CN102092674B - Method for preparing micro-electrode array - Google Patents
Method for preparing micro-electrode array Download PDFInfo
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- CN102092674B CN102092674B CN2011100006269A CN201110000626A CN102092674B CN 102092674 B CN102092674 B CN 102092674B CN 2011100006269 A CN2011100006269 A CN 2011100006269A CN 201110000626 A CN201110000626 A CN 201110000626A CN 102092674 B CN102092674 B CN 102092674B
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Abstract
The invention provides a method for preparing a micro-electrode array, which prepares the microelectrode array on scale from conductive fiber materials through assembly, cutting, cabling and encapsulation so as to promote the popularization and application of the micro-electrode array. The micro-electrode array draws high attention of people due to wide application value in sensing and displaying fields, but the current micro-electrode array has the problems of higher cost and to-be-improved performances, so that further popularization and application of the micro-electrode array is influenced. Therefore, the invention combines low-price conductive fiber materials with mechanical assembly, fixing, cutting, cabling and encapsulation processes so as to reduce the cost of the micro-electrode array and improve the performance of the micro-electrode array to be contributive to further popularization and application for the micro-electrode array.
Description
Technical field
The present invention relates to a kind of preparation method of microelectrode array, thus particularly with conductive fiber material through assembling, cutting, wiring, encapsulation and the scale preparation microelectrode array promotes applying of microelectrode array.
Background technology
Microelectrode array is owing to being worth and receiving showing great attention to of people in sensing, demonstration extensive applications.People have developed multiple array electrode technologies of preparing such as comprising flat plate array microelectrode, aciculiform array microelectrode.At present, the flat plate array electrode mainly is employed in depositing electrode on the selected base material, lead or on silicon chip, adopts the microelectronic technique preparation; Aciculiform array microelectrode then adopts methods such as comprising spark machined is handled, machinery assembling micropin to combine and prepare with Wiring technique.But also there is the problem of every aspect in microelectrode array aspect preparation at present.For example at present the preparation cost of microelectrode array is generally than higher, and the price of silica-based Utah electrode is up to thousands of dollars one, and silica-based aciculiform microelectrode is easy to wreck, and the wire needle electrode is easily deformable and be difficult to accurately control position wiry and spacing.These all will influence further applying of microelectrode array, so countries in the world are also in the numerous and confused technology of preparing of developing new microelectrode array.
And in addition on the one hand, along with mechanical industry and material industry development of technology, people have set up the fibrous material and the composite industry system of comparative maturity at present.Fibrous material and polymer-based, the Metal Substrate, the ceramic matric composite that comprise carbon fiber, wire material, organic fiber have been widely used among people's the industrial and agricultural production and life.Therefore develop the microelectrode array preparation method to reduce the preparation cost of microelectrode array by the mature technology of existing fibrous material industry and composite industry, the performance of improving existing microelectrode array has just become a thing highly significant.
The application proposes to prepare based on conductive fiber material assembling, cutting technique the new method of microelectrode array for this reason, thinks that some contributions in power are done in the development of microelectrode array.
Summary of the invention
Technical problem:The preparation method who the purpose of this invention is to provide a kind of microelectrode array, with technical maturity
Thereby fibrous material and composite technology combine through fibrous material assembling, cutting mass preparation microelectrode-1-
Array is to promote its application.
Technical scheme:The preparation method of microelectrode array of the present invention is characterized in that preparing microelectrode array through following step: a. at first insulate macromolecular material to form insulating barrier in the fibrous material surface coated of conduction;
B. will be coated with the conductive fiber individual layer orientations of insulating barrier and contain the sheet material that individual layer is orientated conductive fiber with formation with the insulation macromolecular material is fixing;
The sheet material that c. will contain individual layer orientation conductive fiber is along fiber orientation mutual superposition and with the fixing bulk that forms the orientation conductive fiber of macromolecular material;
The bulk that d. will be orientated conductive fiber along fiber axis to vertical direction carry out the thin slice that machine cuts, polishing obtain to contain two insulation macromolecular material conductive material lattice array planes at interval;
E. with a said conductive material lattice array plane that contains two conductive material lattice array plane laminas as the electrode electricity contact portion, and in addition one side wiring, encapsulation promptly get dull and stereotyped tiny array electrode;
Or the said conductive material lattice array plane that contains two conductive material lattice array plane laminas removed the part macromolecular material with the expose portion conductive material, and becoming the needle-like conductive material, one side connects up, encapsulates and promptly gets the needle-like tiny array electrode in addition.
