CN102044534A - Light-emitting diode encapsulation structure capable of enhancing heat-radiating and light-emitting effects and manufacturing method thereof - Google Patents
Light-emitting diode encapsulation structure capable of enhancing heat-radiating and light-emitting effects and manufacturing method thereof Download PDFInfo
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- CN102044534A CN102044534A CN 200910206080 CN200910206080A CN102044534A CN 102044534 A CN102044534 A CN 102044534A CN 200910206080 CN200910206080 CN 200910206080 CN 200910206080 A CN200910206080 A CN 200910206080A CN 102044534 A CN102044534 A CN 102044534A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The invention relates to a light-emitting diode encapsulation structure capable of enhancing heat-radiating and light-emitting effects, which comprises a base plate unit, an alloy unit, a light-emitting unit, an electric conduction unit and an encapsulation unit, wherein the base plate unit is provided with a base plate body, and the upper surface of the base plate body is provided with a first electric conduction welding pad, a second electric conduction welding pad and a crystal-containing welding pad; the alloy unit is provided with a nickel-palladium alloy formed on the crystal-containing welding pad; the light-emitting unit is provided with a light-emitting diode crystal grain which is penetrated through a solidified tin ball or tin paste and positioned on the nickel-palladium alloy of the alloy unit; the electric conduction unit is provided with at least two lead wires, and the light-emitting diode crystal grain is penetrated through the two lead wires and is electrically connected between the first electric conduction welding pad and the second electric conduction welding pad; and the encapsulation unit is provided with a transparent encapsulation rubber body which is formed on the upper surface of the base plate body to cover the light-emitting unit and the electric conduction unit.
Description
Technical field
The present invention refers to a kind of package structure for LED that increases heat radiation and illumination effect and preparation method thereof especially relevant for a kind of package structure for LED and preparation method thereof.
Background technology
Press, the invention of electric light can be described as the life style that has changed the whole mankind up hill and dale, if our life does not have electric light, when night or weather conditions are not good, the work of all will be stopped; If be subject to illumination, building construction mode or human life style are thoroughly changed, therefore the whole mankind will can't improve, the age that stays on and fall behind.
Be with, today employed on the market lighting apparatus, for example: fluorescent lamp, tungsten lamp even the more popular till now Electricity-saving lamp bulb of being accepted are widely used in the middle of the daily life all.Yet this type of electric light has fast, the high power consumption of optical attenuation mostly, be easy to generate high heat, the life-span is short, frangible or shortcoming such as difficult recovery.Moreover; the color rendering of traditional fluorescent lamp is relatively poor; so produce pale light and be out of favour; in addition because principle of luminosity is 120 times quick flowing in a second of fluorescent tube two utmost point electronics; when firm unlatching and electric current instability, cause flicker easily; this phenomenon is considered to cause the arch-criminal of domestic high rate of myopia usually; but this problem can solve by the fluorescent tube of repacking with " high-frequency electrical minor stabilizer "; its high-frequency electrical minor stabilizer not only can fall 20% to the power consumption of traditional fluorescent lamp again; when lighting a lamp because of high frequency moment again; the light wave of output is highly stable; therefore almost flicker free takes place; and when power supply voltage variation or fluorescent tube are in low temperature, be not easy to produce flicker, therefore help the protection of eyesight.Yet the stabilizer of general Electricity-saving lamp bulb and power-saving lighting tube all is fixed, if eliminate the words of trade-in, must connect stabilizer abandons together, moreover no matter fluorescent tube how power saving again,, still inevitably environment is caused serious pollution after discarded because of it contains the coating of mercury.Therefore, in order to solve the above problems, light emitting diode bulb or light-emitting diode lamp tube in response to and give birth to.
Summary of the invention
Main purpose of the present invention is to provide a kind of package structure for LED that increases heat radiation and illumination effect and preparation method thereof.Because the present invention is arranged at Ni-Pd alloy (or NiPdAu alloy) bottom of tin ball or tin cream, so when crossing the tin stove composition of tin ball or tin cream not can with substrate body on put the stratum boundary metallic compound that brilliant weld pad surface reaction forms a fragility (Intermetallic Compound, IMC).
