CN102102181A - Coating device - Google Patents

Coating device Download PDF

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Publication number
CN102102181A
CN102102181A CN2009103119948A CN200910311994A CN102102181A CN 102102181 A CN102102181 A CN 102102181A CN 2009103119948 A CN2009103119948 A CN 2009103119948A CN 200910311994 A CN200910311994 A CN 200910311994A CN 102102181 A CN102102181 A CN 102102181A
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CN
China
Prior art keywords
voltage
slip ring
coating apparatus
film coating
conducting slip
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Granted
Application number
CN2009103119948A
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Chinese (zh)
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CN102102181B (en
Inventor
洪新钦
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN 200910311994 priority Critical patent/CN102102181B/en
Publication of CN102102181A publication Critical patent/CN102102181A/en
Application granted granted Critical
Publication of CN102102181B publication Critical patent/CN102102181B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention relates to a coating device. The coating device comprises a turntable, and a rotation driving piece, a material rod, a conductive slip ring and a voltage input disc which are fixedly arranged on the turntable, wherein the material rod is used for hanging a workpiece to be coated; one end of the material rod is connected to the rotation driving piece and can rotate under the drive of the rotation driving piece, and the other end of the material rod is rotatably connected to the voltage input disc; the conductive slip ring comprises a stator part and a rotor part rotatably arranged in the stator part; the stator part is provided with a stator wire connected with a voltage source; and the rotor part is provided with a rotor wire connected with the voltage input disc to transmit the voltage of the voltage source to the workpiece to be coated which is hung on the material rod through the voltage input disc, so that an electric brush can be saved, a system is simplified, the transmission path of current is shortened, stable voltage is input into the workpiece to be coated, and coating quality is improved.

