CN102059538A - Non-welding assembly method of multistage depressed collector assembly - Google Patents

Non-welding assembly method of multistage depressed collector assembly Download PDF

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Publication number
CN102059538A
CN102059538A CN2009102377726A CN200910237772A CN102059538A CN 102059538 A CN102059538 A CN 102059538A CN 2009102377726 A CN2009102377726 A CN 2009102377726A CN 200910237772 A CN200910237772 A CN 200910237772A CN 102059538 A CN102059538 A CN 102059538A
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CN
China
Prior art keywords
collector
circular arc
multistage
collectors
outer sleeve
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CN2009102377726A
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Chinese (zh)
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CN102059538B (en
Inventor
李实�
赵丽
贺鑫
李颖
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Institute of Electronics of CAS
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Institute of Electronics of CAS
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Priority to CN200910237772A priority Critical patent/CN102059538B/en
Publication of CN102059538A publication Critical patent/CN102059538A/en
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Publication of CN102059538B publication Critical patent/CN102059538B/en
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Abstract

The invention provides a non-welding assembly method of a multistage depressed collector assembly. The method comprises the following steps: axially dividing the whole ceramic cylinder into N circular arcs according to the stage number N of collectors; arranging at least one groove for locating collector electrodes on an inner cambered surface of each circular arc; forming a through hole for mounting leads of the collectors on each circular arc; and arranging N circular arcs around the multistage collectors to form the ceramic cylinder, locating a flange on the electrode of the collector of each stage and the corresponding groove in the circular arc in a fit manner, leading out the leads of the multistage collectors from the through holes, and placing the ceramic cylinder formed by the circular arcs in a collector outer sleeve so that the multistage collectors, the ceramic cylinder formed by arranging the circular arcs and the collector outer sleeve are tightly assembled together. By means of the non-welding assembly method provided by the invention, the problems such as heat dissipation, insulation, reliability and service life of the traditional multistage depressed collectors can be solved.

Description

The non-welding assembly method of multi-level depressurization collector assembly
Technical field
The present invention relates to a kind of multi-level depressurization collector component assembling method, relate to the non-welding assembly method of a kind of multi-level depressurization collector assembly particularly.
Background technology
Multi-level depressurization collector adopts welding method at present.During collector work, along with the rising of temperature in the collector, scolder will evaporate gradually and attached to the insulating ceramics surface, its insulating capacity be descended, and directly influence stability and service life.
Summary of the invention
The object of the present invention is to provide the non-welding assembly method of a kind of multi-level depressurization collector assembly, can solve the defective that exists in the background technology.
For achieving the above object, method provided by the invention is according to the progression N of collector whole pottery tube to be divided into N circular arc vertically, and these N circular arc can be combined into a complete circle.
On the intrados of each circular arc, offer the groove of at least one collector electrode location usefulness.
On each circular arc, have the through hole that each lead-in wire of collector is installed.
N circular arc arranged around the synthetic pottery tube of multistage collector, and the location of the groove fit in fin on the electrode of every grade of collector and the corresponding circular arc, each utmost point lead-in wire of multistage collector is drawn in through hole, to place by the pottery tube that circular arc is arranged in again and collect outer sleeve, the pottery tube that multistage collector, circular arc are arranged in will be in the same place with collector outer sleeve close fit with hot extrusion technique.
Pottery tube of the present invention can adopt the beryllium oxide material.
The present invention does not adopt the scolder welding and firmly fixes each assembly, each ceramic multistage collector, collector outer sleeve surface is fully contacted, and have certain pressure, well heat conduction.When collector is worked, though the liter of temperature very high, do not have scolder evaporative emission pottery yet, its insulating capacity is descended.The stability and the life-span of product have so just been guaranteed.
Description of drawings
Fig. 1 is a side of the present invention cross-sectional schematic.
Fig. 2 is the vertical view schematic diagram of Fig. 1.
The specific embodiment
See also illustrated in figures 1 and 2.Fig. 1 is a side sectional view of the present invention.The pottery tube 11 of pottery (as aluminium oxide, beryllium oxide etc.) material is installed coaxially in the inside of collector outer sleeve (adopting heat conduction good metal material) 10, this pottery tube axially is divided into 3 circular arcs 121,122 and 123, and (progression of the collector among Fig. 2 is example with 3, therefore the pottery tube is divided into 3 circular arcs vertically, promptly each circular arc be pottery tin 1/3rd).Offer groove 12 and through hole 13 on the medial surface of each circular arc, this groove 12 is the fins 131 on the ccontaining fixedly collector electrode 13, and collector can be located in circular arc; This through hole 14 is used to draw the lead-in wire of each utmost point of collector.
The fin 131 of collector electrodes 13 at different levels is placed the groove 12 of circular arc 121,122,123 respectively, three circular arcs 121,122,123 are combined into a complete circle, place in the collector outer sleeve 10, make pottery tube and each electrode of collector, collector outer sleeve tight fit, use known hot extrusion assembly technology then together three's close fit.Even also can firmly fix each assembly without the scolder welding like this, each pottery fully contacts with electrode, sleeve surface, and has certain pressure, heat conduction well.
Do not use scolder among the present invention, when collector is worked, even the liter of temperature very high, do not have scolder evaporative emission pottery yet, its insulating capacity is descended.The stability and the life-span of product have so just been guaranteed.

