CN102045937A - 电路板及采用该电路板的显示装置 - Google Patents

电路板及采用该电路板的显示装置 Download PDF

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Publication number
CN102045937A
CN102045937A CN2009103084544A CN200910308454A CN102045937A CN 102045937 A CN102045937 A CN 102045937A CN 2009103084544 A CN2009103084544 A CN 2009103084544A CN 200910308454 A CN200910308454 A CN 200910308454A CN 102045937 A CN102045937 A CN 102045937A
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Prior art keywords
circuit board
plate body
outer electrode
stacked body
electric capacity
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Pending
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CN2009103084544A
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English (en)
Inventor
洪煦
符占伟
余明峰
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Innolux Shenzhen Co Ltd
Chi Mei Optoelectronics Corp
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Innolux Shenzhen Co Ltd
Innolux Display Corp
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Application filed by Innolux Shenzhen Co Ltd, Innolux Display Corp filed Critical Innolux Shenzhen Co Ltd
Priority to CN2009103084544A priority Critical patent/CN102045937A/zh
Priority to US12/713,324 priority patent/US20110090661A1/en
Publication of CN102045937A publication Critical patent/CN102045937A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

本发明涉及一种电路板及采用该电路板的显示装置。该显示装置包括一显示面板和一与该显示面板相连接的电路板。该电路板包括一板体和一设置在该板体上的电容。该电容包括一堆叠体和二位于该堆叠体两端的外部电极。该外部电极与该板体连接。其中，该堆叠体的堆叠方向平行于该板体的表面。该电路板及该显示装置的品质较高。

Description

电路板及采用该电路板的显示装置
技术领域
本发明涉及一种电路板及采用该电路板的显示装置。
背景技术
电路板是电子设备的基本部件，其上通常安装有芯片、电阻、电容等电子零部件。零部件之间通过铺设于电路板上的导线实现电性连接。积层陶瓷电容(Multi-layer CeramicCapacitor)由于具有体积小、耐高电压和高热、运作温度范围广和适合大量生产等优势，因此，其被广泛应用于高频电子产品与小型的携带型电子产品中，尤其是显示装置等电子产品中。
然而，当电路板工作时，频率在20HZ～20KHZ之间的外部交流信号，如脉宽调制信号(Pulse Width Modulation，PWM)，通过电路板上的积层陶瓷电容时，通常产生人耳能够听见的噪音，影响了电路板的品质。进而，采用该电路板的电子产品，如显示装置，其品质也会受到影响。
发明内容
为了解决现有技术中电路板的品质较低的问题，有必要提供一种品质较高的电路板。
另外，为了解决现有技术中显示装置的品质较低的问题，有必要提供一种品质较高的显示装置。
一种电路板，其包括一板体和一设置在该板体上的电容。该电容包括一堆叠体和二位于该堆叠体两端的外部电极。该外部电极与该板体连接。其中，该堆叠体的堆叠方向平行于该板体的表面。
一种显示装置，其包括一显示面板和一与该显示面板相连接的电路板。该电路板包括一板体和一设置在该板体上的电容。该电容包括一堆叠体和二位于该堆叠体两端的外部电极。该外部电极与该板体连接。其中，该堆叠体的堆叠方向平行于该板体的表面。
相较于现有技术，在本发明的电路板中，由于该电容的堆叠体的堆叠方向平行于该板体的表面，所以当该电路板工作时，外部电路的交流信号通过该电路板时，该电路板产生的噪音较小，使得人耳很难听见该噪音，进而能够提高该电路板的品质。因此，采用该电路板的显示装置的品质也较高。
附图说明
图1为本发明电路板的一较佳实施方式的结构示意图。
图2为采用图1所示电路板的显示装置的侧面结构示意图。
具体实施方式
请参阅图1，其是本发明电路板的一较佳实施方式的结构示意图。该电路板3包括一板体31和一设置在该板体31上的电容33。该板体31可为一印刷电路板(Printed Circuit Board，PCB)。该电容33为一积层陶瓷电容，其可以用于滤波。
该电容33包括一堆叠体35和分别位于该堆叠体35两端的外部电极37。该堆叠体35包括多个间隔设置的陶瓷层39和内部电极41。该陶瓷层39和内部电极41沿平行该板体31的表面的方向堆叠形成该堆叠体35，该陶瓷层39和内部电极41的堆叠方向定义为该堆叠体35的堆叠方向。该内部电极41与该陶瓷层39是相互平行的矩形片层结构。该外部电极37与该内部电极41电连接。每一陶瓷层39和与其相邻的两内部电极41都构成一平板电容，通过该内部电极41与该外部电极37电连接，该每一平板电容相并联，进而提高该电容33的总储存电量。每一外部电极37包括一焊接点43，用于与该电路板3电连接。其中，该焊接点43位于该外部电极37的一与该堆叠体35的堆叠方向相平行的表面上，如图4所示，该外部电极37的底面是与该堆叠体35的堆叠方向相平行的表面，该焊接点43位于该外部电极37的底面。
该板体31的表面上还设置有二金属接触点45，且该金属接触点表面涂布有锡膏(图未示)，利用表面贴装技术，该电容33的两外部电极37的两焊接点43与该板体31上的两金属接触点45分别焊接。进而，该板体31与该电容33电连接。
当外部的交流信号，如PWM信号，通过该电路板3的电容33时，由于该堆叠体35的堆叠方向平行于该板体31的表面，所以该堆叠体35的陶瓷层39产生平行于该板体31的往返震动，震动方向如图所示。从力学角度分析，因为该堆叠体35的震动方向平行于该板体31的表面，所以该堆叠体35由于震动而产生的力会沿平行该板体31表面的方向传递出去。因此，该板体31与该电容33之间的相互作用很小，进而解决了该电路板3产生人耳能够听见的噪音的问题，提高了该电路板3的品质。
请参阅图2，其是采用图1所示电路板的显示装置的侧面结构示意图。该显示装置300包括一显示面板4和该电路板3。该显示面板4与该电路板3电连接。该显示面板4用于显示画面。该电路板3用于为该显示面板4提供各种信号，进而驱动该显示面板4显示画面。因为该电路板3的品质得到提高，所以采用该电路板3的电子产品，如该显示装置300，其品质也会得到提高。
该显示装置300可为一液晶显示装置或一发光二极体显示装置或一电致发光显示装置等显示装置。

