CN102076203A - Heat radiator for press packaging and cooling and packaging stack - Google Patents
Heat radiator for press packaging and cooling and packaging stack Download PDFInfo
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- CN102076203A CN102076203A CN2009102526311A CN200910252631A CN102076203A CN 102076203 A CN102076203 A CN 102076203A CN 2009102526311 A CN2009102526311 A CN 2009102526311A CN 200910252631 A CN200910252631 A CN 200910252631A CN 102076203 A CN102076203 A CN 102076203A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
The invention relates to a heat radiator for press packaging and a cooling and packaging stack and provides a heat radiator (300) for directly cooling at least one electronic device package (20). The electronic device package is provided with an upper contact surface (22) and a lower contact surface (24). The heat radiator comprises a cooling element (310) made of at least one heat conductive materials. The cooling element is limited to be constructed into a plurality of charge divided manifolds (12) for receiving a coolant and a plurality of discharge divided manifolds (14) for discharging the coolant. The charge divided manifolds and the discharge divided manifolds are staggered. The cooling element is also limited to be constructed into a plurality of millichannels (16) for receiving the coolant derived from the charge divided manifolds and conveying the coolant to the discharge divided manifolds. The millichannels, the charge divided manifolds and the discharge divided manifolds are also constructed for directly cooling one of the upper contact surface and the lower contact surface of the electronic device package by direct contact with the coolant so that the heat radiator forms an integrated type heat radiator.
Description
Technical field
The present invention relates generally to power electronics devices, and relates more specifically to be used for the improvement type cooling of power electronics devices.
Background technology
High power conversion device such as middle pressure industrial drives device, the frequency converter that is used for oil gas, traction drive device, flexible AC transmission (FACT) device, and other high power switching device, as rectifier and inverter, generally include press pack (press-pack) power device with liquid cools.The limiting examples of power device comprises integral gate change transistor (IGCT), diode, insulated gate bipolar transistor npn npn (IGBT), thyristor and gate level turn-off thyristor (GTO).The press pack device is for the high-power applications advantageous particularly, and the benefit of press pack comprises two-sided cooling, and the situation that can not occur the plasma blast between age at failure.
In order to construct the high power conversion device circuit that uses the press pack device, sandwich radiator and press pack device usually and form lamination (stack).The power converter lamination of prior art level uses the conventional liquid cooling radiator with the bigger cooling duct of diameter usually.Radiator and power device are not integrated in the power converter lamination of prior art level.In some applications, hot fat layer is arranged between each press pack device and liquid cooling heat radiator in press pack device and the liquid cooling heat radiator.In other was used, at least some layers in these layers were only to be kept together by pressure, and do not have hot fat between them.This layout has produced significant contact impedance.Other weak point of this power converter lamination comprises that from semiconductor junction to liquid higher thermal impedance is arranged, and owing to the number of included part makes the structure of stacked wafer module and technology comparatively complicated.
Therefore expectation is, improves the hot property and the packing of the power converter lamination that uses the press pack device.More specifically, expectation is to reduce the thermal impedance from semiconductor junction to liquid so that improve reliability and/or power density.Further expectation is, provides a kind of simple relatively stack configuration to improve maintenanceability.
Summary of the invention
In brief, one aspect of the present invention is a kind of radiator that is used for directly cooling off at least one electronic installation packing (package).This electronic package harness has last contact surface and following contact surface.Radiator comprises the cooling piece that is formed by at least a thermally-conductive materials.Cooling piece defines a plurality of manifolds that enter that are configured in order to the reception cooling agent, and is configured to a plurality of discharge manifolds in order to the discharging cooling agent.Enter manifold and discharge manifold and interlock.Cooling piece also defines and is configured to come from cooling agent that enters manifold and a plurality of milli passages (millichannel) of coolant feed being given the discharge manifold in order to reception.Milli passage and enter manifold and discharge manifold and also be configured in order to by directly contact one in last contact surface that direct cooling electronic device packs and the following contact surface with cooling agent makes radiator formation integrated radiator.
