CN106750946A - A kind of packaging material for electronic product and preparation method thereof - Google Patents
A kind of packaging material for electronic product and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
- C08F255/02—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses packaging material for electronic product and preparation method thereof, it is with polypropylene, chlorosulfonated polyethylene, phthalic acid ester, vinylacetate is main component, by adding ethyoxyl cocoalkyl amines, nano aluminium oxide, magnesium fluoride, clay, high wear-resistant carbon black, mica powder, benzyltriethylammoinium chloride, carboxymethyl chitosan, rilanit special, plasticizer, coupling agent, it is aided with water bath with thermostatic control, centrifugation, vacuum drying, grinding refinement, microwave treatment, mixing, plasticizing, melting extrusion, the technique such as hot-forming, so that the packaging material for electronic product being prepared from, its anti-static effect continuation is good, and physical strength is high, disclosure satisfy that the requirement of industry, with preferable application prospect.
Description
Technical field
It is more particularly to a kind of for the packaging material of electronic product and its preparation side the present invention relates to packaging material field
Method.
Background technology
Packaging material refer to meet product packaging for manufacturing packing container, packing and decorating, packages printing, packed and transported etc.
It is required that the material for being used, it is to include that metal, plastics, glass, ceramics, paper, bamboo sheet, wild mushroom class, natural fiber, chemistry are fine
The main packaging material such as dimension, composite, and the auxiliary material such as including coating, adhesive, strapping, decoration, printing material.
In main packaging material, paper packing material, plastic package material, metal packing material and glass packaging materials are using the widest
General several classes.
Packaging material with electrostatic-proof function are used as the electronics unit for protecting the semiconductor very fragile to electrostatic etc.
The packaging material or antistatic adhesive tape of part and use.The manufacture method of the existing packaging material for possessing electrostatic-proof function has
Following method.That is, as using vacuum plant physical gas-phase deposite method, using splash source using as the aluminium of metallics,
The evaporation such as nickel, copper, indium oxide, tin oxide arrives general macromolecule membrane, so as to manufacture the packaging material of electric conductivity/electrostatically dissipative
Method.However, being entered using the packaging material for possessing electrostatic-proof function that the physical gas-phase deposite method of vacuum plant is manufactured
During row manufacturing process and/or after manufacturing process terminates, due to macromolecule membrane and the metallic film being deposited with it
Between cohesive force it is low, come off and reduce electrostatic-proof function so as to there is metallic film, and pollution surrounding environment problem.Have
Another manufacture method of the packaging material of electrostatic-proof function has using the method for surfactant, and has thin in macromolecule resin
The outside application type of film surface coating surface activating agent and the mixing input antistatic surface when macromolecule resin film is manufactured
The internal mix feeding type of activating agent.During using the former, manufacturing expense is cheap, and initial performance is good, but anti-quiet due to playing
The surfactant-coated of Electricity Functional is on the surface of film, therefore the persistence and durability of electrostatic-proof function are relatively low, and
Other materials contacted when there is a problem of that pollution is used.During using internal mix feeding type, continuation and durability are compared
The former is excellent, and manufacturing expense is cheap, and manufacturing process is simple, therefore is currently used more method.Although being at present
Only to be initial performance excellent for the known packaging material for possessing electrostatic-proof function, but continuation is poor, therefore exists
The problem of electrostatic dissipation effect can be lost after a predetermined time.
Based on drawbacks described above, it is badly in need of developing the packaging material that a kind of production technology is environmentally friendly, anti-static effect is lasting.
The content of the invention
In order to solve the above technical problems, the present invention provides a kind of packaging material for electronic product and preparation method thereof,
It is combined by using specified raw material, the corresponding production technology of cooperation, the packaging material for electronic product for obtaining, it is prevented
Electrostatic efficiency continuation is good, and physical strength is high, disclosure satisfy that the requirement of industry, with preferable application prospect.
