CN102117786A - Elastic connecting structure of semiconductor power tube - Google Patents
Elastic connecting structure of semiconductor power tube Download PDFInfo
- Publication number
- CN102117786A CN102117786A CN 201110026443 CN201110026443A CN102117786A CN 102117786 A CN102117786 A CN 102117786A CN 201110026443 CN201110026443 CN 201110026443 CN 201110026443 A CN201110026443 A CN 201110026443A CN 102117786 A CN102117786 A CN 102117786A
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- Prior art keywords
- semiconductor power
- power tube
- power pipe
- semiconductor
- fixed
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Abstract
The invention relates to an elastic connecting structure of a semiconductor power tube, comprising a semiconductor power tube, a semiconductor power tube module and horizontal heat radiating fins; the semiconductor power tube is installed on the semiconductor power tube module; and the semiconductor power tube is fixed on the horizontal heat radiating fins through screws. The elastic connecting structure of the semiconductor power tube is characterized in that a fixed base is fixed on a main power board; an elastic connecting piece is fixed on the semiconductor power tube module; and the fixed base and the elastic connecting piece are fixedly connected through a screw. The invention effectively solves the problem of base pin stress of a semiconductor power component and greatly improves the stability for the heat radiating of the semiconductor power component.
Description
Technical field
The present invention relates to a kind of elastic connection structure of semiconductor power pipe, belong to electric and electronic technical field.
Background technology
At present, in field of power electronics, the semiconductor power pipe is a kind of key element, it has operating characteristics such as power consumption is big, responsive to temperature, and self-defect such as package dimension instability, pin toughness deficiency, field of power electronics main flow mounting means is direct insertion (shown in Figure 1) and horizontal (shown in Figure 2) at present, and direct insertion fin 1 is fixed on the semiconductor power tube module 4, and semiconductor power pipe 3 is fixed on the direct insertion fin 1 by screw 2.Because the fin volume is bigger, it is big to occupy the power amplifier board space, causes the power amplifier board volume big, is unfavorable for the product miniaturization Design; The horizontal fin is independent of power amplifier board, because fin need not be fixed on the power amplifier board, so help significantly reducing the power amplifier board volume, helps the product miniaturization Design.But mounting means adopts traditional horizontal that following defective is arranged: power consumption is very big in the power tube running, need normal pressure that semiconductor power pipe and fin are fitted tightly and guarantee normal radiating requirements, but the semiconductor power pipe has the unstable and thermally sensitive self-defect of package dimension, as shown in Figure 2, semiconductor power pipe 3 is installed on semiconductor power tube module 4, and semiconductor power pipe 3 is fixed on the horizontal fin 7 by screw.The power amplifier board that adopts traditional horizontal to install is constant with respect to the distance L 1 of fin, as semiconductor power pipe size L2 the time less than theoretical value, the semiconductor power pipe is subjected to the pulling force that pin makes progress, cause semiconductor power pipe normal pressure to reduce, reduce semiconductor power pipe and fin applying degree, semiconductor power pipe heat dispersion in running is reduced, operating temperature rises, the final damage, even burst and jeopardize personal safety; As semiconductor power pipe size L2 the time greater than theoretical value, the semiconductor power pipe is subjected to the downward pressure of pin, causes semiconductor power pipe normal pressure to become big, increases the bearing capacity in semiconductor power pipe front, when being increased to semiconductor power pipe front bearing capacity critical value, the final damage; No matter L2 is greater than theoretical value or less than theoretical value simultaneously, the semiconductor power pipe all is subjected to corresponding pulling force and pressure, be in stress always, and the self-defect that semiconductor power pipe pin itself has the toughness deficiency, not enough because of fatigue strength in the long-time running process, thus bring the problem that bulk life time reduce, rate of finished products reduce of product much smaller than semi-conductive theoretical value the useful life that makes the semiconductor power pipe.
Summary of the invention
The objective of the invention is to overcome above-mentioned weak point, thereby a kind of elastic connection structure of semiconductor power pipe is provided, and the mode of this spring connection terminal can solve the pin stress problem of power semiconductor component effectively and significantly increase the power semiconductor component radiation stability.
According to technical scheme provided by the invention, a kind of elastic connection structure of semiconductor power pipe comprises semiconductor power pipe, semiconductor power tube module and horizontal fin, the semiconductor power pipe is installed on the described semiconductor power tube module, the semiconductor power pipe is fixed on the horizontal fin by screw, feature is: firm banking is fixed on the main power amplifier board, Flexible Connector is fixed on the semiconductor power tube module, and firm banking and Flexible Connector are fastenedly connected by screw.Described Flexible Connector is that the thick copper sheet of 0.5mm processes.
Compared with the prior art the present invention has the following advantages:
The present invention is simple, compact and reasonable for structure; The semiconductor element plate is spun off from main power amplifier board, form module, introduce a kind of spring connection terminal of semiconductor power pipe then, indirect couples together semiconductor power tube module and main power amplifier board elasticity, the spring connection terminal of this semiconductor power pipe is made up of firm banking and Flexible Connector, base is fixed on the main power amplifier board, Flexible Connector is fixed on the semiconductor power tube module, no matter semiconductor power pipe L2 becomes greatly still diminishes, the angle of spring connection terminal can both be corresponding diminish and become big, the semiconductor power tube module is moved up and move down, thereby make the semiconductor power pipe not be subjected to any stress substantially, solved the pin stress problem of power semiconductor component effectively and significantly increased the power semiconductor component radiation stability.
