CN102082100B - Packaging method for semiconductor devices with bulged pins - Google Patents
Packaging method for semiconductor devices with bulged pins Download PDFInfo
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- CN102082100B CN102082100B CN 200910253503 CN200910253503A CN102082100B CN 102082100 B CN102082100 B CN 102082100B CN 200910253503 CN200910253503 CN 200910253503 CN 200910253503 A CN200910253503 A CN 200910253503A CN 102082100 B CN102082100 B CN 102082100B
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- Prior art keywords
- lead frame
- plastic packaging
- pin
- metal
- semiconductor device
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 74
- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 70
- 229910052751 metal Inorganic materials 0.000 claims abstract description 70
- 238000005520 cutting process Methods 0.000 claims abstract description 37
- 238000012858 packaging process Methods 0.000 claims abstract description 5
- 238000012856 packing Methods 0.000 claims description 24
- 210000003205 muscle Anatomy 0.000 claims description 17
- 238000009826 distribution Methods 0.000 claims description 8
- 239000002699 waste material Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000638 solvent extraction Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 8
- 238000003466 welding Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 241000500881 Lepisma Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention relates to a packaging method for semiconductor devices with bulged pins, which comprises the following steps of: 1 carrying out pasting and wiring on a lead frame; 2 carrying out plastic package by using metal ribs on the lead frame as divisions to form a plurality of plastic strips; 3 cutting off the metal ribs between neighboring plastic strips and partitioning to form exposed independent pins; and 4 transversely cutting the plastic strips to form a plurality of independent semiconductor devices. By combining and adopting a cutting and packaging method and a pin cut-off type packaging method in the prior art, the invention realizes a semiconductor packaging process with high density, low material consumption and high production rate to produce semiconductor device products with high qualities.
Description
Technical field
The present invention relates to a kind of packaging technology, refer in particular to a kind of method for packing of the semiconductor device that pin is protruded.
Background technology
In prior art, for the encapsulation of semiconductor device, generally can adopt following two kinds of technology modes to carry out.
The first is the cutting packaged type, specifically comprises following steps: step 1, paster: attach chip on the preplating lead frame of film posting; The film of this lead frame is for being attached to its back side; This lead frame comprises some lead frames unit, and each lead frame comprises slide holder and some pins in the unit; For each lead frame unit, chip is pasted on its slide holder respectively; Step 2, distribution: for each lead frame unit, connect wherein chip and pin with metal wire respectively; Step 3, plastic packaging: whole lead frame is carried out plastic packaging, be about to chip, slide holder and pin and all be encapsulated in plastic-sealed body; Step 4, take off film: the film at this lead frame back side is taken off, the metal pins of welding use is partly exposed; Step 5, subsides UV film: the front at plastic-sealed body attaches the UV film; Step 6, cutting: in the plane of whole lead frame, it is carried out respectively the cutting of horizontal direction and vertical direction, form some independently semiconductor device products; Step 7, go the UV film to separate: after using ultraviolet light to make UV film curable adhesive layer, the packaging after cutting to be peeled off from the UV film.
Adopt above-mentioned cutting mode to carry out the encapsulation of semiconductor device, on whole lead frame, the density of arranging of each lead frame unit is higher, therefore comparatively save material.But, this method for packing has following some shortcomings: 1, due in cutting process, can relate to simultaneously the cutting to outside plastic-sealed body and interior metal pin, so can produce the situation of metallic bur power or distortion in the pin end, and easily produce the layering between bi-material, affect the quality of semiconductor device product.2, due in cutting process, need to carry out respectively the cutting of horizontal direction and vertical direction, consuming time longer, cause productivity ratio lower.3, the semiconductor device that adopts this method encapsulation to form, its pin is to be encapsulated in plastic-sealed body inside, only have the pin surface to be exposed to outer, this semiconductor device can be because of the pin surf zone that is used for welding littlely makes welding quality decline in the follow-up course of processing.