Description

Film coating apparatus
Technical field
The present invention relates to the plated film processing technique field, particularly a kind of film coating apparatus.
Background technology
Sputter is to utilize the ion of plasma generation to remove to clash into target, and the atom in the target is knocking-on and be deposited on substrate surface and pile up film forming.At present, when workpiece is carried out plated film, generally be workpiece to be hung be located on the rotation bin, to rotate then on the round circular orbit that bin is placed on a revolution rotation film coating apparatus, many inside and outside both sides that target then relatively are arranged on track respectively, thereby rotate relative to target by the workpiece on the round circular orbit driven rotary bin of revolution rotation film coating apparatus, making can depositional coating on each workpiece.
For compactness or the hardness that increases rete, generally be to be applied voltage by on the workpiece that plates, be generally negative bias, lower voltage can make the compactness of rete or hardness improve, higher voltage then can produce the electricity slurry, utilize electricity slurry bombardment workpiece surface, can make the workpiece surface activation, improve the tack of rete.For the such rotating mechanism of revolution rotation film coating apparatus, it generally is the driving module that adopts brush contact revolution rotation film coating apparatus, yet the drive disk assembly that this kind structure electric current passes through in transmission course is more, rotate contact between each parts mutually, cause the input voltage instability easily, and then influence the quality of plated film.
Summary of the invention
In view of this, be necessary to provide a kind of film coating apparatus with stable input voltage.
A kind of film coating apparatus, comprise the driving module, be arranged at the material bar that drives on the module, conducting slip ring and voltage importing dish, described material bar is used to hang workpiece to be plated, described driving module is used for driving the material bar and rotates, described voltage importing dish links to each other with described material bar, but described conducting slip ring comprises the rotor portions that stator department and relative stator portion rotate, described stator department is provided with stator conductor and is used for being connected with voltage source, is transferred on the workpiece to be plated that is hung on the described material bar by described voltage importing dish thereby described rotor portions is provided with the voltage that rotor wire is connected with voltage importing dish voltage source.
A kind of film coating apparatus, comprise rotating disk, be fixedly set in the rotation actuator on the rotating disk, the material bar, conducting slip ring and voltage importing dish, described material bar is used to hang workpiece to be plated, one end of material bar is connected on the autobiography actuator and can rotation under the driving of rotation actuator, the other end is connected on the voltage importing dish rotationally, described conducting slip ring comprises stator department and is arranged at the interior rotor portions of stator department rotationally, described stator department is provided with stator conductor and is used for being connected with voltage source, is transferred on the workpiece to be plated that is hung on the described material bar by described voltage importing dish thereby described rotor portions is provided with the voltage that rotor wire is connected with voltage importing dish voltage source.
Compared with prior art, described film coating apparatus was directed into voltage on the workpiece to be plated by conducting slip ring and cooperating of voltage importing dish, can remove from and use traditional wiper mechanism, the transmission route of simplified system, shortening electric current, thereby can import stable voltage to workpiece to be plated, effectively promote coating quality.
Description of drawings
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the structural representation of the film coating apparatus of the present invention's one better embodiment.
The main element nomenclature
Figure G200910311994820091222D000021
Figure G200910311994820091222D000031
Embodiment
See also Fig. 1, the film coating apparatus of the present invention's one better embodiment is used for some workpiece 100 to be plated are carried out plated film simultaneously, and this film coating apparatus comprises that a sputtering chamber 10, drives module 30, a bin 50, reaches voltage importing frame 70.
Described sputtering chamber 10 comprises a diapire 12, a roof 14 and is connected in a sidewall 16 between described diapire 12 and the roof 14.Wherein, offer inlet mouth 160 and bleeding point 162 on the sidewall 16 of described sputtering chamber 10.Described inlet mouth 160 is used for the required reactant gases of input sputter in sputtering chamber 10, and described bleeding point 162 is used for sputtering chamber 10 is vacuumized processing.Some targets 18 are arranged on the sidewall 16 of described sputtering chamber 10, as the sputtering source that workpiece 100 to be plated is carried out sputter.
Described driving module 30 comprises a rotating disk 32, revolution actuator 34 and some rotation actuators 36.Wherein, described rotating disk 32 is arranged in the described sputtering chamber 10, and described revolution actuator 34 is connected with described rotating disk 32, is used to drive described rotating disk 32 with respect to its center rotation.Described rotation actuator 36 is arranged at the marginal position place of described rotating disk 32, and is provided with at interval along the circumferential direction of described rotating disk 32, and each rotation actuator 36 all can be with the center rotation of described rotating disk 32 with respect to rotating disk 32.
