CN102092674A - Method for preparing micro-electrode array - Google Patents
Method for preparing micro-electrode array Download PDFInfo
- Publication number
- CN102092674A CN102092674A CN 201110000626 CN201110000626A CN102092674A CN 102092674 A CN102092674 A CN 102092674A CN 201110000626 CN201110000626 CN 201110000626 CN 201110000626 A CN201110000626 A CN 201110000626A CN 102092674 A CN102092674 A CN 102092674A
- Authority
- CN
- China
- Prior art keywords
- array
- conductive
- conductive material
- needle
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
Abstract
The invention provides a method for preparing a micro-electrode array, which prepares the microelectrode array on scale from conductive fiber materials through assembly, cutting, cabling and encapsulation so as to promote the popularization and application of the micro-electrode array. The micro-electrode array draws high attention of people due to wide application value in sensing and displaying fields, but the current micro-electrode array has the problems of higher cost and to-be-improved performances, so that further popularization and application of the micro-electrode array is influenced. Therefore, the invention combines low-price conductive fiber materials with mechanical assembly, fixing, cutting, cabling and encapsulation processes so as to reduce the cost of the micro-electrode array and improve the performance of the micro-electrode array to be contributive to further popularization and application for the micro-electrode array.
Description
Technical field
The present invention relates to a kind of preparation method of microelectrode array, thus particularly with conductive fiber material by assembling, cutting, wiring, encapsulation and the scale preparation microelectrode array promotes applying of microelectrode array.
Background technology
Microelectrode array is subjected to showing great attention to of people owing to the extensive use in sensing, demonstration field is worth.People have developed multiple array electrode technologies of preparing such as comprising flat plate array microelectrode, aciculiform array microelectrode.At present, the flat plate array electrode mainly adopts depositing electrode, lead or employing microelectronic technique preparation on silicon chip on selected base material; Aciculiform array microelectrode then adopts methods such as comprising spark machined is handled, machinery assembling micropin to combine with Wiring technique and prepares.But also there is the problem of every aspect in microelectrode array aspect preparation at present.For example at present the preparation cost of microelectrode array is generally than higher, and the price of silica-based Utah electrode is up to thousands of dollars one, and silica-based aciculiform microelectrode is easy to wreck, and the wire needle electrode is easily deformable and be difficult to accurately control position wiry and spacing.These all will influence further applying of microelectrode array, so countries in the world are also in the numerous and confused technology of preparing of developing new microelectrode array.
And in addition on the one hand, along with mechanical industry and material industry development of technology, people have set up the fibrous material and the composite industry system of comparative maturity at present.Comprise that the fibrous material of carbon fiber, wire material, organic fiber and polymer-based, Metal Substrate, ceramic matric composite have been widely used among people's the industrial and agricultural production and life.Therefore develop the microelectrode array preparation method to reduce the preparation cost of microelectrode array by the mature technology of existing fibrous material industry and composite industry, the performance of improving existing microelectrode array has just become a thing highly significant.
The application proposes to prepare based on conductive fiber material assembling, cutting technique the new method of microelectrode array for this reason, thinks that some contributions in power are done in the development of microelectrode array.
Summary of the invention
Technical problem:The preparation method who the purpose of this invention is to provide a kind of microelectrode array, with technical maturity
Thereby fibrous material and composite technology in conjunction with the assembling by fibrous material, cutting mass preparation microelectrode-1-
Array is to promote its application.
Technical scheme:The preparation method of microelectrode array of the present invention is characterized in that preparing microelectrode array by following step: a. at first insulate macromolecular material to form insulating barrier in the fibrous material surface coating of conduction;
B. will be coated with the conductive fiber individual layer orientations of insulating barrier and contain the sheet material that individual layer is orientated conductive fiber with formation with the insulation macromolecular material is fixing;
The sheet material that c. will contain individual layer orientation conductive fiber is fixed the bulk that forms the orientation conductive fiber along fiber orientation mutual superposition and with macromolecular material;
The bulk that d. will be orientated conductive fiber along fiber axis to vertical direction carry out the thin slice that machine cuts, polishing obtain to contain two insulation macromolecular material conductive material lattice array planes at interval;
E. a described conductive material lattice array plane that contains two conductive material lattice array plane laminas is electrically contacted part as electrode, and one side connects up in addition, encapsulation promptly gets dull and stereotyped tiny array electrode;
Or the described conductive material lattice array plane that contains two conductive material lattice array plane laminas removed the part macromolecular material with the expose portion conductive material, and becoming the needle-like conductive material, one side connects up, encapsulates and promptly gets the needle-like tiny array electrode in addition.
