CN102076875B - 含有磷和铁的铜合金以及使用了该铜合金的电子元件 - Google Patents

含有磷和铁的铜合金以及使用了该铜合金的电子元件 Download PDF

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Publication number
CN102076875B
CN102076875B CN200980124537.6A CN200980124537A CN102076875B CN 102076875 B CN102076875 B CN 102076875B CN 200980124537 A CN200980124537 A CN 200980124537A CN 102076875 B CN102076875 B CN 102076875B
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Prior art keywords
copper alloy
quality
copper
content
alloy
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CN200980124537.6A
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English (en)
Chinese (zh)
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CN102076875A (zh
Inventor
山口洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
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Mitsui Mining and Smelting Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
CN200980124537.6A 2009-03-12 2009-03-12 含有磷和铁的铜合金以及使用了该铜合金的电子元件 Active CN102076875B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/054793 WO2010103646A1 (ja) 2009-03-12 2009-03-12 リンと鉄とを含有する銅合金及びその銅合金を用いた電気部材

Publications (2)

Publication Number Publication Date
CN102076875A CN102076875A (zh) 2011-05-25
CN102076875B true CN102076875B (zh) 2013-06-26

Family

ID=42351991

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CN200980124537.6A Active CN102076875B (zh) 2009-03-12 2009-03-12 含有磷和铁的铜合金以及使用了该铜合金的电子元件

Country Status (3)

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JP (1) JP4495251B1 (ja)
CN (1) CN102076875B (ja)
WO (1) WO2010103646A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5306557B1 (ja) * 2012-03-29 2013-10-02 三菱電機株式会社 曲率可変ミラー、曲率可変ユニットおよび曲率可変ミラーの作製方法
JP5467163B1 (ja) * 2013-03-26 2014-04-09 Jx日鉱日石金属株式会社 銅合金板、それを備える放熱用電子部品および、銅合金板の製造方法
JP2024141255A (ja) * 2023-03-29 2024-10-10 Dowaメタルテック株式会社 銅合金板材、その製造方法および通電部品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000328158A (ja) * 1999-05-13 2000-11-28 Kobe Steel Ltd プレス打抜き性が優れた銅合金板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000328159A (ja) * 1999-05-19 2000-11-28 Kobe Steel Ltd 銅合金箔
JP4392104B2 (ja) * 2000-03-31 2009-12-24 株式会社神戸製鋼所 電子・電気部品用銅合金およびその板条材、異形断面条材ならびにその板条材または異形断面条材より形成されるリードフレーム
JP4378502B2 (ja) * 2004-02-25 2009-12-09 Dowaメタルテック株式会社 半導体装置用の放熱板およびその製造法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000328158A (ja) * 1999-05-13 2000-11-28 Kobe Steel Ltd プレス打抜き性が優れた銅合金板

Also Published As

Publication number Publication date
JP4495251B1 (ja) 2010-06-30
CN102076875A (zh) 2011-05-25
JPWO2010103646A1 (ja) 2012-09-10
WO2010103646A1 (ja) 2010-09-16

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