CN202331329U - Central processing unit (CPU) radiating device - Google Patents
Central processing unit (CPU) radiating device Download PDFInfo
- Publication number
- CN202331329U CN202331329U CN 201120435152 CN201120435152U CN202331329U CN 202331329 U CN202331329 U CN 202331329U CN 201120435152 CN201120435152 CN 201120435152 CN 201120435152 U CN201120435152 U CN 201120435152U CN 202331329 U CN202331329 U CN 202331329U
- Authority
- CN
- China
- Prior art keywords
- cpu
- radiating device
- heat
- radiator
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a central processing unit (CPU) radiating device, which comprises radiating sheets (2) and a base (1) contacted with a CPU and is characterized by further comprising a longitudinal fastener (3) perpendicular to the ground, wherein the CPU radiating device is connected with the upper portion of the machine case (4) through the longitudinal fastener (3). The CPU radiating device is simple in structure, ingenious in design and capable of achieving bearing of radiators with heavy weight so as to obtain better radiating performance, and solves the problem that a main board is poor in CPU radiator bearing capacity.
Description
Technical field
The utility model relates to a kind of heat abstractor, particularly a kind of heat abstractor that is used for computer housing CPU.
Background technology
The raising of cpu performance causes thermal value to increase, and in order to ensure the operate as normal of CPU, people are installed heating radiator additional on CPU, and constantly improve the heat dispersion of cpu heat.According to the manufacturing process of current air-cooled radiator, improve heat dispersion, just need correspondingly increase the weight of heating radiator.And according to traditional heating radiator fixed form, heating radiator just is fixed on the mainboard through the fastener on the base, and the weight of cpu heat drops on the mainboard fully.When mainboard is mounted in the vertical chassis of main flow; The main part of heating radiator does not have supporting point on gravity direction, be horizontal vacant state, because the lifting capacity of mainboard is relatively poor relatively; Therefore heavier heating radiator tends to cause distortion, the distortion of mainboard; The fault that causes computer easily if heatsink weight is too big, even can directly cause mainboard to damage.
Above-mentioned situation limited people in order to pursue high heat dispersion the bigger heating radiator of design and use weight, thereby limited the performance and the raising of cpu performance, the overall performance that has restricted computer promotes.Therefore need a kind of novel C PU heat abstractor that can address the above problem now.
Summary of the invention
The utility model is in order to solve the above-mentioned deficiency of existing in prior technology, proposes a kind of simple in structurely, designs ingeniously, can realize the load-bearing of the big heating radiator of weight, to obtain the CPU heat abstractor of better heat dispersion.
The technical solution of the utility model is: a kind of CPU heat abstractor; Comprise heat radiator 2 and with the contacted base 1 of CPU; It is characterized in that: also comprise the vertical securing member 3 perpendicular to ground, described CPU heat abstractor is connected with the top of cabinet 4 through vertical securing member 3.
The utility model is compared with prior art, has following advantage:
The CPU heat abstractor of this kind of version; It is simple in structure; Design ingeniously, rationally distributed, it has taken into full account the defective of prior art; Can cause the problem of mainboard torsional deformation to heatsink weight when big, design the heat abstractor that is connected with the cabinet housing through vertical securing member perpendicular to ground.When this heat abstractor is installed in the cabinet; Cpu heat is connected and fixed with cabinet in vertical direction; The action of gravity direction of radiator body portion and its supporting point are on same the straight line, and heating radiator fixes solidly, reasonable, are convenient to cabinet and bear bigger heatsink weight.Therefore cabinet has just been born the weight of heating radiator morely like this, and mainboard is then born the weight of heating radiator rarely, has guaranteed the mainboard distortion that can not be distorted.This structure has solved that heating radiator for a long time receives the restriction of weight and the quagmire that can't fully improve performance, for the research and development of high-performance, heavy weight CPU heat abstractor product provide strong technical support with using.
The manufacture craft of this CPU heat abstractor is simple, and is cheap for manufacturing cost, possesses multiple advantage, is particularly suitable in the computer radiating apparatus industry, applying.
Description of drawings
Fig. 1 is the sectional view of the utility model embodiment.
Fig. 2 is the vertical view of the utility model embodiment.
