CN102109728A - Electronic paper unit, cutting equipment and manufacturing method of electronic paper unit - Google Patents
Electronic paper unit, cutting equipment and manufacturing method of electronic paper unit Download PDFInfo
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- CN102109728A CN102109728A CN 201110026774 CN201110026774A CN102109728A CN 102109728 A CN102109728 A CN 102109728A CN 201110026774 CN201110026774 CN 201110026774 CN 201110026774 A CN201110026774 A CN 201110026774A CN 102109728 A CN102109728 A CN 102109728A
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- electronic paper
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- electronic
- ink layer
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- 238000005520 cutting process Methods 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000003292 glue Substances 0.000 claims abstract description 25
- 230000001154 acute effect Effects 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 29
- 230000004888 barrier function Effects 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 24
- 239000011248 coating agent Substances 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 229910000831 Steel Inorganic materials 0.000 claims description 12
- 239000010959 steel Substances 0.000 claims description 12
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims 1
- 239000010409 thin film Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000002650 habitual effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
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- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Laser Beam Processing (AREA)
Abstract
An electronic paper unit, a cutting device and a manufacturing method of the electronic paper unit are provided. The thin-film transistor layer is disposed on the flexible substrate. The electronic ink layer is disposed on a surface of the thin-film-transistor layer. The waterproof layer is disposed on the electronic ink layer. The end face of the waterproof layer and the end face of the electronic ink layer jointly form a side wall, and a first acute angle or a first obtuse angle is formed between the side wall and the surface. The frame glue is coated on the side wall and the surface. Meanwhile, the manufacturing method of the cutting equipment and the electronic paper unit is also disclosed.
Description
Technical field
The present invention relates to a kind of Electronic Paper, particularly a kind of Electronic Paper unit, the cutting equipment of cutting Electronic Paper and the method for making of Electronic Paper unit.
Background technology
In recent years, Electronic Paper (E-paper) is just flourish with e-book (E-book), and the display with lighter, thinner and deflection characteristic will become the trend of following main development.
Yet flexible base plate has the restriction of many materials own, therefore also can't be suitable for present glass substrate technology fully.Therefore, improve as existing equipment how, just make its making that can be applicable to flexible base plate become the problem that the related personnel need solve.
Summary of the invention
Technical matters to be solved by this invention provides a kind of Electronic Paper unit, and it has preferable durability.
Another technical matters to be solved by this invention provides a kind of cutting equipment, and it has preferable prouctiveness.
Another technical matters to be solved by this invention provides the method for making of a kind of Electronic Paper unit, and it can be produced the Electronic Paper unit with preferable durability and have preferable prouctiveness by cutting equipment.
To achieve these goals, the invention provides a kind of Electronic Paper unit, comprise a flexible base plate, a tft layer, an electronic ink layer, a water barrier and a frame glue.Tft layer is configured on the flexible base plate.Electronic ink layer is configured on the surface of tft layer.Water barrier is configured on the electronic ink layer.One end face of water barrier enough becomes a sidewall jointly with an end face of electronic ink layer, and this sidewall and clip surface one first acute angle or one first obtuse angle.On the sidewall and surface that the coating of frame glue covers.
In order to realize above-mentioned purpose better, the present invention also provides a kind of cutting equipment, comprises a platform, a laser cell, a cutter and a catoptron.Laser cell is corresponding to the platform setting.Cutter is liftably corresponding to disposing on the platform.Catoptron is in adjustable angle corresponding to platform and laser cell configuration.When laser cell penetrated a laser beam, laser beam was through mirror reflects, and with platform clamp one second acute angle or one second obtuse angle.
In order to realize above-mentioned purpose better, the present invention also provides a kind of method for making of Electronic Paper, comprise a rigid substrate is provided, and dispose in regular turn a flexible base plate, a tft layer, an electronic ink layer and a water barrier on rigid substrate to form an Electronic Paper array.One cutting equipment then is provided, and the Electronic Paper array is positioned on the platform.Then cut the Electronic Paper array to form a plurality of Electronic Paper unit by cutting equipment.Then be coated with frame glue around each Electronic Paper unit.At last, take off the Electronic Paper unit from rigid substrate.
