CN103971788B - Transparent conductive body and preparation method thereof - Google Patents
Transparent conductive body and preparation method thereof Download PDFInfo
- Publication number
- CN103971788B CN103971788B CN201310043714.6A CN201310043714A CN103971788B CN 103971788 B CN103971788 B CN 103971788B CN 201310043714 A CN201310043714 A CN 201310043714A CN 103971788 B CN103971788 B CN 103971788B
- Authority
- CN
- China
- Prior art keywords
- layer
- transparency carrier
- microns
- network
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
A kind of transparent conductive body; including transparency carrier, network-like UV adhesive layer, network-like metal conducting layer and insulating protective layer; metal conducting layer is bonded in a surface of transparency carrier by UV adhesive layer, and insulating protective layer is formed at this surface of transparency carrier and covers metal conducting layer；Wherein, the material of metal conducting layer one in gold, silver, copper and aluminum.The cost of above-mentioned transparent conductive body is relatively low.Additionally, also provide for the preparation method of a kind of transparent conductive body.
Description
Technical field
The present invention relates to touch screen field, particularly to a kind of transparent conductive body and preparation method thereof.
Background technology
The features such as transparent conductive material is high with light penetration because of it, and electric conductivity is good, the most extensively
Be applied in touch screens and the O-E Products such as capacitance plate, transparency electromagnetic wave shield film as transparency electrode.
At present, generally use vacuum evaporation or magnetron sputtering mode by transparent conductive material tin indium oxide (ITO)
It is coated on PET or glass substrate formation transparent conductive body to be applied to capacitance touch screen.
But, because indium metal (In) is a kind of scarce resource, recent country carries out control to it and causes indium unit
The cost of cellulosic material steeply rises；Ito thin film mainly uses vacuum evaporation or magnetron sputtering to produce, and production sets
Standby expensive, this also causes ito thin film price to remain high always, directly results in the transparent height leading material cost
High.
Summary of the invention
Based on this, it is necessary to provide a kind of lower-cost transparent conductive body and preparation method thereof.
A kind of transparent conductive body, leads including transparency carrier, network-like UV adhesive layer, network-like metal
Electric layer and insulating protective layer, described metal conducting layer is bonded in described transparent base by described UV adhesive layer
One surface of plate, described insulating protective layer is formed at the described surface of described transparency carrier and covers described metal
Conductive layer；Wherein, the material of described metal conducting layer one in gold, silver, copper and aluminum.
Wherein in an embodiment, the width of the lines forming the network of described metal conducting layer is 0.2 micron
~ 5 microns, distance between centers of tracks is 50 microns ~ 800 microns.
Wherein in an embodiment, the thickness of described transparency carrier is 50 microns ~ 1200 microns；Described gold
The thickness belonging to conductive layer is 0.5 micron ~ 5 microns.
Wherein in an embodiment, the material of described transparency carrier is glass or transparent plastic；Described UV
The material of adhesive layer is UV polymer；The material of described insulating protective layer is the thermosetting of transparent shape after solidification
Type polymer or UV curing type polymer.
Wherein in an embodiment, described insulating protective layer is provided with planar portions, and described planar portions is positioned at described
Insulating protective layer away from the side of described transparency carrier, the flatness of described planar portions is
0.1μm/mm2~2μm/mm2；Described planar portions and described metal conducting layer are away from the one side of described transparency carrier
Between distance less than 10 microns.
The preparation method of a kind of transparent conductive body, comprises the steps:
Using UV adhesive to form network-like pattern on a surface of transparency carrier, precuring processes
Until the viscosity of described UV adhesive stops solidification after reaching 30000cps ~ 50000cps, formed network-like
UV adhesive layer；
Thering is provided transfer member, described transfer member includes base membrane layer and is laminated in the metal level on described base membrane layer, will
Described transfer member has the one side of described metal level to be formed described in described UV adhesive layer with described transparency carrier
Surface phase pressing, cured until after described UV adhesive layer is fully cured, peeling off described base membrane layer,
The network-like metal conducting layer with described UV adhesive layer stacking, and composition institute is formed on described transparency carrier
The lines of network stating metal conducting layer overlap with the lines of the network forming described UV adhesive layer；Wherein,
The material of described metal level one in gold, silver, copper and aluminum；And
The described surface-coated insulant of described metal conducting layer it is formed with at described transparency carrier, cured
Form the insulating protective layer covering described metal conducting layer, obtain transparent conductive body.
Wherein in an embodiment, use described UV adhesive shape on a surface of described transparency carrier
The method becoming described network-like pattern is: use inkjet technology, and with described UV adhesive as material
Material, the printout surface at described transparency carrier goes out described network-like pattern.
