CN102110764A - LED (light emitting diode) and LED bracket - Google Patents
LED (light emitting diode) and LED bracket Download PDFInfo
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- CN102110764A CN102110764A CN 201010594373 CN201010594373A CN102110764A CN 102110764 A CN102110764 A CN 102110764A CN 201010594373 CN201010594373 CN 201010594373 CN 201010594373 A CN201010594373 A CN 201010594373A CN 102110764 A CN102110764 A CN 102110764A
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- led
- led support
- inside casing
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Abstract
The invention relates to an LED (light emitting diode) and an LED bracket. The LED bracket comprises an internal frame and an external frame, wherein the internal frame forms a reflector and is made from white resin, and the internal frame is integrally molded with the external frame in a double-shot injection manner. During the molding of the LED bracket, double shooting is adopted, namely, a molded internal frame is shot out firstly and then a molded external frame is shot out; made from white resin, the internal frame achieves higher reflection rate and can ensure the higher brightness of the LED; the external frame adopts another color, thereby achieving the effect of decorating the LED appearance; and the external frame can protect LED products by preventing invasion of water and moisture, resisting high temperature, preventing UV appearance yellowing and resisting corrosion, and is suitable to use outdoors; and the yield rate of the LED bracket subjected to the double-shot injection is very high. The LED employing the LED bracket provided by the invention has the advantages of high contrast ratio and high brightness, and the LED can be widely applied to the fields such as LED display, LED illumination, LED backlight, and the like.
Description
Technical field
The present invention relates to a kind of LED and led support.
Background technology
LED has numerous advantages such as light efficiency height, long service life, energy-saving and environmental protection, more and more widely be applied to numerous fields, as room lighting, outdoor lighting, backlight etc.
SMD LED is for improving the contrast of color at present, the following two kinds of methods of main employing: a kind of is that led support adopts white PPA material ejection formation, brushing China ink after the moulding above led support handles, the method can guarantee the brightness of LED preferably, and its shortcoming is to fall China ink easily, and led support finished product fraction defective is higher, cause cost too high, and the led support side can't brush China ink and handle, and can occur the phenomenon of side whiting when being applied to LED display, causes contrast to reduce; Another kind is that led support adopts black PPA material ejection formation, and the method can improve the contrast of color well, but because the reflector inside of led support is similarly black, the reflecting effect variation has seriously reduced the brightness of LED.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of led support, adopts the LED of this led support to possess high-contrast, high brightness, advantage cheaply.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of led support is provided, comprises inside casing and housing, described inside casing forms reflection shield, and described interior frame material is a white resin, and described inside casing and housing are one by double-shot moulding.
Wherein, described housing covers the upper surface of described inside casing.
Wherein, the upper surface of described housing is higher than the upper surface of inside casing.
Wherein, described outer frame material is a black resin.
Wherein, described outer frame material is black PPA.
Wherein, described interior frame material is white PPA.
Wherein, described led support is a SMD horizontal structure led support, also comprises metallic plate, and the equal double-shot moulding of described housing and inside casing is on metallic plate.
Wherein, the side of the described metallic plate of all or part of covering of described housing.
The present invention also provides a kind of LED, comprises led support, and described led support comprises inside casing and housing, and described inside casing forms reflection shield, and described interior frame material is a white resin, and described inside casing and housing are one by double-shot moulding.
Wherein, described outer frame material is black PPA, and described interior frame material is white PPA.
The invention has the beneficial effects as follows: led support of the present invention penetrates when being shaped at twice; ejection formation inside casing at first; and then ejection formation housing; interior frame material adopts white resin; has very high reflecting rate; can guarantee the higher brightness that has of LED; and housing can adopt other color; to play the effect of decorating the LED outward appearance; housing also can play waterproof to the LED product, prevent moisture intrusion, high temperature resistant, ultraviolet outward appearance xanthochromia and corrosion resistant protective effect; suitable outdoor use, the led support yields of double-shot moulding is very high in addition, and cost is low.When the material of housing was black resin, LED also had the advantage of high color contrast, and did not have to fall black phenomenon, and cost is low.