The second is pin cutting type packaged type, specifically comprises following steps: step 1, paster: on each lead frame unit in lead frame, chip is pasted on its slide holder respectively; Step 2, distribution: for each lead frame unit, connect wherein chip and pin with metal wire respectively; Step 3, plastic packaging: lead frame is carried out plastic packaging, chip, slide holder and part pin all are encapsulated in the plastic packaging cavity; In this step, be some metal ribs on the lead frame as separation, be the plastic packaging cavity of unit thereby form some by each lead frame unit; Described metal ribs is used for connecting between each plastic packaging cavity in length and breadth and connects; Step 4, glue goes to overflow: in the plastic packaging process, can be at the plastic-sealed body edge residual have a waste material, so, in this step, the waste material at formed each plastic packaging bar edge is removed; Step 5, plating: to the exposed metal parcel plating metal level of the lead frame after plastic packaging; Step 6, cut muscle and separate: the metal ribs between each plastic packaging cavity is excised in punching press, connection between the pin of each lead frame unit is separated, keep simultaneously the part that each pin protrudes from plastic-sealed body, thereby form the semiconductor packages product that some independently pins protrude.
Adopt above-mentioned pin cutting type packaged type to carry out the encapsulation of semiconductor device, the density of the lead frame unit of arranging on this lead frame is less, thereby makes stock utilization greatly reduce, and produces significant wastage.
Summary of the invention
The method for packing that the purpose of this invention is to provide a kind of semiconductor device that protrudes for pin, it is in conjunction with adopting cutting method for packing of the prior art and pin cutting type method for packing, realize higher density, low material consumption, and large-duty semiconductor packages, produce and obtain high-quality semiconductor device product.
In order to achieve the above object, technical scheme of the present invention is to provide a kind of method for packing of the semiconductor device that protrudes for pin, comprises the following steps:
Described lead frame comprises the lead frame unit of some arranged distribution, and each lead frame unit comprises some slide holders and some pins; Adjacent lead frame laterally connects by pin between the unit, vertically is connected with pin by some metal ribs;
On each lead frame unit, chip is pasted on slide holder, and connects described chip and pin with metal connector;
Step 2, plastic packaging: lead frame is carried out plastic packaging, all be encapsulated in chip, slide holder and part pin in plastic-sealed body;
Wherein, the metal ribs on lead frame is carried out plastic packaging as separating, and forms several plastic packaging bars, comprises the some lead frames unit that is arranged in order in each plastic packaging bar; And connect without metal ribs between the slide holder of each adjacent lead frame unit, relatively independent; The pin of this each lead frame unit is positioned at the both sides of plastic packaging bar after plastic packaging;
Step 3, cut muscle: excise the metal ribs between adjacent plastic packaging bar, independence is cut apart in the connection between the pin of each lead frame unit, and kept the part that each pin exposed protrudes from plastic-sealed body;
Step 4, cutting: the plastic packaging bar is carried out transverse cuts, cut apart the some independently semiconductor device of rear formation.
In a preferred version, can further will be formed on the leftover waste material removal at plastic packaging bar edge after step 2 in above-mentioned plastic packaging process.In another preferred version of the present invention, also can be after step 2 further the exposed metal to lead frame partly electroplate, namely each lead frame unit exposed pin and metal ribs electroplated metal layer.In another preferred version of the present invention, also can be after step 3 further the bottom surface of the lead frame after the excision metal ribs and plastic packaging bar attach fixedly film of one deck; Fixedly film is the UV film in another preferred version.
Further, in step 1, described metal connector is metal wire, or metal plate, or metal tape.
Between described step 2 and step 3, also be included in each plastic packaging bar two ends by the fixing step of plastic packaging bar of rivet; Wherein, this rivet passes and is opened in the rivet hole on lead frame and is fixedly connected with plastic packaging bar and lead frame.
In step 3, include some metal ribs between described adjacent plastic packaging bar, in cutting the muscle step, can excise all metal ribs between adjacent plastic packaging bar, perhaps also can only excise the metal ribs of the most close plastic packaging bar respectively, metal ribs in the middle of keeping, the easy fracture not with the toughness of reinforced leads framework.
The method for packing of the semiconductor device that protrudes for pin provided by the invention has following useful technique effect and advantage:
1, due to adopted cut that the muscle step is cut apart and independent each lead frame unit in pin, and the reserve part pin protrudes outside plastic-sealed body, make the semiconductor device that forms after encapsulation in follow-up processing technology, have larger pin welding region (being exposed parts), effectively improve welding quality.
2, due to adopted cut that the muscle step is cut apart and independent each lead frame unit in pin, in cutting step, only need the lead frame that is encapsulated by plastic-sealed body is carried out transverse cuts, and need not to carry out respectively horizontal and vertical cutting, effectively save process time, improved production efficiency.
Simultaneously, such packaged type has been avoided simultaneously situation that outside plastic-sealed body and interior metal pin are cut, so can not produce the situation of metallic bur power or distortion in the pin end, can not produce the plastic-sealed body that causes because of cutting and the layering between this bi-material of metal yet, effectively improve the quality of semiconductor device product.