Description of drawings
Fig. 1 is the direct insertion structural representation of power semiconductor multi-tube high in the prior art.
Fig. 2 is a power semiconductor multi-tube high horizontal structural representation in the prior art.
Fig. 3 is the elastic connection structure schematic diagram of the described high power semi-conductor of the embodiment of the invention.
Embodiment
Embodiment during following the present invention incites somebody to action in conjunction with the accompanying drawings is further described:
As shown in Figure 3, comprise main power amplifier board 8, firm banking 9, Flexible Connector 10, semiconductor power pipe 3, semiconductor power tube module 4 and horizontal fin 7.
When semiconductor power pipe L3 diminishes, the semiconductor power pipe is subjected to pulling force upwards, this moment, the spring connection terminal angle became big, semi-conductor power module is slight downwards to be moved, reduce the distance L 4 of semi-conductor power module and fin, be subjected to pulling force upwards, make the pressure in semiconductor power pipe front constant substantially thereby reduce the semiconductor power pipe, realize fitting tightly of semiconductor power pipe and radiator, significantly increased the power semiconductor component radiation stability; When semiconductor power pipe L3 becomes big, the semiconductor power pipe is subjected to downward pressure, this moment, the spring connection terminal angle diminished, semi-conductor power module is upwards slight to be moved, increased the distance of semi-conductor power module and fin, be subjected to pulling force upwards, made the pressure in semiconductor power pipe front constant substantially thereby reduce the semiconductor power pipe, thereby avoided semiconductor power pipe positive pressure to reach the pressure-bearing critical value, significantly increased the life-span of semiconductor power pipe; No matter semiconductor power pipe L3 becomes simultaneously greatly still diminishes, the angle of spring connection terminal can both be corresponding diminish and become big, thereby make semiconductor power pipe pin not be subjected to any stress substantially, avoided the semiconductor power pipe because the damage that the fatigue strength of pin own brings inadequately, significantly improve the life-span of semiconductor power pipe, directly improved product machine life and finished product rate.
Claims (2)
1. the elastic connection structure of a semiconductor power pipe, comprise semiconductor power pipe (3), semiconductor power tube module (4) and horizontal fin (7), described semiconductor power tube module (4) is gone up semiconductor power pipe (3) is installed, semiconductor power pipe (3) is fixed on the horizontal fin (7) by screw, it is characterized in that: firm banking (9) is fixed on the main power amplifier board (8), Flexible Connector (10) is fixed on the semiconductor power tube module (4), and firm banking (9) and Flexible Connector (10) are fastenedly connected by screw.
2. the elastic connection structure of a kind of semiconductor power pipe according to claim 1 is characterized in that:
Described Flexible Connector (10) processes for the thick copper sheet of 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110026443 CN102117786A (en) | 2011-01-25 | 2011-01-25 | Elastic connecting structure of semiconductor power tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110026443 CN102117786A (en) | 2011-01-25 | 2011-01-25 | Elastic connecting structure of semiconductor power tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102117786A true CN102117786A (en) | 2011-07-06 |
Family
ID=44216472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110026443 Pending CN102117786A (en) | 2011-01-25 | 2011-01-25 | Elastic connecting structure of semiconductor power tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102117786A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711415A (en) * | 2012-05-18 | 2012-10-03 | 新乡豫新车辆换热设备股份有限公司 | Heat dissipating structure of electric component of vehicle air conditioner controller |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201052809Y (en) * | 2006-08-30 | 2008-04-30 | 天津市松正半导体技术有限公司 | Electric vehicle controller outer casing |
| CN201064046Y (en) * | 2007-05-24 | 2008-05-21 | 天津市松正电子有限公司 | Controller for electric vehicle |
| CN201499408U (en) * | 2009-08-05 | 2010-06-02 | 孙永君 | Assembly structure for electric vehicle controllers |
| CN201557073U (en) * | 2009-10-19 | 2010-08-18 | 上海航天汽车机电股份有限公司 | Novel device for installing power tube of controller of brushless electric machine |
| CN201633526U (en) * | 2009-09-07 | 2010-11-17 | 南京浩悦电子有限公司 | Electric vehicle controller with elastic contact heat radiator |
-
2011
- 2011-01-25 CN CN 201110026443 patent/CN102117786A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201052809Y (en) * | 2006-08-30 | 2008-04-30 | 天津市松正半导体技术有限公司 | Electric vehicle controller outer casing |
| CN201064046Y (en) * | 2007-05-24 | 2008-05-21 | 天津市松正电子有限公司 | Controller for electric vehicle |
| CN201499408U (en) * | 2009-08-05 | 2010-06-02 | 孙永君 | Assembly structure for electric vehicle controllers |
| CN201633526U (en) * | 2009-09-07 | 2010-11-17 | 南京浩悦电子有限公司 | Electric vehicle controller with elastic contact heat radiator |
| CN201557073U (en) * | 2009-10-19 | 2010-08-18 | 上海航天汽车机电股份有限公司 | Novel device for installing power tube of controller of brushless electric machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711415A (en) * | 2012-05-18 | 2012-10-03 | 新乡豫新车辆换热设备股份有限公司 | Heat dissipating structure of electric component of vehicle air conditioner controller |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20110706 |
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| C20 | Patent right or utility model deemed to be abandoned or is abandoned |