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of package structure for LED that increases heat radiation and illumination effect is provided, and it comprises: a base board unit, an alloy unit, a luminescence unit, a conductive unit and an encapsulation unit.Wherein, this base board unit has a substrate body, and the upper surface of this substrate body has at least one first conductive welding pad, at least one second conductive welding pad and at least onely puts brilliant weld pad.This alloy unit has at least one above-mentioned at least one Ni-Pd alloy of putting on the brilliant weld pad that is formed on.This luminescence unit has and at least onely sees through the tin ball solidified or tin cream and be positioned at LED crystal particle at least one Ni-Pd alloy of this alloy unit.This conductive unit has at least two leads, and wherein above-mentioned at least one LED crystal particle sees through above-mentioned at least two leads and is electrically connected between above-mentioned at least one first conductive welding pad and above-mentioned at least one second conductive welding pad.This encapsulation unit has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of this luminescence unit and this conductive unit.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of package structure for LED that increases heat radiation and illumination effect is provided, and it comprises: a base board unit, an alloy unit, a luminescence unit, a conductive unit and an encapsulation unit.Wherein, this base board unit has a substrate body, and the upper surface of this substrate body has at least one first conductive welding pad and at least onely puts brilliant weld pad.This alloy unit has at least one above-mentioned at least one Ni-Pd alloy of putting on the brilliant weld pad that is formed on.This luminescence unit has and at least onely sees through the tin ball solidified or tin cream and be positioned at LED crystal particle at least one Ni-Pd alloy of this alloy unit electrically.This conductive unit has at least one lead, and wherein above-mentioned at least one LED crystal particle sees through above-mentioned at least one lead and is electrically connected at above-mentioned at least one first conductive welding pad.This encapsulation unit has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of this luminescence unit and this conductive unit.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of manufacture method that increases the package structure for LED of heat radiation and illumination effect is provided, it comprises the following steps: at first, one base board unit is provided, wherein this base board unit has a substrate body, and the upper surface of this substrate body has at least one brilliant weld pad of putting; Then, be shaped at least one Ni-Pd alloy in above-mentioned at least one putting on the brilliant weld pad; Then, see through tin ball or tin cream, at least one LED crystal particle is arranged on above-mentioned at least one Ni-Pd alloy; Next, cross the tin stove, so that above-mentioned tin ball or tin cream become tin ball or the tin cream that has solidified, wherein above-mentioned at least one LED crystal particle sees through the above-mentioned tin ball that has solidified or tin cream and is positioned on above-mentioned at least one Ni-Pd alloy; And then, above-mentioned at least one light-emitting diode is electrically connected at this substrate body; At last, the printing opacity packing colloid that is shaped is in the upper surface of this substrate body, to cover this luminescence unit and this conductive unit.
Therefore, beneficial effect of the present invention is: because the present invention is arranged at Ni-Pd alloy (or NiPdAu alloy) bottom of tin ball or tin cream, so when crossing the tin stove composition of tin ball or tin cream not can with substrate body on put the stratum boundary metallic compound that brilliant weld pad surface reaction forms a fragility (Intermetallic Compound, IMC).In other words, when LED crystal particle was arranged on tin ball or the tin cream and crosses the tin stove, the strength of connection of putting between brilliant weld pad (weld strength) of tin ball or tin cream and this substrate body can be reinforced.In addition, the upper surface of above-mentioned at least one first conductive welding pad and above-mentioned at least one second conductive welding pad has an other Ni-Pd alloy (or NiPdAu alloy) respectively, in order to carrying out follow-up routing processing procedure.
Reach technology, means and the effect that predetermined purpose is taked in order further to understand the present invention, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, go deep into and concrete understanding when getting one thus, yet appended graphic reference and the explanation usefulness of only providing not is to be used for the present invention is limited.