Wherein in an embodiment, the width of the lines of the network of described network-like pattern is 0.2 micron ~ 5
Micron, distance between centers of tracks is 50 microns ~ 800 microns.
Wherein in an embodiment, transfer member also includes between described metal level and described base membrane layer
Release layer；The material of described release layer is silicone oil or paraffin；The material of described base membrane layer is poly terephthalic acid
Glycol ester or polyimide resin；The thickness of described metal level is 0.5 micron ~ 5 microns.
Wherein in an embodiment, described transfer member is had the one side of described metal level and described transparency carrier
The device used when being formed with the described surface phase pressing of described UV adhesive layer is roller；During pressing used
Pressure be 2kg/cm2~10kg/cm2；And the thickness of the described UV adhesive of coating is 1 micron ~ 5 microns；
The viscosity of described UV adhesive is 10cps ~ 1000cps.
Above-mentioned transparent conductive body includes transparency carrier, network-like UV adhesive layer, network-like metallic conduction
Layer and insulating protective layer, be by using UV adhesive layer that metal conducting layer is bonded in the surface of transparency carrier,
The conductive material used is metal conducting layer, and the material of metal conducting layer is in gold, silver, copper and aluminum
A kind of, it is to avoid the conductive material of traditional use tin indium oxide (ITO) this costliness, thus reduce
The cost of bright conductive material, therefore, the cost of above-mentioned transparent conductive body is relatively low.
Accompanying drawing explanation
Fig. 1 is the structural representation of the transparent conductive body of an embodiment；
Fig. 2 is the structural representation of another angle of the transparent conductive body shown in Fig. 1；
Fig. 3 is the flow chart of the preparation method of the transparent conductive body of an embodiment；
Fig. 4 is the preparation process schematic diagram of the transparent conductive body of an embodiment.
Detailed description of the invention
Mainly in combination with drawings and the specific embodiments, transparent conductive body and preparation method thereof is made the most below
Explanation.
As shown in Figures 1 and 2, the transparent conductive body 100 of an embodiment, including transparency carrier 110, UV
Adhesive layer 120, metal conducting layer 130 and insulating protective layer 140.
The material of transparency carrier 110 can be the Transparent Parts that field is conventional, preferably glass or transparent plastic.
Glass can be simple glass.Transparent plastic can be the transparent plastic of hard, and plate is made every effort to overcome in such as Asia；Also may be used
Think the transparent plastic of flexibility, such as polyethylene terephthalate (PET), Merlon (PC) etc.
Thin film.The thickness of transparency carrier 110 is preferably 50 microns ~ 1200 microns.
UV adhesive layer 120 is network-like.UV adhesive layer 120 is formed at a surface of transparency carrier 110.
The material of UV adhesive layer 120 can be UV polymer commonly used in the art, and such as PMMA type UV gathers
Compound, epoxide resin type UV polymer etc..
Metal conducting layer 130 is network-like, and metal conducting layer 130 is bonded in by UV adhesive layer 120
One surface of bright substrate 110.And form lines and the composition UV adhesive layer of the network of metal conducting layer 130
The lines of the network of 120 overlap.Owing to metal material is light tight, therefore the network of composition metal conducting layer 130
The width of lines is preferably 0.2 micron ~ 5 microns, and the lines of the network of this width make transparent conductive body 100
There is lower sheet resistance so that electric conductor 100 has more preferable electric conductivity；More preferably 0.5 micron ~ 2
Micron.The distance between centers of tracks of the lines of the network of metal conducting layer 130 is preferably 50 microns ~ 800 microns, just due to
Metal itself is light tight, and line pitch is the least, and the light transmittance that can make transparent conductive body 100 is relatively low, even
It is susceptible to " Moire fringe " phenomenon；If spacing the farthest cannot meet the requirement of electricity, this spacing
Metal conducting layer 130 makes transparent conductive body 100 both have preferable light transmittance, has again preferable electricity
Performance.And the transparent conductive body prepared of the metal conducting layer 130 of above-mentioned width and spacing only have a few Ω/ ~
Tens Ω/, can meet large scale, the demand of slimming contact panel.Wherein, metal conducting layer 130
Material one in gold, silver, copper and aluminum.Preferably, the thickness of metal conducting layer 130 is 0.5 micro-
Rice ~ 5 microns；Thickness is more preferably 2 microns ~ 5 microns.
