CN102104092A - Novel LED encapsulation method and device beneficial to radiating - Google Patents
Novel LED encapsulation method and device beneficial to radiating Download PDFInfo
- Publication number
- CN102104092A CN102104092A CN2011100066791A CN201110006679A CN102104092A CN 102104092 A CN102104092 A CN 102104092A CN 2011100066791 A CN2011100066791 A CN 2011100066791A CN 201110006679 A CN201110006679 A CN 201110006679A CN 102104092 A CN102104092 A CN 102104092A
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- Prior art keywords
- glue housing
- heat sink
- base plate
- led
- glue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The invention provides a novel light-emitting diode (LED) encapsulation method and a novel LED encapsulation device beneficial to radiating. Heat can be ensured to fully transfer to an overall aluminum alloy dispensing outer frame from a bottom plate heat sink by combining the bottom plate heat sink with the overall aluminum alloy dispensing outer frame with high heat conductivity in the modes such as bonding and the like to bond the overall aluminum alloy dispensing outer frame to the bottom plate heat sink in a planarity way. Through the treatment, a radiator is attached to the bottom plate heat sink equivalently so that the radiating problem of the LED in the prior art is relieved very well.
Description
Technical field
The present invention relates to electronic semi-conductor's technical field, particularly relate to a kind of New LED method for packing and device that is beneficial to heat radiation.
Background technology
At present, traditional LED (Light Emitting Diode, light-emitting diode) encapsulating products mainly is divided into such several types: single pearl straight cutting, Piranha, SMD (single or many), high-power (single or many integrated) etc.These encapsulation all are to finish on different special stands.
Concrete, the support of single pearl direct plugging-in LED product has positive and negative two pins, and wherein the head of negative pole pin is formed a bowl-shape reflection cap through punching press.Led chip is just finished solid crystalline substance, bonding wire, some glue process in this reflection in cap, and is last, and epoxy resin goes out the lens of a round cap shape in the support outer enclosure, manages bright dipping.The point glue process is coated on fluorescent glue in the reflection cap exactly, wraps the led chip and the gold thread that weld line.
Lens that go out through the reflector and the epoxy encapsulation of punching press formation are also arranged in the Piranha type LED product, and bowl-shape reflection cap in the effect that they are played in product and the single pearl direct plugging-in LED product and circle cap ring epoxy resins lens are similar.
The support of SMD type LED product is to make in a kind of insulation colloid of special use through punching press, silver-plated metal pad encapsulated by structures.Metal pad through silver-plated processing has certain reflective, and the directly solid crystalline substance of led chip, bonding wire are on metal pad; The part that the special isolation colloid is formed has the cylindrical structural of a hollow, also can be the bowl shaped structure that certain angle of inclination is arranged, and fluorescent glue just is coated in this zone.
The support of large-power LED product is to be wrapped in jointly in the special-purpose insulating cement body structure by a metab with through the pin of punching press to make.A concave configuration is arranged on the metab, be used to carry fluorescent glue.The metab of colloid lens that encapsulate out at last and the silver-plated processing of process is controlled light reflection and the rising angle of LED together.
Yet, bowl-shape or the similar bowl-shape structure that is had in the led support of prior art adopts the method for stamped metal material to come machine-shaping mostly, metal material thickness and volume after the punching press are all limited, only play the reflection action and the effect of containing fluorescent glue of a part, for the heat dissipation problem that ensures the LED life of product, and do not have substantive help; On the contrary,, also use colloid package lens structure, just more can stop heat to shed from this structure division if after being coated with a fluorescent glue.And led support area, finite volume based on traditional structure, heat conduction, the heat radiation insufficient, in order to guarantee life of product and quality, all all must pass through structural design again through the encapsulated LED light source, being installed in can heat conduction, the aluminium base of heat radiation is heat sink and radiator heat sink on, could form the LED application product.This makes subsequent technique very loaded down with trivial details.In addition, the led support that conventional art uses is used for the individual packages of single LEDs chip mostly, if the plurality of LEDs chip is carried out large-area unified encapsulation, will run into difficulty, is not easy to realize.
Therefore, need the urgent technical problem that solves of those skilled in the art to be exactly at present: how can propose a kind of effective treatment measures with innovating,, effectively to solve the heat dissipation problem that LED exists to solve the defective that exists in the prior art.
Summary of the invention
Technical problem to be solved by this invention provides a kind of New LED method for packing and device that is beneficial to heat radiation, in order to the heat dissipation problem of effective solution LED.
In order to address the above problem, the invention discloses a kind of New LED method for packing that is beneficial to heat radiation, described method comprises:
Choose the metal processing whole some glue housing of conductive coefficient more than or equal to 80 watts of/meter Kelvins;
Described some glue housing combined with base plate is heat sink;
At the heat sink crystal bonding area territory packaging LED chips that is then exposed that combines of a glue housing and base plate.
