oxidation of high temperature or be subjected under the external force condition, easily come off or open circuit, cause the internal and external electrode connection unreliable, reduced product reliability.
2, in the large stretch of assembling process of multiple unit because before being divided into unit product, internal and external electrode is not conducting as yet, its middle frequency difference is adjusted in the operation, electrode was achieved in instant measuring frequency was used, but existing vernier device all is to use external electrode to carry out frequency measurement, if it is high but also owing to increase conductor length that existing equipment is transformed not only expense, introduced distributed constant, thereby will certainly the frequency of loss certainty of measurement influence the frequency difference precision.
3, the pit of m*n array obtains by the sandblast of special tooling anchor clamps pad pasting, its relative size precision (pitch of holes) generally can control to ± 0.05mm ~ ± 0.10mm about, but along with the further miniaturization of product, its quality of fit requires more and more higher, uses above-mentioned technology just to have certain limitation.
In addition, CN101388654 discloses a kind of frequency device of full quartz packaged; The scheme that can adopt big chip is disclosed equally, but with the aforesaid technical scheme of mentioning be identical in essence, therefore, face similar problem equally.
Summary of the invention
The present invention is intended to solve the above-mentioned defective of prior art, and a kind of polynary townhouse composite base plate of chip frequency device packaging body is provided.The present invention not only meets the versatility instructions for use of subsequent handling, and the conducting of electrode is more convenient reliable, has further satisfied the requirement of product miniaturization development.
For solving the problems of the technologies described above, a kind of polynary townhouse composite base plate, it comprises a composite base plate that has m*n pit, placement frequency sheet in the pit, described composite base plate is composited by two-layer substrate up and down, wherein top substrate layer is to have the porous substrate that the capable * n of m row are the through hole of arranged, m＞1 wherein, n 〉=1; Following laminar substrate is bonding the forming of basic bar level that is had m depression by n row, each basic bar has depression one side for inboard and be provided with interior electrode, another side be the outside be provided with external electrode and and interior electrode conduction, described depression length less than the length of frequency chip to support frequency chip.
Described polynary townhouse composite base plate, described top substrate layer comprise the longitudinal strip plate that m+1 be arranged in parallel and are arranged on n+1 strip short slab between the longitudinal strip plate, thereby the two ends of strip short slab are connected m*n through hole of formation with the longitudinal strip plate.
Described polynary townhouse composite base plate, described top substrate layer through hole internal diameter size precision reaches ± 0.01mm, laterally, radial hole spacing precision reaches≤± 0.02mm.
Described polynary townhouse composite base plate, the both sides end face of the basic bar level bonding direction of described laminar substrate down is provided with n group or n+1 group and depression corresponding groove, electrode and external electrode in the two sides of described basic bar is respectively equipped with are printed with conduction electrode with the internal and external electrode conducting in the groove.
The preparation method of described polynary townhouse composite base plate, it comprises the following steps:
Step 1:
A. according to the frequency device dimensional requirement, make the alignment pin of the substrate of the precision≤0.01mm of one group of relative dimensions, one group of strip plate and one group of homogeneous material;
B. place a slice aforesaid substrate in the horizontal direction, the bonding m of right-angled intersection strip plate that processes on substrate placed an alignment pin that processes between two adjacent strip plates, and second horizontal base plate that bond, and repeats n time;
C. the multilager base plate of the right-angled intersection complex superposition that will form through b bonding carries out the heating in vacuum cure under pressure, with adhesion strength and the seal of guaranteeing adhesive surface, solidifies the back and takes out alignment pin, forms a compound matrix with m*n hole;
D. with the compound matrix of the porous that is cured,, be processed into the top substrate layer with m*n through hole of different-thickness by cutting and grinding according to the different requirements of frequency device;
A. process a matrix, its gauge is determined for the frequency device length dimension adds cutter seam size, thickness and precision reaches ± 0.005mm by plane lapping, its width dimensions is the size that n frequency device width adds n+1 cutter seam, cut out n group or the n+1 group conductive trough corresponding in the matrix both side surface, and the type metal electrode is fired in advance also in conductive trough with depression;
B. the matrix that bakes is carried out level and cut apart, the length of cutting apart the basic bar of formation is that n frequency device width adds n+1 cutter seam size sum, and width adds the width that a cutter stitches for the single frequency device length, and substrate is machined to required thickness;
C. print layer protecting film on above-mentioned basic bar, the mode by sandblast forms n depression;
D. it is stand-by to print required interior electrode and external electrode and sintering respectively at basic bar upside and downside;
E. the basic bar horizontal direction that m row is provided with n pit and n group internal and external electrode is bonded to down laminar substrate;
Step 3:
Stack and step 1 are made on the following laminar substrate that step 2 obtains top substrate layer bonding and heating in vacuum cure under pressure with m*n through hole form polynary townhouse composite base plate.
