CN102117017A - Photoetching equipment with vacuum silicon chip box - Google Patents
Photoetching equipment with vacuum silicon chip box Download PDFInfo
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- CN102117017A CN102117017A CN2010100224095A CN201010022409A CN102117017A CN 102117017 A CN102117017 A CN 102117017A CN 2010100224095 A CN2010100224095 A CN 2010100224095A CN 201010022409 A CN201010022409 A CN 201010022409A CN 102117017 A CN102117017 A CN 102117017A
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Abstract
The invention relates to photoetching equipment with a vacuum silicon chip box. The photoetching equipment with the vacuum silicon chip box comprises a light source, a vacuum mask table system, a projection object lens system, a vacuum mask transmission system, a vacuum worktable system and a vacuum silicon chip transmission system, wherein the vacuum silicon chip box is connected with a vacuum exposure room in a vacuum way, so that the silicon chip can be exchanged more quickly, and the efficiency of the photoetching equipment is improved.
Description
Technical field
The present invention relates to a kind of lithographic equipment, particularly relate to a kind of lithographic equipment with vacuum silicon chip case.
Background technology
Use the lithographic equipment of extreme ultraviolet light beam as light source, be by extreme ultraviolet light beam (EUV) as light source, with the image projection on the mask to silicon chip.The extreme ultraviolet light beam is produced by plasma source, and the wavelength of extreme ultraviolet light beam is 13.5nm, and therefore he can must be exposed under vacuum environment by the air strong absorption, and silicon chip must be converted to vacuum from normal pressure before exposure.
The replacing of silicon chip is a very frequent link in photoetching process, if the silicon chip storehouse was in vacuum state before entering the vacuum exposure room, then can change silicon chip fast, thereby improves the efficient of lithographic equipment.Chinese patent CN1493921A discloses a kind of lithographic equipment with the vacuum mask plate store that is connected with the vacuum exposure room.U.S. Pat 6445440 discloses a kind of structure of vacuum exposure room.Still the lithographic equipment that does not have at present the vacuum silicon chip storehouse that is connected with the vacuum exposure room.
Summary of the invention
The purpose of this invention is to provide a kind of lithographic equipment, thereby can change silicon chip fast, improve the efficient of lithographic equipment with vacuum silicon chip storehouse.
The present invention discloses a kind of lithographic equipment with vacuum silicon chip case, comprising:
Light source is used for producing EUV light beam required in the exposure;
Vacuum mask platform system comprises vacuum mask plate store and the mask platform that places vacuum and be used for placing mask, and motion by mask platform and alignment system are realized aiming between mask and the lens system;
Projection objective system is used for the parts of images on the mask is projected on the silicon chip;
Mask transmission system is realized the transmission of mask between vacuum mask plate store and mask platform by mechanical arm;
It is characterized in that: also comprise vacuum work stage system, comprise vacuum silicon chip case and place vacuum and be used for placing the exposure desk of silicon chip that motion by exposure desk and alignment system are realized the accurate location between silicon chip and the projection lens;
The vacuum silicon chip transmission system realizes that by the mechanical arm in the vacuum transfer chamber silicon chip is at vacuum silicon chip case and place transmission between the exposure desk of vacuum.
Wherein, be connected with vacuum subenvironment district by gate valve respectively between vacuum silicon chip case and the vacuum transfer chamber.
Wherein, vacuum work stage system also comprises the vacuum sheet case that gives up; The useless sheet case of vacuum silicon chip case and vacuum is positioned at the not ipsilateral of vacuum transfer chamber.
Use has the replacing silicon chip setting process of the lithographic equipment of vacuum silicon chip case, comprises the steps:
A. silicon chip is put into silicon box, silicon box is put into vacuum silicon chip case;
B. vacuum silicon chip case is connected with vacuum subenvironment district;
C. fixing vacuum silicon chip case;
D. open gate valve, vacuum silicon chip case and vacuum subenvironment district are vacuumized;
E. open another gate valve, vacuum silicon chip case is communicated with the vacuum transfer chamber;
F. open another gate valve, the vacuum transfer chamber is communicated with the vacuum exposure room;
G. finishing vacuum environment sets.
The present invention will use vacuum silicon chip case in the lithographic equipment, thereby the silicon chip storehouse is connected with vacuum exposure room vacuum, make the replacing silicon chip more quick, improve the efficient of lithographic equipment.