3, due to before the plastic packaging bar is cut, surface at lead frame and plastic packaging bar has attached fixedly film, effectively strengthened stability in cutting process, the lead frame toughness drop, the easy situation at the cutting process Fracture that cause because cutting muscle have been considered simultaneously, also can adopt the metal ribs that keeps mid portion, and the metal ribs of only excising the most contiguous plastic packaging bar in both sides, with the toughness of reinforced leads framework.
Description of drawings
Fig. 1 is the flow chart of the method for packing of the semiconductor device that is used for the pin protrusion in the present invention;
Fig. 2 A～2H is the schematic diagram that the present invention is used for the method for packing of the semiconductor device that pin protrudes.
Embodiment
Following according to Fig. 1 and Fig. 2, describe preferred embodiments more of the present invention in detail, with better understanding technical scheme of the present invention and beneficial effect.
As shown in Figure 1, the flow chart for the method for packing of the semiconductor device that protrudes for pin provided by the present invention comprises the following steps:
As shown in Fig. 2 A, described lead frame 1 comprises the lead frame unit of some arranged distribution, and each lead frame unit comprises slide holder 11, two pins 12; Laterally connect by pin 12 between the adjacent lead frame unit, vertically be connected with pin 12 by a strip metal muscle 13;
On each lead frame unit, the chip (not shown) is pasted on slide holder 11, and connects described chip and pin 12 with the metal connector (not shown), in the present embodiment, described metal connector can adopt metal wire, or metal plate, or metal tape;
Step 2, plastic packaging: lead frame 1 is carried out plastic packaging, all be encapsulated in the part of chip, slide holder 11 and pin 12 in plastic-sealed body;
As shown in Fig. 2 B, the metal ribs 13 on lead frame 1 is carried out plastic packaging as separating, and forms several plastic packaging bars 14, comprises the some lead frames unit that is arranged in order in each plastic packaging bar 14; And connect without metal ribs between the slide holder of each adjacent lead frame unit, relatively independent; The pin of this each lead frame unit is positioned at the both sides of plastic packaging bar 14 after plastic packaging;
Further can the leftover waste material removal at plastic packaging bar 14 edges will be formed in above-mentioned plastic packaging process;
Also can select lead frame all exposed metal parcel plating metal levels 1 this moment; This metal level can be the tin layer, or the slicker solder layer, or the gold layer;
Step 3, cut muscle: as shown in Fig. 2 C, excise successively the metal ribs 13 between adjacent plastic packaging bar 14, independence is cut apart in connection between the pin 12 of each lead frame unit, and keep the part 121 that each pin exposed protrudes from plastic-sealed body, cut after the muscle step completes, the schematic diagram of lead frame 1 is as shown in Fig. 2 D;
Afterwards, as shown in Fig. 2 E, can be in excision the bottom surface of the lead frame 1 after metal ribs and plastic packaging bar 14 attach fixedly film of one deck, employing UV film 15 in the present embodiment;
Step 4, cutting: as shown in Fig. 2 F, plastic packaging bar 14 is carried out transverse cuts successively, cut apart the some independently semiconductor device 16 of rear formation; As shown in Fig. 2 G, the schematic diagram for cutting step after all completing;
Afterwards, as shown in Fig. 2 H, utilize UV-irradiation, can remove fast and be attached to each independently UV film 15 of the capsulation material bottom surface of semiconductor device 16, complete the encapsulation of the semiconductor device that pin protrudes.
In another preferred embodiment of the present invention, between described step 2 and step 3, also be included in each plastic packaging bar 14 two ends by the fixing step of plastic packaging bar 14 of rivet; Specifically as shown in Fig. 2 A, this rivet passes the rivet hole 17 that is opened on lead frame 1 and is fixedly connected with plastic packaging bar 13 and lead frame 1, with the degree of being connected firmly of further assurance plastic packaging bar 13.
In another preferred embodiment of the present invention, the metal ribs 13 that includes 3 (or more than) between described adjacent plastic packaging bar, cut the muscle process in step 3, only excise 2 strip metal muscle 13 of the most close plastic packaging bar 14 in both sides, and keep metal ribs 13 (not shown) in the middle of being positioned at, the easy fracture not with the toughness of further reinforced leads framework.