Insulating protective layer 140 is formed at this surface of transparency carrier 110 and covers metal conducting layer 130.Insulation
The material of protective layer 140 can be the insulant of transparent shape after solidification, is preferably transparent shape after solidification
Thermosetting polymer or UV curing type polymer, such as, thermosetting polymer can be epoxy resin,
UV curing type polymer can be the PMMA with photosensitizer.Insulating protective layer 140 is provided with planar portions 142,
This planar portions 142 is positioned at the insulating protective layer 140 side away from transparency carrier 110, this planar portions 142
Flatness is 0.1 μm/mm2~2μm/mm2, this flatness makes metal conducting layer 130 have more preferable optics
Performance, the flatness of this planar portions 142 is more preferably 0.2 μm/mm2~0.5μm/mm2.Preferably, plane
Portion 142 and metal conducting layer 130, enter less than 10 microns away from the distance between the one side of transparency carrier 110
The one-step optimization electric conductivity of metal conducting layer 130, distance more preferably less than 5 microns.
Above-mentioned transparent conductive body 100 includes transparency carrier 110, network-like UV adhesive layer 120, network-like
Metal conducting layer 130 and insulating protective layer 140, by use UV adhesive layer 120 by metal conducting layer
130 surfaces being bonded in transparency carrier 110, the conductive material of use is metal conducting layer 130, and metal is led
The material of electric layer 130 one in gold, silver, copper and aluminum, it is to avoid traditional use tin indium oxide (ITO)
The conductive material of this costliness, thus reduce the cost of transparent conductive material, therefore, above-mentioned electrically conducting transparent
The cost of body 100 is relatively low.
As it is shown on figure 3, the preparation method of the transparent conductive body of an embodiment, comprise the steps:
Step S10: use UV adhesive to form network-like pattern, in advance on a surface of transparency carrier
Cured, until the viscosity of UV adhesive stops solidification after reaching 30000cps ~ 50000cps, forms network
The UV adhesive layer of shape.
See also Fig. 4, transparency carrier 110 uses UV adhesive be formed with latticed pattern.
Preferably, a surface at transparency carrier uses the method that UV adhesive forms network-like pattern
For: use inkjet technology, and with UV adhesive as material, the printout surface at transparency carrier goes out
Network-like pattern.
Wherein, the thickness of UV adhesive is preferably 1 micron ~ 5 microns.
Wherein, the material of UV adhesive can be no-solvent type UV polymer, such that it is able to avoid as far as possible
The bigger contraction in the curing process of UV adhesive, can be no-solvent type PMMA type UV polymer,
Epoxide resin type UV polymer etc..The viscosity of UV adhesive is 10cps ~ 1000cps, and solidification wavelength is 200
Nanometer ~ 400 nanometer, being fully cured energy is 100mj/cm2~1000mj/cm2。
Preferably, the width of the lines of the network of this network-like pattern is 0.2 micron ~ 5 microns, distance between centers of tracks
It it is 50 microns ~ 800 microns.It is furthermore preferred that the width of the lines of the network of this network-like pattern is 0.5 micro-
Rice ~ 2 microns.
Step S20: providing transfer member, transfer member includes base membrane layer and the metal level being laminated on base membrane layer, will
Transfer member has the one side of metal level and transparency carrier to be formed with the surface phase pressing of UV adhesive layer, cured
Until after UV adhesive layer is fully cured, peeling off base membrane layer, being formed and UV adhesive layer stacking on the transparent substrate
Network-like metal conducting layer, and the lines of the network of composition metal conducting layer and composition UV adhesive layer
The lines of network overlap.Wherein, the material of metal level one in gold, silver, copper and aluminum.
Preferably, transfer member also includes the release layer between metal level and base membrane layer.The material of release layer
Can be to be prone to the material that metal layer material is peeled off, preferably silicone oil or paraffin.The material of base membrane layer is for poly-right
PET (PET) or polyimide resin (PI).
Preferably, transfer member have the one side of metal level and transparency carrier are formed with the surface phase of UV adhesive layer
The device used during pressing is roller；Pressure used during pressing is 2kg/cm2~10kg/cm2。
Seeing also Fig. 4, transfer member 200 includes metal level 210, release layer 220 and base membrane layer 230.
From fig. 4, it can be seen that be pressed in transfer member 200 on the base membrane layer 230 of transfer member 200 by roller 300
The one side of metal level 210 and transparency carrier 110 is had to be formed with the surface phase pressing of UV adhesive layer 120；Pass through
UV cured, after UV adhesive layer 120 is fully cured, peels off base membrane layer 230, after being fully cured
Adhesive layer 120 very big with the cohesive force of metal level 210, and the material of release layer 220 is for being prone to metal level
210 materials peeled off, release layer 220 and the partial metal layers 210 not having and UV adhesive layer 120 is bonded to
Metal material get off along with base membrane layer 230 is lifted-off together, and metal level 210 and UV adhesive layer 120
The metal material adhered to each other is adhered on UV adhesive layer 120, thus defines metal conducting layer 130.
