CN102074306A - Method for laying power supply leads of conductive film - Google Patents
Method for laying power supply leads of conductive film Download PDFInfo
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- CN102074306A CN102074306A CN2009102377054A CN200910237705A CN102074306A CN 102074306 A CN102074306 A CN 102074306A CN 2009102377054 A CN2009102377054 A CN 2009102377054A CN 200910237705 A CN200910237705 A CN 200910237705A CN 102074306 A CN102074306 A CN 102074306A
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Abstract
The invention relates to a method for laying power supply leads of a conductive film. A laying device for the method comprises a conductive film, a conductive metal foil and leads. The laying method comprises the following steps of: uniformly coating a layer of conductive adhesive a conductive surface of the conductive film; pasting the conductive metal foil on the conductive adhesive layer formed by the conductive adhesive; and the welding the leads on the conductive metal foil. The method solves the problems of flexible material, thinness and difficult lead lead-out of the flexible conductive film.
Description
Technical field
The present invention relates to a kind of laying method of conductive film current supply line, this method is included on the conductive film coating one deck conductive adhesive, conductive metal foil is sticked on the conductive adhesive layer, with wire bonds on conductive metal foil; Solved the problem that the compliant conductive film is difficult for drawing because of the too thin lead of material softness, thickness.
Technical background
Along with the miniaturization and the lighting of electronic device, the research of the transparent conductive film of flexible substrate has caused people's extensive concern, is expected to become the renewal product of hard substrates transparent conductive film.This kind flexible and transparent film plates layer of conductive material and forms on flexible substrate material, flexible substrate can adopt PETG (Polyethylene terephthalate, abbreviation PET), polyimides (Polyimide, abbreviation PI), Merlon (Polycarbonate, be called for short PC) and other organic flexible material, the conductive film layer material comprises metal system, oxidation film system, polymeric membrane system, compound film system etc., adopts methods such as vacuum evaporation, sputtering method, ion plating to carry out plated film usually on flexible substrate.The transparent conductive film for preparing on flexible substrate has many distinct advantages, as: deflection, in light weight, be difficult for broken, be easy to large tracts of land production, be convenient to transportation, equipment investment is few etc., therefore obtained extensive use at numerous areas, as: fields such as fixing demonstration the (EL, electrochromism, the demonstration of LCD electricity etc.), optical memory, optical-electrical converter, Aero-Space.Simultaneously, the preparation of compliant conductive film and practical application also have certain limitation, as the selection of flexible substrate, and the requirement of operational environment etc.The present invention is directed to the problem that the compliant conductive film is soft owing to the conducting film material in actual applications and the too little lead of thickness is difficult for drawing, propose a kind of laying method of conductive film current supply line.
Summary of the invention
The object of the present invention is to provide a kind of laying method of conductive film current supply line, this method is included on the conductive film coating one deck conductive adhesive, conductive metal foil is sticked on the conductive adhesive layer, with wire bonds on conductive metal foil; Method of the present invention has solved the problem that the compliant conductive film is difficult for drawing because of the too thin lead of material softness, thickness.
The objective of the invention is to realize by following technical proposals: a kind of laying method of conductive film current supply line, comprise conductive film, conductive metal foil, lead, it is as follows to lay step:
Even coating one deck conductive adhesive on the conducting surface of described conductive film sticks on described conductive metal foil on the conductive adhesive layer that described conductive adhesive constitutes, with described wire bonds on described conductive metal foil.
Purpose of the present invention can also be realized by following technical proposals: a kind of laying method of conductive film current supply line, comprise conductive film, compliant conductive net sheet, conductive metal foil, lead, and it is as follows to lay step:
On the conducting surface of described conductive film, evenly be coated with one deck conductive adhesive, described compliant conductive net sheet is sticked on the conducting surface of described conductive film, described conductive metal foil is sticked on the described compliant conductive net sheet, with described wire bonds on described conductive metal foil.
Purpose of the present invention can also be realized by the third technical scheme: a kind of laying method of conductive film current supply line, comprise conductive film, compliant conductive net sheet, conductive metal foil, lead, and it is as follows to lay step:
On the conducting surface of described conductive film, evenly be coated with one deck conductive adhesive, described compliant conductive net sheet is sticked on the conducting surface of described conductive film, described conductive metal foil is sticked on the described compliant conductive net sheet, described conductive film, compliant conductive net sheet, conductive metal foil are carried out hot curing together handle, after processing finishes with described wire bonds on described conductive metal foil.