Technique effect of the present invention is: by the laser cell of cutting equipment, and the Electronic Paper unit is cut into the sidewall with obtuse angle or acute angle, take place and reduce the situation that aqueous vapor is invaded electronic ink layer and can effectively reduce bubble when making follow-up coating frame glue.In addition, cutting equipment has laser cell and cutter simultaneously, wherein the laser cell decapacitation reaches by catoptron outside the angle of above-mentioned sidewall, also can be in cutting to heat-treating between the flexible base plate of Electronic Paper unit and the adhesive coating, and then increase stickability between each layer.In addition, arrange in pairs or groups mutually, also can effectively improve the prouctiveness of cutting technique by laser cell and cutter.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the synoptic diagram according to a kind of Electronic Paper unit of one embodiment of the invention;
Fig. 2 is the synoptic diagram according to a kind of Electronic Paper unit of another embodiment of the present invention;
Fig. 3 is the partial schematic diagram according to a kind of cutting equipment of one embodiment of the invention;
Fig. 4 is the process flow diagram according to batch method for making of a kind of Electronic Paper of one embodiment of the invention;
Fig. 5 is the synoptic diagram of Electronic Paper unit when cutting in the method for making of Fig. 4;
Fig. 6 is the synoptic diagram of Electronic Paper unit when cutting of Fig. 5;
Fig. 7 is the partial top view in Fig. 5 cutting process.
Wherein, Reference numeral
100,200 Electronic Paper unit
110 flexible base plates
120 tft layers
130,230 electronic ink layer
140 adhesive coatings
150,250 water barriers
160,260 frame glue
170 rigid substrates
180 from the shape layer
300 cutting equipments
310 platforms
320 laser cells
330 cutters
340 catoptrons
350 absorption rollers
A1, A2 sidewall
B1, B2 bottom surface
C2 second obtuse angle
L1 bubble discharge path
M1 first obtuse angle
N1 first acute angle
The R1 laser beam
The S1 surface
T1, T2 end face
U1～U4 Cutting Road
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and principle of work are done concrete description:
Fig. 1 is the synoptic diagram according to a kind of Electronic Paper unit of one embodiment of the invention.Please refer to Fig. 1, in the present embodiment, Electronic Paper unit 100 can comprise a flexible base plate 110, a tft layer 120, an electronic ink layer 130, an adhesive coating 140, a water barrier 150 and a frame glue 160.Flexible base plate 110 can be the film substrate of polyimide (Polyimide) material.Tft layer 120 is configured on the flexible base plate 110.Electronic ink layer 130 is configured on the surperficial S1 of tft layer 120, wherein electronic ink layer 130 can link together by adhesive coating 140 with tft layer 120, electronic ink layer 130 can be electrophoresis-type (Electro Phoretic, EP) show film, adhesive coating 140 then can be transparent optical cement (Optical Clear Adhesive, OCA).Water barrier 150 is configured on the electronic ink layer 130, and the common formation of an end face of water barrier 150 and an end face of electronic ink layer 130 one sidewall A1, and sidewall A1 and surperficial S1 press from both sides one first obtuse angle M1, make water barrier 150 and electronic ink layer 130 have a up-narrow and down-wide trapezoidal cross-section structure respectively, this first obtuse angle M1 is in fact greater than 90 degree and less than 100 degree, water barrier 150 can be polyethylene terephthalate (Polyethylene Terephthalate, PET) waterproof membrane of material.160 coatings of frame glue cover on sidewall A1 and the surperficial S1.
In the present embodiment, one end face T1 of water barrier 150 is in the frontal projected area of surperficial S1, less than a bottom surface B1 of electronic ink layer 130 frontal projected area at surperficial S1, also promptly the water barrier 150 of the Electronic Paper unit 100 of this moment presents up-narrow and down-wide trapezoidal cross-section structure with electronic ink layer 130 with respect to flexible base plate 110 and tft layer 120, and wherein the angle of the first obtuse angle M1 is greater than 90 degree and less than 100 degree.
In view of the above, when carrying out the coating of frame glue 160, because water barrier 150 is up-narrow and down-wide trapezoidal cross-section structure with electronic ink layer 130, the frame glue 160 at end face T1 place can run underneath to the surperficial S1 of tft layer 120 along sidewall A1, Electronic Paper unit 100 is at this moment become stride glue type structure, help in the area of limited flexible base plate 110, the bubble that effectively frame glue 160 is produced in flow process is discharged corner (bubble discharge path L1 as shown in fig. 1), so can increase the air ability that blocks of frame glue 160.