Description of drawings
Fig. 1 increases by the forward sight generalized section of first embodiment of the heat radiation and the package structure for LED of illumination effect for the present invention;
Fig. 2 increases by the forward sight generalized section of second embodiment of the heat radiation and the package structure for LED of illumination effect for the present invention;
Fig. 3 increases the forward sight generalized section of the 3rd embodiment of the heat radiation and the package structure for LED of illumination effect for the present invention;
Fig. 4 increases the forward sight generalized section of the 4th embodiment of the heat radiation and the package structure for LED of illumination effect for the present invention; And
Fig. 5 increases the flow chart of the manufacture method of the heat radiation and the package structure for LED of illumination effect for the present invention.
The formant symbol description
Heat dissipating layer 101
Reflective insulating barrier 102
The first conductive welding pad 11a
The second conductive welding pad 11b
Put brilliant weld pad 11c
Positive terminal P
Negative pole end N
The reflective colloid 30 of reflecting unit 3 circulating types
The spacing space 300 of colloid
Circular arc tangential line T
Angle θ
Height H
Conductive unit W lead Wa
Ni-Pd alloy M Ni-Pd alloy M1
The tin ball B that has solidified
The tin cream B that has solidified
Embodiment
See also shown in Figure 1ly, first embodiment of the invention provides a kind of heat radiation and package structure for LED of illumination effect of increasing, and it comprises: a base board unit 1, an alloy unit, a luminescence unit 2, a conductive unit W and an encapsulation unit 4.
Wherein, this base board unit 1 has a substrate body 10, and the upper surface of this substrate body 10 has at least one first conductive welding pad 11a, at least one second conductive welding pad 11b and at least onely puts brilliant weld pad 11c.In addition, above-mentionedly at least onely put brilliant weld pad 11c and be arranged between above-mentioned at least one first conductive welding pad 11a and the above-mentioned at least one second conductive welding pad 11b, and above-mentioned at least one first conductive welding pad 11a, above-mentioned at least one second conductive welding pad 11b and above-mentionedly at least onely put brilliant weld pad 11c and all can be Copper Foil or any electric conducting material.In addition, this substrate body 10 have a circuit substrate 100, be arranged at these circuit substrate 100 bottoms heat dissipating layer 101, and one be arranged at these circuit substrate 100 upper surfaces and be used to expose above-mentioned at least one first conductive welding pad 11a, above-mentioned at least one second conductive welding pad 11b and above-mentioned at least one reflective insulating barrier 102 of putting brilliant weld pad 11c.
Moreover this alloy unit has at least one above-mentioned at least one Ni-Pd alloy (Ni/Pd allay) M that puts on the brilliant weld pad 11c that is formed on.In addition, according to different design requirements, this alloy unit has two other Ni-Pd alloy M1 (or NiPdAu alloy), it is formed at the upper surface of above-mentioned at least one first conductive welding pad 11a and the upper surface of above-mentioned at least one second conductive welding pad 11b respectively, in order to carry out follow-up routing processing procedure (that is be convenient to two gold threads of conductive unit W beat respectively on the Ni-Pd alloy M1 that is positioned on above-mentioned at least one first conductive welding pad 11a upper surface and be positioned on the Ni-Pd alloy M1 on above-mentioned at least one second conductive welding pad 11b upper surface).In addition, according to different design requirements, this alloy unit has the gold of sneaking into above-mentioned at least one Ni-Pd alloy M, so that above-mentioned at least one Ni-Pd alloy M forms a NiPdAu alloy (Ni/Pd/Au allay).In other words, according to different design requirements, the present invention also can use " above-mentioned NiPdAu alloy " to replace " above-mentioned at least one Ni-Pd alloy M ".
In addition, this luminescence unit 2 has and at least onely sees through the tin ball solidified or tin cream B and be positioned at LED crystal particle 20 (the present invention also can use most LED crystal particle 20) at least one Ni-Pd alloy M of this alloy unit, and according to first embodiment of the invention for example, the upper surface of above-mentioned at least one LED crystal particle 20 has a positive terminal P and a negative pole end N.Because the present invention is arranged at above-mentioned at least one Ni-Pd alloy M the bottom of tin ball or tin cream, so when crossing the tin stove composition of tin ball or tin cream not can with substrate body 10 on put the stratum boundary metallic compound that brilliant weld pad 11c surface reaction forms a fragility (Intermetallic Compound, IMC).Therefore when above-mentioned at least one LED crystal particle 20 was arranged on tin ball or the tin cream and crosses the tin stove, the strength of connection of putting between the brilliant weld pad 11c (weld strength) of tin ball that has solidified or tin cream B and this substrate body 10 can be reinforced.
