CN102654711B - Electronic paper unit and manufacturing method thereof - Google Patents
Electronic paper unit and manufacturing method thereof Download PDFInfo
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- CN102654711B CN102654711B CN201110402638.4A CN201110402638A CN102654711B CN 102654711 B CN102654711 B CN 102654711B CN 201110402638 A CN201110402638 A CN 201110402638A CN 102654711 B CN102654711 B CN 102654711B
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- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 238000000576 coating method Methods 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 25
- 230000001154 acute effect Effects 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 43
- 239000012528 membrane Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 42
- 230000004888 barrier function Effects 0.000 claims description 41
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000010409 thin film Substances 0.000 abstract 4
- 238000010586 diagram Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Laser Beam Processing (AREA)
Abstract
An electronic paper unit and a manufacturing method thereof are provided, wherein the electronic paper unit comprises a flexible substrate, a thin film transistor layer, an electronic ink layer, a waterproof layer and a frame glue. The thin film transistor layer is disposed on the flexible substrate. The electronic ink layer is disposed on a surface of the thin film transistor layer. The waterproof layer is disposed on the electronic ink layer. The end face of the waterproof layer and the end face of the electronic ink layer jointly form a side wall, and a first acute angle or a first obtuse angle is formed between the side wall and the surface. The frame glue is coated on the side wall and the surface. The manufacturing method of the electronic paper unit comprises the steps of providing a hard substrate; sequentially disposing a flexible substrate, a thin film transistor layer, an electronic ink layer and a waterproof layer on the hard substrate to form an electronic paper array; cutting the electronic paper array to form a plurality of electronic paper units; coating and curing frame glue around each electronic paper unit; and removing the electronic paper units from the hard substrate.
Description
Technical field
The present invention relates to a kind of Electronic Paper and preparation method thereof, particularly the method for making of a kind of Electronic Paper unit and Electronic Paper unit.
Background technology
In recent years, Electronic Paper (E-paper) and e-book (E-book) are just flourish, have gentlier, display thinner and deflection characteristic will become the trend of following main development.
But flexible base plate has the restriction of many materials own, therefore cannot be suitable for current glass substrate technique completely.Therefore,, as existing equipment how improves, become just can be applicable to the making of flexible base plate the problem that related personnel need solve.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of Electronic Paper unit, and it has preferably durability.Another technical matters to be solved by this invention is to provide the method for making of a kind of Electronic Paper unit, can produce the Electronic Paper unit with better durability.
To achieve these goals, the invention provides a kind of Electronic Paper unit, wherein, comprising:
One flexible base plate;
One membrane transistor layer, is configured on this flexible base plate;
One electronic ink layer, is configured on a surface of this membrane transistor layer;
One water barrier, is configured in this electronic ink layer, and an end face of this water barrier and an end face of this electronic ink layer are common forms a sidewall, and this sidewall and this clip surface one first acute angle or one first obtuse angle; And
One frame glue, coating covers on this sidewall and this surface.
Above-mentioned Electronic Paper unit, wherein, an end face of this water barrier, in this surperficial frontal projected area, is less than a bottom surface of this electronic ink layer in this surperficial frontal projected area.
Above-mentioned Electronic Paper unit, wherein, an end face of this water barrier, in this surperficial frontal projected area, is greater than a bottom surface of this electronic ink layer in this surperficial frontal projected area.
Above-mentioned Electronic Paper unit, wherein, also comprises an adhesive coating, is configured between this membrane transistor layer and this electronic ink layer.
Above-mentioned Electronic Paper unit, wherein, the angle of this first acute angle is greater than 80 degree and is less than 90 degree.
Above-mentioned Electronic Paper unit, wherein, the angle at this first obtuse angle is greater than 90 degree and is less than 100 degree.
In order to realize better above-mentioned purpose, the present invention also provides the method for making of a kind of Electronic Paper unit, wherein, comprising:
One rigid substrate is provided;
Sequentially configure a flexible base plate, a membrane transistor layer, an electronic ink layer and a water barrier on this rigid substrate, to form an Electronic Paper array;
Cut this Electronic Paper array to form multiple Electronic Paper unit;
Coating curing frame glue are in each this Electronic Paper unit around; And
Take off those Electronic Paper unit from this rigid substrate.