The polynary townhouse frequency device group that described arbitrary polynary townhouse composite base plate is made, described frequency device group comprises that also a loam cake composite base plate on the laminar substrate that is incumbent on is to seal frequency chip, the inboard of described loam cake composite base plate is provided with the individual size in length and breadth of the capable * n row of m greater than the last pit of composite base plate pit, forms a loam cake composite base plate that latticed solid-state adhesion agent layer is arranged thereby be coated with solid-state solid around the last pit.
Described frequency device group, described frequency chip is fixed on by conducting resinl in the pit of described composite base plate, and described loam cake composite base plate forms a polynary townhouse frequency device group that is made of the capable * n row of a m frequency device with the composite base plate heating in vacuum pressurization bonding that the capable * n row of a m frequency chip is housed.
The frequency device that described frequency device group is made, described frequency device forms m*n discrete frequency device by described polynary townhouse frequency device group through vertically reaching transverse cuts, wherein the loam cake composite base plate becomes the upper cover plate of discrete frequency device, and the composite base plate that is made of two-layer substrate up and down becomes the pedestal of discrete frequency device.
Described frequency device, the end face of described frequency device is neat, upper cover plate and fully coincidence consistent with the pedestal size; When m＞1, during n=1, then have at least the pair of parallel end face to form through cutting, end face overlaps fully, and promptly upper cover plate is consistent with pedestal length or width dimensions and overlap.
The present invention will mainly be under the prerequisite that sheet is produced, the structure of the middle splint of easy processing is provided, and set in advance conduction electrode for the conducting of internal and external electrode, simultaneously with middle splint and bottom plate combined being bonded together, and scribble solid-state solid on the upper cover plate, can be bonding in the heat top substrate layer depressed with composite base plate of vacuum, when producing, a class frequency sheet is assemblied in the pit of composite base plate, through making polynary townhouse frequency device group after frequency difference adjustment, the encapsulation; At last the polynary townhouse packaging body of sheet being cut into single frequency device gets final product.
This shows, because the present invention has adopted unique structure design, utilize multilayer right-angled intersection bonding and location technology and townhouse composite methods, make the internal and external electrode of each individual unit realize conducting, not only improve reliability, and reduced the cut surface end face evaporization process in original technology, reduced cost, improved efficient, and the multiunit assembling of this large stretch of townhouse, encapsulation technology in industry can have been promoted.Because 30-300 frequency device once can be assembled in the location, can improve the work efficiency of expensive device greatly.Thereby part substitutes the import packing component.The pore size in its each unit and the dimensional accuracy of pitch of holes have all reached high level simultaneously, meet the requirement of the further miniaturization of frequency device fully.
Description of drawings
The present invention is described in further detail below in conjunction with drawings and embodiments:
Fig. 1 a to Fig. 1 f is the manufacturing process schematic diagram of the top substrate layer of composite base plate;
Fig. 2 a to Fig. 2 f is the manufacturing process schematic diagram of the following laminar substrate of composite base plate;
Fig. 3 a is upper and lower laminar substrate recombination process schematic diagram;
Fig. 3 b is the cutaway view of composite base plate of the present invention;
Fig. 4 is described loam cake composite plate schematic diagram;
Fig. 5 is the schematic diagram of described polynary townhouse frequency device group;
Fig. 6 a is described discrete frequency device schematic diagram;
Fig. 6 b is described discrete frequency device cutaway view.
Embodiment
Please see Figure 2c-Fig. 2 e, Fig. 3 a and Fig. 3 b are simultaneously in conjunction with Fig. 6 b, from scheming as seen, a kind of polynary townhouse composite base plate, it is a composite base plate that has m*n pit 31, the frequency chip 51 of described frequency device is as in the pit 31, described composite base plate is composited by two- layer substrate 1,2 up and down, wherein top substrate layer 1 is to have the porous substrate that the capable * n of m row are the through hole 14 of arranged, m＞1 wherein, n 〉=1; Following laminar substrate 2 is to arrange the little substrate 201 that has m depression 24 by n to form by the level bonding, and the through hole 14 of described depression 23 and top substrate layer 1 is configured to hold the pit 31 of frequency chip 51 together jointly; The little substrate 201 of described every row have depression 24 one sides for inboard and be provided with in electrode 23, another side is that the outside is provided with external electrode 22, form, both sides end face in its level bonding direction is provided with n group or the n+1 group and the 24 corresponding slot electrodes 21 that cave in, and is printed with conduction electrode in the slot electrode 21 with internal and external electrode 23,22 conductings.Described depression 24 length less than the length of frequency chip 51 to support frequency chip 51.