Method of the present invention has solved the problem that the compliant conductive film is difficult for drawing because of the too thin lead of material softness, thickness.
Embodiment
Embodiment one:
A kind of laying method of conductive film current supply line comprises conductive film, conductive metal foil, lead, and it is as follows to lay step:
Even coating one deck conductive adhesive on the conducting surface of described conductive film sticks on described conductive metal foil on the conductive adhesive layer that described conductive adhesive constitutes, with described wire bonds on described conductive metal foil.
In the present embodiment, on compliant conductive film conducting surface, evenly be coated with one deck conductive adhesive, conductive adhesive is cured, described conductive metal foil is sticked on the conductive adhesive layer that has solidified of described conductive adhesive formation, described compliant conductive film, conductive adhesive and copper-foil conducting electricity constitute electrode assembly of the present invention together, afterwards with described wire bonds on the conductive metal foil of this electrode, lead is drawn with peripheral control unit and is electrically connected.
In the present embodiment, it is that substrate is coated with the flexible ITO-PET conducting film that ITO (tin indium oxide) makes that described compliant conductive film adopts with PETG (PET), described conductive adhesive is epoxy resin-silver powder conductive silver paste, described conductive metal foil adopts copper-foil conducting electricity, be shaped as bar shaped, width is 1mm～30mm, indefinite length.
The film of compliant conductive described in the present embodiment also can be with polyimides (PI), Merlon (PC) and other organic flexible material are as flexible substrate, be coated with ITO (tin indium oxide) or ZAO (zinc oxide aluminum) or other oxidation film system (TCO) and metal system, the conductive film of electric conducting materials such as polymeric membrane system and compound film system, described conductivity type adhesive also can be phenolic aldehyde-electrolytic silver powder conducting resinl, epoxy-nylon-reduction sliver-powder conducting glue, epoxy-rubber-sliver-powder conducting glue, polyurethane-reduction sliver-powder conducting glue and active copper powder, silver-plated copper powder, carbon fiber, the compound particle conducting resinl, and the adhesive etc. that comprises other one or more conducting particless, described conductive metal foil also can be that conduction silver foil or other are difficult for oxidized metal forming.
Embodiment two:
A kind of laying method of conductive film current supply line comprises conductive film, compliant conductive net sheet, conductive metal foil, lead, and it is as follows to lay step:
On the conducting surface of described conductive film, evenly be coated with one deck conductive adhesive, described compliant conductive net sheet is sticked on the conducting surface of described conductive film, described conductive metal foil is sticked on the described compliant conductive net sheet, with described wire bonds on described conductive metal foil.
In the present embodiment, on compliant conductive film conducting surface, evenly be coated with one deck conductive adhesive, one deck compliant conductive net sheet or compliant conductive thin slice are coated conductive adhesive, be pasted together with described conductive film.The described conductive film that scribbles conductive adhesive and be stained with compliant conductive net sheet or conductive foil is cured processing, makes the conductive adhesive full solidification, bonding firmly between compliant conductive net sheet or compliant conductive thin slice and the described conductive film.Described compliant conductive film, conductive adhesive, conductive metal foil, compliant conductive wire netting sheet or compliant conductive thin slice constitute electrode assembly of the present invention together, afterwards with wire bonds on the compliant conductive wire netting sheet or compliant conductive thin slice of this electrode, lead is drawn with peripheral control unit and is electrically connected.
In the present embodiment, it is that substrate is coated with the flexible ITO-PC conducting film that ITO (tin indium oxide) makes that described compliant conductive film adopts with polycarbonate (PC), described conductive adhesive is an electric conduction of carbon fiber glue, described conductive metal foil adopts copper-foil conducting electricity, be shaped as bar shaped, width is 1mm～30mm, indefinite length, described compliant conductive net sheet or compliant conductive thin slice are copper mesh sheet or copper sheet, adopt the mode of ultraviolet light polymerization to be cured processing.
The film of compliant conductive described in the present embodiment also can be with PETG (PET), polyimides (PI) and other organic flexible material are as flexible substrate, be coated with ITO (tin indium oxide) or ZAO (zinc oxide aluminum) or other oxidation film system (TCO) and metal system, the conductive film of electric conducting materials such as polymeric membrane system and compound film system, described conductivity type adhesive also can be epoxy resin-sliver-powder conducting glue, phenolic aldehyde-electrolytic silver powder conducting resinl, epoxy-nylon-reduction sliver-powder conducting glue, epoxy-rubber-sliver-powder conducting glue, polyurethane-reduction sliver-powder conducting glue and active copper powder, silver-plated copper powder, carbon fiber, the compound particle conducting resinl, and comprise adhesive of other one or more conducting particless etc., described conductive metal foil also can be that copper-foil conducting electricity or other are difficult for oxidized metal forming, described flexible metal net sheet or compliant conductive thin slice also can be silver-colored net sheet or silver strip or other quality softness easy conductive and be difficult for oxidized wire netting sheet, nonmetal net or sheet metal, non-metal plate.