The method for packing of the semiconductor device that protrudes for pin provided by the invention has following useful technique effect and advantage:
1, due to adopted cut that the muscle step is cut apart and independent each lead frame unit in pin, and the reserve part pin protrudes outside plastic-sealed body, make the semiconductor device that forms after encapsulation in follow-up processing technology, have larger pin welding region (being exposed parts), effectively improve welding quality.
2, due to adopted cut that the muscle step is cut apart and independent each lead frame unit in pin, in cutting step, only need the lead frame that is encapsulated by plastic-sealed body is carried out transverse cuts, and need not to carry out respectively horizontal and vertical cutting, effectively save process time, improved production efficiency.
Simultaneously, such packaged type has been avoided simultaneously situation that outside plastic-sealed body and interior metal pin are cut, so can not produce the situation of metallic bur power or distortion in the pin end, can not produce the plastic-sealed body that causes because of cutting and the layering between this bi-material of metal yet, effectively improve the quality of semiconductor device product.
3, due to before the plastic packaging bar is cut, surface at lead frame and plastic packaging bar has attached fixedly film, effectively strengthened stability in cutting process, the lead frame toughness drop, the easy situation at the cutting process Fracture that cause because cutting muscle have been considered simultaneously, also can adopt the metal ribs that keeps mid portion, and the metal ribs of only excising the most contiguous plastic packaging bar in both sides, with the toughness of reinforced leads framework.
The method for packing of the semiconductor device that protrudes for pin of the present invention, it is in conjunction with adopting cutting method for packing of the prior art and pin cutting type method for packing, both advantages have been drawn, and efficiently solve present existing shortcoming, be applicable to protrude the encapsulation that pin length surpasses the tiny semiconductor device of 0.1 millimeter.
Although content of the present invention has been done detailed introduction by above preferred embodiment, will be appreciated that above-mentioned description should not be considered to limitation of the present invention.After those skilled in the art have read foregoing, for multiple modification of the present invention with to substitute will be all apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (9)
1. a method for packing that is used for the semiconductor device of pin protrusion, is characterized in that, specifically comprises the following steps:
Step 1, carry out paster and distribution on lead frame;
Described lead frame comprises the lead frame unit of some arranged distribution, and each lead frame unit comprises some slide holders and some pins; Adjacent lead frame laterally connects by pin between the unit, vertically is connected with pin by some metal ribs;
On each lead frame unit, chip is pasted on slide holder, and connects described chip and pin with metal connector;
Being arranged as of described lead frame unit: its pin is positioned at plastic packaging bar both sides after plastic packaging, and connects without metal ribs between the slide holder of adjacent lead frame unit;
Step 2, plastic packaging: lead frame is carried out plastic packaging, all be encapsulated in chip, slide holder and part pin in plastic-sealed body;
Wherein, the metal ribs on lead frame is carried out plastic packaging as separating, and forms several plastic packaging bars, comprises the some lead frames unit that is arranged in order in each plastic packaging bar;
Step 3, cut muscle: excise the metal ribs between adjacent plastic packaging bar, independence is cut apart in the connection between the pin of each lead frame unit, and kept the part that each pin exposed protrudes from plastic-sealed body;
Step 4, cutting: the plastic packaging bar is carried out transverse cuts, cut apart the some independently semiconductor device of rear formation.
2. the method for packing of the semiconductor device that protrudes for pin as claimed in claim 1, is characterized in that, in step 1, described metal connector is metal wire, or metal plate, or metal tape.
3. the method for packing of the semiconductor device that protrudes for pin as claimed in claim 1, is characterized in that, between described step 2 and step 3, also is included in each plastic packaging bar two ends by the fixing step of plastic packaging bar of rivet; Wherein, this rivet passes and is opened in the rivet hole on lead frame and is fixedly connected with plastic packaging bar and lead frame.
4. the method for packing of the semiconductor device that protrudes for pin as claimed in claim 1, is characterized in that, in step 3, includes some metal ribs between described adjacent plastic packaging bar, in cutting the muscle step, excises all metal ribs between adjacent plastic packaging bar.
5. the method for packing of the semiconductor device that protrudes for pin as claimed in claim 1, is characterized in that, in step 3, include some metal ribs between described adjacent plastic packaging bar, in cutting the muscle step, the metal ribs of only excising the most close plastic packaging bar in both sides keeps the metal ribs in the middle of being positioned at.
6. the method for packing of the semiconductor device that protrudes for pin as claimed in claim 1, is characterized in that, further comprises step 2 after: the step that will be formed on the leftover waste material removal at plastic packaging bar edge in described plastic packaging process.