Owing to UV adhesive layer 120 is fully cured, it is the biggest with the cohesive force of metal level 210 so that in stripping
From transfer member 200 when, with the metal level of UV adhesive layer 120 bonding by UV adhesive layer 120 tightly
Stick on transparency carrier 110, and define the network-like metal with UV adhesive layer stacking and identical patterns
Conductive layer 130.
Preferably, the thickness of metal level is 0.5 micron ~ 5 microns；More preferably 2 microns ~ 5 microns.Wherein,
The thickness of metal level is the thickness of metal conducting layer.
Wherein, step S10 is with step S20, and the equipment that cured is used is UV solidification equipment.
By UV solidification equipment cured in Fig. 4, transparency carrier 110 forms UV adhesive layer 120, and
Use UV solidification equipment cured, make UV adhesive layer 120 be fully cured.
Step S30: be formed with the surface-coated insulant of metal conducting layer, cured formation at transparency carrier
Cover the insulating protective layer of metal conducting layer, obtain transparent conductive body.
Wherein, the method for coating insulant is wet coating technique.
Wherein, equipment used during insulant solidification is UV solidification equipment or hot-air oven.
Insulant can be transparent insulant after solidification, heat curing-type transparent after being preferably solidification
Polymer or UV curing type polymer, such as, thermosetting polymer can be epoxy resin, UV curing type
Polymer can be the PMMA with photosensitizer.Insulating protective layer is provided with planar portions, and this planar portions is positioned at absolutely
Edge protective layer is away from the side of transparency carrier, and the flatness of this planar portions is 0.1 μm/mm2~2μm/mm2, should
Flatness makes metal conducting layer have more preferable optical property, and the flatness of this planar portions is more preferably
0.2μm/mm2~0.5μm/mm2.Preferably, planar portions and metal conducting layer away from transparency carrier one side it
Between distance less than 10 microns, optimize the electric conductivity of metal conducting layer further, distance is the least
In 5 microns.
The preparation method of above-mentioned transparent conductive body, employing transfer member will under the cohesive force effect of UV adhesive
Metal material on metal level is transferred on transparency carrier be formed the metal conducting layer of transparent conductive body, it becomes possible to
Simply preparing transparent conductive body, preparation method is simple, thus improves production efficiency；And it is true without using
The expensive production equipment such as empty evaporation or magnetron sputtering, thus reduce preparation cost.
And the sheet resistance of transparent conductive body prepared by the preparation method of above-mentioned transparent conductive body is relatively low, the most a few Ω/ ~
Tens Ω/, can meet large scale, the demand of slimming contact panel.
Embodiment 1
Preparing of the transparent conductive body of the present embodiment is as follows:
(1) polyethylene terephthalate (PET) transparency carrier providing thickness to be 50 microns, uses
Hyperfine inkjet technology, and to use epoxide resin type UV polymer be that material is in poly terephthalic acid second
Required network-like pattern is printed on one surface of diol ester (PET) transparency carrier.Wherein, epoxy resin
The solidification wavelength of type UV polymer is 365 nanometers, and viscosity is 200cps, and the accumulative irradiation energy of solidification reaches
To 400mj/cm2；The thickness of network-like pattern is 2 microns.And the lines of the network of this network-like pattern
Width be 0.5 micron, distance between centers of tracks is 50 microns；Use UV solidification equipment carry out precuring process until
The viscosity of epoxide resin type UV polymer stops solidification, in poly terephthalic acid second two after reaching 30000cps
The surface of alcohol ester (PET) transparency carrier forms network-like UV adhesive layer.
(2) providing transfer member, transfer member includes layers of copper, silicon layer and the poly terephthalic acid second stacked gradually
Layer, wherein, copper layer thickness is 0.5 micron, uses roller that transfer member has the one side of layers of copper right with poly-
PET (PET) transparency carrier is formed with the surface phase pressing of UV adhesive layer, during pressing
Pressure is 2kg/cm2, then use UV solidification equipment to carry out cured until UV adhesive layer is fully cured
After, peel off polyethylene terephthalate layer, silicon layer and the part not having and UV adhesive layer is bonded to
Copper gets off along with polyethylene terephthalate layer is lifted-off together, and layers of copper sticks to UV adhesive layer
Copper together is adhered on UV adhesive layer, thus at polyethylene terephthalate (PET) transparent base
The network-like copper conductive layer with UV adhesive layer stacking, and the line of the network of composition copper conductive layer is formed on plate
Bar overlaps with the lines of the network of composition UV adhesive layer；And the thickness of copper conductive layer is 0.5 micron.