The LED of employing led support of the present invention possesses the advantage of high-contrast, high brightness, can be widely applied to multiple fields such as LED demonstration, LED illumination and LED-backlit.
Description of drawings
Fig. 1 is the front view of LED of the present invention and led support embodiment one;
Fig. 2 is the cut-away view of LED of the present invention and led support embodiment one;
Fig. 3 is the cut-away view of LED of the present invention and led support embodiment two;
Fig. 4 is the cut-away view of LED of the present invention and led support embodiment three.
Wherein, 1, inside casing; 2, housing; 3, luminescence chip; 4, gold thread; 5, glue; 6, metallic plate.
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
Embodiment one as LED of the present invention and led support, see also Fig. 1 and Fig. 2, LED of the present invention comprises led support, described led support comprises inside casing 1 and housing 2, described inside casing 1 forms reflection shield, described inside casing 1 material is a white resin, and described inside casing 1 and housing 2 are one by double-shot moulding.
Led support of the present invention penetrates when being shaped at twice, at first the ejection formation inside casing 1, and then ejection formation housing 2, inside casing 1 material adopts white resin, have very high reflecting rate, can guarantee the higher brightness that has of LED, and housing 2 can adopt other color, to play the effect of decorating the LED outward appearance, the led support yields of double-shot moulding is very high in addition.
In one embodiment, described housing 2 materials are black resin, and when the material of housing 2 was black resin, LED also had the advantage of high color contrast, and did not have to fall black phenomenon, and cost is low.The LED of employing led support of the present invention possesses the advantage of high-contrast, high brightness.Further, described housing 2 can adopt black PPA material, and described inside casing 1 material can adopt white PPA material.
Shown in the following table is that LED adopts in the prior art black PPA led support and adopts brightness data contrast situation under the led support shades of colour of the present invention.
Data contrast from last table can sum up: adopt the LED brightness of the LED brightness of led support of the present invention apparently higher than employing prior art led support, the ratio average out to that specifically exceeds:
Ruddiness: 62.89% green glow: 47.14% blue light: 107.43%.
In one embodiment, as shown in Figure 2, described led support is a SMD horizontal structure led support, also comprise metallic plate 6, described housing 2 and inside casing 1 all by double-shot moulding on metallic plate 6, luminescence chip 3 is arranged on the metallic plate 6, and be electrically connected with electrode by gold thread 4, in the present embodiment, described housing 2 covers the upper surface of described inside casing 1, handle the color contrast that equally can improve LED with brush China ink in the prior art, and the upper surface of described housing 2 is higher than the upper surface of inside casing 1, this kind structure can play the effect that prevents that glue 5 from overflowing when encapsulation embedding glue 5.In the present embodiment; cover the side of described metallic plate 6 when described housing 2 parts; as shown in Figure 3; perhaps described housing 2 all covers the side of described metallic plate 6; in the time of as shown in Figure 4; housing 2 also can play waterproof to the LED product, prevent moisture intrusion, high temperature resistant, ultraviolet outward appearance xanthochromia and corrosion resistant protective effect, very suitable outdoor use.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. led support is characterized in that: comprise inside casing and housing, described inside casing forms reflection shield, described in frame material be white resin, described inside casing and housing are one by double-shot moulding.
2. led support according to claim 1 is characterized in that: described housing covers the upper surface of described inside casing.
3. led support according to claim 1 is characterized in that: the upper surface of described housing is higher than the upper surface of inside casing.
4. led support according to claim 1 is characterized in that: described outer frame material is a black resin.
5. led support according to claim 4 is characterized in that: described outer frame material is black PPA.
6. led support according to claim 1 is characterized in that: frame material is white PPA in described.