Another aspect of the present invention is to comprise the cooling and the packaging laminate of at least one radiator.This radiator comprises cooling piece, this cooling piece limits: be configured to a plurality ofly enter manifold, be configured to a plurality of discharge manifolds in order to the discharging cooling agent in order to what receive cooling agent, and be configured to come from the cooling agent that enters manifold and coolant feed given a plurality of milli passages of discharging manifold in order to reception.Enter manifold and discharge manifold and interlock.Lamination also comprises at least one the electronic installation packing with last contact surface and following contact surface.Manifold and milli passage are arranged to be adjacent to the corresponding contact surface in contact surface and the following contact surface, are used for directly cooling off this corresponding surface by directly contacting with cooling agent, make radiator constitute integrated radiator.
Description of drawings
When the reference accompanying drawing is studied following detailed description carefully, these and other feature of the present invention, aspect and advantage will become and be more readily understood, and the similar label in institute's drawings attached is represented similar part, in the accompanying drawings:
Fig. 1 has described to have the electronic installation packing of last radiator and following radiator;
Fig. 2 shows has the milli passage that is incorporated in the single cooling piece and the radiator of manifold;
Fig. 3 shows the cross section of the radially milli passage of the radiator that is used for Fig. 2 or Fig. 4; And
Fig. 4 shows the fansink designs that has increased the radial passage number;
Fig. 5 shows cooling and the packaging laminate that is configured for a plurality of electronic installation packings;
Fig. 6 is the sectional view that the manifold among Fig. 2 or Fig. 4 is arranged;
Fig. 7 shows the sealing arrangement that is used for two-sided radiator of the present invention; And
Fig. 8 is the sectional view that the skew manifold layout that is used for two-sided radiator embodiment of the present invention is shown.
Although above-mentioned figure has been listed alternative; Also can visualize other embodiments of the invention; as what will mention in the following argumentation.In all cases, present disclosure all is that the mode unrestricted by representative introduced illustrated embodiment of the present invention.Those skilled in the art can design a plurality of other modifications and the embodiment in the scope and spirit that fall into the principle of the invention.2 3 4 5 10 11 12 13 14 16 20 ( ) 21 22 23 24 25 ( CTE ) 26 27 ( CTE ) 28 29 100 300 302 O304 ( O ) 310
Embodiment
Referring to figs. 1 through Fig. 4, the radiator 300 that is used for directly cooling off at least one electronic installation packing 20 has been described.For example, as shown in fig. 1, exemplary electronic installation packing 20 has last contact surface 22 and following contact surface 24.Radiator 300 comprises the cooling piece 310 that is formed by at least a thermally-conductive materials.For example, as shown in Fig. 2 and Fig. 4, cooling piece 310 defines and is configured to enter manifold 12 in order to receive a plurality of of cooling agent, and is configured to a plurality of discharge manifolds 14 in order to the discharging cooling agent.For example, as shown in Fig. 2, Fig. 4, Fig. 6 and Fig. 8, enter manifold and discharge (alternate mixed) of manifold for interlocking.Cooling piece 310 also defines and is configured to come from cooling agent that enters manifold and a plurality of milli passages 16 of coolant feed being given the discharge manifold in order to reception.Milli passage 16 and enter manifold 12 and discharge manifold 14 and also be configured in order to by directly contact direct cooling electronic device to pack a contact surface in 20 last contact surface 22 and the following contact surface 24 with cooling agent makes radiator formation integrated radiator.More specifically, manifold 12,14 and milli passage 16 are arranged to be adjacent to a corresponding contact surface in contact surface 22 and the following contact surface 24, are used for cooling off this surface accordingly by directly contacting with cooling agent.According to embodiment more specifically, milli passage 16 and enter manifold 12 and discharge manifold 14 and be configured in order to the corresponding contact surface in the last contact surface 22 that cooling agent flowed to equably the electronic installation packing that is cooled and the following contact surface 24.
