CN102070847A - Semiconductive composite plastic - Google Patents

Semiconductive composite plastic Download PDF

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Publication number
CN102070847A
CN102070847A CN 201010547743 CN201010547743A CN102070847A CN 102070847 A CN102070847 A CN 102070847A CN 201010547743 CN201010547743 CN 201010547743 CN 201010547743 A CN201010547743 A CN 201010547743A CN 102070847 A CN102070847 A CN 102070847A
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China
Prior art keywords
parts
semiconduction
complex plastic
nano
several
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Pending
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CN 201010547743
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Chinese (zh)
Inventor
吴坚
洪梅
卫贞
陈琪良
张坚禾
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WUXI TAILITE SCIENCE AND TECHNOLOGY Co Ltd
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WUXI TAILITE SCIENCE AND TECHNOLOGY Co Ltd
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Priority to CN 201010547743 priority Critical patent/CN102070847A/en
Publication of CN102070847A publication Critical patent/CN102070847A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a semiconductive composite plastic which has high cost performance and physical and mechanical performances and can be applied to the fields such as microelectronics, ores, petrochemical industry and the like, and equipment, appliances and engineering materials with plastics to replace steel, other fields and daily life. The semiconductive composite plastic is characterized in that chlorinated polyethylene (CSPE) (CSM) or chlorinated polyethylene (CPE) (CM) is used as the main substrate; any one or more of polyethylene (PE), polyvinyl chloride (PVC), polyurethane (PU), polyamide (PA), polypropylene (PP) and acrylonitrile butadiene styrene (ABS) plastic are used as auxiliary materials; any one or more of conductive polymers, carbon black, graphite, nano-carbon fibers, nano-metals, nano-metal fibers and silver (nickel)-plated materials are used as conductive fillers; and the semiconductive composite plastic has semi-conduction with resistance between 1.0ohm.cm and 1*10<9>ohm.cm.

Description

The semiconduction complex plastic
Technical field
The present invention relates to a kind of semiconduction complex plastic, being specially with chlorosulfonated polyethylene CSPE (CSM) or chlorinatedpolyethylene CPE (CM) is the semiconduction complex plastic of main base material.
Background technology
The production plant of microelectronic, the metope of its use, ground, utensil and articles for use all need be used antistatic material; Used plastic cement equipment, material all need to reach the flame-retardant and anti-static safety requirements in the production in field such as mine, petrochemical industry.In the prior art, the related products that plastic material in the practical application is made, all have the conflicting situation of mechanical property and antistatic property, if will guarantee that the associated safety performance then can influence physical and mechanical property, it is very of short duration to cause not reaching service requirements or work-ing life.
Summary of the invention
Physical and mechanical property, anti-electrostatic fire retardant performance, the conflicting situation of production cost at present semiconduction plastic material existence, the invention provides the semiconduction complex plastic material of high performance-price ratio, high physical and mechanical property, it can be applied to fields such as microelectronics, ore, petrochemical industry, to mould, also can be applicable in other field and the daily life for steel equipment, utensil and engineering materials.
It is achieved through the following technical solutions: it is characterized in that: it is main base material with chlorinatedpolyethylene CSPE (CSM) or chlorinatedpolyethylene CPE (CM), with any in polythene PE, polyvinylchloride, polyurethane PU, polymeric amide PA, polypropylene PP, the ABS plastic or severally be auxiliary material, in conductive polymers, carbon black, graphite, carbon nano fiber, nano metal, nano metal fiber, silver-plated (nickel) material any or several be conductive filler material, have resistance value simultaneously in 1.0 Ω cm and 1 * 10 9Semi-conductivity between the Ω cm.
It is further characterized in that: it also comprises packing material, fire retardant, processing aid; Described semiconduction complex plastic is made of following parts by weight of component: 30 parts-70 parts of main base materials, and 20 parts-50 parts in auxiliary material, 1 part-30 parts of conductive filler materials, packing material 0-35 part, fire retardant 0-25 part, and the processing aid of 0-10 part is formed; Described packing material is any or several of lime carbonate class, Magnesium Silicate q-agent salt, aluminum oxide powder, kaolin, polynite, titanium dioxide; Described fire retardant is any or several in inorganic combustion inhibitor, halogenated flame retardant, the phosphorus flame retardant.
In the said components of the present invention, processing aid is made up of oxidation inhibitor, thermo-stabilizer.
Adopt the present invention of said components, under the prerequisite that reaches the flame-retardant and anti-static safety requirements, guaranteed high physical and mechanical property of the present invention, can be widely used in microelectronics, ore, petrochemical industry and the daily life, to mould for steel equipment, utensil and engineering materials the use range broadness.
Embodiment
The present invention includes 30 parts-70 parts is main base material with chlorinatedpolyethylene CSPE (CSM) or chlorinatedpolyethylene CPE (CM), 20 parts-50 parts with any in polythene PE, polyvinylchloride, polyurethane PU, polymeric amide PA, polypropylene PP, the ABS plastic or severally be auxiliary material, 1 part-30 parts with in conductive polymers, carbon black, graphite, carbon nano fiber, nano metal, nano metal fiber, silver-plated (nickel) material any or several be conductive filler material, also have 0-35 part packing material, 0-25 part fire retardant, 0-10 part processing aid; Wherein best proportioning: 50 parts of main base materials, 35 parts in auxiliary material, 15 parts of conductive filler materials, 17.5 parts of packing materials, 12.5 parts of fire retardants, 5 parts of processing aids; Packing material is any or several of lime carbonate class, Magnesium Silicate q-agent salt, aluminum oxide powder, kaolin (polynite), titanium dioxide; Fire retardant is any or several in inorganic combustion inhibitor, halogenated flame retardant, the phosphorus flame retardant.