Description of drawings
Fig. 1 is lithographic equipment one-piece construction figure of the present invention;
Fig. 2 is vacuum silicon chip case of the present invention and lithographic equipment syndeton vertical view;
Fig. 3 is vacuum silicon chip case of the present invention and lithographic equipment syndeton side view;
Fig. 4 changes the silicon chip process flow diagram for lithographic equipment of the present invention.
Embodiment
Below, describe in detail according to a preferred embodiment of the invention in conjunction with the accompanying drawings.For convenience of description and highlight the present invention, omitted existing associated components in the prior art in the accompanying drawing, and will omit description these well-known components.
Fig. 1 is lithographic equipment one-piece construction figure of the present invention.Lithographic equipment comprises light-source system, is used for producing light source required in the exposure.The PB beam system will provide PB light beam (UV or EUV line, electron beam or ion beam) for projection.Vacuum mask platform system comprises the vacuum mask plate store and places vacuum and mask platform that be used for placing mask, and motion by mask platform and alignment system are realized aiming between mask and the lens system.Projection objective system is used for the parts of images on the mask is projected to silicon chip.Vacuum work stage system comprises vacuum silicon chip case and places the exposure desk that is used for placing silicon chip of vacuum, and motion by exposure desk and alignment system are realized the accurate location between silicon chip and the projection lens.The vacuum mask transmission system realizes that by mechanical arm mask is at the vacuum mask plate store and place transmission between the mask platform of vacuum.The vacuum silicon chip transmission system realizes that by mechanical arm silicon chip is at vacuum silicon chip case and place transmission between the exposure desk of vacuum.
Fig. 2 and 3 is depicted as vacuum silicon chip case of the present invention and lithographic equipment johning knot composition.As shown in Figure 2, the inner silicon box 12 of installing of vacuum silicon chip case 1 is communicated with by gate valve 11 between vacuum silicon chip case 1 and the vacuum subenvironment district 2.Vacuum silicon chip case 1 is fixed and sealing by rotating clamp 8 with vacuum subenvironment district 2, and wherein register pin 81 is used for vacuum silicon chip case 1 is positioned, and O-ring seal 82 is used for carrying out the sealing of gas, and catching 83 is played the effect of clamping by cylinder control.Be communicated with by gate valve 21 between vacuum subenvironment district 2 and the vacuum transfer chamber 5.Transmit machine arm 4 is installed in the vacuum transfer chamber 5.Be communicated with by gate valve 51 between vacuum transfer chamber 5 and the vacuum exposure region.Most important component is an exposure desk 7 in the vacuum exposure region 6.The useless sheet that produces in the litho machine production run is deposited by the useless sheet case 3 of independent vacuum.The structure of the useless sheet case 3 of vacuum is consistent with vacuum silicon chip case 2, is connected with vacuum subenvironment district by gate valve 31.The useless sheet case 3 of vacuum is positioned on the side different with vacuum silicon chip case 2.The useless sheet case 3 of vacuum is deposited the useless sheet that produces in the production run, and vacuum silicon chip case 2 is deposited normal silicon chip.
As shown in Figure 3, silicon chip is placed in the silicon box 12, then vacuum silicon chip case 1 is installed together with vacuum subenvironment district 2.Vacuum silicon chip case 1 fixed mount 9 is arranged on vacuum transfer chamber 5, and wherein three combination salient point stationary installations 91 are used for vacuum silicon chip case 1 is positioned.Three salient point stationary installations are distributed on the circumference.Each salient point stationary installation comprises card extender 95, bulb plunger 92, and spring 93 and set nut 94 are formed.Make being installed on the relevant position of vacuum silicon chip case 1 level by the height of regulating the bulb plunger.Vacuum subenvironment district 2 is by the vacuum in gas admittance valve 22 releasing subenvironment districts 2, and the district vacuumizes by 23 pairs of vacuum subenvironments of extraction valve.The vacuum that transmission vacuum chamber 5 is removed in the vacuum chamber by gas admittance valve 52 vacuumizes by 53 pairs of transmission vacuum chambers of extraction valve.