The method for making of above-mentioned Electronic Paper unit, wherein, cut this Electronic Paper array and also comprise with the step that forms multiple Electronic Paper unit:
Cut and wear this water barrier and this electronic ink layer, to manifest a surface of this membrane transistor layer; And
Cut and wear this membrane transistor layer and this flexible base plate.
The method for making of above-mentioned Electronic Paper unit, wherein, cut and wear this water barrier and this electronic ink layer, also comprise with this surperficial step that manifests this membrane transistor layer: cut and wear this water barrier and this electronic ink layer, make the common formation of an end face of this water barrier and an end face of this electronic ink layer one sidewall, and this clip surface one first acute angle or one first obtuse angle of this sidewall and this membrane transistor layer.
The method for making of above-mentioned Electronic Paper unit, wherein, cut this Electronic Paper array and also comprise with the step that forms multiple Electronic Paper unit:
Cut this rigid substrate and become multiple rigid unit.
The method for making of above-mentioned Electronic Paper unit, wherein, by a laser cell to cut this water barrier, this electronic ink layer, this membrane transistor layer and this flexible base plate, so that the cut surface of each layer is heat-treated.
The method for making of above-mentioned Electronic Paper unit, wherein, also comprises:
Configuration one from shape layer between this rigid substrate and this flexible base plate.
The method for making of above-mentioned Electronic Paper unit, wherein, cut the step of wearing this membrane transistor layer and this flexible base plate and also comprise:
Cut and wear this from shape layer.
The method for making of above-mentioned Electronic Paper unit, wherein, also comprises:
Configure an adhesive coating between this membrane transistor layer and this electronic ink layer.
The method for making of above-mentioned Electronic Paper unit, wherein, cuts and wears this water barrier and this electronic ink layer, also comprises with this surperficial step that manifests this membrane transistor layer:
Cut and wear this adhesive coating, to manifest this surface of this membrane transistor layer.
The method for making of above-mentioned Electronic Paper unit, wherein, also comprises:
Clean and reclaim this rigid substrate.
Technique effect of the present invention is: Electronic Paper of the present invention unit has preferably durability, method for making of the present invention cuts into the sidewall with obtuse angle or acute angle by cutting equipment by Electronic Paper unit, occurs and reduces aqueous vapor and invade the situation of electronic ink layer and can effectively reduce bubble when making follow-up coating frame glue.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Brief description of the drawings
Fig. 1 is the schematic diagram according to a kind of Electronic Paper unit of one embodiment of the invention;
Fig. 2 is the schematic diagram according to a kind of Electronic Paper unit of another embodiment of the present invention;
Fig. 3 is the partial schematic diagram according to a kind of cutting equipment of one embodiment of the invention;
Fig. 4 A is the process flow diagram according to the method for making of a kind of Electronic Paper of one embodiment of the invention;
Fig. 4 B is the process flow diagram of the method for making of a kind of Electronic Paper of another embodiment of the present invention;
The schematic diagram of Electronic Paper unit in the method for making that Fig. 5 A to Fig. 5 C is Fig. 4;
Fig. 5 D is the wherein schematic diagram of a step of process flow diagram of contrast Fig. 4 B.