Fig. 2 is the synoptic diagram according to a kind of Electronic Paper unit of another embodiment of the present invention.Please refer to Fig. 2, in the present embodiment, different with the foregoing description is, the end face T2 of water barrier 250 is in the frontal projected area of surperficial S1, greater than the bottom surface B2 of electronic ink layer 230 frontal projected area at surperficial S1.At this, the common formation of one end face of water barrier 250 and an end face of electronic ink layer 230 one sidewall A2, and sidewall A2 and surperficial S1 press from both sides one first acute angle N1, this first acute angle N1 is in fact greater than 80 degree and less than 90 degree, so that the water barrier 250 of Electronic Paper unit 200 presents trapezoidal cross-section structure wide at the top and narrow at the bottom with electronic ink layer 230, frame glue 260 can be inserted sidewall A2 and surperficial S1 constitutes in the groove, and forms a strike-through type structure.The distance L 1 that this measure can make frame glue 260 coating backs cover at surperficial S1 is longer.In other words, Wai Jie aqueous vapor just is not easy to invade to electronic ink layer 230 and causes Electronic Paper unit 200 to lose efficacy.Compared to Figure 1, though though when coating frame glue 260 bottom corner may have bubble slightly and exist, can be in the area of limited flexible base plate 110, increase the frame glue 260 gas distance L 1 that blocks water effectively, gas is preferable so it blocks water.
Fig. 3 is the partial schematic diagram according to a kind of cutting equipment of one embodiment of the invention.Please also refer to Fig. 2 and Fig. 3, in the present embodiment, cutting equipment 300 comprises a platform 310, a laser cell 320 and a cutter 330 and a catoptron 340 corresponding to platform 310 settings, wherein cutter 330 for example is a steel knife unit, cutter 330 can carry out the adjustment of lifting and angle with respect to platform 310, the quality of the steel knife unit flywheel knife unit hardness habitual than prior art is low, knife edge place is not sharper yet simultaneously, usually between 10 microns (μ m) and 30 microns (μ m), steel knife unit material can be iron-nickel alloy to the width range at knife edge place, steel knife unit.Catoptron 340 is in adjustable angle corresponding to platform 310 and laser cell 320 configurations.When laser cell 320 penetrated a laser beam R1, laser beam R1 reflected via catoptron 340, and makes laser beam R1 and platform 310 folders one second obtuse angle C2.At this, the totalling of the second obtuse angle C2 and the first acute angle N1 is 180 degree, also be in the Electronic Paper unit 200 of Fig. 2 the first folded acute angle N1 of sidewall A2 and surperficial S1 be via and platform 310 between press from both sides the second obtuse angle C2 laser beam R1 cut and form.
Similarly, in another not shown embodiment of the present invention, the user also can adjust the angle of catoptron 340, press from both sides one second acute angle between laser beam and the platform 310 and make, in the Electronic Paper unit 100 after cutting as shown in Figure 1 with correspondence, the first obtuse angle M1 that sidewall A1 and surperficial S1 are folded is 180 degree and make adding of the first obtuse angle M1 and second acute angle always.
In addition, cutting equipment 300 also comprises an absorption roller 350, liftable be provided with corresponding to platform 310 rotationally.After Electronic Paper unit 100 or 200 is finished by 330 cuttings of laser cell 320 or cutter, by this absorption roller 350 and Electronic Paper unit 100 or 200 can be taken off from platform 310.
Fig. 4 is the process flow diagram according to the method for making of a kind of Electronic Paper of one embodiment of the invention, and Fig. 5 is the synoptic diagram of Electronic Paper unit in the method for making of Fig. 4.Please also refer to Fig. 4 and Fig. 5, at this, present embodiment is only made target to describe with the embodiment of Fig. 1.At first, in step S401, provide a rigid substrate 170, it for example is a glass substrate.Then in step S402, coating one from shape layer 180 on rigid substrate 170.Then in step S403～S407, dispose flexible base plate 110, tft layer 120, adhesive coating 140, electronic ink layer 130 and water barrier 150 in regular turn at rigid substrate 170 and on shape layer 180, so that above-mentioned each layer forms an Electronic Paper array 10.At this, the architectural feature of Electronic Paper array 10 illustrates in the embodiment of above-mentioned Fig. 1 and Fig. 2, just repeats no more at this.