Preferably, the surface of described some glue housing is wavy, column or zigzag.
Preferably, described method also comprises:
Anodic metal oxide, plating, spraying or sanding and polishing are carried out in the surface of described some glue housing handle, to obtain the light reflection surface of high reflectance.
Preferably, described crystal bonding area territory is used to encapsulate one or plurality of LEDs chip.
Preferably, the mode of described combination is chimeric, punching press or bonding.
Preferably, the metal of the whole point of described processing glue housing is silver, copper, gold, aluminium, iron, aluminium alloy or magnesium alloy.
Preferably, described crystal bonding area territory is shaped as square, circle or polygon.
The present invention has also announced a kind of New LED packaging system that is beneficial to heat radiation, and described device comprises:
First processing module is used to choose the metal processing whole some glue housing of conductive coefficient more than or equal to 80 watts of/meter Kelvins;
Second processing module is used for described some glue housing combined with base plate is heat sink;
The 3rd processing module is used at the heat sink crystal bonding area territory packaging LED chips that is then exposed that combines of a glue housing and base plate.
Preferably, described device also comprises:
The manages module everywhere, is used for that anodic metal oxide, plating, spraying or sanding and polishing are carried out in the surface of described some glue housing and handles, to obtain the light reflection surface of high reflectance.
Preferably, described first processing module Surface Machining that integral body is put the glue housing is wavy, column or zigzag.
Compared with prior art, the present invention has the following advantages:
The present invention is by adopting mode such as bonding in conjunction with a heat conductivility good whole aluminium alloy point glue housing on base plate is heat sink, flatness ground bonds together with base plate is heat sink, guarantees that heat can be transmitted on this whole aluminium alloy point glue housing from base plate is heat sink fully.This processing is equivalent to adhere to a radiator on base plate is heat sink, thereby has well alleviated the existing heat dissipation problem of LED in the prior art.
Description of drawings
Fig. 1 is the embodiment of the invention one described a kind of flow chart that is beneficial to the New LED method for packing of heat radiation;
Fig. 2 is the embodiment of the invention one described a kind of New LED encapsulation schematic diagram that is beneficial to heat radiation with described method characteristic;
Fig. 3 is the embodiment of the invention two described a kind of structure charts that are beneficial to the New LED packaging system of heat radiation.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
The LED product in the course of the work, chip can produce heat, if this heat can not be derived effectively apace, will be accumulated in led chip inside, and led chip itself is caused irreversible damage, influences the life-span and the quality of LED product.The heat conduction of led chip mainly is by being positioned at heat sink realization of base plate of led chip bottom.In the conventional stent designs of LED encapsulating products, heat is mainly derived by pin by the metal material of the bowl-shape or similar bowl structure that is stamped out.
The present invention is by adopting mode such as bonding in conjunction with a heat conductivility good whole aluminium alloy point glue housing on base plate is heat sink, flatness ground bonds together with base plate is heat sink, guarantees that heat can be transmitted on this whole aluminium alloy point glue housing from base plate is heat sink fully.This processing is equivalent to adhere to a radiator on base plate is heat sink.
Embodiment one:
With reference to Fig. 1, show a kind of flow chart that is beneficial to the New LED method for packing of heat radiation of the present invention, described method specifically comprises:
Step S101 chooses the metal processing whole some glue housing of conductive coefficient more than or equal to 80 watts of/meter Kelvins;
Preferably, the metal of the whole point of described processing glue housing is silver, copper, gold, aluminium, iron, aluminium alloy or magnesium alloy.
In the present embodiment, choose the whole point of metal processing glue housing with good heat conductive performance, in the reality, the higher material of thermal conductivity value comprises silver (429 watts of/meter Kelvins of conductive coefficient-W/mK), copper (conductive coefficient 401W/mK), gold (conductive coefficient 317W/mK), aluminium (conductive coefficient 237W/mK), iron (conductive coefficient 80W/mK).The heat conduction, the heat sink material that are widely used in the LED illuminating product mainly are copper and aluminium, based on aluminium alloy, magnesium alloy.Wherein, use 6063 maximum type aluminium alloy conductive coefficients to be 201W/mK.
Step S102 combines described some glue housing with base plate is heat sink;
Preferably, the mode of described combination is chimeric, punching press or bonding.
On base plate is heat sink, increase a heat conductivility and put the glue housing preferably, combining of flatness with base plate is heat sink, having guaranteed that base plate is heat sink is transmitted on the whole some glue housing, can simply this processing be interpreted as and adhere to a radiator on base plate is heat sink.In the specific implementation, some glue housing is chimeric, punching press or bonding with the heat sink mode that combines of base plate.