Claims (5)

1.
Figure 830624DEST_PATH_IMAGE001
The semiconduction complex plastic, it is characterized in that: it is main base material with chlorinatedpolyethylene CSPE (CSM) or chlorinatedpolyethylene CPE (CM), with any in polythene PE, polyvinylchloride, polyurethane PU, polymeric amide PA, polypropylene PP, the ABS plastic or severally be auxiliary material, in conductive polymers, carbon black, graphite, carbon nano fiber, nano metal, nano metal fiber, silver-plated (nickel) material any or several be conductive filler material, have resistance value simultaneously in 1.0 Ω cm and 1 * 10 9Semi-conductivity between the Ω cm.
2. semiconduction complex plastic according to claim 1 is characterized in that: it also comprises packing material, fire retardant, processing aid.
3. semiconduction complex plastic according to claim 1 and 2, it is characterized in that: described semiconduction complex plastic is made of following parts by weight of component: 30 parts-70 parts of main base materials, 20 parts-50 parts in auxiliary material, 1 part-30 parts of conductive filler materials, packing material 0-35 part, fire retardant 0-25 part, and the processing aid of 0-10 part is formed; Described packing material is any or several of lime carbonate class, Magnesium Silicate q-agent salt, aluminum oxide powder, kaolin, polynite, titanium dioxide.
4. semiconduction complex plastic according to claim 3 is characterized in that: described fire retardant is any or several in inorganic combustion inhibitor, halogenated flame retardant, the phosphorus flame retardant.
5. semiconduction complex plastic according to claim 4 is characterized in that: above-mentioned processing aid is made up of oxidation inhibitor, thermo-stabilizer.
CN 201010547743 2010-11-17 2010-11-17 Semiconductive composite plastic Pending CN102070847A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201010547743 CN102070847A (en) 2010-11-17 2010-11-17 Semiconductive composite plastic

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Application Number Priority Date Filing Date Title
CN 201010547743 CN102070847A (en) 2010-11-17 2010-11-17 Semiconductive composite plastic

Publications (1)

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CN102070847A true CN102070847A (en) 2011-05-25