In addition, this conductive unit W has at least two lead Wa, and wherein above-mentioned at least one LED crystal particle 20 sees through above-mentioned at least two lead Wa and is electrically connected between above-mentioned at least one first conductive welding pad 11a and the above-mentioned at least one second conductive welding pad 11b.With first embodiment of the invention for example, above-mentioned two lead Wa are electrically connected between the positive terminal P of this LED crystal particle 20 and the above-mentioned at least one first conductive welding pad 11a respectively and are electrically connected between the negative pole end N and above-mentioned at least one second conductive welding pad 11b of this LED crystal particle 20.
In addition, this encapsulation unit 4 has one and forms in these substrate body 10 upper surfaces to cover the printing opacity packing colloid 40 of this luminescence unit 2 and this conductive unit W.
With first embodiment of the invention for example, each LED crystal particle 20 can be a blue LED crystal grain, and this printing opacity packing colloid 40 can be a fluorescent colloid, therefore the blue light beam (figure does not show) that cast out of those LED crystal particle 20 (those blue LED crystal grain) can directly pass this printing opacity packing colloid 40 (this fluorescent colloid) and throw away, with the white light beam (scheming not show) that produces similar fluorescent lamp source.
Following table is the Correlated Case with ARMA Measurement data that known package structure for LED (comprising minimum value, maximum and mean value) and first embodiment of the invention (comprising NiPdAu and NiPd) import the light source that is produced after 700 milliamperes (mA):
| Project | Minimum value | Maximum | Mean value | NiPdAu | NiPd |
| Luminous flux | 569.748 | 647.311 | 620.645 | 660.659 | 678.645 |
| Luminous efficiency | 68.038 | 76.777 | 73.596 | 78.991 | 81.27 |
| CIE?x | 0.3078 | 0.3207 | 0.3143 | 0.3138 | 0.3131 |
| CIE?y | 0.3244 | 0.3511 | 0.3375 | 0.3435 | 0.3452 |
| Relative colour temperature | 6000.4 | 6819.7 | 6370.8 | 6351.2 | 6373.3 |
| Color rendering | 74.235 | 77.196 | 75.624 | 73.894 | 73.308 |
Wherein, the unit of luminous flux (Luminous Flux) is lumen (Lumen); The unit of luminous efficiency is lumens/watt (Lumen/W); CIE x and CIE y are x and the y coordinate of CIE (International Commission on Illumination, Commission Internationale De L'Eclairage) xy chromaticity coordinate figure (xy chromaticity diagram); (Correlated Color Temperature, unit CCT) are K (kelvin) to colour temperature relatively; The unit of color rendering (color render index) is Ra (Rendering average).
In other words, because the present invention uses Ni-Pd alloy (Ni/Pd allay) M or NiPdAu alloy (Ni/Pd/Au allay) as the above-mentioned tin ball that has solidified or tin cream B and above-mentioned at least one interface layer of putting between the brilliant weld pad 11c, so package structure for LED of the present invention not only can " be strengthened the strength of connection (weld strength) between the brilliant weld pad 11c put of the above-mentioned tin ball that has solidified or tin cream B and this substrate body 10 ", and also can increase radiating effect (heat that above-mentioned at least one LED crystal particle 20 produced can be directed to the brilliant weld pad 11c of putting of this substrate body 10 through above-mentioned at least one Ni-Pd alloy M from tin ball or the tin cream B that has solidified) and promote luminous efficiency (as above showing resulting measuring structure).
See also shown in Figure 2, second embodiment of the invention provides a kind of package structure for LED that increases heat radiation and illumination effect, and it comprises: a base board unit 1, alloy unit, a luminescence unit 2, a conductive unit W, a reflecting unit 3, an encapsulation unit 4.