Preferably, the surface of described some glue housing is wavy or zigzag.
In actual applications, the upper surface of some glue housing can be processed into the Any shape that can increase surface area, as zigzag, wavy, column etc., by obtaining bigger surface area with further raising radiating efficiency.Same, that the edge of described some glue housing also can be processed as is wavy, column or zigzag, obtains bigger edge area and improves radiating efficiency.
Step S103 is at the heat sink crystal bonding area territory packaging LED chips that is then exposed that combines of a glue housing and base plate.
Preferably, described crystal bonding area territory is used to encapsulate one or plurality of LEDs chip.
Preferably, described crystal bonding area territory is shaped as square, circle or polygon.
After some glue housing combines with base plate is heat sink, can expose the crystal bonding area territory of base plate on heat sink, the crystal bonding area territory packaging LED chips on the base plate that is exposed is heat sink.
In actual applications, openwork part on the some glue housing, promptly the crystal bonding area territory shape of the base plate that is exposed on heat sink can be done squarely, circle or polygon etc. as required, simultaneously, can encapsulate single LEDs chip or plurality of LEDs chip as required in the base plate that is exposed each crystal bonding area territory on heat sink.In addition, pairing marginal portion on the some glue housing, also beveling shape as required, the angle of its inclination can be according to doing greatlyyer to the size requirements of LED rising angle or less.By the crystal bonding area territory is designed to different shape, produce the product of various hot spot effects, can encapsulate the led chip of different colours, produce full-color product.For the situation that has encapsulated the plurality of LEDs chip in the single crystal bonding area territory simultaneously, can arrange flexibly, weld, improved the stability of product; If the multiple chips in the same crystal bonding area territory has one or several damages, can't cause the blind area that forms light in this crystal bonding area territory, because the probability that all chips all damage in the single crystal bonding area territory is very very little.
Preferably, described method also comprises:
Anodic metal oxide, plating, spraying or sanding and polishing are carried out in the surface of described some glue housing handle, to obtain the light reflection surface of high reflectance.
The chamfered portion and the surface portion of some glue housing can also adopt methods such as anodic metal oxide, plating, spraying, sanding and polishing to process the light reflection surface of high reflectance, a upper surface of glue housing and inclined-plane have been carried out surface treatment, be processed into the reflection of light face, can improve the product light extraction efficiency greatly; For the integrated light source of subregion encapsulation, cooperate polygon encapsulation shape and surperficial columnar protrusions structure, can play even bright dipping, reduce the effect of dazzle.
Simultaneously, expose the openwork part inclined-plane in crystal bonding area territory on the some glue housing and can produce either large or small inclination angle according to the requirement of product rising angle, independently lens packages is carried out in each crystal bonding area territory, like this, both satisfied the management of product, and can not play functional obstruction again the structure that benefits heat radiation to the bright dipping aspect.And, the light source of the described method of employing present embodiment, the use of radiator can be cancelled or reduce to its heat conduction, heat radiation fully to a certain extent, and the reduction subsequent technique is saved product cost greatly.The technology of the present invention is particularly useful for the encapsulation and the application of large-area planar type light source.It is a bonding heat conductivility good metal housing on a kind of baseboard material that is used for solid crystalline substance, bonding wire, when carrying out the white light LEDs encapsulation, just fluorescent glue is coated with a little and passes through in the frame structure that designs this.Because this frame structure directly is bonded on the baseboard material, so can play the effect of auxiliary heat dissipation, this frame structure is carried out surface treatment or shape-designing, it can play the effect that increases light extraction efficiency, control rising angle again.For ease of understanding, show a kind of New LED encapsulation schematic diagram that is beneficial to heat radiation referring to Fig. 2 with the described method characteristic of the foregoing description.
Further, adopt application example that method of the present invention is introduced, specifically be applied in a kind of large-area strip source encapsulation, increased the heat sinking function part of LED product shelves structure greatly; By material selection, surface treatment and shape-designing, make this structure except bringing into play the auxiliary effect that is coated with a fluorescent glue, can also fully help the heat radiation of LED product, manage bright dipping, reduce dazzle.With multiple chips subregion overall package, form the high-quality product that the large tracts of land bright dipping is even, heat radiation is good.
Select for use certain good model aluminium alloy of heat conductivility to be made into a kind of some glue housing of integral body, be bonded in base plate heat sink on.The point glue housing edge of this integral body is wavy; The octangle crystal bonding area territory of base plate on heat sink after being bonded in that base plate is heat sink and going up, just exposed in the zone that several octangle hollow outs are arranged on it; The inclined-plane of octangle engraved structure can process certain angle of inclination, by changing this angle of chamfer, can control the rising angle of product; The upper surface of some glue housing is a kind of structure with columnar protrusions; The upper surface of some glue housing and inclined-plane have good light reflective through surface treatment; Each octagonal crystal bonding area territory by containing of a glue housing, encapsulates out separately independently fluorescent glue lens arrangement.