The insulating polymeric material that said insulation macromolecular material size is at interval arranged conductive fiber through the insulation macromolecular material and the fixed orientation of the coating of control conductive fiber surfaces is confirmed.
The removal method of said macromolecular material comprises reaction and plasma etching method, laser processing method, dissolution with solvents method and high-temperature melting method.
Said conductive material lattice array is modified gold, platinum or its alloy.
Said needle-like conductive material improves the acuteness of syringe needle earlier through corrosion, at needle-like conductive material needle body coating insulating materials, remove the insulating materials at needle-like conductive material top at last then.
Beneficial effect:The preparation of microelectrode array at present often need be adopted expensive microelectronic technique and aspect serviceability, also exist like problems such as the easy to break and metal microelectrode array of silica-based microelectrode array are yielding; The application has not only utilized conductive fiber material and the lower-cost advantage of mechanically actuated but also formed conductive fiber material thereof and the high molecular composite of fixed insulation to be easy to regulate and control to comprise the characteristics of many performances of mechanical strength through conductive fiber material assembling, fixing, cutting, wiring, encapsulation preparation microelectrode array for this reason, so helps applying of microelectrode array.
Description of drawings
Fig. 1 is the preparation flow sketch map of dull and stereotyped microelectrode array.
Fig. 2 is the preparation flow sketch map of needle-like microelectrode array.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is further described.
Shown in Figure 1 is the preparation method of dull and stereotyped microelectrode array.To form fiber c, the fiber c that then insulating materials is coated is assembled into individual layer with conductive fiber a coated insulation material b, and with the fixing thin slice e that forms of insulating materials d.Thin slice e superposeed under the situation that guarantees the parallel and fiber alignment of different thin slice fibers orientations obtain block f.Cutting the thin slice g that block f obtains the conductive material lattice array with the axial vertical direction of orientation fibers.The one side that thin slice g is contained the conductive material lattice array connects up and encapsulates and shown in h, promptly obtains dull and stereotyped microelectrode array.
Fig. 2 has then provided the main flow process of needle-like microelectrode array preparation.At first with conductive fiber a coated insulation material b to form fiber c, the group of fibers that then insulating materials is coated is dressed up individual layer, and with the fixing formation of insulating materials d thin slice e.Thin slice e superposeed under the situation that guarantees the parallel and fiber alignment of different thin slice fibers orientations obtain block f.Cutting the thin slice g that block f obtains the conductive material lattice array with the axial vertical direction of orientation fibers.The one side that thin slice g is contained the conductive material lattice array is removed the needle-like array that the SI semi-insulation material obtains conductive material a1 formation, and the other one side that will contain the conductive material lattice array connects up and encapsulates and shown in h, promptly obtains the needle-like microelectrode array.Describe below in conjunction with embodiment.
Embodiment one: the stainless steel metal wire of getting 18 microns is at the about 25 microns polyimide insulative lacquer of its surface coated; The stainless steel metal wire that then insulated paint is coated is that the surface of aluminum plate orientations of teflon becomes individual layer and pours into the polyimide insulative lacquer once more on the top layer; Thickness has the aluminium sheet wiry pressurization that is harmonious to be controlled at about 50 microns through other top layer aluminium sheet that is teflon and above-mentioned row, obtains the fixing orientation stainless steel metal wire array sheet of polyimides.100 layers of above-mentioned thin slice are superposeed by the differently-oriented directivity of stainless steel metal wire and pour into the polyimide insulative lacquer once more, and the polyimides that obtains being orientated the stainless steel metal wire array is block fixedly.It is that stainless steel lattice array thickness is about 100 microns polyimide that the vertical direction cutting of edge and stainless steel metal wire differently-oriented directivity obtains the two sides.This thin slice is contained the one side wiring encapsulation of stainless steel lattice array and makes another one stainless steel lattice array surface coverage gold promptly obtain the dull and stereotyped microelectrode array that is made up of the stainless steel lattice array through plating.