The purpose of the present invention can be achieved through the following technical solutions：
For the packaging material of electronic product, it is made from the following raw materials in parts by weight:Polypropylene 45-55 parts, chlorosulfonated polyethylene
40-50 parts, phthalic acid ester 30-40 parts, vinylacetate 20-30 parts, 16-20 parts of ethyoxyl cocoalkyl amines, nano oxygen
Change 8-12 parts of aluminium, magnesium fluoride 6-8 parts, clay 6-8 parts, high wear-resistant carbon black 4-6 parts, mica powder 1-3 parts, benzyltriethylammoinium chloride
2-4 parts, carboxymethyl chitosan 2-4 parts, rilanit special 1-3 parts, plasticizer 3-5 parts, coupling agent 3-5 parts.
Preferably, the plasticizer is selected from N, appointing in N- dimethyl lauramides, dioctyl adipate and chlorinated paraffin
Meaning is a kind of.
Preferably, the coupling agent is selected from vinyltrimethoxy silane, the oleic acid acyloxy titanate esters of isopropyl three and two
Any one in stearoyl keto isopropoxy Aluminate.
The preparation method of the described packaging material for electronic product, comprises the following steps：
（1）Polypropylene, chlorosulfonated polyethylene, phthalic acid ester, vinylacetate, ethyoxyl cocoalkyl amines are put into constant temperature
In water-bath, the polyethylene glycol of quality, isothermal reaction 3 hours, centrifugation after discharging, by separating mixture with anhydrous such as add
Ethanol is washed 2 times, then is placed in drying 5 hours in vacuum drying chamber, obtains preconditioned mixture；
（2）Magnesium fluoride, clay, high wear-resistant carbon black, mica powder are ground refinement, nano aluminium oxide, benzyl three is subsequently adding
Ethyl ammonium chloride, carboxymethyl chitosan, are warming up to 50-60 DEG C after being mixed thoroughly, microwave treatment 25-35 minutes, obtain micro-
Ripple processes mixture；
（3）The preconditioned mixture of step 1 gained is sufficiently mixed with the microwave treatment mixture of step 2 gained, is stirred,
Rilanit special, plasticizer, coupling agent are added, 85-95 DEG C is warming up to, kneaded 15-20 minutes, be subsequently sent to enter in banbury
Row plasticizing, plasticization temperature is 110-120 DEG C, and fusion time is 20 minutes, the material of gained then is transferred into double roller open
Further plastified in plasticator, plasticization temperature is 90-95 DEG C, fusion time is 10-12 minutes；
（4）Compound after plasticizing is added in parallel double-screw extruder to carry out melt blending and granulates, then by particulate material
Hot press carries out hot-forming, and at 190-200 DEG C, briquetting pressure is controlled in 50 kg/cm2, dwell time for hot pressing temperature control
Control obtained finished product at 6-8 minutes after shaping.
Preferably, the step（2）The frequency of middle microwave treatment is 2200 MHz, power is 1000 W.
Preferably, the step（4）The barrel zone temperature of middle parallel double-screw extruder is 190-200 DEG C, and die head temperature is
195-205 DEG C, screw speed is 500-600 revs/min.
Compared with prior art, its advantage is the present invention：
（1）Packaging material for electronic product of the invention are with polypropylene, chlorosulfonated polyethylene, phthalic acid ester, acetic acid
Vinyl acetate is main component, by add ethyoxyl cocoalkyl amines, nano aluminium oxide, magnesium fluoride, clay, high wear-resistant carbon black,
Mica powder, benzyltriethylammoinium chloride, carboxymethyl chitosan, rilanit special, plasticizer, coupling agent, be aided with water bath with thermostatic control, from
The heart is separated, is vacuum dried, grinding the technique such as refinement, microwave treatment, mixing, plasticizing, melting extrusion, hot-forming so that prepared
The packaging material for electronic product, its anti-static effect continuation is good, and physical strength is high, disclosure satisfy that industry
It is required that, with preferable application prospect.
（2）Packaging material raw material for electronic product of the invention is cheap, process is simple, is suitable to heavy industrialization fortune
With practical.
Specific embodiment
The technical scheme invented is described in detail with reference to specific embodiment.