Described bin 50 comprises a voltage importing dish 52, some supports 54 and some material bars 56.Described voltage importing dish 52 is positioned at the top of rotating disk 32 and be arranged in parallel with rotating disk 32.Described support 54 is arranged between voltage importing dish 52 and the rotating disk 32, is used to support voltage importing dish 52.The bottom of each support 54 is fixedly connected on the rotating disk 32, and collets 58 are arranged between the top of voltage importing dish 52 and each support 54, makes insulation between the driving module 30 of voltage importing dish 52 and bottom.
Described material bar 56 is used to hang workpiece 100 to be plated, and the quantity of material bar 56 is suitable with the quantity of rotation actuator 36.The bottom of each material bar 56 is connected on the corresponding rotation actuator 36 rotationally, and the top then is connected on the voltage importing dish 52 rotationally.When rotating disk 32 produces time rotational under the driving of the revolution actuator 34 of driving module 30, be arranged at the support 54 on the rotating disk 32, material bar 56, workpiece to be plated 100 on the material bar 56, and voltage importing dish 52 can be with the central synchronous rotation of rotating disk 32 relative rotating disks 32, meanwhile, thereby each material bar 56 under the driving of corresponding rotation actuator 36 relatively the central shaft of self carry out rotation and drive workpiece to be plated 100 rotations on the material bar 56, that is to say, under the driving that drives module 30, workpiece 100 to be plated in the revolution of the center of rotating disk 32 relative rotating disks 32 also in rotation, thereby can carry out plated film to each workpiece 100 to be plated equably continuously.
Described voltage imports frame 70 and comprises a support bar 72 and a conducting slip ring 74.Described support bar 72 is fixedly installed on the diapire 12 of sputtering chamber 10, and the top of support bar 72 forms a supporting part 720.Described conducting slip ring 74 is arranged on the supporting part 720 of support bar 72, comprises one being fixed in stator department 740 on the support bar 72, and being arranged at a rotor portions 742 in the stator department 740 rotationally.Wherein upwards lead to rotor wire 744 on this rotor portions 742, lead to stator conductor 746 on the stator department 740 downwards, this stator conductor 746 is used for being connected with voltage source, and the end of rotor wire 744 then is fixedly connected on the corresponding position of voltage importing dish 52 symmetrically.Owing to form a fixed connection between the rotor wire 744 of voltage importing dish 52 and conducting slip ring 74, therefore when rotating disk 32 drives 52 rotations of voltage importing dish, the rotor portions 742 of conducting slip ring 74 is being understood under the traction of rotor wire 744 along with voltage importing dish 52 rotates with respect to the stator department 740 that is fixed on the support bar 72 together, thereby voltage can be guided on each workpiece 100 to be plated by voltage importing dish 52.
In the present embodiment, this conducting slip ring 74 is fixed on the supporting part 720 of this support bar 72 by a fixed block 90, this fixed block 90 comprises a pressure section 92, one location division 94 and a junction 96, this connection section 96 passes through mounting block, as screw etc., be fixedly connected on the supporting part 720 of support bar 72, this location division 94 is extended upward by the inner edge of connection section 96, and be sheathed on the periphery of the stator department 740 of conducting slip ring 74, with restriction conducting slip ring 74 moving in the horizontal, this pressure section 92 is vertically extended internally by the top of location division 94, and lean with the top of stator department 740, with restriction conducting slip ring 74 moving in the vertical, thereby this conducting slip ring 74 is fixed on the supporting part 720 of support bar 72 by this fixed block 90.
During plated film, after with 10 vacuum pumpings of described sputtering chamber, can be by inlet mouth 160 toward described sputtering chamber 10 interior transport of reactant gases bodies, start simultaneously and drive module 30, in effect lower rotary table 32 rotations of the revolution actuator 34 that drives module 30 and drive the rotate center revolution of dish 32 of workpiece to be plated 100 on the rotating disk 32, meanwhile, the rotation of rotating disk 32 can drive the rotor portions 742 of conducting slip ring 74 and rotate relative to its stator department 740, thereby voltage is guided on each workpiece 100 to be plated.In addition, under the effect of rotation actuator 36, workpiece to be plated 100 rotations on the described material bar 56, thus described target 18 can be to the plated film equably continuously of the workpiece to be plated 100 on the described material bar 56.Compared to prior art, film coating apparatus of the present invention by conducting slip ring 74 with voltage transmission to described voltage importing dish 52, directly be directed on each workpiece 100 to be plated by voltage importing dish 52 then, not only can avoid spraining lead because of the rotation of workpiece 100 to be plated, also can remove from and use traditional wiper mechanism, thereby simplified system shortens the transmission route of electric current, imports stable voltage; On the other hand, also can avoid brush, effectively promote the cleanliness factor in sputter chamber and the efficient that vacuumizes, promote coating quality because of fricative powder chip pollutes plated film.
Be with being appreciated that, for the person of ordinary skill of the art, can make change and the distortion that other various pictures are answered by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.