Therefore, radiator 300 is integral in the electronic installation packing 20, and wherein, radiator 300 is by directly contacting cooling electronic device packing 20 with cooling agent.In other words, the milli passage 16 of integrated radiator 300 and enter manifold 12 and discharge manifold 14 and opening wide in the face of a side of power device packing 20 makes the cooling agent that flows through milli passage 16 can directly contact power device packing 20.This layout is that in the self-contained radiator of prior art, cooling agent is included in the radiator to the remarkable improvement of self-contained (self-contained) radiator of prior art, and therefore must cool off this device indirectly via radiator shell.By removing these additional thermospheres, integrated radiator 300 of the present invention provides the enhancing cooling to power device.
The limiting examples of cooling agent comprises deionized water and other non-electrically conductive liquid.
For certain embodiments, manifold 12,14 has relative diameter greater than milli passage 16.In a limiting examples, the milli width of channel at about 0.5mm to the scope of about 2.0mm, and the degree of depth of milli passage at about 0.5mm to the scope of about 2mm.Particularly, the thickness of passage can be specified in order to guarantee the pressure uniformity on the semiconductor.By making the pressure distribution on the semiconductor more even, semi-conductive performance just can not suffer damage.In addition, should be noted that milli passage 16 and manifold 12,14 can have multiple cross sectional shape, include but not limited to annular, circle, trapezoidal, triangle, and the square/rectangle cross section.Channel shape is selected based on application scenario and manufacturing constraint, and can influence suitable manufacture method and cooling agent stream.Advantageously, milli passage 16 is incorporated into can to increase from semiconductor device 20 heat transfer surface to cooling agent in the radiator 10 significantly long-pending.
Shown in layout in, enters manifold 12 and discharge manifold 14 and be arranged to circle (this paper is also referred to as axially) and arrange, and passage 16 is arranged to radial arrangement in the least.In another example (not shown), enter manifold 12 and be arranged to radial arrangement, and milli passage 16 is arranged to circle (axially) layout with discharge manifold 14.As used herein, phrase " circular arrangement " and " axial arranged " should be understood to hold the bending that is connected radial passage (milli passage or manifold, this depends on embodiment) and straight " circle " path (or manifold or milli passage, this depends on embodiment).
For the exemplary arrangement shown in Fig. 2 and Fig. 4, cooling piece 310 also is defined for the groove 302 of accommodating packing ring 304 (see figure 7)s such as O shape circle.As shown in Figure 7, packing ring 304 is used for radiator 300 is sealed to adjacent electronic installation packing 20.For example, as shown in Figure 6, cooling agent is fed in the radiator 300 via entering chamber 3.As shown in Figure 6, cooling agent flows into via entry port 11 then and enters in the manifold (the concentric manifold segments that replaces) 12.For example, as shown in Figure 6, passing milli passage 16 (referring to Fig. 2 or Fig. 4) afterwards, cooling agent is disposed to discharge chamber 5 from discharging manifold 14 (the concentric manifold segments that other replaces) via discharging port 13.
Fig. 3 shows the radial passage 16 as the cross section of milli passage radially.Fig. 4 shows the number that increases the radial passage so that reduce pressure drop and correspondingly improve the design of cooling effectiveness.More specifically, for the exemplary arrangement shown in Fig. 4, near the radial passage number of cooling piece 310 peripheries with respect to bigger near the radial passage number at cooling piece 310 centers.This layout is allowed for given space and processing constraint and is comprised additional radial passage.
Advantageously, for example, as shown in Fig. 2 to Fig. 4, incorporate single cooling piece 310 into, simplified assembling process by inciting somebody to action the milli passage and entering/discharge manifold.Particularly, use single cooling piece 310 to eliminate to linking the demand of two members.As an alternative, radiator 300 can use packing ring 304 to be sealed on the adjacent device package 20 as O shape coil assembly, and this packing ring 304 provides sane and simple sealing between adjacent members.