Embodiment 1
45 parts of polypropylene, 40 parts of chlorosulfonated polyethylene, 30 parts of phthalic acid ester, vinylacetate are accurately weighed according to weight portion
20 parts, 16 parts of ethyoxyl cocoalkyl amines, 8 parts of nano aluminium oxide, 6 parts of magnesium fluoride, 6 parts of clay, 4 parts of high wear-resistant carbon black, mica
1 part of powder, 2 parts of benzyltriethylammoinium chloride, 2 parts of carboxymethyl chitosan, 1 part of rilanit special, N, N- dimethyl lauramides 3
Part, 3 parts of vinyltrimethoxy silane.
（1）Polypropylene, chlorosulfonated polyethylene, phthalic acid ester, vinylacetate, ethyoxyl cocoalkyl amines are put into
In thermostat water bath, separating mixture is used in the polyethylene glycol of the quality such as addition, isothermal reaction 3 hours, centrifugation after discharging
Absolute ethanol washing 2 times, then drying 5 hours in vacuum drying chamber are placed in, obtain preconditioned mixture；
（2）Magnesium fluoride, clay, high wear-resistant carbon black, mica powder are ground refinement, nano aluminium oxide, benzyl three is subsequently adding
Ethyl ammonium chloride, carboxymethyl chitosan, are warming up to 50 DEG C after being mixed thoroughly, microwave treatment 25 minutes obtains microwave treatment
The frequency of mixture, wherein microwave treatment is 2200 MHz, power is 1000 W；
（3）The preconditioned mixture of step 1 gained is sufficiently mixed with the microwave treatment mixture of step 2 gained, is stirred,
Rilanit special, N are added, N- dimethyl lauramides, vinyltrimethoxy silane are warming up to 85 DEG C, knead 15 minutes,
It is subsequently sent to be plastified in banbury, plasticization temperature is 110 DEG C, fusion time is 20 minutes, then turns the material of gained
Move to and further plastify in double roller open mill, plasticization temperature is 90 DEG C, fusion time is 10 minutes；
（4）Compound after plasticizing is added in parallel double-screw extruder to carry out melt blending and granulates, wherein parallel double
The barrel zone temperature of screw extruder is 190 DEG C, and die head temperature is 195 DEG C, and screw speed is 500 revs/min, then by particulate material hot pressing
Machine carries out hot-forming, and at 190 DEG C, briquetting pressure control is controlled at 6 points in 50 kg/cm2, dwell time for hot pressing temperature control
Clock, obtains finished product after shaping.
The performance test results of the obtained packaging material for electronic product are as shown in table 1.
Embodiment 2
50 parts of polypropylene, 45 parts of chlorosulfonated polyethylene, 35 parts of phthalic acid ester, vinylacetate are accurately weighed according to weight portion
25 parts, 18 parts of ethyoxyl cocoalkyl amines, 10 parts of nano aluminium oxide, 7 parts of magnesium fluoride, 7 parts of clay, 5 parts of high wear-resistant carbon black, mica
2 parts of powder, 3 parts of benzyltriethylammoinium chloride, 3 parts of carboxymethyl chitosan, 2 parts of rilanit special, 4 parts of dioctyl adipate, isopropyl
4 parts of the oleic acid acyloxy titanate esters of base three.
（1）Polypropylene, chlorosulfonated polyethylene, phthalic acid ester, vinylacetate, ethyoxyl cocoalkyl amines are put into
In thermostat water bath, separating mixture is used in the polyethylene glycol of the quality such as addition, isothermal reaction 3 hours, centrifugation after discharging
Absolute ethanol washing 2 times, then drying 5 hours in vacuum drying chamber are placed in, obtain preconditioned mixture；
（2）Magnesium fluoride, clay, high wear-resistant carbon black, mica powder are ground refinement, nano aluminium oxide, benzyl three is subsequently adding
Ethyl ammonium chloride, carboxymethyl chitosan, are warming up to 55 DEG C after being mixed thoroughly, microwave treatment 30 minutes obtains microwave treatment
The frequency of mixture, wherein microwave treatment is 2200 MHz, power is 1000 W；
（3）The preconditioned mixture of step 1 gained is sufficiently mixed with the microwave treatment mixture of step 2 gained, is stirred,
Rilanit special, dioctyl adipate, the oleic acid acyloxy titanate esters of isopropyl three are added, 90 DEG C are warming up to, kneaded 17 minutes,
It is subsequently sent to be plastified in banbury, plasticization temperature is 115 DEG C, fusion time is 20 minutes, then turns the material of gained
Move to and further plastify in double roller open mill, plasticization temperature is 92 DEG C, fusion time is 11 minutes；
（4）Compound after plasticizing is added in parallel double-screw extruder to carry out melt blending and granulates, wherein parallel double
The barrel zone temperature of screw extruder is 195 DEG C, and die head temperature is 200 DEG C, and screw speed is 550 revs/min, then by particulate material hot pressing
Machine carries out hot-forming, and at 195 DEG C, briquetting pressure control is controlled at 7 points in 50 kg/cm2, dwell time for hot pressing temperature control
Clock, obtains finished product after shaping.