The difference of second embodiment and the first embodiment maximum is: in a second embodiment, package structure for LED further comprises: a reflecting unit 3, it has one and sees through the mode of coating and form in the reflective colloid 30 of circulating type of these substrate body 10 upper surfaces around ground, wherein the reflective colloid 30 of this circulating type is around above-mentioned at least one LED crystal particle 20, forming a spacing space 300 of colloid that is positioned at these substrate body 10 tops, and this printing opacity packing colloid 40 is limited in the spacing space 300 of this colloid.
Moreover, the upper surface of the reflective colloid 30 of this circulating type is a circular arc, the reflective colloid 30 of this circulating type with respect to the angle θ of the circular arc tangential line T of these substrate body 10 upper surfaces between 40 to 50 degree, the end face of the reflective colloid 30 of this circulating type with respect to the height H of these substrate body 10 upper surfaces between 0.3 to 0.7mm, the width of the reflective colloid of this circulating type 30 bottoms is between 1.5 to 3mm, the thixotropic index of the reflective colloid 30 of this circulating type (thixotropic index) is between 4-6, and the reflective colloid 30 of this circulating type is a white hot that the is mixed with inorganic additive reflective colloid that hardens.
See also shown in Figure 3ly, third embodiment of the invention provides a kind of heat radiation and package structure for LED of illumination effect of increasing, and it comprises: a base board unit 1, an alloy unit, a luminescence unit 2, a conductive unit W and an encapsulation unit 4.
Wherein, this base board unit 1 has a substrate body 10, and the upper surface of this substrate body 10 has at least one first conductive welding pad 11a and at least onely puts brilliant weld pad 11c.In addition, above-mentionedly at least onely put the contiguous above-mentioned at least one first conductive welding pad 11a of brilliant weld pad 11c, and above-mentioned at least one first conductive welding pad 11a and above-mentionedly at least onely put brilliant weld pad 11c and all can be Copper Foil or any electric conducting material.In addition, this substrate body 10 have a circuit substrate 100, be arranged at these circuit substrate 100 bottoms heat dissipating layer 101, and one be arranged at these circuit substrate 100 upper surfaces and be used to expose above-mentioned at least one first conductive welding pad 11a and above-mentioned at least one reflective insulating barrier 102 of putting brilliant weld pad 11c.
Moreover this alloy unit has at least one above-mentioned at least one Ni-Pd alloy (Ni/Pd allay) M that puts on the brilliant weld pad 11c that is formed on.In addition, according to different design requirements, this alloy unit has another one Ni-Pd alloy M1 (or NiPdAu alloy), it is formed at the upper surface of above-mentioned at least one first conductive welding pad 11a, in order to carrying out follow-up routing processing procedure (that is being convenient to the gold thread of conductive unit W is beaten on the Ni-Pd alloy M1 that is positioned on above-mentioned at least one first conductive welding pad 11a upper surface).In addition, according to different design requirements, this alloy unit has the gold of sneaking into above-mentioned at least one Ni-Pd alloy M, so that above-mentioned at least one Ni-Pd alloy M forms a NiPdAu alloy.In other words, according to different design requirements, the present invention also can use " above-mentioned NiPdAu alloy " to replace " above-mentioned at least one Ni-Pd alloy M ".
In addition, this luminescence unit 2 has and at least onely sees through the tin ball solidified or tin cream B and " electrically " is positioned at the LED crystal particle 20 (the present invention also can use most LED crystal particle 20) at least one Ni-Pd alloy M of this alloy unit, and according to third embodiment of the invention for example, the upper surface of above-mentioned at least one LED crystal particle 20 and lower surface have power on an extreme P (for example positive terminal) and an electrode tip N (for example negative pole end) once respectively.Because the present invention is arranged at above-mentioned at least one Ni-Pd alloy M the bottom of tin ball or tin cream, so when crossing the tin stove composition of tin ball or tin cream not can with substrate body 10 on put the stratum boundary metallic compound that brilliant weld pad 11c surface reaction forms a fragility (Intermetallic Compound, IMC).Therefore when above-mentioned at least one LED crystal particle 20 was arranged on tin ball or the tin cream and crosses the tin stove, the strength of connection of putting between the brilliant weld pad 11c (weld strength) of tin ball that has solidified or tin cream B and this substrate body 10 can be reinforced.