For the exemplary embodiment of describing above with reference to Fig. 1 to Fig. 4, last contact surface 22 and following contact surface 24 can be circular cross-section, and cooling piece 310 can be cylindrical (that is, dish type or ice hockey shape (hockey-puck) are arranged).Yet, also can use other geometry, include but not limited to square and square-section.For exemplary arrangement depicted in figure 1, electronic installation packing 20 is a press pack 20.Be used for illustrative purposes although provide exemplary press pack to construct below, the present invention is not limited to any specific apparatus structure.In example, press pack 20 comprises at least one semiconductor device 21, upward thermal coefficient of expansion (CTE) matching disc 25 and the following matched coefficients of thermal expansion plate 27, and top electrode 28 and bottom electrode 29 that is formed on the wafer 23.For example, as shown in fig. 1, wafer 23 is arranged between the CTE plate 25,27, and top electrode 28 is arranged on CTE plate 25 tops, and following CTE plate 27 is arranged on the top of bottom electrode 29.For the embodiment of press pack, each in wafer 23, CTE plate 25,27 and the electrode 28,29 all can have circular cross-section.The limiting examples of semiconductor device comprises IGCT, GTO and IGBT.The present invention has obtained application on the semiconductor device of being made by various semiconductors, semi-conductive limiting examples comprises silicon (Si), carborundum (SiC), gallium nitride (GaN), and GaAs (GaAs).For example, as shown in fig. 1, press pack generally includes insulation (for example, pottery) housing 26.Extend outside housing 26 although Fig. 1 shows radiator, in other embodiments, the cooling piece 310 of radiator 300 can be arranged in the housing 26.In addition, electrode 28,29 can vertically extend beyond the scope of housing 26, and for example, the compliance seal is arranged between the neighboring and housing 26 of electrode 28 (and 29).In addition, radiator 300 extended housings (as shown in the figure) are with other device that allows to electrically connect and be used to settle the needs cooling.Therefore, cooling piece 310 can have the diameter greater than housing 26.
Fig. 8 has described to be used for the arranged offset that enters manifold and discharge manifold of two-sided radiator.As shown in Figure 8, the manifold 12 that enters in first subclass departs from and enters manifold in second set.Similar, the discharge manifold 14 in first subclass departs from the discharge manifold in second set.More specifically, the manifold that enters in first subclass is positioned to relative with discharge manifold in second subclass.Similar, the discharge manifold in first subclass be positioned to second subclass in to enter manifold relative.This arranged offset has multiple advantage.Relative by being positioned to the manifold (entering manifold) that on another cooling surface, is loaded with cold fluid at the manifold that is loaded with hot fluid on first cooling surface (discharge manifold), and enter manifold and align and discharge the situation that manifold aligns and compare " thermal diffusion " that has realized better in manifold.In addition, arranged offset has been improved the speed and the pressure distribution of cooling agent, and all these helps to improve the performance of radiator.
Advantageously, radiator 300 provides the heat transmission that strengthens for the routine cooling of power device.Conventional radiator is not attached in the press pack, but self-contained, cooling agent does not contact power device therein, but is enclosed in the radiator.Therefore, conventional radiator comprises shell, and this shell is connected on the press pack via the hot fat layer that increases thermal resistance usually.Therefore, conventional radiator comprises additional thermosphere (shell), and this can hinder heat transmission.On the contrary, radiator 300 is arranged to be attached in the press pack, by the next direct cooling power device of the direct contact of cooling agent, thereby strengthens heat transmission.In addition, staggered admission passage and passing away are transported to cooling agent on the apparatus surface that is cooled equably, and the heat transfer surface of the cooling agent passage has increased from power device to this integrated radiator in the least is long-pending.For the embodiment shown in Fig. 1 to Fig. 4, radiator 300 is suitable for using together as press pack 20 in conjunction with existing electronic equipment packing 20.Therefore, radiator 300 can form under the situation that modifier is not packed and cool off conventional press pack power device integratedly.In addition, will the milli passage and enter/discharge manifold and be incorporated in the single cooling piece 310 and simplified assembling process.