Wherein, Reference numeral
100,200 Electronic Paper unit
110 flexible base plates
120 membrane transistor layers
130,230 electronic ink layer
140 adhesive coatings
150,250 water barriers
160,260 frame glue
170 rigid substrates
The rigid unit of 170a
180 from shape layer
300 cutting equipments
310 platforms
320 laser cells
330 cutters
340 catoptrons
350 absorption rollers
A1, A2 sidewall
B1, B2 bottom surface
C2 the second obtuse angle
L1 bubble discharge path
M1 the first obtuse angle
N1 the first acute angle
R1 laser beam
S1 surface
T1, T2 end face
Embodiment
Below in conjunction with accompanying drawing, structural principle of the present invention and principle of work are described in detail:
Fig. 1 is the schematic diagram according to a kind of Electronic Paper unit of one embodiment of the invention.Please refer to Fig. 1, in the present embodiment, Electronic Paper unit 100 can comprise a flexible base plate 110, a membrane transistor layer 120, an electronic ink layer 130, an adhesive coating 140, a water barrier 150 and a frame glue 160.Flexible base plate 110 can be the film substrate of polyimide (Polyimide) material.Membrane transistor layer 120 is configured on flexible base plate 110.Electronic ink layer 130 is configured on a surperficial S1 of membrane transistor layer 120, wherein electronic ink layer 130 can link together by adhesive coating 140 with membrane transistor layer 120, electronic ink layer 130 can be electrophoresis-type (Electro Phoretic, EP) show film, adhesive coating 140 can be transparent optical cement (Optical Clear Adhesive, OCA), adhesive coating 140 is configurable between membrane transistor layer 120 and electronic ink layer 130.Water barrier 150 is configured in electronic ink layer 130, and the common formation of an end face of water barrier 150 and an end face of electronic ink layer 130 one sidewall A1, and sidewall A1 and surperficial S1 folder one first obtuse angle M1, make water barrier 150 and electronic ink layer 130 there is respectively a up-narrow and down-wide trapezoidal cross-section structure, this first obtuse angle M1 is greater than in fact 90 degree and is less than 100 degree, water barrier 150 can be the waterproof membrane of polyethylene terephthalate (Polyethylene Terephthalate, PET) material.In addition, water barrier 150 can be disposed in electronic ink layer 130 with attaching, coating or other suitable way.160 coatings of frame glue cover on sidewall A1 and surperficial S1.
In the present embodiment, one end face T1 of water barrier 150 is in the frontal projected area of surperficial S1, be less than a bottom surface B1 of electronic ink layer 130 in the frontal projected area of surperficial S1, that is the water barrier 150 of Electronic Paper unit 100 now presents up-narrow and down-wide trapezoidal cross-section structure with electronic ink layer 130 with respect to flexible base plate 110 and membrane transistor layer 120, wherein the angle of the first obtuse angle M1 is greater than 90 degree and is less than 100 degree.
Accordingly, in the time carrying out the coating of frame glue 160, because water barrier 150 and electronic ink layer 130 are all up-narrow and down-wide trapezoidal cross-section structure, the frame glue 160 at end face T1 place can run underneath to along sidewall A1 the surperficial S1 of membrane transistor layer 120, make Electronic Paper unit 100 now become one across glue type structure, be conducive in the area of limited flexible base plate 110, the bubble effectively frame glue 160 being produced in flow process is discharged corner (bubble discharge path L1 as shown in Figure 1), therefore can increase the ability of air that blocks of frame glue 160.
Fig. 2 is the schematic diagram according to a kind of Electronic Paper unit of another embodiment of the present invention.Please refer to Fig. 2, in the present embodiment, different from above-described embodiment, the end face T2 of water barrier 250, in the frontal projected area of surperficial S1, is greater than the bottom surface B2 of electronic ink layer 230 in the frontal projected area of surperficial S1.At this, the common formation of one end face of water barrier 250 and an end face of electronic ink layer 230 one sidewall A2, and sidewall A2 and surperficial S1 folder one first acute angle N1, this first acute angle N1 is greater than in fact 80 degree and is less than 90 degree, so that the water barrier 250 of Electronic Paper unit 200 presents trapezoidal cross-section structure wide at the top and narrow at the bottom with electronic ink layer 230, frame glue 260 can be inserted sidewall A2 and surperficial S1 forms among groove, and forms a strike-through type structure.This measure can make the distance L 1 covering at surperficial S1 after 260 coatings of frame glue longer.In other words, extraneous aqueous vapor is just not easy to invade to electronic ink layer 230 and causes Electronic Paper unit 200 to lose efficacy.Compared to Figure 1, although bottom corner may slightly have bubble and exists in the time of coating frame glue 260, can be in the area of limited flexible base plate 110, effectively increase the frame glue 260 gas distance L 1 that blocks water, therefore it blocks water, gas is better.
Fig. 3 is the partial schematic diagram according to a kind of cutting equipment of one embodiment of the invention.Please also refer to Fig. 2 and Fig. 3, in the present embodiment, cutting equipment 300 can comprise a platform 310 and the laser cell 320 and the catoptron 340 that arrange corresponding to platform 310, wherein configures corresponding to platform 310 and laser cell 320 in adjustable angle by catoptron 340.In the time that laser cell 320 penetrates a laser beam R1, laser beam R1 reflects via catoptron 340, and makes laser beam R1 and platform 310 press from both sides one second obtuse angle C2.At this, the totalling of the second obtuse angle C2 and the first acute angle N1 is about 180 degree, that is in the Electronic Paper unit 200 of Fig. 2 sidewall A2 and folded the first acute angle N1 of surperficial S1 be via and platform 310 between press from both sides the second obtuse angle C2 laser beam R1 cut and form.