Embodiment two: the stainless steel metal wire of getting 50 microns is at the about 30 microns polyurethane insulating varnish of its surface coated; The stainless steel metal wire that then insulated paint is coated is that the surface of aluminum plate orientations of teflon becomes individual layer and filling polyurethane insulated paint once more on the top layer; Thickness has the aluminium sheet wiry pressurization that is harmonious to be controlled at about 100 microns through other top layer aluminium sheet that is teflon and above-mentioned row, obtains the fixing orientation stainless steel metal wire array sheet of polyurethane.10 layers of above-mentioned thin slice are superposeed by the differently-oriented directivity of stainless steel metal wire and filling polyurethane insulated paint once more, and the polyurethane that obtains being orientated the stainless steel metal wire array is block fixedly.It is that stainless steel lattice array thickness is about 100 microns sheet of polyurethane that the vertical direction cutting of edge and stainless steel metal wire differently-oriented directivity obtains the two sides.The one side that this thin slice is contained the stainless steel lattice array is handled to remove part polyurethane acquisition stainless steel needle-like array through PRK; This needle-like array is formed once more that the stainless steel microneedle array surface coated of sharp-pointed head is the about 10 microns Kapton of the stainless steel micropin of sharp-pointed head and removes the polyimides of the sharp-pointed head of stainless steel micropin through plasma etching through the Corrosion of Stainless Steel corrosion, and the other one side that contains the stainless steel lattice array connects up, encapsulates and promptly obtains the needle-like microelectrode array that is made up of the sharp-pointed microneedle array of stainless steel.
Embodiment three:
The carbon fiber of getting 100 microns is at the about 50 microns PDMS silicon rubber of its surface coated; The carbon fiber that then PDMS silicon rubber is coated is that the surface of aluminum plate orientations of teflon becomes individual layer and pours into PDMS silicon rubber once more on the top layer; Thickness has the pressurization that is harmonious of the aluminium sheet of carbon fiber to be controlled at about 200 microns through other top layer aluminium sheet that is teflon and above-mentioned row, obtains the fixing oriented carbon fiber array sheet of PDMS silicon rubber.20 layers of above-mentioned thin slice are superposeed by the differently-oriented directivity of carbon fiber and pour into PDMS silicon rubber once more, and the PDMS silicon rubber that obtains the oriented carbon fiber array is block fixedly.It is that carbon fiber lattice array thickness is about 200 microns PDMS silicon rubber thin slice that the vertical direction cutting of edge and carbon fiber orientation direction obtains the two sides.The one side of this thin slice carbon fiber-containing lattice array wiring encapsulation promptly obtained the dull and stereotyped microelectrode array that constitutes by the carbon fiber lattice array.
Embodiment four:
The tungsten wire of getting 200 microns is at the about 50 microns epoxy resin of its surface coated; The tungsten wire that then epoxy resin is coated is arranged in individual layer and pours into the SU8 photoresist at teflon plate surface orientation; Quartz plate that thickness is crossed through an other top layer silicon fluoride coupling agent treatment and above-mentioned row have the pressurization that is harmonious of tungsten teflon plate wiry to be controlled at about 300 microns, and the exposure machine exposure fixedly obtains being orientated tungsten wire array thin slice.36 layers of above-mentioned thin slice are superposeed by tungsten differently-oriented directivity wiry and infusion epoxy resin once more, and the epoxy resin that obtains being orientated the tungsten wire array is block fixedly.The edge obtains the tungsten lattice array that the two sides is the epoxy resin interval with the vertical direction cutting of tungsten wire differently-oriented directivity, and thickness is about 250 microns thin slice.The one side of this thin slice tungstenic lattice array wiring encapsulation promptly obtained the dull and stereotyped microelectrode array that constitutes by the tungsten lattice array.