The insulating polymeric material that described insulation macromolecular material size is at interval arranged conductive fiber by the insulation macromolecular material and the fixed orientation of the coating of control conductive fiber surfaces is determined.
The removal method of described macromolecular material comprises reaction and plasma etching method, laser processing method, dissolution with solvents method and high-temperature melting method.
Described conductive material lattice array is modified gold, platinum or its alloy.
Described needle-like conductive material improves the acuteness of syringe needle earlier by corrosion, at needle-like conductive material needle body coating insulating materials, remove the insulating materials at needle-like conductive material top at last then.
Beneficial effect:The preparation of microelectrode array at present often needs to adopt expensive microelectronic technique and also exists aspect serviceability as problems such as the easy to break and metal microelectrode array of silica-based microelectrode array are yielding, the application assembles by conductive fiber material for this reason, fixing, cutting, wiring, encapsulation preparation microelectrode array has not only utilized conductive fiber material and the lower-cost advantage of mechanically actuated but also formed conductive fiber material thereof and the high molecular composite of fixed insulation to be easy to regulate and control to comprise the characteristics of many performances of mechanical strength, so helps applying of microelectrode array.
Description of drawings
Fig. 1 is the preparation flow schematic diagram of dull and stereotyped microelectrode array.
Fig. 2 is the preparation flow schematic diagram of needle-like microelectrode array.
The specific embodiment
The present invention is further illustrated below in conjunction with drawings and Examples.
Figure 1 shows that the preparation method of dull and stereotyped microelectrode array.To form fiber c, the fiber c that insulating materials is coated is assembled into individual layer then with conductive fiber a coated insulation material b, and fixes formation thin slice e with insulating materials d.Thin slice e superposeed under the situation that guarantees the parallel and fiber alignment of different thin slice fibers orientations obtain block f.Cutting the thin slice g that block f obtains the conductive material lattice array with the axial vertical direction of orientation fibers.The one side that thin slice g is contained the conductive material lattice array connects up and encapsulates and promptly obtain dull and stereotyped microelectrode array shown in h.
Fig. 2 has then provided the main flow process of needle-like microelectrode array preparation.At first with conductive fiber a coated insulation material b to form fiber c, the group of fibers that insulating materials is coated is dressed up individual layer then, and with the fixing formation of insulating materials d thin slice e.Thin slice e superposeed under the situation that guarantees the parallel and fiber alignment of different thin slice fibers orientations obtain block f.Cutting the thin slice g that block f obtains the conductive material lattice array with the axial vertical direction of orientation fibers.The one side that thin slice g is contained the conductive material lattice array is removed the needle-like array that the SI semi-insulation material obtains conductive material a1 formation, and the other one side that will contain the conductive material lattice array connects up and encapsulates and promptly obtain the needle-like microelectrode array shown in h.Describe below in conjunction with embodiment.
Embodiment one: the stainless steel metal wire of getting 18 microns is at the about 25 microns polyimide insulative lacquer of its surface coating, the stainless steel metal wire that insulated paint is coated is that the surface of aluminum plate orientations of teflon becomes individual layer and pours into the polyimide insulative lacquer once more on the top layer then, thickness has the aluminium sheet wiry pressurization that is harmonious to be controlled at about 50 microns by other top layer aluminium sheet that is teflon and above-mentioned row, obtains the fixing orientation stainless steel metal wire array sheet of polyimides.100 layers of above-mentioned thin slice are superposeed by the differently-oriented directivity of stainless steel metal wire and pour into the polyimide insulative lacquer once more, the polyimides that obtains being orientated the stainless steel metal wire array is block fixedly.Obtaining the two sides along the vertical direction cutting with the stainless steel metal wire differently-oriented directivity is that stainless steel lattice array thickness is about 100 microns polyimide.This thin slice is contained the one side wiring encapsulation of stainless steel lattice array and makes another one stainless steel lattice array surface coverage gold promptly obtain the dull and stereotyped microelectrode array that is made of the stainless steel lattice array by plating.