With reference to Fig. 5, the embodiment of cooling of the present invention and packaging laminate 100 has been described.Cooling and packaging laminate 100 comprise at least one radiator 300, this radiator 300 comprises cooling piece 310, cooling piece 310 defines and is configured to a plurality ofly enter manifold 12, be configured to a plurality of discharge manifolds 14 in order to the discharging cooling agent in order to what receive cooling agent, and is configured to come from the cooling agent that enters manifold and coolant feed given a plurality of milli passages 16 of discharging manifold in order to reception.Radiator 300 is described hereinbefore, and therefore just no longer repeats the various details of the various embodiment of radiator.Cooling and packaging laminate 100 also comprise at least one the electronic installation packing 20 with last contact surface 22 and following contact surface 24.Manifold 12,14 and milli passage 16 are arranged to be adjacent to a corresponding contact surface in contact surface 22 and the following contact surface 24, are used for making radiator constitute integrated radiator by directly cooling off this corresponding surface with direct contact of cooling agent.
The exemplary materials that is used for radiator 300 has above been described.Enter manifold 12 and discharge manifold 14 having described above with reference to Fig. 2, Fig. 6 and Fig. 8.For the embodiment shown in Fig. 6, cooling agent flows to radiator 300 via entering chamber 3, and via discharging chamber 5 dischargings.At the various structures of having described milli passage 16 above with reference to Fig. 2 to Fig. 4.Manifold and being oppositely disposed in above with reference to Fig. 2 and Fig. 4 of passage of milli are described.In one embodiment, enter manifold 12 and discharge manifold 14 and be arranged to radial arrangement, and milli passage 116 is arranged to circle (or more common axially) and is arranged.In the embodiment shown in Fig. 2 and Fig. 4, milli passage 16 is arranged to radial arrangement, is arranged to circular arrangement and enter manifold 12 with discharge manifold 14.
In order to strengthen cooling, the radiator 300 in the lamination 100 can use the milli channels designs shown in Fig. 4.As indicated above, Fig. 4 shows increases the radial passage number so that reduce pressure drop and correspondingly improve the design of cooling effectiveness.More specifically, for the exemplary arrangement shown in Fig. 4, near the radial passage number of cooling piece 310 peripheries with respect to bigger near the radial passage number at cooling piece 310 centers.This layout has been allowed under given space and processing constraint and has been comprised additional radial passage.
Exemplary arrangement shown in Fig. 5 shows the cooling construction of last radiator with single face and following radiator 300 and two-sided intermediate heat sink 300.For shown in embodiment, lamination 100 comprises a plurality of radiators 300 and a plurality of electronic installation packing 20.As shown in the figure, radiator 300 and electronic installation packing 20 is alternately arranged.More specifically, and as indicated above, for embodiment shown in Figure 5, at least one radiator 300 wherein comprises two-sided radiator.Two-sided radiator comprises the cooling piece 310 with first surface 2 and second surface 4.Milli passage 16, first subclass that enters manifold 12 and discharge manifold 14 are formed in the first surface 2 of cooling piece 310.Similar, milli passage 16, second subclass that enters manifold 12 and discharge manifold 14 are formed in the second surface 4 of cooling piece 310.First subset construction of milli passage 16 becomes in order to utilize cooling agent to cool off the last contact surface 22 of one of them electronic installation packing 20.Similar, second subset construction of milli passage 16 becomes in order to utilize cooling agent to cool off the wherein following contact surface 24 of another electronic installation packing 20.Described with reference to Fig. 8 as mentioned, two-sided radiator can be in conjunction with the arranged offset that enters manifold and discharge manifold, in order to further raising radiator performance.
For cooling and packaging laminate 100, radiator 300 is sealed on the last contact surface 22 and the corresponding contact surface in the following contact surface 24 of electronic installation packing 20, makes the cooling agent that flows through the milli passage by contacting direct cooling electronic device to pack this corresponding contact surface in 20 last contact surface and the following contact surface with cooling agent direct.For Fig. 2 and exemplary arrangement depicted in figure 7, each cooling piece 310 all further defines at least one groove 302.For example, as shown in Figure 7, lamination 100 also comprises being arranged on and is used in the groove 302 radiator 300 is sealed at least one packing ring 304 on the corresponding electronic installation packing 20.In specific embodiment, packing ring 304 comprises O shape circle.Advantageously, this assembling process is simple relatively and sane, needs less manufacturing step, and has eliminated the demand of comparatively complicated packaging technology as welding or other metal connecting technology.