The performance test results of the obtained packaging material for electronic product are as shown in table 1.
Embodiment 3
55 parts of polypropylene, 50 parts of chlorosulfonated polyethylene, 40 parts of phthalic acid ester, vinylacetate are accurately weighed according to weight portion
30 parts, 20 parts of ethyoxyl cocoalkyl amines, 12 parts of nano aluminium oxide, 8 parts of magnesium fluoride, 8 parts of clay, 6 parts of high wear-resistant carbon black, mica
3 parts of powder, 4 parts of benzyltriethylammoinium chloride, 4 parts of carboxymethyl chitosan, 3 parts of rilanit special, 5 parts of chlorinated paraffin, distearyl
5 parts of oxygen isopropoxy Aluminate.
（1）Polypropylene, chlorosulfonated polyethylene, phthalic acid ester, vinylacetate, ethyoxyl cocoalkyl amines are put into
In thermostat water bath, separating mixture is used in the polyethylene glycol of the quality such as addition, isothermal reaction 3 hours, centrifugation after discharging
Absolute ethanol washing 2 times, then drying 5 hours in vacuum drying chamber are placed in, obtain preconditioned mixture；
（2）Magnesium fluoride, clay, high wear-resistant carbon black, mica powder are ground refinement, nano aluminium oxide, benzyl three is subsequently adding
Ethyl ammonium chloride, carboxymethyl chitosan, are warming up to 60 DEG C after being mixed thoroughly, microwave treatment 35 minutes obtains microwave treatment
The frequency of mixture, wherein microwave treatment is 2200 MHz, power is 1000 W；
（3）The preconditioned mixture of step 1 gained is sufficiently mixed with the microwave treatment mixture of step 2 gained, is stirred,
Rilanit special, chlorinated paraffin, distearyl acyl-oxygen aluminum isopropoxide acid esters are added, 95 DEG C are warming up to, 20 minutes are kneaded, then
Plastified in feeding banbury, plasticization temperature is 120 DEG C, and fusion time is 20 minutes, is then transferred to the material of gained
Further plastified in double roller open mill, plasticization temperature is 95 DEG C, fusion time is 12 minutes；
（4）Compound after plasticizing is added in parallel double-screw extruder to carry out melt blending and granulates, wherein parallel double
The barrel zone temperature of screw extruder is 200 DEG C, and die head temperature is 205 DEG C, and screw speed is 600 revs/min, then by particulate material hot pressing
Machine carries out hot-forming, and at 200 DEG C, briquetting pressure control is controlled at 8 points in 50 kg/cm2, dwell time for hot pressing temperature control
Clock, obtains finished product after shaping.
The performance test results of the obtained packaging material for electronic product are as shown in table 1.
Embodiment 4
55 parts of polypropylene, 40 parts of chlorosulfonated polyethylene, 40 parts of phthalic acid ester, vinylacetate are accurately weighed according to weight portion
20 parts, 20 parts of ethyoxyl cocoalkyl amines, 8 parts of nano aluminium oxide, 8 parts of magnesium fluoride, 6 parts of clay, 6 parts of high wear-resistant carbon black, mica
1 part of powder, 4 parts of benzyltriethylammoinium chloride, 2 parts of carboxymethyl chitosan, 3 parts of rilanit special, 3 parts of chlorinated paraffin, vinyl three
5 parts of methoxy silane.