Embodiment two: the stainless steel metal wire of getting 50 microns is at the about 30 microns polyurethane insulating varnish of its surface coating, the stainless steel metal wire that insulated paint is coated is that the surface of aluminum plate orientations of teflon becomes individual layer and filling polyurethane insulated paint once more on the top layer then, thickness has the aluminium sheet wiry pressurization that is harmonious to be controlled at about 100 microns by other top layer aluminium sheet that is teflon and above-mentioned row, obtains the fixing orientation stainless steel metal wire array sheet of polyurethane.10 layers of above-mentioned thin slice are superposeed by the differently-oriented directivity of stainless steel metal wire and filling polyurethane insulated paint once more, the polyurethane that obtains being orientated the stainless steel metal wire array is block fixedly.Obtaining the two sides along the vertical direction cutting with the stainless steel metal wire differently-oriented directivity is that stainless steel lattice array thickness is about 100 microns sheet of polyurethane.The one side that this thin slice is contained the stainless steel lattice array is handled to remove part polyurethane acquisition stainless steel needle-like array by PRK, the Kapton that the stainless steel micropin that this needle-like array is formed sharp-pointed head by the Corrosion of Stainless Steel corrosion is about 10 microns with the stainless steel microneedle array surface coating of sharp-pointed head is once more also removed the polyimides of the sharp-pointed head of stainless steel micropin by plasma etching, and the other one side that contains the stainless steel lattice array connects up, encapsulates and promptly obtains the needle-like microelectrode array that is made of the sharp-pointed microneedle array of stainless steel.
Embodiment three:
The carbon fiber of getting 100 microns is at the about 50 microns PDMS silicon rubber of its surface coating, the carbon fiber that PDMS silicon rubber is coated is that the surface of aluminum plate orientations of teflon becomes individual layer and pours into PDMS silicon rubber once more on the top layer then, thickness has the pressurization that is harmonious of the aluminium sheet of carbon fiber to be controlled at about 200 microns by other top layer aluminium sheet that is teflon and above-mentioned row, obtains the fixing oriented carbon fiber array sheet of PDMS silicon rubber.20 layers of above-mentioned thin slice are superposeed by the differently-oriented directivity of carbon fiber and pour into PDMS silicon rubber once more, the PDMS silicon rubber that obtains the oriented carbon fiber array is block fixedly.Obtaining the two sides along the vertical direction cutting with the carbon fiber orientation direction is that carbon fiber lattice array thickness is about 200 microns PDMS silicon rubber thin slice.The one side of this thin slice carbon fiber-containing lattice array wiring encapsulation promptly obtained the dull and stereotyped microelectrode array that constitutes by the carbon fiber lattice array.
Embodiment four:
The tungsten wire of getting 200 microns is at the about 50 microns epoxy resin of its surface coating, the tungsten wire that epoxy resin is coated is arranged in individual layer and pours into the SU8 photoresist at teflon plate surface orientation then, quartz plate that thickness is crossed by an other top layer silicon fluoride coupling agent treatment and above-mentioned row have the pressurization that is harmonious of tungsten teflon plate wiry to be controlled at about 300 microns, and the exposure machine exposure fixedly obtains being orientated tungsten wire array thin slice.36 layers of above-mentioned thin slice are superposeed by tungsten differently-oriented directivity wiry and infusion epoxy resin once more, the epoxy resin that obtains being orientated the tungsten wire array is block fixedly.Obtaining the two sides along the vertical direction cutting with tungsten wire differently-oriented directivity is epoxy resin tungsten lattice array at interval, and thickness is about 250 microns thin slice.The one side of this thin slice tungstenic lattice array wiring encapsulation promptly obtained the dull and stereotyped microelectrode array that constitutes by the tungsten lattice array.