Then, Fig. 6 is the synoptic diagram of Electronic Paper unit when cutting of Fig. 5.Please also refer to Fig. 3 to Fig. 6, in step S408, this Electronic Paper array 10 is placed on the platform 310 of cutting equipment 300.
In step S409, the cutting equipment (as: laser cell 320 or cutter 330) by cutting equipment 300 cuts into a plurality of Electronic Paper unit 100 with Electronic Paper array 10.In the embodiment that uses cutter 330 cutting Electronic Paper arrays 10, cutter 330 can be the steel knife unit, because the quality of steel knife unit is softer, wears rigid substrate 170 so can't cut, and helps rigid substrate 170 recycling uses.In like manner, if what use is the laser cell 320 (for example the far infrared carbon dioxide laser has stronger absorptivity to plastics) of low-power, high absorbed rate, also can avoid cutting and wear rigid substrate 170, can reach the technology effect of rigid substrate 170 recycling uses equally.Yet, in other embodiments, also can use the habitual flywheel knife unit of prior art to replace the steel knife unit, but because the quality of flywheel knife unit is harder, and be not easy control cutting power, cut easily and wear or damage rigid substrate 170, cause the directly recycling use of rigid substrate 170.
Then, in step S410, coating frame glue 160 (being shown in Fig. 1) are around each Electronic Paper unit 100 and solidify frame glue 160.Decide according to the kind of frame glue 160 in these means of solidifying frame glue 160, present embodiment is not limited to this.
After treating that frame glue 160 solidifies, in step S411, can take off Electronic Paper unit 100 from rigid substrate 170 by absorption roller 350.
At last, in step S412, clean and reclaim rigid substrate 170.
In the step S409 of present embodiment, the user can be by cutting flexible base plate 110, tft layer 120, adhesive coating 140, electronic ink layer 130 and water barrier 150 with the laser beam at platform 310 folder second acute angles or second obtuse angle, and continue to be cut to rigid substrate 170 places (as shown in Figure 6) downwards, so that Electronic Paper unit 100 is cut off fully.
On the other hand, in another not shown embodiment of the present invention, the user also can be only with behind laser beam cutting flexible base plate 110, tft layer 120, adhesive coating 140, electronic ink layer 130 and the water barrier 150, with the rigid substrate 170 of steel knife unit 330 cuttings, also can reach the purpose that Electronic Paper unit 100 is cut off fully again.At this, whether the present invention does not limit steel knife unit 330 and needs and laser cell 320 cutting of arranging in pairs or groups.
In the present embodiment, the laser beam of laser cell 320 can be the laser beam of a Gaussian distribution, between 100 watts/pulse (W/pulse) and 650 watts/pulse (W/pulse), perhaps its heat scope that is produced in the unit interval is between 105 card/seconds (cal/s) and 4.1868 * 105 card/seconds (cal/s) in power bracket that unit pulse provided for they.In view of the above, when cutting Electronic Paper array 10, laser beam is heat-treated the commissure between flexible base plate 110 and the adhesive coating 130, avoids the possible warpage of peeling off to increase the stickability between each layer.
Fig. 7 is the partial top view in Fig. 5 cutting process.Please also refer to Fig. 5 and Fig. 6, what deserves to be mentioned is, for the Electronic Paper unit 100 after the cutting can be taken off from rigid substrate 170 easily, therefore in step S409, four Cutting Road U1 of each Electronic Paper unit 100, U2, among U3 and the U4, a Cutting Road U1 is cut to rigid substrate 170 therein, and its excess-three Cutting Road U2, U3 and U4 only need be cut to flexible base plate 110 and get final product, so, Electronic Paper unit 100 just can take off from rigid substrate 170 by absorption roller 350 easily from Cutting Road U1, then can stay on the rigid substrate 170 from shape layer 180.
In sum, in the above embodiment of the present invention, by the laser cell of cutting equipment, and the Electronic Paper unit is cut into the sidewall with obtuse angle or acute angle, take place and reduce the situation that aqueous vapor is invaded electronic ink layer and can effectively reduce bubble when making follow-up coating frame glue.