(3) wet coating technique is used to be formed at polyethylene terephthalate (PET) transparency carrier
The surface-coated of copper conductive layer is with the PMMA of photosensitizer, and through using the solidification of UV solidification equipment, formation is covered
The insulating protective layer of lid copper conductive layer, obtains transparent conductive body.The solidification wavelength of the PMMA of photosensitizer is 365
Nanometer, viscosity is 600cps, and the accumulative irradiation energy of solidification is 600mj/cm2.Wherein, insulating protective layer is provided with
Planar portions, and planar portions is positioned at insulating protective layer away from polyethylene terephthalate (PET) transparency carrier
Side, this planar portions and copper conductive layer are away from the one of polyethylene terephthalate (PET) transparency carrier
Distance between face is 2 microns, and the flatness of this planar portions is 0.1 μm/mm2。
After tested, the sheet resistance of transparent conductive body prepared by the present embodiment is 38.6 Ω/.
Embodiment 2
Preparing of the transparent conductive body of the present embodiment is as follows:
(1) providing thickness is 700 microns of transparent glass substrates, uses hyperfine inkjet technology, and makes
It is material with PMMA type UV polymer, a surface of glass substrate is printed required network-like figure
Case.Wherein, the solidification wavelength of PMMA type UV polymer is 365 nanometers, and viscosity is 100cps, solidification
Accumulative irradiation energy reach 600mj/cm2；The thickness of network-like pattern is 3 microns.And this network-like figure
The width of the lines of the network of case is 3 microns, and distance between centers of tracks is 300 microns；UV solidification equipment is used to carry out
Precuring processes until the viscosity of PMMA type UV polymer stops solidification, transparent after reaching 50000cps
The surface of glass substrate forms network-like UV adhesive layer.
(2) providing transfer member, transfer member includes silver layer, paraffin layer and the polyimide resin (PI) stacked gradually
Layer, wherein, the thickness of silver layer is 2 microns, uses roller that transfer member has one side and the clear glass of silver layer
Substrate is formed with the surface phase pressing of UV adhesive layer, and pressure during pressing is 4kg/cm2, then use UV
Solidification equipment carries out cured until after UV adhesive layer is fully cured, peeling off polyimide resin (PI) layer,
Paraffin layer with do not have and part that UV adhesive layer is bonded to silver along with polyimide resin (PI) layer lifted-off together
Get off, and the silver that silver layer and UV adhesive layer adhere to each other is adhered on UV adhesive layer, thus transparent
The network-like silver conductive layer with UV adhesive layer stacking, and the net of composition silver conductive layer is formed on glass substrate
The lines of network overlap with the lines of the network of composition UV adhesive layer；And the thickness of silver conductive layer is 2 microns.
(3) wet coating technique is used to be formed with the surface-coated asphalt mixtures modified by epoxy resin of silver conductive layer at transparent glass substrate
Fat, solidifies through hot-air oven, forms the insulating protective layer covering silver conductive layer, obtains transparent conductive body.Gu
Change condition is: 80 DEG C solidify 10 minutes.Wherein, insulating protective layer is provided with planar portions, and planar portions is positioned at absolutely
Edge protective layer is away from the side of transparent glass substrate, and this planar portions and silver conductive layer are away from transparent glass substrate
Distance between Yi Mian is 5 microns, and the flatness of this planar portions is 0.2 μm/mm2。
After tested, the sheet resistance of transparent conductive body prepared by the present embodiment is 18.2 Ω/.
Embodiment 3
Preparing of the transparent conductive body of the present embodiment is as follows:
(1) Merlon (PC) transparency carrier providing thickness to be 1200 microns, uses hyperfine ink-jet
Printing technique, and to use epoxide resin type UV polymer be material, at Merlon (PC) transparency carrier
A surface on print required network-like pattern.Wherein, the solidification ripple of epoxide resin type UV polymer
A length of 365 nanometers, viscosity is 200cps, and the accumulative irradiation energy of solidification reaches 400mj/cm2；Network-like
The thickness of pattern is 2 microns.And the width of the lines of the network of this network-like pattern is 2 microns, between line
Away from for 400 microns；UV solidification equipment is used to carry out precuring process until epoxide resin type UV polymer
Viscosity stops solidification after reaching 30000cps, is formed network-like on the surface of Merlon (PC) transparency carrier
UV adhesive layer.
(2) providing transfer member, transfer member includes aluminium lamination, silicon layer and the poly terephthalic acid second stacked gradually
Diol ester (PET) layer, wherein, the thickness of aluminium lamination is 5 microns, uses roller that transfer member has the one of aluminium lamination
Face and Merlon (PC) transparency carrier are formed with the surface phase pressing of UV adhesive layer, pressure during pressing
For 10kg/cm2, then use UV solidification equipment to carry out cured until after UV adhesive layer is fully cured,
Peel off polyethylene terephthalate layer (PET), silicon layer and the portion not having and UV adhesive layer is bonded to
Divide aluminum to get off along with polyethylene terephthalate layer (PET) is lifted-off together, and aluminium lamination is gluing with UV
The aluminum that layer adheres to each other is adhered on UV adhesive layer, thus on Merlon (PC) transparency carrier
Form the network-like aluminum conductive layer with UV adhesive layer stacking, and the lines of the network of composition aluminum conductive layer with
The lines of the network of composition UV adhesive layer overlap；And the thickness of aluminum conductive layer is 5 microns.