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CN (1) CN102070847A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102276943A (en) * 2011-06-22 2011-12-14 青岛润兴塑料新材料有限公司 Bi-anti polrvinyl chloride plastic used for steel-plastic compound pipes and manufacturing method thereof
CN102807763A (en) * 2012-07-27 2012-12-05 苏州市兴吴工程塑胶有限公司 Formula of carbon nanofiber plastic
CN104962012A (en) * 2015-07-30 2015-10-07 苏州荣昌复合材料有限公司 Antistatic PVC (polyvinyl chloride) modified plastic and preparation method thereof
CN105153606A (en) * 2015-07-10 2015-12-16 苏州科茂电子材料科技有限公司 Heat-resistance and aging-resistance polymer electric cable material and preparation method thereof
CN105968786A (en) * 2016-07-22 2016-09-28 丁悦 Athletic ground runway material
CN106147073A (en) * 2016-07-06 2016-11-23 苏州亚科塑胶有限公司 A kind of preparation method of color antistatic fire retardant plastic composite
CN106188913A (en) * 2016-09-07 2016-12-07 马鞍山纽盟知识产权管理服务有限公司 A kind of high temperature-resistant cable insulant
CN106750946A (en) * 2016-12-23 2017-05-31 苏州缔绿电子科技有限公司 A kind of packaging material for electronic product and preparation method thereof
CN109943068A (en) * 2019-03-28 2019-06-28 金旸(厦门)新材料科技有限公司 A kind of high-temperature-resnylont nylont material and plating nylon material and its preparation method and application

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3816347A (en) * 1972-11-02 1974-06-11 Du Pont Semiconductive elastomeric composition of chlorinated or chlorosulfonated polyethylene,ethylene polymer and conductive carbon black
CN1896135A (en) * 2005-12-03 2007-01-17 河北九星橡塑制品有限公司 Oil and acid-base resisting blended material and its production

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3816347A (en) * 1972-11-02 1974-06-11 Du Pont Semiconductive elastomeric composition of chlorinated or chlorosulfonated polyethylene,ethylene polymer and conductive carbon black
CN1896135A (en) * 2005-12-03 2007-01-17 河北九星橡塑制品有限公司 Oil and acid-base resisting blended material and its production

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102276943A (en) * 2011-06-22 2011-12-14 青岛润兴塑料新材料有限公司 Bi-anti polrvinyl chloride plastic used for steel-plastic compound pipes and manufacturing method thereof
CN102807763A (en) * 2012-07-27 2012-12-05 苏州市兴吴工程塑胶有限公司 Formula of carbon nanofiber plastic
CN105153606A (en) * 2015-07-10 2015-12-16 苏州科茂电子材料科技有限公司 Heat-resistance and aging-resistance polymer electric cable material and preparation method thereof
CN104962012A (en) * 2015-07-30 2015-10-07 苏州荣昌复合材料有限公司 Antistatic PVC (polyvinyl chloride) modified plastic and preparation method thereof
CN106147073A (en) * 2016-07-06 2016-11-23 苏州亚科塑胶有限公司 A kind of preparation method of color antistatic fire retardant plastic composite
CN105968786A (en) * 2016-07-22 2016-09-28 丁悦 Athletic ground runway material
CN106188913A (en) * 2016-09-07 2016-12-07 马鞍山纽盟知识产权管理服务有限公司 A kind of high temperature-resistant cable insulant
CN106750946A (en) * 2016-12-23 2017-05-31 苏州缔绿电子科技有限公司 A kind of packaging material for electronic product and preparation method thereof
CN109943068A (en) * 2019-03-28 2019-06-28 金旸(厦门)新材料科技有限公司 A kind of high-temperature-resnylont nylont material and plating nylon material and its preparation method and application
CN109943068B (en) * 2019-03-28 2022-01-25 金旸(厦门)新材料科技有限公司 High-temperature-resistant nylon material, electroplating nylon material, preparation method and application thereof

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Application publication date: 20110525