Claims (10)

1. film coating apparatus, comprise and drive module and be arranged at the material bar that drives on the module, described material bar is used to hang workpiece to be plated, described driving module is used for driving the material bar and rotates, it is characterized in that: also comprise conducting slip ring and voltage importing dish, described voltage importing dish links to each other with described material bar, but described conducting slip ring comprises the rotor portions that stator department and relative stator portion rotate, described stator department is provided with stator conductor and is used for being connected with voltage source, is transferred on the workpiece to be plated that is hung on the described material bar by described voltage importing dish thereby described rotor portions is provided with the voltage that rotor wire is connected with voltage importing dish voltage source.
2. film coating apparatus as claimed in claim 1, it is characterized in that: described driving module comprises rotating disk, revolution actuator and rotation actuator, described revolution actuator is connected with described rotating disk, be used to drive described rotating disk rotation, described rotation actuator is fixedly set in also can be with dial rotation on the rotating disk, one end of described material bar is connected on the autobiography actuator and can rotation under the driving of rotation actuator, and the other end is connected on the voltage importing dish rotationally.
3. film coating apparatus as claimed in claim 2 is characterized in that: also comprise support and collets, an end of support is fixedly connected on the rotating disk, and collets are located between the other end of voltage importing dish and support.
4. film coating apparatus as claimed in claim 2 is characterized in that: the rotor wire of the rotor portions of described conducting slip ring is fixedly connected on the voltage importing dish and is and is symmetrical arranged, and described rotor portions is rotated with voltage importing dish by the traction of rotor wire.
5. film coating apparatus as claimed in claim 1 is characterized in that: also comprise support bar, the end of described support bar forms supporting part, and the stator department of described conducting slip ring is fixedly set on the described supporting part.
6. film coating apparatus as claimed in claim 5, it is characterized in that: also comprise fixed block, described fixed block comprises pressure section, location division and connection section, described connection section is fixedly connected on the supporting part of support bar, described location division extends upward and is sheathed on the periphery of conducting slip ring by the inner edge of connection section, and described pressure section is extended internally by the top bending of location division and leans with the top of the stator department of conducting slip ring.
7. film coating apparatus as claimed in claim 1, it is characterized in that: described film coating apparatus also comprises sputtering chamber and target, described sputtering chamber comprises diapire, roof and connects the sidewall of described diapire and roof, described material bar, conducting slip ring and voltage importing dish all are arranged in the sputtering chamber, described target is arranged on the sidewall of described sputtering chamber, as the sputtering source that workpiece to be plated is carried out sputter.
8. film coating apparatus as claimed in claim 7, it is characterized in that: offer the inlet mouth and the bleeding point that are connected with sputtering chamber on the sidewall of described sputtering chamber, described inlet mouth is used for the reactant gases that sputter is required and is passed in the sputtering chamber, and described bleeding point is used for sputtering chamber is vacuumized processing.
9. film coating apparatus, comprise rotating disk, be fixedly set in rotation actuator and material bar on the rotating disk, described material bar is used to hang workpiece to be plated, it is characterized in that: also comprise conducting slip ring and voltage importing dish, one end of described material bar is connected on the autobiography actuator and can rotation under the driving of rotation actuator, the other end is connected on the voltage importing dish rotationally, described conducting slip ring comprises stator department and is arranged at the interior rotor portions of stator department rotationally, described stator department is provided with stator conductor and is used for being connected with voltage source, is transferred on the workpiece to be plated that is hung on the described material bar by described voltage importing dish thereby described rotor portions is provided with the voltage that rotor wire is connected with voltage importing dish voltage source.
10. film coating apparatus as claimed in claim 9, it is characterized in that: also comprise support bar and fixed block, the end of described support bar forms supporting part, described fixed block comprises pressure section, location division and connection section, described connection section is fixedly connected on the supporting part of support bar, described location division extends upward and is sheathed on the periphery of conducting slip ring by the inner edge of connection section, and described pressure section is extended internally by the top bending of location division and leans with the stator department of conducting slip ring.
CN 200910311994 2009-12-22 2009-12-22 Coating device Expired - Fee Related CN102102181B (en)

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CN102102181B CN102102181B (en) 2013-10-09

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107299329A (en) * 2017-07-14 2017-10-27 信利光电股份有限公司 A kind of coating apparatus and film plating process of curved surface cover plate
CN109151113A (en) * 2018-08-28 2019-01-04 余泽军 A kind of manufacture craft of mobile phone glass cover board
CN114178126A (en) * 2021-11-24 2022-03-15 巢湖市国力航标器材有限公司 Surface coating equipment for beacon light lampshade

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2157324A (en) * 1984-03-13 1985-10-23 Sharp Kk A plasma chemical vapor deposition apparatus
CN200941524Y (en) * 2006-08-23 2007-08-29 中国海洋石油总公司 Closed conductive sliding ring
CN101294270A (en) * 2008-06-06 2008-10-29 东北大学 Equipment and method for producing nichrome composite plate with vacuum arc ion plating
WO2008145459A1 (en) * 2007-05-25 2008-12-04 Oerlikon Trading Ag, Trübbach Vacuum treatment unit and vacuum treatment process

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2157324A (en) * 1984-03-13 1985-10-23 Sharp Kk A plasma chemical vapor deposition apparatus
CN200941524Y (en) * 2006-08-23 2007-08-29 中国海洋石油总公司 Closed conductive sliding ring
WO2008145459A1 (en) * 2007-05-25 2008-12-04 Oerlikon Trading Ag, Trübbach Vacuum treatment unit and vacuum treatment process
CN101294270A (en) * 2008-06-06 2008-10-29 东北大学 Equipment and method for producing nichrome composite plate with vacuum arc ion plating

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107299329A (en) * 2017-07-14 2017-10-27 信利光电股份有限公司 A kind of coating apparatus and film plating process of curved surface cover plate
CN109151113A (en) * 2018-08-28 2019-01-04 余泽军 A kind of manufacture craft of mobile phone glass cover board
CN109151113B (en) * 2018-08-28 2020-10-09 安徽徽昂光电科技有限公司 Manufacturing process of mobile phone glass cover plate
CN114178126A (en) * 2021-11-24 2022-03-15 巢湖市国力航标器材有限公司 Surface coating equipment for beacon light lampshade

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