Claims (5)
1. the preparation method of a microelectrode array is characterized in that this method prepares microelectrode array by following step:
A. at first insulate macromolecular material to form insulating barrier in the fibrous material surface coating of conduction;
B. will be coated with the conductive fiber individual layer orientations of insulating barrier and contain the sheet material that individual layer is orientated conductive fiber with formation with the insulation macromolecular material is fixing;
The sheet material that c. will contain individual layer orientation conductive fiber is fixed the bulk that forms the orientation conductive fiber along fiber orientation mutual superposition and with macromolecular material;
The bulk that d. will be orientated conductive fiber along fiber axis to vertical direction carry out the thin slice that machine cuts, polishing obtain to contain two insulation macromolecular material conductive material lattice array planes at interval;
E. a described conductive material lattice array plane that contains two conductive material lattice array plane laminas is electrically contacted part as electrode, and one side connects up in addition, encapsulation promptly gets dull and stereotyped tiny array electrode;
Or the described conductive material lattice array plane that contains two conductive material lattice array plane laminas removed the part macromolecular material with the expose portion conductive material, and becoming the needle-like conductive material, one side connects up, encapsulates and promptly gets the needle-like tiny array electrode in addition.
2. the preparation method of microelectrode array according to claim 1 is characterized in that described insulation macromolecular material size is at interval passed through the insulation macromolecular material of control conductive fiber surfaces coating and the insulating polymeric material of fixed orientation arrangement conductive fiber is determined.
3. the preparation method of microelectrode array according to claim 1 is characterized in that the removal method of described macromolecular material comprises reaction and plasma etching method, laser processing method, dissolution with solvents method and high-temperature melting method.
4. the preparation method of microelectrode array according to claim 1 is characterized in that described conductive material lattice array modification gold, platinum or its alloy.
5. the preparation method of microelectrode array according to claim 1, it is characterized in that described needle-like conductive material improves the acuteness of syringe needle earlier by corrosion, at needle-like conductive material needle body coating insulating materials, remove the insulating materials at needle-like conductive material top at last then.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100006269A CN102092674B (en) | 2011-01-05 | 2011-01-05 | Method for preparing micro-electrode array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100006269A CN102092674B (en) | 2011-01-05 | 2011-01-05 | Method for preparing micro-electrode array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102092674A true CN102092674A (en) | 2011-06-15 |
| CN102092674B CN102092674B (en) | 2012-07-25 |
Family
ID=44125964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100006269A Expired - Fee Related CN102092674B (en) | 2011-01-05 | 2011-01-05 | Method for preparing micro-electrode array |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102092674B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102636538A (en) * | 2012-04-24 | 2012-08-15 | 广州盈思传感科技有限公司 | Microelectrode array sensor as well as preparation method and stripping voltmeter detection method thereof |
| CN103568191A (en) * | 2012-07-18 | 2014-02-12 | 合肥杰事杰新材料股份有限公司 | Fiber exposure method for fiber-reinforced injection molded product |
| CN103613912A (en) * | 2013-11-15 | 2014-03-05 | 无锡中科光远生物材料有限公司 | Preparation method of conductive polymer microelectrode array |
| CN104772538A (en) * | 2015-04-29 | 2015-07-15 | 常州工学院 | Copper-aluminum composite micro-electrolysis electrode and preparation method for same |
| CN104772540A (en) * | 2015-04-29 | 2015-07-15 | 常州工学院 | Electrochemical machining method for copper-aluminum composite electrode surface texturing |
| CN107838509A (en) * | 2017-09-19 | 2018-03-27 | 南京航空航天大学 | Array tube electrode preparation method for Electrolyzed Processing |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040167014A1 (en) * | 2002-11-13 | 2004-08-26 | The Regents Of The Univ. Of California, Office Of Technology Transfer, University Of California | Nanostructured proton exchange membrane fuel cells |
| WO2005017971A2 (en) * | 2003-08-14 | 2005-02-24 | Johnson Research & Development Company, Inc. | Nanomachined and micromachined electrodes for electrochemical devices |