(3) wet coating technique is used to be formed at polyethylene terephthalate (PET) transparency carrier
The surface-coated of aluminum conductive layer is with the PMMA of photosensitizer, through using UV solidification equipment to solidify, shape
Become the insulating protective layer of aluminium coating conductive layer, obtain transparent conductive body.The solidification wavelength of the PMMA of photosensitizer
Being 365 nanometers, viscosity is 600cps, and the accumulative irradiation energy of solidification is 600mj/cm2.Wherein, insulation protection
Layer is provided with planar portions, and this planar portions is positioned at the insulating protective layer side away from Merlon (PC) transparency carrier,
This planar portions and aluminum conductive layer are 4 microns away from the distance between the one side of Merlon (PC) transparency carrier,
The flatness of this planar portions is 0.5 μm/mm2。
After tested, the sheet resistance of transparent conductive body prepared by the present embodiment is 89.4 Ω/.
Embodiment 4
Preparing of the transparent conductive body of the present embodiment is as follows:
(1) Merlon (PC) transparency carrier providing thickness to be 1000 microns, uses hyperfine ink-jet
Printing technique, and to use epoxide resin type UV polymer be material, at Merlon (PC) transparency carrier
A surface on print required network-like pattern.Wherein, the solidification ripple of epoxide resin type UV polymer
A length of 365 nanometers, viscosity is 200cps, and the accumulative irradiation energy of solidification reaches 400mj/cm2；Network-like
The thickness of pattern is 2 microns.And the width of the lines of the network of this network-like pattern is 3 microns, between line
Away from for 400 microns；UV solidification equipment is used to carry out precuring process until epoxide resin type UV polymer
Viscosity stops solidification after reaching 30000cps, is formed network-like on the surface of Merlon (PC) transparency carrier
UV adhesive layer.
(2) providing transfer member, transfer member includes layer gold, silicon layer and the poly terephthalic acid second stacked gradually
Diol ester (PET) layer, wherein, the thickness of layer gold is 5 microns, uses roller that transfer member has the one of layer gold
Face and Merlon (PC) transparency carrier are formed with the surface phase pressing of UV adhesive layer, pressure during pressing
For 10kg/cm2, then use UV solidification equipment to carry out cured until after UV adhesive layer is fully cured,
Peel off polyethylene terephthalate layer (PET), silicon layer and the portion not having and UV adhesive layer is bonded to
Parting gets off along with polyethylene terephthalate layer (PET) is lifted-off together, and layer gold is gluing with UV
The gold that layer adheres to each other is adhered on UV adhesive layer, thus on Merlon (PC) transparency carrier
Form the network-like golden conductive layer with UV adhesive layer stacking, and the lines of the network of composition gold conductive layer with
The lines of the network of composition UV adhesive layer overlap；And the thickness of gold conductive layer is 5 microns.
(4) wet coating technique is used to be formed at polyethylene terephthalate (PET) transparency carrier
The surface-coated of gold conductive layer is with the PMMA of photosensitizer, through using UV solidification equipment to solidify, shape
Become to cover the insulating protective layer of gold conductive layer, obtain transparent conductive body.The solidification wavelength of the PMMA of photosensitizer
Being 365 nanometers, viscosity is 600cps, and the accumulative irradiation energy of solidification is 600mj/cm2.Wherein, insulation protection
Layer is provided with planar portions, and this planar portions is positioned at the insulating protective layer side away from Merlon (PC) transparency carrier,
This planar portions and gold conductive layer are 1 micron away from the distance between the one side of Merlon (PC) transparency carrier,
The flatness of this planar portions is 2 μm/mm2。
After tested, the sheet resistance of transparent conductive body prepared by the present embodiment is 28.8 Ω/.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for this area
Those of ordinary skill for, without departing from the inventive concept of the premise, it is also possible to make some deformation and
Improving, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended
Claim is as the criterion.
Claims (6)
1. a transparent conductive body, it is characterised in that include transparency carrier, network-like UV adhesive layer,
Network-like metal conducting layer and insulating protective layer, described metal conducting layer is bonding by described UV adhesive layer
In a surface of described transparency carrier, described insulating protective layer is formed at the described surface of described transparency carrier also
Cover described metal conducting layer；Wherein, the material of described metal conducting layer is in gold, silver, copper and aluminum
A kind of；Described insulating protective layer is provided with planar portions, and described planar portions is positioned at described insulating protective layer away from described
The side of transparency carrier, the flatness of described planar portions is 0.1 μm～2 μm；Described planar portions is to described metal
Conductive layer is less than 10 microns away from the distance of the one side of described transparency carrier；Form the net of described metal conducting layer
The width of the lines of network is 0.2 micron～5 microns, and distance between centers of tracks is 50 microns～800 microns；Described transparency carrier
Thickness be 50 microns～1200 microns；The thickness of described metal conducting layer is 0.5 micron～5 microns.