Similarly, in the present invention in another embodiment not illustrating, user is the angle of capable of regulating catoptron 340 also, and make to press from both sides between laser beam and platform 310 one second acute angle, in Electronic Paper unit 100 after cutting as shown in Figure 1 with correspondence, the first obtuse angle M1 that sidewall A1 and surperficial S1 are folded, and make the totalling of the first obtuse angle M1 and the second acute angle also be about 180 degree.It should be noted that, the angle of catoptron control laser beam is a kind of control mode wherein, there is various ways capable of regulating laser beam angle perhaps, as this makes it can make sample edge form obtuse angle or acute angle perpendicular to sample surfaces as Gaussian distribution to utilize laser beam, but be not limited to this, can select appropriate ways to adjust laser beam angle according to actual demand.
In addition, cutting equipment 300 also can comprise an absorption roller 350, liftable with arrange corresponding to platform 310 rotationally.After Electronic Paper array has been cut by laser cell 320, Electronic Paper unit 100 or 200 can be taken off from platform 300 by this absorption roller 350.
In the present invention in another embodiment not illustrating, can also replace above-mentioned laser cell 320 in a cutting knife unit, this cutting knife unit is suitable for cutting the object that pliability is high, its along perpendicular to platform 310 or with respect to platform 310 along an inclination angle translation cut out Electronic Paper unit 100 or 200, can reach equally the above-mentioned effect that cuts out the Electronic Paper unit 100 or 200 with inclination angle with laser cell 320.
Fig. 4 A is the process flow diagram according to the method for making of a kind of Electronic Paper of one embodiment of the invention, and Fig. 5 A to Fig. 5 C is the schematic diagram of Electronic Paper unit in the method for making of Fig. 4 A.Please also refer to Fig. 4 A and Fig. 5 A to Fig. 5 C, at this, the present embodiment only describes as an example of the embodiment of Fig. 1 example.First, in step S401, provide a rigid substrate 170, it is for example a glass substrate.Then in step S402, configurable one from shape layer 180 on rigid substrate 170, configuration mode can be coating, attaching or other modes.Then in step S403～S407, sequentially configurable flexible base plate 110, membrane transistor layer 120, adhesive coating 140, electronic ink layer 130 and water barrier 150 are at rigid substrate 170 and on shape layer 180, so that above-mentioned each layer of formation one Electronic Paper array 10 (as shown in Figure 5A), the wherein convenience based on technique, can be continuous rete from shape layer 180 and flexible base plate 110, and membrane transistor layer 120, adhesive coating 140, electronic ink layer 130 and water barrier 150 can be discontinuous rete.
Then, wish cutting Electronic Paper array 10, to form multiple Electronic Paper unit 100, can cut this Electronic Paper array 10 by cutting equipment as shown in Figure 3.With figure below only taking the Electronic Paper unit 100 of laser cell 320 and Fig. 1 as example is described.Please refer to Fig. 4 A, 4B and Fig. 5 B, in step S408, can cut and wear water barrier 150, electronic ink layer 130 and adhesive coating 140, to manifest the surperficial S1 (as Fig. 1) of membrane transistor 120, specifically, cut and wear water barrier 150 and electronic ink layer 130, make an end face of water barrier 150 and an end face of electronic ink layer 130 jointly form sidewall A1, and the surperficial S1 of sidewall A1 and membrane transistor layer 120 presss from both sides the first obtuse angle M1.Then, in step S409 and Fig. 5 C, can cut wear membrane transistor layer 120, flexible base plate 110 with from shape layer 180.Then,, in step S410, coating frame glue 160 is around each Electronic Paper unit 100, and curing frame glue 160 (seeing Fig. 1); And in step S411, can take off Electronic Paper unit 100 from rigid substrate 170 by the absorption roller 350 shown in Fig. 3.Finally, in step S412, clean and reclaim rigid substrate 180, rigid substrate 180 can reclaim and re-use.The present embodiment only describes as an example of the embodiment of Fig. 1 example, but can also identical method for making completes the Electronic Paper unit embodiment of Fig. 2, is not repeated herein.