| CN101487906A (en) * | 2009-02-23 | 2009-07-22 | 南京邮电大学 | Production method of electric tuning microcurrent-control zoom lens array chip |
| CN101543406A (en) * | 2008-03-26 | 2009-09-30 | 中国科学院半导体研究所 | Method for assembling microwire electrode array by using silicon array hole |
-
2011
- 2011-01-05 CN CN2011100006269A patent/CN102092674B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040167014A1 (en) * | 2002-11-13 | 2004-08-26 | The Regents Of The Univ. Of California, Office Of Technology Transfer, University Of California | Nanostructured proton exchange membrane fuel cells |
| WO2005017971A2 (en) * | 2003-08-14 | 2005-02-24 | Johnson Research & Development Company, Inc. | Nanomachined and micromachined electrodes for electrochemical devices |
| CN101543406A (en) * | 2008-03-26 | 2009-09-30 | 中国科学院半导体研究所 | Method for assembling microwire electrode array by using silicon array hole |
| CN101487906A (en) * | 2009-02-23 | 2009-07-22 | 南京邮电大学 | Production method of electric tuning microcurrent-control zoom lens array chip |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102636538A (en) * | 2012-04-24 | 2012-08-15 | 广州盈思传感科技有限公司 | Microelectrode array sensor as well as preparation method and stripping voltmeter detection method thereof |
| CN103568191A (en) * | 2012-07-18 | 2014-02-12 | 合肥杰事杰新材料股份有限公司 | Fiber exposure method for fiber-reinforced injection molded product |
| CN103613912A (en) * | 2013-11-15 | 2014-03-05 | 无锡中科光远生物材料有限公司 | Preparation method of conductive polymer microelectrode array |
| CN103613912B (en) * | 2013-11-15 | 2016-04-13 | 无锡中科光远生物材料有限公司 | A kind of preparation method of conductive polymer microelectrode array |
| CN104772538A (en) * | 2015-04-29 | 2015-07-15 | 常州工学院 | Copper-aluminum composite micro-electrolysis electrode and preparation method for same |
| CN104772540A (en) * | 2015-04-29 | 2015-07-15 | 常州工学院 | Electrochemical machining method for copper-aluminum composite electrode surface texturing |
| CN104772540B (en) * | 2015-04-29 | 2017-05-24 | 常州工学院 | Electrochemical machining method for copper-aluminum composite electrode surface texturing |
| CN107838509A (en) * | 2017-09-19 | 2018-03-27 | 南京航空航天大学 | Array tube electrode preparation method for Electrolyzed Processing |
| CN107838509B (en) * | 2017-09-19 | 2019-06-18 | 南京航空航天大学 | Array tube electrode preparation method for Electrolyzed Processing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102092674B (en) | 2012-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102092674B (en) | Method for preparing micro-electrode array | |
| US7400159B2 (en) | Integrated complex nano probe card and method of making same | |
| JP5120453B2 (en) | Carbon electrode, electrochemical sensor, and carbon electrode manufacturing method | |
| US8418911B2 (en) | Method for the miniaturizable contacting of insulated wires | |
| CN100431487C (en) | Processing method of three-dimensional implantable microelectrode array | |
| US6289583B1 (en) | Method for making cards with multiple contact tips for testing semiconductor chips | |
| US8058627B2 (en) | Addressable transmission electron microscope grid | |
| CN101609063A (en) | A kind of microelectrode array chip sensor that is used for the electro-chemistry immunity detection | |
| CN110631743A (en) | Piezoresistive sensor and preparation method thereof | |
| CN101832796A (en) | Nonmetal character integrated sensor-interconnect device, manufacture method and related application | |
| JP2018526946A (en) | Probe assemblies and systems including modular devices and cable assemblies | |
| EP2880183A1 (en) | Assembly for nucleic acid sequencing by means of tunnel current analysis | |
| CN109300578B (en) | Conductive leather material and preparation method thereof | |
| US20130048350A1 (en) | Base member | |
| JP2018538672A (en) | Array connector and manufacturing method thereof | |
| CN101308108B (en) | Preparation method of sensor embodying one-dimensional nano material sensitive element | |
| CN102507699A (en) | Normal-temperature electrochemical oxygen sensor and preparation method thereof | |
| JP2003287513A (en) | Array electrode for bio sample and method of manufacturing the same | |
| KR101215389B1 (en) | Probe manufacturing method, probe structure, probe apparatus, and test apparatus | |
| US20120091999A1 (en) | Insulated probe pin and method for fabricating the same | |
| Pei et al. | Silicon-based wire electrode array for neural interfaces | |
| TW200532209A (en) | Multi-signal single beam probe | |
| JP2004195052A (en) | Multipoint microelectrode, biopotential measuring device, manufacturing method of multipoint microelectrode, and manufacturing method of biopotential measuring device | |
| WO2013114919A1 (en) | Method of manufacturing electronic part | |
| TWI377350B (en) | Branched probe and method for making the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120725 Termination date: 20150105 |
|
| EXPY | Termination of patent right or utility model |