In addition, cutting equipment has laser cell and steel knife unit, wherein the laser cell decapacitation reaches by catoptron outside the angle of above-mentioned sidewall, also can be in cutting to heat-treating between the flexible base plate of Electronic Paper unit and the adhesive coating, and then increase stickability between each layer.In addition, arrange in pairs or groups mutually, also can effectively improve the prouctiveness of cutting technique by laser cell and steel knife unit.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (21)
1. an Electronic Paper unit is characterized in that, comprising:
One flexible base plate;
One tft layer is configured on this flexible base plate;
One electronic ink layer is configured on the surface of this tft layer;
One water barrier is configured on this electronic ink layer, and an end face of this water barrier and an end face of this electronic ink layer are common to constitute a sidewall, and this sidewall and this clip surface one first acute angle or one first obtuse angle; And
One frame glue, coating covers on this sidewall and this surface.
2. Electronic Paper as claimed in claim 1 unit is characterized in that, an end face of this water barrier is in this surperficial frontal projected area, less than a bottom surface of this electronic ink layer in this surperficial frontal projected area.
3. Electronic Paper as claimed in claim 1 unit is characterized in that, an end face of this water barrier is in this surperficial frontal projected area, greater than a bottom surface of this electronic ink layer in this surperficial frontal projected area.
4. Electronic Paper as claimed in claim 1 unit is characterized in that, also comprises an adhesive coating, is configured between this tft layer and this electronic ink layer.
5. Electronic Paper as claimed in claim 1 unit is characterized in that, the angle of this first acute angle is greater than 80 degree and less than 90 degree.
6. Electronic Paper as claimed in claim 1 unit is characterized in that, the angle at this first obtuse angle is greater than 90 degree and less than 100 degree.
7. a cutting equipment is characterized in that, comprising:
One platform;
One laser cell is corresponding to this platform configuration;
One cutter is liftably corresponding to disposing on this platform; And
One catoptron, in adjustable angle corresponding to the configuration of this platform and this laser cell, when this laser cell penetrated a laser beam, this laser beam was through this mirror reflects, and with this platform clamp one second acute angle or one second obtuse angle.
8. cutting equipment as claimed in claim 7 is characterized in that, this laser beam is the laser beam of a Gaussian distribution.
9. cutting equipment as claimed in claim 7 is characterized in that, this laser beam in power bracket that unit pulse provided between 100 watts/pulse and 650 watts/pulse.
10. cutting equipment as claimed in claim 7 is characterized in that the heat scope that this laser beam is produced is between 105 card/seconds and 4.1868 * 105 card/seconds in the unit interval.
11. cutting equipment as claimed in claim 7 is characterized in that, also comprises:
One absorption roller, liftable with rotationally corresponding to disposing on this platform.
12. the method for making of an Electronic Paper unit is characterized in that, comprising:
One rigid substrate is provided;
Dispose a flexible base plate, a tft layer, an electronic ink layer and a water barrier in regular turn on this rigid substrate, to form an Electronic Paper array;
Provide just like any described cutting equipment of claim 7 to 10, and the Electronic Paper array is placed on this platform;
Cut this Electronic Paper array to form a plurality of Electronic Paper unit by this cutting equipment;
Coating frame glue is around this Electronic Paper unit respectively; And
Take off those Electronic Paper unit from this rigid substrate.
13. the method for making of Electronic Paper as claimed in claim 12 unit is characterized in that, this cutting equipment cuts this Electronic Paper array and comprises with the step that forms a plurality of Electronic Paper unit:
By cutting this flexible base plate, this tft layer, this electronic ink layer and this water barrier with this laser beam at this second acute angle of this platform clamp or this second obtuse angle.
14. the method for making of Electronic Paper as claimed in claim 12 unit is characterized in that, this cutting equipment cuts this Electronic Paper array and also comprises with the step that forms a plurality of Electronic Paper unit:
By cutting this rigid substrate with this laser beam at this second acute angle of this platform clamp or this second obtuse angle.
15. the method for making of Electronic Paper as claimed in claim 12 unit is characterized in that, this cutting equipment cuts this Electronic Paper array and also comprises with the step that forms a plurality of Electronic Paper unit:
By this this rigid substrate of steel knife unit cutting.
16. the method for making of Electronic Paper as claimed in claim 12 unit is characterized in that, also comprises:
The configuration one from the shape layer between this rigid substrate and this flexible base plate.
17. the method for making of Electronic Paper as claimed in claim 12 unit is characterized in that, also comprises:
Dispose an adhesive coating between this tft layer and this electronic ink layer.