7. led support according to claim 1 is characterized in that: described led support is a SMD horizontal structure led support, also comprises metallic plate, and the equal double-shot moulding of described housing and inside casing is on metallic plate.
8. led support according to claim 7 is characterized in that: the side of the described metallic plate of all or part of covering of described housing.
9. a LED comprises led support, it is characterized in that: described led support comprises inside casing and housing, and described inside casing forms reflection shield, and described interior frame material is a white resin, and described inside casing and housing are one by double-shot moulding.
10. LED according to claim 9 is characterized in that: described outer frame material is black PPA, and described interior frame material is white PPA.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201010594373 CN102110764A (en) | 2010-12-17 | 2010-12-17 | LED (light emitting diode) and LED bracket |
Applications Claiming Priority (1)
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CN 201010594373 CN102110764A (en) | 2010-12-17 | 2010-12-17 | LED (light emitting diode) and LED bracket |
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CN102110764A true CN102110764A (en) | 2011-06-29 |
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CN 201010594373 Pending CN102110764A (en) | 2010-12-17 | 2010-12-17 | LED (light emitting diode) and LED bracket |
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102306697A (en) * | 2011-09-29 | 2012-01-04 | 昆山市华英精密模具工业有限公司 | Ultra-thin-type LED (light emitting diode) support with heat-radiation bottom |
CN102683551A (en) * | 2012-04-19 | 2012-09-19 | 浙江英特来光电科技有限公司 | Outdoor display screen SMD (surface mount device) LED (light-emitting diode) structure |
CN102779926A (en) * | 2012-08-02 | 2012-11-14 | 慧明光电(深圳)有限公司 | Waterproof watch patch LED (light emitting diode) lamp with high-contract ratio |
CN103262269A (en) * | 2011-11-24 | 2013-08-21 | 惠州科锐半导体照明有限公司 | Water resistant led devices and led display including the same |
WO2013181896A1 (en) * | 2012-06-06 | 2013-12-12 | 深圳雷曼光电科技股份有限公司 | Led bracket for surface mounting, manufacturing method thereof and led lamp |
CN104246364A (en) * | 2012-04-12 | 2014-12-24 | 夏普株式会社 | Light source substrate unit |
JP2017152629A (en) * | 2016-02-26 | 2017-08-31 | 日亜化学工業株式会社 | Light-emitting device and illuminating apparatus using the same |
US10248372B2 (en) | 2013-12-31 | 2019-04-02 | Ultravision Technologies, Llc | Modular display panels |
US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
CN110265523A (en) * | 2014-07-30 | 2019-09-20 | Lg 伊诺特有限公司 | Luminescent device and light source module with luminescent device |
US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
CN111900242A (en) * | 2020-06-24 | 2020-11-06 | 深圳市聚飞光电股份有限公司 | LED light-emitting piece, manufacturing method thereof and display device |
CN112086547A (en) * | 2019-06-13 | 2020-12-15 | 光宝光电(常州)有限公司 | Light emitting diode packaging structure |
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CN2523027Y (en) * | 2001-12-14 | 2002-11-27 | 诠兴开发科技股份有限公司 | Improved packaging structure of power light-emitting diode |
US20030025449A1 (en) * | 2001-08-03 | 2003-02-06 | Osram Opto Semiconductors Gmbh | Hybrid LED |
US20060060867A1 (en) * | 2004-09-09 | 2006-03-23 | Toyoda Gosei Co., Ltd. | Light emitting device |
CN101737646A (en) * | 2009-12-04 | 2010-06-16 | 深圳雷曼光电科技股份有限公司 | LED lamp and encapsulating method thereof |