Fig. 4 changes the silicon chip process flow diagram for lithographic equipment of the present invention.Change the silicon chip setting process and comprise the steps: silicon chip is put into silicon box 12, silicon box 12 is put into vacuum silicon chip case 1; Vacuum silicon chip case 1 is connected with vacuum subenvironment district 2; By the fixing vacuum silicon chip case 1 of clamp device 8 and salient point locating device 9; Open gate valve 11, closed gate valve 21 utilizes extraction valve 23 that vacuum silicon chip case 1 and vacuum subenvironment district 2 are vacuumized.Useless sheet case 3 operating processes are identical.Judge whether vacuum of vacuum transfer chamber.As not being, open gate valve 53, transfer chamber 4 is evacuated; In this way, open gate valve 21, vacuum silicon chip case 1 is communicated with the vacuum transfer chamber; Open another gate valve 51, vacuum transfer chamber 4 is communicated with vacuum exposure room 6; Finishing vacuum environment sets.
Described in this instructions is several preferred embodiment of the present invention, and above embodiment is only in order to illustrate technical scheme of the present invention but not limitation of the present invention.All those skilled in the art all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (4)
1. lithographic equipment with vacuum silicon chip case comprises:
Light source is used for producing EUV light beam required in the exposure;
Vacuum mask platform system comprises vacuum mask plate store and the mask platform that places vacuum and be used for placing mask, and motion by mask platform and alignment system are realized aiming between mask and the lens system;
Projection objective system is used for the parts of images on the mask is projected on the silicon chip;
Mask transmission system is realized the transmission of mask between vacuum mask plate store and mask platform by mechanical arm;
It is characterized in that: also comprise vacuum work stage system, comprise vacuum silicon chip case and place vacuum and be used for placing the exposure desk of silicon chip that motion by exposure desk and alignment system are realized the accurate location between silicon chip and the projection lens;
The vacuum silicon chip transmission system realizes that by the mechanical arm in the vacuum transfer chamber silicon chip is at vacuum silicon chip case and place transmission between the exposure desk of vacuum.
2. lithographic equipment as claimed in claim 1 is characterized in that: be connected with vacuum subenvironment district by gate valve respectively between vacuum silicon chip case and the vacuum transfer chamber.
3. lithographic equipment as claimed in claim 1 is characterized in that: vacuum work stage system also comprises the vacuum sheet case that gives up; The useless sheet case of vacuum silicon chip case and vacuum is positioned at the not ipsilateral of vacuum transfer chamber.
4. use replacing silicon chip setting process, comprise the steps: as one of claim 1-3 described lithographic equipment
A. silicon chip is put into silicon box, silicon box is put into vacuum silicon chip case;
B. vacuum silicon chip case is connected with vacuum subenvironment district;
C. fixing vacuum silicon chip case;
D. open gate valve, vacuum silicon chip case and vacuum subenvironment district are vacuumized;
E. open another gate valve, vacuum silicon chip case is communicated with the vacuum transfer chamber;
F. open another gate valve, the vacuum transfer chamber is communicated with the vacuum exposure room;
G. finishing vacuum environment sets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100224095A CN102117017A (en) | 2010-01-04 | 2010-01-04 | Photoetching equipment with vacuum silicon chip box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100224095A CN102117017A (en) | 2010-01-04 | 2010-01-04 | Photoetching equipment with vacuum silicon chip box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102117017A true CN102117017A (en) | 2011-07-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010100224095A Pending CN102117017A (en) | 2010-01-04 | 2010-01-04 | Photoetching equipment with vacuum silicon chip box |
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| Country | Link |
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| CN (1) | CN102117017A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103863821A (en) * | 2012-12-07 | 2014-06-18 | 上海微电子装备有限公司 | Mask transmission device and method |
-
2010
- 2010-01-04 CN CN2010100224095A patent/CN102117017A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103863821A (en) * | 2012-12-07 | 2014-06-18 | 上海微电子装备有限公司 | Mask transmission device and method |
| CN103863821B (en) * | 2012-12-07 | 2016-12-21 | 上海微电子装备有限公司 | Mask transmitting device and method |
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Application publication date: 20110706 |