Embodiment two:
With reference to Fig. 3, show a kind of structure chart that is beneficial to the New LED packaging system of heat radiation of the present invention, described device specifically comprises:
First processing module 301 is used to choose the metal processing whole some glue housing of conductive coefficient more than or equal to 80 watts of/meter Kelvins;
Preferably, described first processing module Surface Machining that integral body is put the glue housing is wavy, column or zigzag.
Second processing module 302 is used for described some glue housing combined with base plate is heat sink;
The 3rd processing module 303 is used at the heat sink crystal bonding area territory packaging LED chips that is then exposed that combines of a glue housing and base plate.
Preferably, described device also comprises:
The manages module 304 everywhere, is used for that anodic metal oxide, plating, spraying or sanding and polishing are carried out in the surface of described some glue housing and handles, to obtain the light reflection surface of high reflectance.
Each embodiment in this specification all adopts the mode of going forward one by one to describe, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.For device embodiment, because it is similar substantially to method embodiment, so description is fairly simple, relevant part gets final product referring to the part explanation of method embodiment.
More than a kind of New LED method for packing and device that is beneficial to heat radiation provided by the present invention is described in detail, used specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. New LED method for packing that is beneficial to heat radiation is characterized in that described method comprises:
Choose the metal processing whole some glue housing of conductive coefficient more than or equal to 80 watts of/meter Kelvins;
Described some glue housing combined with base plate is heat sink;
At the heat sink crystal bonding area territory packaging LED chips that is then exposed that combines of a glue housing and base plate.
2. method according to claim 1 is characterized in that:
The surface of described some glue housing is wavy, column or zigzag.
3. method according to claim 2 is characterized in that, described method also comprises:
Anodic metal oxide, plating, spraying or sanding and polishing are carried out in the surface of described some glue housing handle, to obtain the light reflection surface of high reflectance.
4. method according to claim 3 is characterized in that:
Described crystal bonding area territory is used to encapsulate one or plurality of LEDs chip.
5. method according to claim 4 is characterized in that:
The mode of described combination is chimeric, punching press or bonding.
6. method according to claim 5 is characterized in that:
The metal of the whole point of described processing glue housing is silver, copper, gold, aluminium, iron, aluminium alloy or magnesium alloy.
7. method according to claim 6 is characterized in that:
Being shaped as of described crystal bonding area territory is square, circle or polygon.
8. New LED packaging system that is beneficial to heat radiation is characterized in that described device comprises:
First processing module is used to choose the metal processing whole some glue housing of conductive coefficient more than or equal to 80 watts of/meter Kelvins;
Second processing module is used for described some glue housing combined with base plate is heat sink;
The 3rd processing module is used at the heat sink crystal bonding area territory packaging LED chips that is then exposed that combines of a glue housing and base plate.
9. device according to claim 8 is characterized in that, described device also comprises:
The manages module everywhere, is used for that anodic metal oxide, plating, spraying or sanding and polishing are carried out in the surface of described some glue housing and handles, to obtain the light reflection surface of high reflectance.
10. device according to claim 8 is characterized in that:
The Surface Machining that described first processing module is put the glue housing with integral body is wavy, column or zigzag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100066791A CN102104092A (en) | 2011-01-13 | 2011-01-13 | Novel LED encapsulation method and device beneficial to radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100066791A CN102104092A (en) | 2011-01-13 | 2011-01-13 | Novel LED encapsulation method and device beneficial to radiating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102104092A true CN102104092A (en) | 2011-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100066791A Pending CN102104092A (en) | 2011-01-13 | 2011-01-13 | Novel LED encapsulation method and device beneficial to radiating |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101213892A (en) * | 2006-03-03 | 2008-07-02 | Lg伊诺特有限公司 | Light-emitting diode package and manufacturing method thereof |
| CN101501388A (en) * | 2006-08-09 | 2009-08-05 | 飞利浦拉米尔德斯照明设备有限责任公司 | Illumination device with wavelength converting element side holding heat sink |
-
2011
- 2011-01-13 CN CN2011100066791A patent/CN102104092A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101213892A (en) * | 2006-03-03 | 2008-07-02 | Lg伊诺特有限公司 | Light-emitting diode package and manufacturing method thereof |
| CN101501388A (en) * | 2006-08-09 | 2009-08-05 | 飞利浦拉米尔德斯照明设备有限责任公司 | Illumination device with wavelength converting element side holding heat sink |
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Application publication date: 20110622 |