Claims (10)

1.一种电路板，其包括一板体和一设置在该板体上的电容，该电容包括一堆叠体和二位于该堆叠体两端的外部电极，该外部电极与该板体连接，其特征在于：该堆叠体的堆叠方向平行于该板体的表面。
2.如权利要求1所述的电路板，其特征在于：该板体上还设置有二金属接触点，该每一外部电极包括一焊接点，通过该二焊接点与该二金属接触点分别对应焊接，该二外部电极与该板体相连接。
3.如权利要求2所述的电路板，其特征在于：该焊接点位于该外部电极的一与该堆叠体的堆叠方向相平行的表面上，该外部电极的底面是与该堆叠体的堆叠方向相平行的表面，该焊接点位于该外部电极的底面。
4.如权利要求3所述的电路板，其特征在于：该外部电极与该金属接触点采用表面贴装技术焊接。
5.如权利要求3所述的电路板，其特征在于：该堆叠体是由多个间隔设置的陶瓷层和内部电极堆叠而成，该陶瓷层和内部电极沿平行该板体表面的方向堆叠形成该堆叠体。
6.如权利要求5所述的电路板，其特征在于：该内部电极与该外部电极相连接，每一陶瓷层和与该陶瓷层相邻的两内部电极构成一平板电容。
7.如权利要求1所述的电路板，其特征在于：该电容为一积层陶瓷电容。
8.如权利要求1所述的电路板，其特征在于：该板体是一印刷电路板。
9.一种显示装置，其包括一显示面板和一与该显示面板相连接的电路板，其特征在于：该电路板为权利要求1至权利要求8中任意一项所述的电路板。
10.如权利要求9所述的显示装置，其特征在于：该显示装置为一液晶显示装置或一发光二极体显示装置或一电致发光显示装置。
CN2009103084544A 2009-10-19 2009-10-19 电路板及采用该电路板的显示装置 Pending CN102045937A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009103084544A CN102045937A (zh) 2009-10-19 2009-10-19 电路板及采用该电路板的显示装置
US12/713,324 US20110090661A1 (en) 2009-10-19 2010-02-26 Circuit board with capacitor having a multilayer body and display device using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009103084544A CN102045937A (zh) 2009-10-19 2009-10-19 电路板及采用该电路板的显示装置

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Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6507495B1 (en) * 2000-06-28 2003-01-14 Dell Products L.P. Three-dimensional technique for improving the EMC characteristics of a printed circuit board
DE102005012395A1 (de) * 2005-03-17 2006-09-21 Epcos Ag Durchführungsfilter und elektrisches Mehrschicht-Bauelement
CN201094168Y (zh) * 2007-09-13 2008-07-30 鸿富锦精密工业（深圳）有限公司 一种电路板
TW201108880A (en) * 2009-08-21 2011-03-01 Kinpo Elect Inc Electrostatic discharge protection structure and electronic device using the same

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