Now please see Figure 1-f, described upper strata composite base plate 1 comprises the longitudinal strip plate 111 that m+1 be arranged in parallel and is arranged on the individual strip short slab 121 of m* (n+1) between the longitudinal strip plate 111, thereby the two ends of strip short slab 121 are connected m*n through hole 14 of formation with longitudinal strip plate 111.
Described upper strata composite base plate 1 through hole 14 internal diameter size precision reach ± 0.01mm, laterally, radial hole spacing precision reach to≤± 0.02mm.
Please see Figure 1-a to Fig. 3-b, the preparation method of described arbitrary multiple unit townhouse composite base plate comprises,
Step: (referring to Fig. 1-a to Fig. 1-f)
A. according to the frequency device dimensional requirement, make the alignment pin 13 of the substrate 11 of the precision≤0.01mm of one group of relative dimensions, one group of strip plate 12 and one group of homogeneous material;
B. place a slice aforesaid substrate 11 in the horizontal direction, between 12, two adjacent strip plates 12 of strip plate that the bonding m row of right-angled intersection on the substrate 11 processes, place an alignment pin that processes 13, and second horizontal base plate 11 that bond, repeat n time;
C. the multilager base plate of the right-angled intersection complex superposition that will form through step b bonding carries out the heating in vacuum cure under pressure, with adhesion strength and the seal of guaranteeing adhesive surface, solidifies the back and takes out alignment pin 13, forms a compound matrix with m*n hole;
D. with the compound matrix of the porous that is cured,, become the top substrate layer with m*n array through hole 14 1 of different-thickness by cutting, attrition process according to the different requirements of frequency device;
A. process a matrix 20, its gauge is determined for the frequency device length dimension adds cutter seam size, thickness and precision reaches ± 0.005mm by plane lapping, its width dimensions is the size that n frequency device width adds n+1 cutter seam, cut out n group or n+1 group slot electrode 21 in substrate 20 both side surface, and the type metal electrode is fired in advance also in slot electrode 21;
The matrix 20 that b. will bake electrode carries out level cuts apart the basic bar 201 of formation, the length of the basic bar 201 after cutting apart is that n frequency device width adds n+1 cutter seam size sum, width adds the width that a cutter stitches for the single frequency device length, and basic bar 201 is machined to required thickness;
C. print layer protecting film on above-mentioned basic bar 201, the mode by sandblast forms n depression 24;
D. print required interior electrode 23 and external electrode 22 and sintering respectively at basic bar 201 upsides and downside;
E. the basic bar 201 that the m row who forms behind the d sintering is provided with n pit and n group internal and external electrode 23,22 is bonded to down laminar substrate 2 by horizontal direction;
Step 3:
Top substrate layer with m*n array through hole 1 compoiste adhering and the heating in vacuum cure under pressure made in the following laminar substrate 2 of the acquisition of step 2 and step 1 form polynary townhouse composite base plate 3.(see Fig. 3-b)
Shown in Fig. 4, Fig. 5,6-a, Fig. 6-b, the frequency device group that described arbitrary chip frequency device is made of polynary townhouse composite base plate, it comprises that also a loam cake composite plate 4 (referring to Fig. 4) on the laminar substrate 1 that is incumbent on is to seal frequency chip 51, the inboard of described loam cake composite base plate 4 is provided with the individual size in length and breadth of the capable * n row of m greater than the last pit 41 of composite base plate pit, forms a loam cake composite base plate 4 that latticed solid-state adhesion agent layer is arranged thereby be coated with solid-state solid 42 around the last pit 41.
Form m*n discrete frequency device 7 by described polynary townhouse frequency device group through vertically reaching transverse cuts, wherein loam cake composite plate 4 becomes the upper cover plate of discrete frequency device 7, and the composite base plate that is made of two- layer substrate 1,2 up and down becomes the pedestal of discrete frequency device 7.