18. the method for making of Electronic Paper as claimed in claim 17 unit is characterized in that, this cutting equipment cuts this Electronic Paper array and comprises with the step that forms a plurality of Electronic Paper unit:
By cutting this flexible base plate, this adhesive coating, this tft layer, this electronic ink layer and this water barrier, and the commissure between this flexible base plate and this adhesive coating is heat-treated with this second acute angle of this platform clamp or this this laser beam of second obtuse angle.
19. the method for making of Electronic Paper as claimed in claim 12 unit, it is characterized in that, one end face of this water barrier in one of those Electronic Paper unit and an end face of this electronic ink layer are common to constitute a sidewall, and a clip surface one first acute angle or one first obtuse angle of this sidewall and this tft layer.
20. the method for making of Electronic Paper as claimed in claim 19 unit is characterized in that, the totalling of the totalling at this first acute angle and this second obtuse angle or this first obtuse angle and this second acute angle equals 180 degree.
21. the method for making of Electronic Paper as claimed in claim 12 unit is characterized in that, also comprises:
Cleaning also reclaims this rigid substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99144527 | 2010-12-17 | ||
| TW099144527 | 2010-12-17 |
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| Publication Number | Publication Date |
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| CN102109728A true CN102109728A (en) | 2011-06-29 |
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| CN 201110026774 Pending CN102109728A (en) | 2010-12-17 | 2011-01-20 | Electronic paper unit, cutting equipment and manufacturing method of electronic paper unit |
| CN201110402638.4A Active CN102654711B (en) | 2010-12-17 | 2011-11-30 | Electronic paper unit and manufacturing method thereof |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110402638.4A Active CN102654711B (en) | 2010-12-17 | 2011-11-30 | Electronic paper unit and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108717832A (en) * | 2018-06-04 | 2018-10-30 | 京东方科技集团股份有限公司 | Display base plate motherboard and preparation method thereof and cutting method, display base plate and display device |
| CN108828871A (en) * | 2018-07-24 | 2018-11-16 | 上海天马微电子有限公司 | Manufacturing method of flexible electronic paper and flexible electronic paper device thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112577539A (en) * | 2020-12-07 | 2021-03-30 | 潍坊歌尔微电子有限公司 | Waterproof sensor and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0460513A (en) * | 1990-06-28 | 1992-02-26 | Sharp Corp | Production of liquid crystal display element |
| JP2006154515A (en) * | 2004-11-30 | 2006-06-15 | Koninkl Philips Electronics Nv | Electronic ink display apparatus and manufacturing method therefor |
| JP2007322766A (en) * | 2006-06-01 | 2007-12-13 | Seiko Epson Corp | Liquid crystal display device and electronic equipment |
| CN101833215B (en) * | 2009-03-09 | 2013-07-10 | 财团法人工业技术研究院 | Transfer structure of flexible electronic device and manufacturing method thereof |
| KR101552729B1 (en) * | 2009-04-30 | 2015-09-11 | 엘지디스플레이 주식회사 | method of manufacturing a flexible display device |
| CN101872100B (en) * | 2010-06-18 | 2011-12-14 | 友达光电股份有限公司 | Electronic ink display and manufacturing method thereof |
| CN101916022B (en) * | 2010-07-06 | 2012-10-10 | 友达光电股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN101916733B (en) * | 2010-07-12 | 2012-07-04 | 友达光电股份有限公司 | Manufacturing method of display panel |
-
2011
- 2011-01-20 CN CN 201110026774 patent/CN102109728A/en active Pending
- 2011-11-30 CN CN201110402638.4A patent/CN102654711B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108717832A (en) * | 2018-06-04 | 2018-10-30 | 京东方科技集团股份有限公司 | Display base plate motherboard and preparation method thereof and cutting method, display base plate and display device |
| CN108717832B (en) * | 2018-06-04 | 2020-04-24 | 京东方科技集团股份有限公司 | Display substrate mother board, preparation method and cutting method thereof, display substrate and display device |
| CN108828871A (en) * | 2018-07-24 | 2018-11-16 | 上海天马微电子有限公司 | Manufacturing method of flexible electronic paper and flexible electronic paper device thereof |
| CN108828871B (en) * | 2018-07-24 | 2021-08-24 | 上海天马微电子有限公司 | Manufacturing method of flexible electronic paper and flexible electronic paper device thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102654711B (en) | 2014-07-09 |
| CN102654711A (en) | 2012-09-05 |
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Application publication date: 20110629 |