（1）Polypropylene, chlorosulfonated polyethylene, phthalic acid ester, vinylacetate, ethyoxyl cocoalkyl amines are put into
In thermostat water bath, separating mixture is used in the polyethylene glycol of the quality such as addition, isothermal reaction 3 hours, centrifugation after discharging
Absolute ethanol washing 2 times, then drying 5 hours in vacuum drying chamber are placed in, obtain preconditioned mixture；
（2）Magnesium fluoride, clay, high wear-resistant carbon black, mica powder are ground refinement, nano aluminium oxide, benzyl three is subsequently adding
Ethyl ammonium chloride, carboxymethyl chitosan, are warming up to 50 DEG C after being mixed thoroughly, microwave treatment 35 minutes obtains microwave treatment
The frequency of mixture, wherein microwave treatment is 2200 MHz, power is 1000 W；
（3）The preconditioned mixture of step 1 gained is sufficiently mixed with the microwave treatment mixture of step 2 gained, is stirred,
Rilanit special, chlorinated paraffin, vinyltrimethoxy silane are added, 85 DEG C are warming up to, kneaded 20 minutes, be subsequently sent to close
Plastified in mill, plasticization temperature is 110 DEG C, and fusion time is 20 minutes, the material of gained then is transferred into double roller and is opened
Put and further plastify in formula plasticator, plasticization temperature is 95 DEG C, fusion time is 10 minutes；
（4）Compound after plasticizing is added in parallel double-screw extruder to carry out melt blending and granulates, wherein parallel double
The barrel zone temperature of screw extruder is 200 DEG C, and die head temperature is 195 DEG C, and screw speed is 600 revs/min, then by particulate material hot pressing
Machine carries out hot-forming, and at 190 DEG C, briquetting pressure control is controlled at 8 points in 50 kg/cm2, dwell time for hot pressing temperature control
Clock, obtains finished product after shaping.
The performance test results of the obtained packaging material for electronic product are as shown in table 1.
Comparative example 1
50 parts of polypropylene, 45 parts of chlorosulfonated polyethylene, 35 parts of phthalic acid ester, vinylacetate are accurately weighed according to weight portion
25 parts, 10 parts of nano aluminium oxide, 7 parts of magnesium fluoride, 7 parts of clay, 5 parts of high wear-resistant carbon black, 3 parts of benzyltriethylammoinium chloride, carboxylic first
3 parts of base enclosure glycan, 2 parts of rilanit special, 4 parts of dioctyl adipate, 4 parts of the oleic acid acyloxy titanate esters of isopropyl three.
（1）Polypropylene, chlorosulfonated polyethylene, phthalic acid ester, vinylacetate are put into thermostat water bath, are added
Etc. the polyethylene glycol of quality, isothermal reaction 3 hours, centrifugation after discharging, by separating mixture absolute ethanol washing 2 times,
It is placed in again in vacuum drying chamber and dries 5 hours, obtains preconditioned mixture；
（2）Magnesium fluoride, clay, high wear-resistant carbon black are ground refinement, nano aluminium oxide, benzyl triethyl ammonium chlorination is subsequently adding
Ammonium, carboxymethyl chitosan, are warming up to 55 DEG C after being mixed thoroughly, microwave treatment 30 minutes obtains microwave treatment mixture, its
The frequency of middle microwave treatment is 2200 MHz, power is 1000 W；
（3）The preconditioned mixture of step 1 gained is sufficiently mixed with the microwave treatment mixture of step 2 gained, is stirred,
Rilanit special, dioctyl adipate, the oleic acid acyloxy titanate esters of isopropyl three are added, 90 DEG C are warming up to, kneaded 17 minutes,
It is subsequently sent to be plastified in banbury, plasticization temperature is 115 DEG C, fusion time is 20 minutes, then turns the material of gained
Move to and further plastify in double roller open mill, plasticization temperature is 92 DEG C, fusion time is 11 minutes；
（4）Compound after plasticizing is added in parallel double-screw extruder to carry out melt blending and granulates, wherein parallel double
The barrel zone temperature of screw extruder is 195 DEG C, and die head temperature is 200 DEG C, and screw speed is 550 revs/min, then by particulate material hot pressing
Machine carries out hot-forming, and at 195 DEG C, briquetting pressure control is controlled at 7 points in 50 kg/cm2, dwell time for hot pressing temperature control
Clock, obtains finished product after shaping.