Should be noted that the specific arrangements shown in Fig. 5 only for exemplary, and cooling and packaging laminate 100 can comprise the electronic installation packing 20 of arbitrary number, and the radiator 300 that is used for the correspondence of cooling electronic device packing.One of them of a plurality of benefits of the present invention is the flexibility and the modularization of the device package that it cools off desired number.
For above with reference to the described exemplary embodiment of Fig. 5, each contact surface in last contact surface 22 and the following contact surface 24 all can be circular cross-section, and each cooling piece 310 all can be cylindrical cross-section (that is dish type or ice hockey shape layout).Yet, and as indicated above, also can use other geometry, include but not limited to square and square-section.According to embodiment more specifically, electronic installation packing 20 is a press pack 20.As indicated above, the invention is not restricted to any specific apparatus structure.Yet, following exemplary press pack structure is provided for illustrative purposes.For example, as shown in fig. 1, in example, press pack 20 comprises at least one semiconductor device 21 that is formed on the wafer 23.For example, as shown in fig. 1, press pack 20 comprises that also thermal coefficient of expansion (CTE) matching disc 25 reaches matched coefficients of thermal expansion plate 27 down, and top electrode 28 and bottom electrode 29.Wafer 23 is arranged between the CTE plate 25,27.Top electrode 28 is arranged on CTE plate 25 tops, and CTE plate 27 is arranged on bottom electrode 29 tops down.In wafer 23, CTE plate 25,27 and the electrode 28,29 each all has circular cross-section.For example, as shown in Fig. 1 and Fig. 5, for shown in press pack embodiment, lamination 100 also comprises insulation (for example, pottery) housing 26.As indicated above, although showing radiator, Fig. 1 and Fig. 5 outside housing 26, extend, in other embodiments, the cooling piece 310 of radiator 300 is arranged in the housing 26.
Advantageously, cooling and packaging laminate 100 provide the heat transmission of enhancing for conventional cooling power device, have sane and simple sealing arrangement.For example, radiator can use simple relatively O shape coil assembly to be sealed on the adjacent device package.In addition, in specific embodiment, can strengthen heat transmission by last contact surface 22 and the following contact surface 24 that makes cooling agent directly contact press pack 20.In addition, by narrow and dark milli passage 16 directly being positioned at the power device below, farthest aggrandizement apparatus is for the heat transfer surface area of liquid phase joint.Than the conventional stacked wafer module of press pack device and liquid cooling radiator, thermal resistance greatly reduces, and pressure drop and flow velocity are relatively low.By realizing higher relatively flow velocity, strengthened cooling with lower pressure drop.
By providing higher reliability and bigger margin of operation by improving hot property, radiator 300 and cooling and packaging laminate 100 are just desirable especially for the application of needs very high reliability, these application examples if any the liquefied natural gas (LNG) of oil gas and pipeline drive, carry in the seabed of oil gas and distribute, and drive.In addition, radiator 300 and cooling and packaging laminate 100 can use in multiple application, and limiting examples wherein comprises high-power applications, as metal rolled machine, papermaking machine and pulling equipment etc.
Although this paper only illustrates and described some embodiments of the present invention, those skilled in the art can expect some modifications and variations.Therefore, be to be understood that, expectation be that claims contain all such modifications and the variation that falls in the true spirit of the present invention.