In addition, this conductive unit W has at least one lead Wa, and wherein above-mentioned at least one LED crystal particle 20 sees through above-mentioned at least one lead Wa and is electrically connected at above-mentioned at least one first conductive welding pad 11a.With third embodiment of the invention for example, the bottom electrode end N of above-mentioned at least one LED crystal particle 20 directly sees through above-mentioned tin ball that has solidified or tin cream B and above-mentioned at least one Ni-Pd alloy M and is electrically connected at above-mentioned at least one brilliant weld pad 11c that puts, and the top electrode P of above-mentioned at least one LED crystal particle 20 sees through above-mentioned at least one lead Wa and is electrically connected at above-mentioned at least one first conductive welding pad 11a.
In addition, this encapsulation unit 4 has one and forms in these substrate body 10 upper surfaces to cover the printing opacity packing colloid 40 of this luminescence unit 2 and this conductive unit W.
With third embodiment of the invention for example, each LED crystal particle 20 can be a blue LED crystal grain, and this printing opacity packing colloid 40 can be a fluorescent colloid, therefore the blue light beam (figure does not show) that cast out of those LED crystal particle 20 (those blue LED crystal grain) can directly pass this printing opacity packing colloid 40 (this fluorescent colloid) and throw away, with the white light beam (scheming not show) that produces similar fluorescent lamp source.
See also shown in Figure 4, fourth embodiment of the invention provides a kind of package structure for LED that increases heat radiation and illumination effect, and it comprises: a base board unit 1, alloy unit, a luminescence unit 2, a conductive unit W, a reflecting unit 3, an encapsulation unit 4.
The difference of the 4th embodiment and the 3rd embodiment maximum is: in the 4th embodiment, package structure for LED further comprises: a reflecting unit 3, it has one and sees through the mode of coating and form in the reflective colloid 30 of circulating type of these substrate body 10 upper surfaces around ground, wherein the reflective colloid 30 of this circulating type is around above-mentioned at least one LED crystal particle 20, forming a spacing space 300 of colloid that is positioned at these substrate body 10 tops, and this printing opacity packing colloid 40 is limited in the spacing space 300 of this colloid.
Moreover, the upper surface of the reflective colloid 30 of this circulating type is a circular arc, the reflective colloid 30 of this circulating type with respect to the angle θ of the circular arc tangential line T of these substrate body 10 upper surfaces between 40 to 50 degree, the end face of the reflective colloid 30 of this circulating type with respect to the height H of these substrate body 10 upper surfaces between 0.3 to 0.7mm, the width of the reflective colloid of this circulating type 30 bottoms is between 1.5 to 3mm, the thixotropic index of the reflective colloid 30 of this circulating type (thixotropic index) is between 4-6, and the reflective colloid 30 of this circulating type is a white hot that the is mixed with inorganic additive reflective colloid that hardens.
See also shown in Figure 5, the invention provides a kind of manufacture method that increases the package structure for LED of heat radiation and illumination effect, it comprises the following steps: at first, one base board unit 1 is provided, wherein this base board unit 1 has a substrate body 10, and the upper surface of this substrate body 10 has at least one brilliant weld pad 11c (step S100) that puts; Then, be shaped at least one Ni-Pd alloy M in above-mentioned at least one brilliant weld pad 11c upward (step S102) that puts; Then, see through tin ball or tin cream, at least one LED crystal particle 20 is arranged on above-mentioned at least one Ni-Pd alloy M goes up (step S104); Next, cross the tin stove, so that above-mentioned tin ball or tin cream become tin ball or the tin cream B that has solidified, wherein above-mentioned at least one LED crystal particle 20 sees through the above-mentioned tin ball that has solidified or tin cream B and is positioned on above-mentioned at least one Ni-Pd alloy M (step S106); And then, above-mentioned at least one light-emitting diode 20 is electrically connected at this substrate body 10 (step S108); At last, the printing opacity packing colloid 40 that is shaped is in the upper surface of this substrate body 10, to cover this luminescence unit 3 and this conductive unit W (step S110).