7. the method for packing of the semiconductor device that protrudes for pin as claimed in claim 1, it is characterized in that, further comprise after step 2: the exposed metal to lead frame is partly electroplated, namely to the step that exposes pin and metal ribs electroplated metal layer of each lead frame unit.
8. the method for packing of the semiconductor device that protrudes for pin as claimed in claim 1, is characterized in that, further comprise step 3 after: bottom surface attaching one deck of the lead frame after the excision metal ribs and plastic packaging bar is the step of film fixedly.
9. the method for packing of the semiconductor device that protrudes for pin as claimed in claim 8, is characterized in that, the described film that is attached to lead frame and plastic packaging bar bottom surface is the UV film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910253503 CN102082100B (en) | 2009-11-30 | 2009-11-30 | Packaging method for semiconductor devices with bulged pins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910253503 CN102082100B (en) | 2009-11-30 | 2009-11-30 | Packaging method for semiconductor devices with bulged pins |
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| Publication Number | Publication Date |
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| CN102082100A CN102082100A (en) | 2011-06-01 |
| CN102082100B true CN102082100B (en) | 2013-05-15 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108258912B (en) * | 2015-09-11 | 2020-04-28 | 万国半导体(开曼)股份有限公司 | Pulse transformer |
| CN108109796A (en) * | 2017-12-14 | 2018-06-01 | 贵州凯里经济开发区中昊电子有限公司 | The production method of SMD plastic-packaged electronic components and the metal tape of use |
| CN109317583B (en) * | 2018-09-29 | 2020-06-23 | 深圳赛意法微电子有限公司 | Semiconductor device cutting rib forming method and semiconductor device processing equipment |
| CN110993786B (en) * | 2019-11-13 | 2023-05-30 | 合肥久昌半导体有限公司 | Processing technology of multi-row high-power Hall element |
| CN111211097B (en) * | 2020-02-17 | 2021-11-16 | 珠海格力电器股份有限公司 | Packaging module and packaging method of power semiconductor device |
| CN116230648A (en) * | 2023-01-06 | 2023-06-06 | 重庆万国半导体科技有限公司 | Semiconductor device group and preparation method and application thereof |
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| CN1905142A (en) * | 2006-08-01 | 2007-01-31 | 上海凯虹科技电子有限公司 | QFN chip packaging technique |
| CN1956157A (en) * | 2005-10-28 | 2007-05-02 | 半导体元件工业有限责任公司 | Method of forming a leaded molded array package |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4349541B2 (en) * | 2000-05-09 | 2009-10-21 | 大日本印刷株式会社 | Resin-encapsulated semiconductor device frame |
| US6686258B2 (en) * | 2000-11-02 | 2004-02-03 | St Assembly Test Services Ltd. | Method of trimming and singulating leaded semiconductor packages |
| US20040058478A1 (en) * | 2002-09-25 | 2004-03-25 | Shafidul Islam | Taped lead frames and methods of making and using the same in semiconductor packaging |
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2009
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1956157A (en) * | 2005-10-28 | 2007-05-02 | 半导体元件工业有限责任公司 | Method of forming a leaded molded array package |
| CN1905142A (en) * | 2006-08-01 | 2007-01-31 | 上海凯虹科技电子有限公司 | QFN chip packaging technique |
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Address after: The United States of California Sunnyvale mercury Street No. 495 Patentee after: ALPHA & OMEGA SEMICONDUCTOR, Ltd. Address before: The United States of California Sunnyvale mercury Street No. 495 Patentee before: Alpha and Omega Semiconductor Inc. |
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Effective date of registration: 20160831 Address after: 400700 Chongqing city Beibei district and high tech Industrial Park the road No. 5 of 407 Patentee after: Chongqing Wanguo Semiconductor Technology Co.,Ltd. Address before: Bermuda Hamilton Church 2 Cola Lunden House Street Patentee before: ALPHA & OMEGA SEMICONDUCTOR, Ltd. |
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Denomination of invention: Packaging method for semiconductor devices with bulged pins Effective date of registration: 20191210 Granted publication date: 20130515 Pledgee: Chongqing Branch of China Development Bank Pledgor: Chongqing Wanguo Semiconductor Technology Co.,Ltd. Registration number: Y2019500000007 |
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Granted publication date: 20130515 Pledgee: Chongqing Branch of China Development Bank Pledgor: Chongqing Wanguo Semiconductor Technology Co.,Ltd. Registration number: Y2019500000007 |