Embodiment
Below with the embodiment of accompanying drawings the utility model.Like Fig. 1, shown in Figure 2:
Specific embodiment:
A kind of CPU heat abstractor comprises the contacted base 1 with CPU, and base 1 is connected on the mainboard 6 through fastener 5, and contacts with CPU; In base 1, be installed with heat pipe 7; The upper end of heat pipe 7 then links to each other with heat radiator 2, and above-mentioned base 1, heat pipe 7 and heat radiator 2 have been formed the basic structure of this heating radiator jointly, are outside equipped with heat radiator framework 8 at heat radiator 2; It can let heat radiator 2 form an one-piece construction; Be convenient to load-bearing, on heat radiator 2 and heat radiator framework 8, all offer the hole 9 that matches, in hole 9, be installed with long screw (being a kind of form of vertical securing member 3); The lower end of long screw is furnished with nut 10; The upper end of long screw is plugged in the slotted hole 11 that is opened in cabinet 4 upper surfaces, and long screw can be done the adjustment of certain limit according to the particular location of heating radiator in slotted hole 11, to adapt to the cpu i/f socket position variation in the horizontal direction of different mainboards.Nut can be adjusted its level altitude on long screw as required, to adapt to the cpu i/f socket position variation in vertical direction of different mainboards.So just make that this structure can both be compatible well to the mainboard of different CPU interface socket position.
When this heat abstractor is installed in the cabinet; Cpu heat is connected and fixed with cabinet in vertical direction; The action of gravity direction of radiator body portion and its supporting point are on same the straight line, and heating radiator fixes solidly, reasonable, are convenient to cabinet and bear bigger heatsink weight.
The described vertical securing member 3 of the utility model is not limited only to screw, bolt etc., can also be that other can realize vertically connecting fixing structure, the bearing bar that for example is fixedly clamped etc.
The above; Be merely the preferable embodiment of the utility model; But the protection domain of the utility model is not limited thereto; Any technician who is familiar with the present technique field is equal to replacement or changes according to the technical scheme of the utility model and inventive concept thereof in the technical scope that the utility model discloses, and all should be encompassed within the protection domain of the utility model.
Claims (1)
1. CPU heat abstractor; Comprise heat radiator (2) and with the contacted base of CPU (1); It is characterized in that: also comprise the vertical securing member (3) perpendicular to ground, described CPU heat abstractor is connected through the top of vertical securing member (3) with cabinet (4).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120435152 CN202331329U (en) | 2011-11-07 | 2011-11-07 | Central processing unit (CPU) radiating device |
| PCT/CN2012/082870 WO2013067876A1 (en) | 2011-11-07 | 2012-10-12 | Cpu heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120435152 CN202331329U (en) | 2011-11-07 | 2011-11-07 | Central processing unit (CPU) radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202331329U true CN202331329U (en) | 2012-07-11 |
Family
ID=46443303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120435152 Expired - Fee Related CN202331329U (en) | 2011-11-07 | 2011-11-07 | Central processing unit (CPU) radiating device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202331329U (en) |
| WO (1) | WO2013067876A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013067876A1 (en) * | 2011-11-07 | 2013-05-16 | Zhong Zhi | Cpu heat dissipation device |
| CN104914948A (en) * | 2015-05-25 | 2015-09-16 | 铜陵宏正网络科技有限公司 | CPU radiator with top hanging structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2616732Y (en) * | 2002-12-13 | 2004-05-19 | 联想(北京)有限公司 | Integrated parallel heat tube radiator |
| CN101290537A (en) * | 2008-06-12 | 2008-10-22 | 上海爱瑞科技发展有限公司 | Industrial computer large area CPU heat storage radiation structure |
| CN201607676U (en) * | 2010-04-16 | 2010-10-13 | 山东高效能服务器和存储研究院 | Fixing device of CPU radiator |
| CN202331329U (en) * | 2011-11-07 | 2012-07-11 | 仲志 | Central processing unit (CPU) radiating device |
-
2011
- 2011-11-07 CN CN 201120435152 patent/CN202331329U/en not_active Expired - Fee Related
-
2012
- 2012-10-12 WO PCT/CN2012/082870 patent/WO2013067876A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013067876A1 (en) * | 2011-11-07 | 2013-05-16 | Zhong Zhi | Cpu heat dissipation device |
| CN104914948A (en) * | 2015-05-25 | 2015-09-16 | 铜陵宏正网络科技有限公司 | CPU radiator with top hanging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013067876A1 (en) | 2013-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20141107 |
|
| EXPY | Termination of patent right or utility model |