Embodiment three:
A kind of laying method of conductive film current supply line comprises conductive film, compliant conductive net sheet, conductive metal foil, lead, and it is as follows to lay step:
On the conducting surface of described conductive film, evenly be coated with one deck conductive adhesive, described compliant conductive net sheet is sticked on the conducting surface of described conductive film, described conductive metal foil is sticked on the described compliant conductive net sheet, described conductive film, compliant conductive net sheet, conductive metal foil are cured processing together, after processing finishes with described wire bonds on described conductive metal foil.
In the present embodiment, one deck compliant conductive net sheet or compliant conductive thin slice are coated conductive adhesive, be pasted together with the described conductive film that scribbles the conductivity type adhesive, one deck conductive metal foil is affixed on this compliant conductive net sheet or the compliant conductive thin slice again, then with described compliant conductive film, conductive adhesive, compliant conductive wire netting sheet and conductive metal foil cured together, constitute electrode assembly of the present invention, afterwards with wire bonds on the compliant conductive wire netting sheet or compliant conductive thin slice of this electrode, lead is drawn with peripheral control unit and is electrically connected.
In the present embodiment, described compliant conductive film adopts being that substrate is coated with the flexible ITO-PET conducting film that ITO (tin indium oxide) makes with PETG (PET), described conductive adhesive is epoxy resin-silver powder conductive silver paste, described conductive metal foil adopts the conduction silver foil, be shaped as bar shaped, width is 5cm, indefinite length.Described compliant conductive wire netting sheet or compliant conductive thin slice are silver-colored net sheet or silver strip, adopt the mode of ultraviolet light polymerization to be cured processing.
The film of compliant conductive described in the present embodiment also can be with polyimides (PI), Merlon (PC) and other organic flexible material are as flexible substrate, be coated with ITO (tin indium oxide) or ZAO (zinc oxide aluminum) or other oxidation film system (TCO) and metal system, the conductive film of electric conducting materials such as polymeric membrane system and compound film system, described conductivity type adhesive also can be phenolic aldehyde-electrolytic silver powder conducting resinl, epoxy-nylon-reduction sliver-powder conducting glue, epoxy-rubber-sliver-powder conducting glue, polyurethane-reduction sliver-powder conducting glue and active copper powder, silver-plated copper powder, carbon fiber, the compound particle conducting resinl, and comprise adhesive of other one or more conducting particless etc., described conductive metal foil also can be that copper-foil conducting electricity or other are difficult for oxidized metal forming, described compliant conductive net sheet or compliant conductive thin slice also can be copper mesh or copper sheet or other quality softness easy conductive and be difficult for oxidized wire netting sheet, nonmetal net sheet or sheet metal or nonmetallic slices.
Claims (9)
1. the laying method of a conductive film current supply line is characterized in that: comprise conductive film, conductive metal foil, lead, it is as follows to lay step:
Even coating one deck conductive adhesive on the conducting surface of described conductive film sticks on described conductive metal foil on the conductive adhesive layer that described conductive adhesive constitutes, with described wire bonds on described conductive metal foil.
2. the laying method of conductive film current supply line according to claim 1, it is characterized in that: it is that substrate is coated with the flexible ITO-PET conducting film that ITO makes that described conductive film adopts with the PETG, described conductive adhesive is epoxy resin-silver powder conductive silver paste, and described conductive metal foil adopts copper-foil conducting electricity.
3. the laying method of conductive film current supply line according to claim 1, it is characterized in that: described conductive film is to be coated with the conductive film of ITO or ZAO with polyimides, Merlon as flexible substrate, and described conductive adhesive is a kind of in phenolic aldehyde-electrolytic silver powder conducting resinl, epoxy-nylon-reduction sliver-powder conducting glue, epoxy-rubber-sliver-powder conducting glue, the polyurethane-reduction sliver-powder conducting glue.
