CN102074512B - Ultrathin tube shell - Google Patents
Ultrathin tube shell Download PDFInfo
- Publication number
- CN102074512B CN102074512B CN 201010588932 CN201010588932A CN102074512B CN 102074512 B CN102074512 B CN 102074512B CN 201010588932 CN201010588932 CN 201010588932 CN 201010588932 A CN201010588932 A CN 201010588932A CN 102074512 B CN102074512 B CN 102074512B
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- shell
- edge
- sole piece
- oxygen
- free copper
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Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010588932 CN102074512B (en) | 2010-12-15 | 2010-12-15 | Ultrathin tube shell |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010588932 CN102074512B (en) | 2010-12-15 | 2010-12-15 | Ultrathin tube shell |
Publications (2)
Publication Number | Publication Date |
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CN102074512A CN102074512A (en) | 2011-05-25 |
CN102074512B true CN102074512B (en) | 2013-03-27 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 201010588932 Active CN102074512B (en) | 2010-12-15 | 2010-12-15 | Ultrathin tube shell |
Country Status (1)
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CN (1) | CN102074512B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108716425B (en) * | 2018-04-09 | 2021-05-18 | 中国科学院理化技术研究所 | Heat insulation supporting device |
CN111933577B (en) * | 2020-07-15 | 2022-05-31 | 中国电子科技集团公司第二十九研究所 | Local large-area welding board-level interconnection integration method for airtight packaging unit |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2201727Y (en) * | 1994-04-07 | 1995-06-21 | 东南大学 | Ceramic package semi-conductor anti-electrophoresis device |
CN201466015U (en) * | 2009-06-24 | 2010-05-12 | 湖北台基半导体股份有限公司 | Ultrathin packaged semiconductor rectifying device |
CN101877332A (en) * | 2010-06-13 | 2010-11-03 | 江阴市赛英电子有限公司 | Novel plate pressure welding type multichip packaging ceramic package |
CN202003974U (en) * | 2010-12-15 | 2011-10-05 | 中国电子科技集团公司第十三研究所 | Ultrathin tube shell |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8159072B2 (en) * | 2007-12-12 | 2012-04-17 | Wen-Huo Huang | Rectification chip terminal structure |
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2010
- 2010-12-15 CN CN 201010588932 patent/CN102074512B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2201727Y (en) * | 1994-04-07 | 1995-06-21 | 东南大学 | Ceramic package semi-conductor anti-electrophoresis device |
CN201466015U (en) * | 2009-06-24 | 2010-05-12 | 湖北台基半导体股份有限公司 | Ultrathin packaged semiconductor rectifying device |
CN101877332A (en) * | 2010-06-13 | 2010-11-03 | 江阴市赛英电子有限公司 | Novel plate pressure welding type multichip packaging ceramic package |
CN202003974U (en) * | 2010-12-15 | 2011-10-05 | 中国电子科技集团公司第十三研究所 | Ultrathin tube shell |
Also Published As
Publication number | Publication date |
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CN102074512A (en) | 2011-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20110525 Assignee: Bowei Integrated Circuits Co., Ltd. Assignor: Inst No.13, Chinese Electronic Science and Technology Group Co Contract record no.: 2014130000056 Denomination of invention: Ultrathin tube shell Granted publication date: 20130327 License type: Exclusive License Record date: 20140429 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
EC01 | Cancellation of recordation of patent licensing contract | ||
EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Bowei Integrated Circuits Co., Ltd. Assignor: Inst No.13, Chinese Electronic Science and Technology Group Co Contract record no.: 2014130000056 Date of cancellation: 20170704 |