The performance test results of the obtained packaging material for electronic product are as shown in table 1.
Comparative example 2
55 parts of polypropylene, 40 parts of chlorosulfonated polyethylene, 40 parts of phthalic acid ester, vinylacetate are accurately weighed according to weight portion
20 parts, 20 parts of ethyoxyl cocoalkyl amines, 8 parts of nano aluminium oxide, 8 parts of magnesium fluoride, 6 parts of clay, 6 parts of high wear-resistant carbon black, mica
1 part of powder, 2 parts of carboxymethyl chitosan, 3 parts of chlorinated paraffin, 5 parts of vinyltrimethoxy silane.
（1）Polypropylene, chlorosulfonated polyethylene, phthalic acid ester, vinylacetate, ethyoxyl cocoalkyl amines are put into
In thermostat water bath, separating mixture is used in the polyethylene glycol of the quality such as addition, isothermal reaction 3 hours, centrifugation after discharging
Absolute ethanol washing 2 times, then drying 5 hours in vacuum drying chamber are placed in, obtain preconditioned mixture；
（2）Magnesium fluoride, clay, high wear-resistant carbon black, mica powder are ground refinement, nano aluminium oxide, carboxymethyl is subsequently adding
Shitosan, is warming up to 50 DEG C after being mixed thoroughly, microwave treatment 35 minutes obtains microwave treatment mixture, wherein at microwave
The frequency of reason is 2200 MHz, power is 1000 W；
（3）The preconditioned mixture of step 1 gained is sufficiently mixed with the microwave treatment mixture of step 2 gained, is stirred,
Chlorinated paraffin, vinyltrimethoxy silane are added, 85 DEG C are warming up to, kneaded 20 minutes, be subsequently sent to be carried out in banbury
Plasticizing, plasticization temperature is 110 DEG C, and fusion time is 20 minutes, and the material of gained then is transferred into double roller open mill
In further plastify, plasticization temperature be 95 DEG C, fusion time be 10 minutes；
（4）Compound after plasticizing is added in parallel double-screw extruder to carry out melt blending and granulates, wherein parallel double
The barrel zone temperature of screw extruder is 200 DEG C, and die head temperature is 195 DEG C, and screw speed is 600 revs/min, then by particulate material hot pressing
Machine carries out hot-forming, and at 190 DEG C, briquetting pressure control is controlled at 8 points in 50 kg/cm2, dwell time for hot pressing temperature control
Clock, obtains finished product after shaping.
The performance test results of the obtained packaging material for electronic product are as shown in table 1.
The packaging material for being used for electronic product obtained in embodiment 1-4 and comparative example 1-2 are carried out using 3 months respectively
Surface resistivity, tensile strength, this several performance tests of elongation at break afterwards.
Table 1
| Use surface resistivity after 3 months（×109Ω） | Tensile strength（MPa） | Elongation at break（%） | |
| Embodiment 1 | 1.76 | 57.6 | 236 |
| Embodiment 2 | 1.93 | 59.1 | 251 |
| Embodiment 3 | 1.88 | 58.4 | 247 |
| Embodiment 4 | 1.79 | 57.9 | 238 |
| Comparative example 1 | 1.24 | 45.2 | 184 |
| Comparative example 2 | 1.16 | 44.3 | 171 |
Packaging material for electronic product of the invention are with polypropylene, chlorosulfonated polyethylene, phthalic acid ester, vinyl acetate
Ester is main component, by adding ethyoxyl cocoalkyl amines, nano aluminium oxide, magnesium fluoride, clay, high wear-resistant carbon black, mica
Powder, benzyltriethylammoinium chloride, carboxymethyl chitosan, rilanit special, plasticizer, coupling agent, are aided with water bath with thermostatic control, centrifugation point
From, vacuum drying, grinding refinement, microwave treatment, mixing, plasticizing, melting extrusion, the technique such as hot-forming so that be prepared from
The packaging material for electronic product, its anti-static effect continuation is good, and physical strength is high, disclosure satisfy that industry will
Ask, with preferable application prospect.Packaging material raw material for electronic product of the invention is cheap, process is simple, is suitable to big
Technical scaleization is used, practical.