The end face of described frequency device 7 is neat, upper cover plate and fully coincidence consistent with the pedestal size; When m＞1, during n=1, then have at least the pair of parallel end face to form through cutting, end face overlaps fully, and promptly upper cover plate is consistent with pedestal length or width dimensions and overlap.
The present invention will mainly be under the prerequisite that sheet is produced, the structure of the middle splint of easy processing is provided, and set in advance conduction electrode for the conducting of internal and external electrode, simultaneously with middle splint and bottom plate combined being bonded together, and scribble solid-state solid on the loam cake composite plate 4, can heat depress with composite base plate in top substrate layer 1 bonding, form airtight packaging body, when producing frequency device, only need a class frequency sheet is put into composite base plate 3, through the frequency difference adjustment, make polynary townhouse frequency device group after the encapsulation, at last the polynary townhouse frequency device group of sheet is cut into single frequency device 7 and get final product.
Nature, technical scheme of the present invention can also make up with the measures such as circular arc chamfering of anti-overflow pit, seamed edge and further improve integrity problem, but consider from succinct angle, do not repeat them here.
Those skilled in the art should be understood that above-mentioned embodiment only is used for illustrating the present invention, and should not be considered as the qualification to claim.
Such as, the top plate that has m*n through hole 1 of composite base plate 3 of the present invention and the lower plywood 2 that bonds by horizontal townhouse, also can be respectively by the whole porcelain substrate that has the m*n through hole of form shown in Fig. 3-a, and the whole porcelain substrate that has the individual electrode conduction of m* (n+1) hole substitutes.Its preparation method generally can be under the precision controlled condition, on the ceramic membrane that The tape casting makes, stamp out the diaphragm that has m*n through hole or little conductive through hole that meets dimensional requirement, make by laminating sintering, plane lapping or being aided with processes such as laser cutting.
Again, the townhouse substrate 2 of lower floor's level bonding of described composite base plate 3 can also be substituted by following various schemes:
The fulcrum that can make projection in the relevant position of planar substrates 2 supports frequency chip to substitute depression, and salient point can be achieved with printing glass paste and sintering.
The internal and external electrode conducting of described townhouse substrate 2 also can adopt the method for vacuum sputtering to realize and need not be in its side prefabricated conduction groove 21.The internal and external electrode conducting of townhouse substrate 2 also can be adopted the method conducting of side printing sintered electrode.Its method is the required product width for the width that makes substrate 201 in advance, passes through corresponding positioning fixture after inside and outside and side conduction electrode are finished in preparation when level splice, and the spacing of two adjacent substrate is stitched greater than cutter, and with top substrate layer 1 compound getting final product.
Various alternate embodiments that disclose above and the similar techniques scheme that does not have announcement; in the connotation scope of the technical scheme of claim of the present invention, be out of shape, replaced, all will be fallen in the protection range that the application's claim asks.
Claims (9)
1. polynary townhouse composite base plate, it comprises a composite base plate that has m*n pit, the frequency chip of placement frequency device in the pit, it is characterized in that, described composite base plate is composited by two-layer substrate up and down, wherein top substrate layer is to have the porous substrate that the capable * n of m row are the through hole of arranged, m＞1 wherein, n 〉=1; Following laminar substrate is bonding the forming of basic bar level that is had m depression by n row, the basic bar of every row has depression one side for inboard and be provided with interior electrode, another side be the outside be provided with external electrode and and interior electrode conduction, described depression length less than the length of frequency chip to support frequency chip.
2. polynary townhouse composite base plate according to claim 1, it is characterized in that, described top substrate layer comprises the longitudinal strip plate that m+1 be arranged in parallel and is arranged on n+1 strip short slab between the longitudinal strip plate, thereby the two ends of strip short slab are connected m*n through hole of formation with the longitudinal strip plate.
3. polynary townhouse composite base plate according to claim 1 and 2 is characterized in that, described top substrate layer through hole internal diameter size precision reaches ± 0.01mm, laterally, radial hole spacing precision reaches≤± 0.02mm.
4. polynary townhouse composite base plate according to claim 1, it is characterized in that, the both sides end face of described lower floor level of base plate bonding direction is provided with n group or n+1 group and depression corresponding groove, electrode and external electrode in the two sides of described strip plate is respectively equipped with are printed with conduction electrode with the internal and external electrode conducting in the groove.