Claims (4)

1. non-welding assembly method of multi-level depressurization collector assembly is divided into N circular arc according to the progression N of collector vertically with whole pottery tube;
On the intrados of each circular arc, offer the groove of at least one collector electrode location usefulness;
On each circular arc, have the through hole that each lead-in wire of collector is installed;
N circular arc arranged around the synthetic pottery tube of multistage collector, and the location of the groove fit in fin on the electrode of every grade of collector and the corresponding circular arc, each utmost point lead-in wire of multistage collector is drawn in through hole, to be placed by the pottery tube that circular arc is arranged in and collect outer sleeve, the pottery tube that multistage collector, circular arc are arranged in is in the same place with collector outer sleeve close fit.
2. the non-welding assembly method of multi-level depressurization collector assembly as claimed in claim 1, wherein, the pottery tube is made for beryllium oxide or alumina material.
3. the non-welding assembly method of multi-level depressurization collector assembly as claimed in claim 1, wherein, the pottery tube that circular arc is arranged in is to adopt hot extrusion technique to place the collector outer sleeve.
4. the non-welding assembly method of multi-level depressurization collector assembly as claimed in claim 1, wherein, the collector outer sleeve is made for the heat conductive metal material.
CN200910237772A 2009-11-17 2009-11-17 Non-welding assembly method of multistage depressed collector assembly Active CN102059538B (en)

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Application Number Priority Date Filing Date Title
CN200910237772A CN102059538B (en) 2009-11-17 2009-11-17 Non-welding assembly method of multistage depressed collector assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200910237772A CN102059538B (en) 2009-11-17 2009-11-17 Non-welding assembly method of multistage depressed collector assembly

Publications (2)

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CN102059538A true CN102059538A (en) 2011-05-18
CN102059538B CN102059538B (en) 2012-09-05

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102956417A (en) * 2011-08-25 2013-03-06 中国科学院电子学研究所 Assembly and hot extrusion method for non-welded columnar insulated-ceramic multistage depressed collectors
CN107204265A (en) * 2017-05-08 2017-09-26 中国科学院电子学研究所 Lead interior crossing type multi-level depressurization collector

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0487138A (en) * 1990-07-26 1992-03-19 Nec Corp Conductive cooling type multistage collector
JPH05325800A (en) * 1992-05-14 1993-12-10 Nec Corp Conduction cooling type multistage collector
CN201153099Y (en) * 2007-12-28 2008-11-19 安徽华东光电技术研究所 Multi-stage step-down collector construction for microwave tube
CN101447384A (en) * 2008-12-29 2009-06-03 电子科技大学 Multi-level depressurization collector for traveling wave tube

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0487138A (en) * 1990-07-26 1992-03-19 Nec Corp Conductive cooling type multistage collector
JPH05325800A (en) * 1992-05-14 1993-12-10 Nec Corp Conduction cooling type multistage collector
CN201153099Y (en) * 2007-12-28 2008-11-19 安徽华东光电技术研究所 Multi-stage step-down collector construction for microwave tube
CN101447384A (en) * 2008-12-29 2009-06-03 电子科技大学 Multi-level depressurization collector for traveling wave tube

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102956417A (en) * 2011-08-25 2013-03-06 中国科学院电子学研究所 Assembly and hot extrusion method for non-welded columnar insulated-ceramic multistage depressed collectors
CN102956417B (en) * 2011-08-25 2015-03-25 中国科学院电子学研究所 Assembly and hot extrusion method for non-welded columnar insulated-ceramic multistage depressed collectors
CN107204265A (en) * 2017-05-08 2017-09-26 中国科学院电子学研究所 Lead interior crossing type multi-level depressurization collector

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