Transparent conductive body the most according to claim 1, it is characterised in that the material of described transparency carrier
For glass or transparent plastic；The material of described UV adhesive layer is UV polymer；The material of described insulating protective layer
Material is the thermosetting polymer of transparent shape or UV curing type polymer after solidification.
3. the preparation method of a transparent conductive body, it is characterised in that comprise the steps:
Using UV adhesive to form network-like pattern on a surface of transparency carrier, precuring processes
Until the viscosity of described UV adhesive stops solidification after reaching 30000cps～50000cps, formed network-like
UV adhesive layer；
Thering is provided transfer member, described transfer member includes base membrane layer and is laminated in the metal level on described base membrane layer, will
Described transfer member has the one side of described metal level to be formed described in described UV adhesive layer with described transparency carrier
Surface phase pressing, cured until after described UV adhesive layer is fully cured, peeling off described base membrane layer,
The network-like metal conducting layer with described UV adhesive layer stacking, and composition institute is formed on described transparency carrier
The lines of network stating metal conducting layer overlap with the lines of the network forming described UV adhesive layer；Wherein,
The material of described metal level one in gold, silver, copper and aluminum；And
The described surface-coated insulant of described metal conducting layer it is formed with at described transparency carrier, cured
Form the insulating protective layer covering described metal conducting layer, obtain transparent conductive body；
Wherein, described insulating protective layer is provided with planar portions, described planar portions be positioned at described insulating protective layer away from
The side of described transparency carrier, the flatness of described planar portions is 0.1 μm/mm2～2 μm/mm2；Described plane
Portion and described metal conducting layer are less than 10 microns away from the distance between the one side of described transparency carrier；Described net
The width of the lines of the network of the pattern of network shape is 0.2 micron～5 microns, and distance between centers of tracks is 50 microns～800 microns；
The thickness of described transparency carrier is 50 microns～1200 microns；The thickness of described metal level is 0.5 micron～5 micro-
Rice.
The preparation method of transparent conductive body the most according to claim 3, it is characterised in that described
The method that one surface of bright substrate uses described UV adhesive to form described network-like pattern is: use
Inkjet technology, and with described UV adhesive as material, the printout surface at described transparency carrier goes out
Described network-like pattern.
The preparation method of transparent conductive body the most according to claim 3, it is characterised in that described transfer
Part also includes the release layer between described metal level and described base membrane layer；The material of described release layer is silicon
Oil or paraffin；The material of described base membrane layer is polyethylene terephthalate or polyimide resin.
The preparation method of transparent conductive body the most according to claim 3, it is characterised in that by described turn
Printed document has the one side of described metal level and described transparency carrier to be formed with the described surface phase of described UV adhesive layer
The device used during pressing is roller；Pressure used during pressing is 2kg/cm2～10kg/cm2；And coating
The thickness of described UV adhesive be 1 micron～5 microns；The viscosity of described UV adhesive is
10cps～1000cps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310043714.6A CN103971788B (en) | 2013-02-04 | 2013-02-04 | Transparent conductive body and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310043714.6A CN103971788B (en) | 2013-02-04 | 2013-02-04 | Transparent conductive body and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103971788A CN103971788A (en) | 2014-08-06 |
| CN103971788B true CN103971788B (en) | 2016-08-31 |
Family
ID=51241174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310043714.6A Active CN103971788B (en) | 2013-02-04 | 2013-02-04 | Transparent conductive body and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103971788B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323972B (en) * | 2015-09-21 | 2018-11-06 | 武汉威杜信息科技有限公司 | A kind of high temperature blocking film, its production method and application for making conducting wire |
| CN108962502A (en) * | 2018-07-31 | 2018-12-07 | 北京梦之墨科技有限公司 | A kind of conductive film and preparation method thereof |
| CN112103009A (en) * | 2020-09-02 | 2020-12-18 | 南昌欧菲显示科技有限公司 | Conductive film, preparation method thereof and product with conductive film |