Embodiments of the invention are the foregoing is only, the scope of the claims of the invention is not thereby limited, it is every to utilize this hair
Equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, is included within the scope of the present invention.
Claims (6)
1. a kind of packaging material for electronic product, it is characterised in that：It is made from the following raw materials in parts by weight:Polypropylene 45-
55 parts, chlorosulfonated polyethylene 40-50 parts, phthalic acid ester 30-40 parts, vinylacetate 20-30 parts, ethyoxyl Cocoalkyl
Amine 16-20 parts, nano aluminium oxide 8-12 parts, magnesium fluoride 6-8 parts, clay 6-8 parts, high wear-resistant carbon black 4-6 parts, mica powder 1-3 parts,
Benzyltriethylammoinium chloride 2-4 parts, carboxymethyl chitosan 2-4 parts, rilanit special 1-3 parts, plasticizer 3-5 parts, coupling agent 3-5
Part.
2. packaging material for electronic product according to claim 1, it is characterised in that：The plasticizer is selected from N, N-
Any one in dimethyl lauramide, dioctyl adipate and chlorinated paraffin.
3. packaging material for electronic product according to claim 1, it is characterised in that：The coupling agent is selected from ethene
It is any one in base trimethoxy silane, the oleic acid acyloxy titanate esters of isopropyl three and distearyl acyl-oxygen aluminum isopropoxide acid esters
Kind.
4. according to the preparation method of any described packaging material for electronic product of claims 1 to 3, it is characterised in that
Comprise the following steps：
（1）Polypropylene, chlorosulfonated polyethylene, phthalic acid ester, vinylacetate, ethyoxyl cocoalkyl amines are put into constant temperature
In water-bath, the polyethylene glycol of quality, isothermal reaction 3 hours, centrifugation after discharging, by separating mixture with anhydrous such as add
Ethanol is washed 2 times, then is placed in drying 5 hours in vacuum drying chamber, obtains preconditioned mixture；
（2）Magnesium fluoride, clay, high wear-resistant carbon black, mica powder are ground refinement, nano aluminium oxide, benzyl three is subsequently adding
Ethyl ammonium chloride, carboxymethyl chitosan, are warming up to 50-60 DEG C after being mixed thoroughly, microwave treatment 25-35 minutes, obtain micro-
Ripple processes mixture；
（3）The preconditioned mixture of step 1 gained is sufficiently mixed with the microwave treatment mixture of step 2 gained, is stirred,
Rilanit special, plasticizer, coupling agent are added, 85-95 DEG C is warming up to, kneaded 15-20 minutes, be subsequently sent to enter in banbury
Row plasticizing, plasticization temperature is 110-120 DEG C, and fusion time is 20 minutes, the material of gained then is transferred into double roller open
Further plastified in plasticator, plasticization temperature is 90-95 DEG C, fusion time is 10-12 minutes；
（4）Compound after plasticizing is added in parallel double-screw extruder to carry out melt blending and granulates, then by particulate material
Hot press carries out hot-forming, and at 190-200 DEG C, briquetting pressure is controlled in 50 kg/cm for hot pressing temperature control2, the dwell time
Control obtained finished product at 6-8 minutes after shaping.
5. the preparation method of the packaging material for electronic product according to claim 4, it is characterised in that：The step
（2）The frequency of middle microwave treatment is 2200 MHz, power is 1000 W.
6. the preparation method of the packaging material for electronic product according to claim 4, it is characterised in that：The step
（4）The barrel zone temperature of middle parallel double-screw extruder is 190-200 DEG C, and die head temperature is 195-205 DEG C, and screw speed is 500-
600 revs/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611203228.6A CN106750946A (en) | 2016-12-23 | 2016-12-23 | A kind of packaging material for electronic product and preparation method thereof |
Applications Claiming Priority (1)
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| CN113045747A (en) * | 2019-12-28 | 2021-06-29 | 合肥杰事杰新材料股份有限公司 | Nano-alumina-filled cast nylon 6 composition and preparation method thereof |
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Application publication date: 20170531 |