It should be noted that at this, in the present embodiment, be attached on rigid substrate 170 and do not peel off along with Electronic Paper unit 100 from shape layer 180, so the present embodiment is not limited to this, that is do not affecting under the function of Electronic Paper unit 100, also can be along with Electronic Paper unit 100 is peeled off from rigid substrate 180 together from shape layer 180.
In addition, the present embodiment cuts each rete of above-mentioned Electronic Paper unit 100 by laser cell 320, except completing above-mentioned cutting effect, in its cutting, also can heat-treat each rete.This measure can improve the stickability of each rete and improve the adhesion between rete.This measure is the above-mentioned effect that is beyond one's reach while cutting Electronic Paper array with cutting knife.Fig. 4 B is the process flow diagram of the method for making of a kind of Electronic Paper of another embodiment of the present invention.Fig. 5 D is the wherein schematic diagram of a step of process flow diagram of contrast Fig. 4 B.Please also refer to Fig. 4 B and contrast Fig. 5 A to Fig. 5 D, different from above-described embodiment is, cutting equipment 300 also can comprise a cutter 330 (referring to Fig. 3), it is for example the flywheel knife for cutting rigid substrate 170, also can be along the cutter unit of cutter hub axle center rotation except translation when flywheel knife cutting, be suitable for the harder material of cutting.After completing steps 409, in step S413, cut 170 one-tenth multiple rigid unit 170a of rigid substrate with cutter 330 again, then be to be coated with frame glue 160 around each Electronic Paper unit 100 in step S414, and curing frame glue 160 (seeing Fig. 1), and take off Electronic Paper unit 100 from rigid unit 170a in step S415.The corresponding flow process of carrying out when this measure is limited to board or process conditions and cannot be reclaimed in response to rigid substrate 170, can reach effect same as the previously described embodiments equally.
In sum, in the above embodiment of the present invention, by cutting equipment, Electronic Paper unit is cut into the sidewall with obtuse angle or acute angle, occur and reduce aqueous vapor and invade the situation of electronic ink layer and can effectively reduce bubble when making follow-up coating frame glue.
In addition, cutting equipment can have laser cell or cutting knife unit, and wherein laser cell can be in cutting be heat-treated between flexible base plate to Electronic Paper unit and adhesive coating, and then increases the stickability between each layer.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (14)
1. a method for making for Electronic Paper unit, is characterized in that, comprising:
One rigid substrate is provided;
Sequentially configure a flexible base plate, a membrane transistor layer, an electronic ink layer and a water barrier on this rigid substrate, to form an Electronic Paper array;
Cut this Electronic Paper array to form multiple Electronic Paper unit; Coating curing frame glue are in each this Electronic Paper unit around; And
Take off those Electronic Paper unit from this rigid substrate;
Wherein, cutting this Electronic Paper array also comprises with the step that forms multiple Electronic Paper unit:
Cut and wear this water barrier and this electronic ink layer, to manifest a surface of this membrane transistor layer; And
Cut and wear this membrane transistor layer and this flexible base plate;
Wherein, by a laser cell to cut this water barrier, this electronic ink layer, this membrane transistor layer and this flexible base plate, so that the cut surface of each layer is heat-treated.
2. the method for making of Electronic Paper as claimed in claim 1 unit, it is characterized in that, cut and wear this water barrier and this electronic ink layer, also comprise with this surperficial step that manifests this membrane transistor layer: cut and wear this water barrier and this electronic ink layer, make the common formation of an end face of this water barrier and an end face of this electronic ink layer one sidewall, and this clip surface one first acute angle or one first obtuse angle of this sidewall and this membrane transistor layer.
3. the method for making of Electronic Paper as claimed in claim 1 unit, is characterized in that, cuts this Electronic Paper array and also comprises with the step that forms multiple Electronic Paper unit:
Cut this rigid substrate and become multiple rigid unit.
4. the method for making of Electronic Paper as claimed in claim 1 unit, is characterized in that, also comprises:
Configuration one from shape layer between this rigid substrate and this flexible base plate.
5. the method for making of Electronic Paper as claimed in claim 4 unit, is characterized in that, cuts the step of wearing this membrane transistor layer and this flexible base plate and also comprises:
Cut and wear this from shape layer.