Claims (5)
1. the preparation method of a microelectrode array is characterized in that this method prepares microelectrode array through following step:
A. at first insulate macromolecular material to form insulating barrier in the fibrous material surface coated of conducting electricity;
B. will be coated with the conductive fiber individual layer orientations of insulating barrier and contain the sheet material that individual layer is orientated conductive fiber with formation with the insulation macromolecular material is fixing;
The sheet material that c. will contain individual layer orientation conductive fiber is along fiber orientation mutual superposition and with the fixing bulk that forms the orientation conductive fiber of insulation macromolecular material;
The bulk that d. will be orientated conductive fiber along fiber axis to vertical direction carry out the thin slice that machine cuts, polishing obtain to contain two insulation macromolecular material conductive material lattice array planes at interval;
E. with a said conductive material lattice array plane that contains two conductive material lattice array plane laminas as the electrode electricity contact portion, and in addition one side wiring, encapsulation promptly get dull and stereotyped tiny array electrode;
Or the said conductive material lattice array plane that contains two conductive material lattice array plane laminas removed the SI semi-insulation macromolecular material with the expose portion conductive material; Become the needle-like conductive material, one side connects up, encapsulates and promptly gets the needle-like tiny array electrode in addition.
2. the preparation method of microelectrode array according to claim 1 is characterized in that said insulation macromolecular material size is at interval passed through the insulation macromolecular material of control conductive fiber surfaces coating and the insulation macromolecular material of fixed orientation arrangement conductive fiber is confirmed.
3. the preparation method of microelectrode array according to claim 1 is characterized in that the removal method of said insulation macromolecular material comprises reaction and plasma etching method, laser processing method, dissolution with solvents method and high-temperature melting method.
4. the preparation method of microelectrode array according to claim 1 is characterized in that said conductive material lattice array modification gold, platinum or its alloy.
5. the preparation method of microelectrode array according to claim 1; It is characterized in that said needle-like conductive material improves the acuteness of syringe needle earlier through corrosion; At needle-like conductive material needle body coating insulating materials, remove the insulating materials at needle-like conductive material top at last then.
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| CN102636538A (en) * | 2012-04-24 | 2012-08-15 | 广州盈思传感科技有限公司 | Microelectrode array sensor as well as preparation method and stripping voltmeter detection method thereof |
| CN103568191A (en) * | 2012-07-18 | 2014-02-12 | 合肥杰事杰新材料股份有限公司 | Fiber exposure method for fiber-reinforced injection molded product |
| CN103613912B (en) * | 2013-11-15 | 2016-04-13 | 无锡中科光远生物材料有限公司 | A kind of preparation method of conductive polymer microelectrode array |
| CN104772538B (en) * | 2015-04-29 | 2017-05-03 | 常州工学院 | Preparation method for copper-aluminum composite micro-electrolysis electrode |
| CN104772540B (en) * | 2015-04-29 | 2017-05-24 | 常州工学院 | Electrochemical machining method for copper-aluminum composite electrode surface texturing |
| CN107838509B (en) * | 2017-09-19 | 2019-06-18 | 南京航空航天大学 | Array tube electrode preparation method for Electrolyzed Processing |
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| CN101487906A (en) * | 2009-02-23 | 2009-07-22 | 南京邮电大学 | Production method of electric tuning microcurrent-control zoom lens array chip |
| CN101543406A (en) * | 2008-03-26 | 2009-09-30 | 中国科学院半导体研究所 | Method for assembling microwire electrode array by using silicon array hole |
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| US20040167014A1 (en) * | 2002-11-13 | 2004-08-26 | The Regents Of The Univ. Of California, Office Of Technology Transfer, University Of California | Nanostructured proton exchange membrane fuel cells |
| US6986838B2 (en) * | 2003-08-14 | 2006-01-17 | Johnson Research & Development Co., Inc. | Nanomachined and micromachined electrodes for electrochemical devices |
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| CN101543406A (en) * | 2008-03-26 | 2009-09-30 | 中国科学院半导体研究所 | Method for assembling microwire electrode array by using silicon array hole |
| CN101487906A (en) * | 2009-02-23 | 2009-07-22 | 南京邮电大学 | Production method of electric tuning microcurrent-control zoom lens array chip |
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