Claims (10)
1. one kind is used for directly cooling off the radiator (300) that at least one electronic installation is packed (20), described electronic package harness has last contact surface (22) and following contact surface (24), described radiator comprises the cooling piece (310) that is formed by at least a thermally-conductive materials, wherein, described cooling piece limits:
Be configured in order to receive a plurality of manifolds (12) that enter of cooling agent;
Be configured in order to discharge a plurality of discharge manifolds (14) of described cooling agent, wherein, described manifold and the described discharge manifold of entering is for staggered; And
Be configured to come from the described a plurality of milli passages (16) that enter the described cooling agent of manifold and described coolant feed is given described discharge manifold in order to reception, wherein, described milli passage and described manifold and the described discharge manifold of entering also are configured in order to by contact the last contact surface that directly cools off described electronic installation packing and a contact surface in the following contact surface with described cooling agent direct, make described radiator formation integrated radiator.
2. radiator according to claim 1 (300) is characterized in that, describedly enters manifold (12) and described discharge manifold (14) is arranged to radial arrangement, and wherein, described milli passage (16) is arranged to circular arrangement.
3. radiator according to claim 1 (300) is characterized in that, described milli passage (16) is arranged to radial arrangement, and wherein, describedly enters manifold (12) and described discharge manifold (14) is arranged to circular arrangement.
4. radiator according to claim 1 (300), it is characterized in that, described radiator is used for the directly a plurality of electronic installation packings of cooling (20), wherein, described cooling piece (310) has first surface (2) and second surface (4), wherein, described milli passage (16), described first subclass that enters manifold (12) and described discharge manifold (14) is formed in the first surface of described cooling piece, wherein, described milli passage, described second subclass that enters manifold and described discharge manifold is formed in the second surface of described cooling piece, wherein, milli passage and described first subset construction that enters manifold and discharge manifold become in order to utilize described cooling agent directly to cool off the last contact surface that the electronic installation of described electronic installation in packing packed, and wherein, milli passage and described second subset construction that enters manifold and discharge manifold become in order to utilize described cooling agent directly to cool off the following contact surface that described electronic installation another electronic installation in packing is packed.
5. radiator according to claim 4 (300), it is characterized in that, described in described first subclass enters manifold (12) and departs from the described manifold that enters in second set, and wherein, the described discharge manifold (14) in described first subclass departs from the described discharge manifold in described second set.
6. radiator according to claim 1 (300) is characterized in that, described cooling piece (310) also is defined for the groove (302) of accommodating packing ring.
7. radiator according to claim 1 (300), it is characterized in that, described milli passage (16) is arranged to radial arrangement, wherein, describedly enter manifold (12) and described discharge manifold (14) is arranged to circular arrangement, and wherein, bigger near the radial passage number of described cooling piece (310) periphery with respect to radial passage number near described cooling piece center.
8. one kind is cooled off and packaging laminate (100), comprising:
At least one radiator (300) that comprises cooling piece (310), described cooling piece (310) defines and is configured to a plurality ofly enter manifold (12), be configured in order to discharge a plurality of discharge manifolds (14) of described cooling agent in order to what receive cooling agent, and be configured to come from the described a plurality of milli passages (16) that enter the described cooling agent of manifold and described coolant feed is given described discharge manifold in order to reception, wherein, described manifold and the described discharge manifold of entering is for staggered; And
At least one the electronic installation packing (20) that comprises contact surface (22) and following contact surface (24),
Wherein, described manifold and described milli passage are arranged to be adjacent to a described corresponding contact surface of going up in contact surface and the described contact surface down, be used for by directly cooling off described respective surfaces, make described radiator constitute integrated radiator with direct contact of described cooling agent.
9. lamination according to claim 8 (100) is characterized in that, described lamination (100) comprises a plurality of radiators (300) and a plurality of electronic installation packing (20), and wherein, described radiator and described electronic installation packing are alternately arranged.