5. according to the preparation method of claim 1,2 or 4 described polynary townhouse composite base plates, it is characterized in that it comprises the following steps:
Step 1:
A. according to the frequency device dimensional requirement, make the alignment pin of the substrate of the precision≤0.01mm of one group of relative dimensions, one group of strip plate and one group of homogeneous material;
B. place a slice aforesaid substrate in the horizontal direction, the strip plate that the bonding m row of right-angled intersection processes on substrate is placed an alignment pin that processes between adjacent two strip plates, and second horizontal base plate that bond, and repeats n time;
C. the multilager base plate of the right-angled intersection complex superposition that will form through b bonding carries out the heating in vacuum cure under pressure, with adhesion strength and the seal of guaranteeing adhesive surface, solidifies the back and takes out alignment pin, forms a compound matrix with m*n hole;
D. with the compound matrix of the porous that is cured,, be processed into the top substrate layer with m*n through hole of different-thickness by cutting and grinding according to the different requirements of frequency device;
Step 2
A. process a matrix, its gauge is determined for the frequency device length dimension adds cutter seam size, thickness and precision reaches ± 0.005mm by plane lapping, its width dimensions is the size that n frequency device width adds n+1 cutter seam, cut out n group or the n+1 group conductive trough corresponding in the matrix both side surface, and the type metal electrode is fired in advance also in conductive trough with depression;
The matrix that b. will bake electrode carries out level to be cut apart, and the length of cutting apart the basic bar of formation is that n frequency device width adds n+1 cutter seam size sum, and width adds the width that a cutter stitches for the single frequency device length, and substrate is machined to required thickness;
C. print layer protecting film on above-mentioned basic bar, the mode by sandblast forms n depression;
D. print required interior electrode and external electrode respectively and sinter the strip plate into stand-by at basic bar upside and downside;
E. the basic bar that m row is provided with n pit and n group internal and external electrode is bonded to down laminar substrate by horizontal direction;
Step 3:
Stack and step 1 are made on the following laminar substrate that step 2 obtains top substrate layer bonding and heating in vacuum cure under pressure with m*n through hole form polynary townhouse composite base plate.
6. polynary townhouse frequency device group that adopts claim 1,2 or 4 described arbitrary polynary townhouse composite base plates to make, it is characterized in that, described frequency device group comprises that also a loam cake composite base plate on the laminar substrate that is incumbent on is to seal frequency chip, the inboard of described loam cake composite base plate is provided with the individual size in length and breadth of the capable * n row of m greater than the last pit of composite base plate pit, forms a loam cake composite base plate that latticed solid-state adhesion agent layer is arranged thereby be coated with solid-state solid around the last pit.
7. polynary townhouse frequency device group according to claim 6, it is characterized in that, described frequency chip is fixed on by conducting resinl in the pit of described composite base plate, and described loam cake composite base plate forms a polynary townhouse frequency device group that is made of the capable * n row of a m frequency device with the composite base plate that the capable * n row of a m frequency chip is housed through heating in vacuum pressurization bonding.
8. frequency device that polynary townhouse frequency device group according to claim 7 is made, it is characterized in that, described frequency device forms m*n discrete frequency device by described polynary townhouse frequency device group through vertically reaching transverse cuts, wherein the loam cake composite base plate becomes the upper cover plate of discrete frequency device, and the composite base plate that is composited by upper and lower two-layer substrate constitutes the pedestal of discrete frequency device.
9. frequency device according to claim 8 is characterized in that the end face of described frequency device is neat, upper cover plate and fully coincidence consistent with the pedestal size; When m＞1, during n=1, then have at least the pair of parallel end face to form through cutting, end face overlaps fully, and promptly upper cover plate is consistent with pedestal length or width dimensions and overlap.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6628178B2 (en) * | 2000-08-30 | 2003-09-30 | Tdk Corporation | Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof |
| CN101131976A (en) * | 2006-08-23 | 2008-02-27 | 恩益禧电子股份有限公司 | Semiconductor device and semiconductor package |
| CN101496173A (en) * | 2006-07-27 | 2009-07-29 | 松下电器产业株式会社 | Nonvolatile semiconductor storage device and method for manufacturing same |
-
2010
- 2010-03-22 CN CN2010101584685A patent/CN102118140A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6628178B2 (en) * | 2000-08-30 | 2003-09-30 | Tdk Corporation | Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof |
| CN101496173A (en) * | 2006-07-27 | 2009-07-29 | 松下电器产业株式会社 | Nonvolatile semiconductor storage device and method for manufacturing same |
| CN101131976A (en) * | 2006-08-23 | 2008-02-27 | 恩益禧电子股份有限公司 | Semiconductor device and semiconductor package |
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