| CN112752413B (en) * | 2020-12-03 | 2022-05-31 | 深圳市晶泓科技有限公司 | Transparent LED circuit board and preparation method of transparent LED display screen |
| GB2613773A (en) * | 2021-11-17 | 2023-06-21 | Scodix Ltd | Article having a Patterned Metal Film on a Surface Thereof, and Methods of Production Therefor |
| CN114455857B (en) * | 2022-02-23 | 2023-05-23 | 江苏铁锚玻璃股份有限公司 | Transparent conductive glass and surface resistance reduction method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000351170A (en) * | 1999-06-10 | 2000-12-19 | Gunze Ltd | Transparent conductive laminate |
| JP2001052529A (en) * | 1999-08-03 | 2001-02-23 | Mitsui Chemicals Inc | Transparent conductive thin film laminate |
| TW201224108A (en) * | 2010-10-29 | 2012-06-16 | Lintec Corp | Transparent electric conductive film, electronic device, manufacturing method of electronic device |
| WO2013004667A1 (en) * | 2011-07-05 | 2013-01-10 | Hutchinson | Transparent conductive multilayer electrode and associated manufacturing process |
| CN102903423A (en) * | 2012-10-25 | 2013-01-30 | 南昌欧菲光科技有限公司 | Conduction structure in transparent conduction film, transparent conduction film and manufacture method thereof |
| CN203118521U (en) * | 2013-02-04 | 2013-08-07 | 深圳欧菲光科技股份有限公司 | Transparent conductor |
-
2013
- 2013-02-04 CN CN201310043714.6A patent/CN103971788B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000351170A (en) * | 1999-06-10 | 2000-12-19 | Gunze Ltd | Transparent conductive laminate |
| JP2001052529A (en) * | 1999-08-03 | 2001-02-23 | Mitsui Chemicals Inc | Transparent conductive thin film laminate |
| TW201224108A (en) * | 2010-10-29 | 2012-06-16 | Lintec Corp | Transparent electric conductive film, electronic device, manufacturing method of electronic device |
| WO2013004667A1 (en) * | 2011-07-05 | 2013-01-10 | Hutchinson | Transparent conductive multilayer electrode and associated manufacturing process |
| CN102903423A (en) * | 2012-10-25 | 2013-01-30 | 南昌欧菲光科技有限公司 | Conduction structure in transparent conduction film, transparent conduction film and manufacture method thereof |
| CN203118521U (en) * | 2013-02-04 | 2013-08-07 | 深圳欧菲光科技股份有限公司 | Transparent conductor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103971788A (en) | 2014-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103971788B (en) | Transparent conductive body and preparation method thereof | |
| CN103412667B (en) | Touch panel and touch display device | |
| WO2015156316A1 (en) | Wiring body and wiring substrate | |
| CN103279222A (en) | Touch panel and preparation method thereof | |
| WO2004061640A1 (en) | Narrow-frame touch panel | |
| JP2013122745A (en) | Touch panel and manufacturing method thereof | |
| CN103279240B (en) | Contact panel | |
| CN104080753B (en) | Glass plate including the first sheet glass being at least partially coated with conductive coating | |
| US20240023240A1 (en) | Ultra-thin Composite Transparent Conductive Film and Preparation Method Therefor | |
| JP5918896B1 (en) | Wiring body, wiring board, and method of manufacturing wiring body | |
| CN203178950U (en) | Single-glass touchpad | |
| CN103971787B (en) | Transparent conductive body and preparation method thereof | |
| TW201206332A (en) | Flexible printed circuit board and method for manufacturing the same | |
| CN104978058B (en) | Circuit element and its manufacturing method | |
| KR102029724B1 (en) | Electrode member and touchpad device with the same | |
| TWM445836U (en) | Electromagnetic interference shielding structure | |
| KR101272625B1 (en) | Assembly of Pad for Touch Panel and Circuit Board | |
| CN203118521U (en) | Transparent conductor | |
| CN111667941A (en) | Integrated composite structure transparent conductive film and preparation method thereof | |
| CN102673046A (en) | Composite board made of metamaterials and preparation method | |
| CN102903467B (en) | There is micro-resistive element and the manufacture method thereof of flexible material layer | |
| JP5618083B2 (en) | Method for manufacturing touch panel member | |
| TWI494807B (en) | One-glass-solution touch panel and method of manufacturing the same | |
| TWM397556U (en) | Single-layer projected capacitive touch panel | |
| CN210142513U (en) | Ultrathin composite transparent conductive film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Ophiguang Group Co.,Ltd. Address before: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Patentee before: OFilm Tech Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP03 | Change of name, title or address |
Address after: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Patentee after: OFilm Tech Co.,Ltd. Address before: Baoan District Gongming town of Shenzhen City, Guangdong province 518106 White Pine Road HUAFA Road Light Technology Park Patentee before: Shenzhen OFilm Tech Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210303 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Patentee after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 518106 oufeiguang Science Park, HUAFA section of Songbai highway, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Ophiguang Group Co.,Ltd. |
|
| TR01 | Transfer of patent right |