6. the method for making of Electronic Paper as claimed in claim 1 unit, is characterized in that, also comprises:
Configure an adhesive coating between this membrane transistor layer and this electronic ink layer.
7. the method for making of Electronic Paper as claimed in claim 6 unit, is characterized in that, cuts and wears this water barrier and this electronic ink layer, also comprises with this surperficial step that manifests this membrane transistor layer:
Cut and wear this adhesive coating, to manifest this surface of this membrane transistor layer.
8. the method for making of Electronic Paper as claimed in claim 1 unit, is characterized in that, also comprises:
Clean and reclaim this rigid substrate.
9. an Electronic Paper unit, uses the method for making of the Electronic Paper unit described in any one in the claims 1-8 to make, and it is characterized in that, comprising:
One flexible base plate;
One membrane transistor layer, is configured on this flexible base plate;
One electronic ink layer, is configured on a surface of this membrane transistor layer;
One water barrier, be configured in this electronic ink layer, cut and wear this water barrier and this electronic ink layer to manifest a surface of this membrane transistor layer by a laser cell, make the common formation of an end face of this water barrier and an end face of this electronic ink layer one sidewall, and this sidewall and this clip surface one first acute angle or one first obtuse angle;
Cut and wear this membrane transistor layer and this flexible base plate by this laser cell, so that the cut surface of each layer is heat-treated; And
One frame glue, coating covers on this sidewall and this surface.
10. Electronic Paper as claimed in claim 9 unit, is characterized in that, an end face of this water barrier, in this surperficial frontal projected area, is less than a bottom surface of this electronic ink layer in this surperficial frontal projected area.
11. Electronic Paper as claimed in claim 9 unit, is characterized in that, an end face of this water barrier, in this surperficial frontal projected area, is greater than a bottom surface of this electronic ink layer in this surperficial frontal projected area.
12. Electronic Paper as claimed in claim 9 unit, is characterized in that, also comprise an adhesive coating, are configured between this membrane transistor layer and this electronic ink layer.
13. Electronic Paper as claimed in claim 9 unit, is characterized in that, the angle of this first acute angle is greater than 80 degree and is less than 90 degree.
14. Electronic Paper as claimed in claim 9 unit, is characterized in that, the angle at this first obtuse angle is greater than 90 degree and is less than 100 degree.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099144527 | 2010-12-17 | ||
| TW99144527 | 2010-12-17 |
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| Publication Number | Publication Date |
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| CN102654711A CN102654711A (en) | 2012-09-05 |
| CN102654711B true CN102654711B (en) | 2014-07-09 |
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| CN 201110026774 Pending CN102109728A (en) | 2010-12-17 | 2011-01-20 | Electronic paper unit, cutting equipment and manufacturing method of electronic paper unit |
| CN201110402638.4A Active CN102654711B (en) | 2010-12-17 | 2011-11-30 | Electronic paper unit and manufacturing method thereof |
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| CN108717832B (en) * | 2018-06-04 | 2020-04-24 | 京东方科技集团股份有限公司 | Display substrate mother board, preparation method and cutting method thereof, display substrate and display device |
| CN108828871B (en) * | 2018-07-24 | 2021-08-24 | 上海天马微电子有限公司 | Manufacturing method of flexible electronic paper and flexible electronic paper device thereof |
| CN112577539A (en) * | 2020-12-07 | 2021-03-30 | 潍坊歌尔微电子有限公司 | Waterproof sensor and electronic device |
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- 2011-01-20 CN CN 201110026774 patent/CN102109728A/en active Pending
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| JPH0460513A (en) * | 1990-06-28 | 1992-02-26 | Sharp Corp | Production of liquid crystal display element |
| TW200632484A (en) * | 2004-11-30 | 2006-09-16 | Koninkl Philips Electronics Nv | Electronic ink display device and method for manufacturing the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN102654711A (en) | 2012-09-05 |
| CN102109728A (en) | 2011-06-29 |
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Effective date of registration: 20151013 Address after: Taiwan, China Hsinchu science and Technology Park Road, No. 3 Patentee after: Yuantai Science and Technology Industry Co., Ltd. Address before: Taiwan, China Hsinchu science and Technology Industrial Park, Hsinchu Road, No. two, No. 1 Patentee before: AU Optronics Corporation |