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US20030025449A1 (en) * | 2001-08-03 | 2003-02-06 | Osram Opto Semiconductors Gmbh | Hybrid LED |
CN2523027Y (en) * | 2001-12-14 | 2002-11-27 | 诠兴开发科技股份有限公司 | Improved packaging structure of power light-emitting diode |
US20060060867A1 (en) * | 2004-09-09 | 2006-03-23 | Toyoda Gosei Co., Ltd. | Light emitting device |
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Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102306697A (en) * | 2011-09-29 | 2012-01-04 | 昆山市华英精密模具工业有限公司 | Ultra-thin-type LED (light emitting diode) support with heat-radiation bottom |
CN103262269B (en) * | 2011-11-24 | 2018-06-19 | 惠州科锐半导体照明有限公司 | LED encapsulation piece |
CN103262269A (en) * | 2011-11-24 | 2013-08-21 | 惠州科锐半导体照明有限公司 | Water resistant led devices and led display including the same |
EP2783400A4 (en) * | 2011-11-24 | 2015-07-15 | Cree Huizhou Solid State Lighting Co Ltd | Water resistant led devices and led display including the same |
CN104246364A (en) * | 2012-04-12 | 2014-12-24 | 夏普株式会社 | Light source substrate unit |
CN102683551A (en) * | 2012-04-19 | 2012-09-19 | 浙江英特来光电科技有限公司 | Outdoor display screen SMD (surface mount device) LED (light-emitting diode) structure |
WO2013181896A1 (en) * | 2012-06-06 | 2013-12-12 | 深圳雷曼光电科技股份有限公司 | Led bracket for surface mounting, manufacturing method thereof and led lamp |
CN102779926A (en) * | 2012-08-02 | 2012-11-14 | 慧明光电(深圳)有限公司 | Waterproof watch patch LED (light emitting diode) lamp with high-contract ratio |
EP2693854A3 (en) * | 2012-08-02 | 2014-02-26 | Kindwin Opto Electronic (Shen Zhen) Co. Ltd. | High-contrast waterproof surface-mounted led lamp |
CN102779926B (en) * | 2012-08-02 | 2015-01-28 | 慧明光电(深圳)有限公司 | Waterproof watch patch LED (light emitting diode) lamp with high-contract ratio |
US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
US10871932B2 (en) | 2013-12-31 | 2020-12-22 | Ultravision Technologies, Llc | Modular display panels |
US10248372B2 (en) | 2013-12-31 | 2019-04-02 | Ultravision Technologies, Llc | Modular display panels |
US10380925B2 (en) | 2013-12-31 | 2019-08-13 | Ultravision Technologies, Llc | Modular display panel |
US10410552B2 (en) | 2013-12-31 | 2019-09-10 | Ultravision Technologies, Llc | Modular display panel |
US10540917B2 (en) | 2013-12-31 | 2020-01-21 | Ultravision Technologies, Llc | Modular display panel |
US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
CN110265523A (en) * | 2014-07-30 | 2019-09-20 | Lg 伊诺特有限公司 | Luminescent device and light source module with luminescent device |
US11282986B2 (en) | 2014-07-30 | 2022-03-22 | Suzhou Lekin Semiconductor Co., Ltd. | Light emitting device and light source module having thereof |
US11688831B2 (en) | 2014-07-30 | 2023-06-27 | Suzhou Lekin Semiconductor Co., Ltd. | Light emitting device and light source module having thereof |
JP2017152629A (en) * | 2016-02-26 | 2017-08-31 | 日亜化学工業株式会社 | Light-emitting device and illuminating apparatus using the same |
CN112086547A (en) * | 2019-06-13 | 2020-12-15 | 光宝光电(常州)有限公司 | Light emitting diode packaging structure |
US11264370B2 (en) | 2019-06-13 | 2022-03-01 | Lite-On Opto Technology (Changzhou) Co., Ltd. | LED package structure |
CN111900242A (en) * | 2020-06-24 | 2020-11-06 | 深圳市聚飞光电股份有限公司 | LED light-emitting piece, manufacturing method thereof and display device |
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Application publication date: 20110629 |