10. lamination according to claim 9 (100), it is characterized in that, at least one radiator in the described radiator (300) comprises two-sided radiator, wherein, described two-sided radiator comprises the cooling piece (310) of have first surface (2) and second surface (4), wherein, described milli passage (16), described first subclass that enters manifold (12) and described discharge manifold (14) is formed in the first surface of described cooling piece, wherein, described milli passage, described second subclass that enters manifold and described discharge manifold is formed in the second surface of described cooling piece, wherein, milli passage and described first subset construction that enters manifold and discharge manifold become in order to directly to cool off the last contact surface (22) that the electronic installation of described electronic installation in packing packed by contacting with described cooling agent direct, wherein, milli passage and described second subset construction that enters manifold and discharge manifold become in order to directly to cool off the following contact surface (24) that described electronic installation another electronic installation in packing is packed by contacting with described cooling agent direct, wherein, described in described first subclass enters manifold and departs from the described manifold that enters in second set, and wherein, the described discharge manifold in described first subclass departs from the described discharge manifold in described second set.
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910252631.1A CN102076203B (en) | 2009-11-24 | 2009-11-24 | For the radiator of press pack and cooling and packaging laminate |
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| CN200910252631.1A CN102076203B (en) | 2009-11-24 | 2009-11-24 | For the radiator of press pack and cooling and packaging laminate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102905505A (en) * | 2011-07-29 | 2013-01-30 | 欧姆龙株式会社 | Heat dissipation structure of double-sided heating element |
| CN103904911A (en) * | 2012-12-27 | 2014-07-02 | 现代自动车株式会社 | Heat sink-integrated double-sided cooled power module |
| CN107818951A (en) * | 2017-10-12 | 2018-03-20 | 南京拓扑瞬电电气科技有限公司 | Band heat management high-voltage pulse thyristor switch device |
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| WO2001095688A1 (en) * | 2000-06-05 | 2001-12-13 | The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of The University Of Oregon | Multiscale transport apparatus and methods |
| US6388317B1 (en) * | 2000-09-25 | 2002-05-14 | Lockheed Martin Corporation | Solid-state chip cooling by use of microchannel coolant flow |
| CN1956647A (en) * | 2005-10-25 | 2007-05-02 | 国际商业机器公司 | Cooling apparatus and method of manufacturing the same |
| CN101103659A (en) * | 2004-11-24 | 2008-01-09 | 通用电气公司 | Heat sink with microchannel cooling for power devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4010489A (en) * | 1975-05-19 | 1977-03-01 | General Motors Corporation | High power semiconductor device cooling apparatus and method |
| US4614227A (en) * | 1983-11-02 | 1986-09-30 | Bbc Brown, Boveri & Company Limited | Cooling body for the liquid cooling of high-power semiconductor components |
| WO2001095688A1 (en) * | 2000-06-05 | 2001-12-13 | The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of The University Of Oregon | Multiscale transport apparatus and methods |
| US6388317B1 (en) * | 2000-09-25 | 2002-05-14 | Lockheed Martin Corporation | Solid-state chip cooling by use of microchannel coolant flow |
| CN101103659A (en) * | 2004-11-24 | 2008-01-09 | 通用电气公司 | Heat sink with microchannel cooling for power devices |
| CN1956647A (en) * | 2005-10-25 | 2007-05-02 | 国际商业机器公司 | Cooling apparatus and method of manufacturing the same |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102905505A (en) * | 2011-07-29 | 2013-01-30 | 欧姆龙株式会社 | Heat dissipation structure of double-sided heating element |
| CN102905505B (en) * | 2011-07-29 | 2015-11-25 | 欧姆龙株式会社 | A kind of radiator structure of Double-side heating element |
| CN103904911A (en) * | 2012-12-27 | 2014-07-02 | 现代自动车株式会社 | Heat sink-integrated double-sided cooled power module |
| CN103904911B (en) * | 2012-12-27 | 2018-04-27 | 现代自动车株式会社 | The power module of heat sink integrated type double-side cooling |
| CN107818951A (en) * | 2017-10-12 | 2018-03-20 | 南京拓扑瞬电电气科技有限公司 | Band heat management high-voltage pulse thyristor switch device |
| CN107818951B (en) * | 2017-10-12 | 2019-08-09 | 南京帕尔斯电气科技有限公司 | Band heat management high-voltage pulse thyristor switch device |
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| Publication number | Publication date |
|---|---|
| CN102076203B (en) | 2015-11-25 |
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