4. the laying method of a conductive film current supply line is characterized in that: comprise conductive film, compliant conductive net sheet, conductive metal foil, lead, it is as follows to lay step:
On the conducting surface of described conductive film, evenly be coated with one deck conductive adhesive, described compliant conductive net sheet is sticked on the conducting surface of described conductive film, described conductive metal foil is sticked on the described compliant conductive net sheet, with described wire bonds on described conductive metal foil.
5. the laying method of conductive film current supply line according to claim 4, it is characterized in that: it is that substrate is coated with the flexible ITO-PET conducting film that ITO makes that described conductive film adopts with the PETG, described conductive adhesive is epoxy resin-silver powder conductive silver paste, and described conductive metal foil adopts copper-foil conducting electricity.
6. the laying method of conductive film current supply line according to claim 4, it is characterized in that: described conductive film is to be coated with the conductive film of ITO or ZAO with polyimides, Merlon as flexible substrate, and described conductive adhesive is a kind of in phenolic aldehyde-electrolytic silver powder conducting resinl, epoxy-nylon-reduction sliver-powder conducting glue, epoxy-rubber-sliver-powder conducting glue, the polyurethane-reduction sliver-powder conducting glue.
7. the laying method of a conductive film current supply line is characterized in that: comprise conductive film, compliant conductive net sheet, conductive metal foil, lead, it is as follows to lay step:
On the conducting surface of described conductive film, evenly be coated with one deck conductive adhesive, described compliant conductive net sheet is sticked on the conducting surface of described conductive film, described conductive metal foil is sticked on the described compliant conductive net sheet, described conductive film, compliant conductive net sheet, conductive metal foil are carried out hot curing together handle, after processing finishes with described wire bonds on described conductive metal foil.
8. the laying method of conductive film current supply line according to claim 7, it is characterized in that: it is that substrate is coated with the flexible ITO-PET conducting film that ITO makes that described conductive film adopts with the PETG, described conductive adhesive is epoxy resin-silver powder conductive silver paste, and described conductive metal foil adopts copper-foil conducting electricity.
9. the laying method of conductive film current supply line according to claim 7, it is characterized in that: described conductive film is to be coated with the conductive film of ITO or ZAO with polyimides, Merlon as flexible substrate, and described conductive adhesive is a kind of in phenolic aldehyde-electrolytic silver powder conducting resinl, epoxy-nylon-reduction sliver-powder conducting glue, epoxy-rubber-sliver-powder conducting glue, the polyurethane-reduction sliver-powder conducting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102377054A CN102074306A (en) | 2009-11-24 | 2009-11-24 | Method for laying power supply leads of conductive film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102377054A CN102074306A (en) | 2009-11-24 | 2009-11-24 | Method for laying power supply leads of conductive film |
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| CN102074306A true CN102074306A (en) | 2011-05-25 |
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| CN2009102377054A Pending CN102074306A (en) | 2009-11-24 | 2009-11-24 | Method for laying power supply leads of conductive film |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103264231A (en) * | 2013-04-28 | 2013-08-28 | 利达光电股份有限公司 | Welding method adaptable to high-temperature sputtering target material |
| CN113421698A (en) * | 2021-06-30 | 2021-09-21 | 东莞市驭能科技有限公司 | Flexible conductive film capable of being firmly welded and preparation method and application thereof |
| CN115032807A (en) * | 2022-08-11 | 2022-09-09 | 成都理工大学工程技术学院 | Three-dimensional imaging device and preparation method thereof |
-
2009
- 2009-11-24 CN CN2009102377054A patent/CN102074306A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103264231A (en) * | 2013-04-28 | 2013-08-28 | 利达光电股份有限公司 | Welding method adaptable to high-temperature sputtering target material |
| CN113421698A (en) * | 2021-06-30 | 2021-09-21 | 东莞市驭能科技有限公司 | Flexible conductive film capable of being firmly welded and preparation method and application thereof |
| CN115032807A (en) * | 2022-08-11 | 2022-09-09 | 成都理工大学工程技术学院 | Three-dimensional imaging device and preparation method thereof |
| CN115032807B (en) * | 2022-08-11 | 2022-11-29 | 成都理工大学工程技术学院 | Three-dimensional imaging device and preparation method thereof |
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Address after: 102600 No. 6 loyalty Road, Xihongmen Town, Beijing, Daxing District Applicant after: Beijing Zhongzhi Tonghui Technology Co., Ltd. Address before: 100166 Beijing city Fengtai District No. 50 a Applicant before: Beijing Zhongzhi Tonghui Technology Co., Ltd. |
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Application publication date: 20110525 |