Therefore, the package structure for LED of first embodiment of the invention and the 3rd embodiment can be made through above-mentioned manufacture method (step S100 is to step S110).More different is at step S108, for example: in first embodiment, two apex electrodes of above-mentioned at least one LED crystal particle 20 see through above-mentioned at least two lead Wa and are electrically connected between above-mentioned at least one first conductive welding pad 11a and the above-mentioned at least one second conductive welding pad 11b.In the 3rd example, the bottom electrode of above-mentioned at least one LED crystal particle 20 sees through tin ball or the tin cream B that has solidified, be positioned at " electrically " at least one Ni-Pd alloy M of this alloy unit, and the apex electrode of above-mentioned at least one LED crystal particle 20 sees through above-mentioned at least one lead Wa and is electrically connected at above-mentioned at least one first conductive welding pad 11a.
Moreover, according to different design requirements, this printing opacity packing colloid 40 of above-mentioned shaping can further comprise before the step of these substrate body 20 upper surfaces: at first, mode with coating forms liquid glue material (figure does not show) in the upper surface (step S109A) of this substrate body 10 around ground, it is (for example circular wherein should liquid state glue material can optionally to be surrounded into a predetermined shape, square, rectangle or the like), the thixotropic index of this liquid state glue material (thixotropic index) is between 4-6, be coated with this liquid state glue material in the pressure of these substrate body 10 upper surfaces between 350-450kpa, be coated with this liquid state glue material in the speed of these substrate body 10 upper surfaces between 5-15mm/s, and to be coated with this liquid state glue material around ground be identical position in the starting point of these substrate body 10 upper surfaces with terminating point; Then, solidify this liquid state glue material again to form the reflective colloid 30 of a circulating type, and the reflective colloid 30 of this circulating type is around above-mentioned at least one LED crystal particle 20, to form a spacing space 300 of colloid (step S109B) that is positioned at these substrate body 10 tops, and this printing opacity packing colloid 40 is limited in the spacing space 300 of this colloid, wherein should harden through the mode of baking by liquid state glue material, the temperature of baking is between the 120-140 degree, and the time of baking is between 20-40 minute.
In sum, because the present invention is arranged at Ni-Pd alloy (or NiPdAu alloy) bottom of tin ball or tin cream, so when crossing the tin stove composition of tin ball or tin cream not can with substrate body on put the stratum boundary metallic compound that brilliant weld pad surface reaction forms a fragility (Intermetallic Compound, IMC).In other words, when LED crystal particle was arranged on tin ball or the tin cream and crosses the tin stove, the strength of connection of putting between brilliant weld pad (weld strength) of tin ball or tin cream and this substrate body can be reinforced.In addition, the upper surface of above-mentioned at least one first conductive welding pad and above-mentioned at least one second conductive welding pad has an other Ni-Pd alloy (or NiPdAu alloy) respectively, in order to carrying out follow-up routing processing procedure.
But, all closing in the embodiment of the spirit variation similar of the present patent application claim with it, all should be contained in the category of the present invention, anyly be familiar with this skill person in the field of the invention, can think easily and variation or modify and all can be encompassed in claim of the present invention.
Claims (10)
1. a package structure for LED that increases heat radiation and illumination effect is characterized in that, comprising:
One base board unit, it has a substrate body, and the upper surface of this substrate body has at least one first conductive welding pad, at least one second conductive welding pad and at least onely puts brilliant weld pad;
One alloy unit, it has at least one above-mentioned at least one Ni-Pd alloy of putting on the brilliant weld pad that is formed on;
One luminescence unit, it has and at least onely sees through the tin ball solidified or tin cream and be positioned at LED crystal particle at least one Ni-Pd alloy of this alloy unit;
One conductive unit, it has at least two leads, and wherein above-mentioned at least one LED crystal particle sees through above-mentioned at least two leads and is electrically connected between above-mentioned at least one first conductive welding pad and above-mentioned at least one second conductive welding pad; And
One encapsulation unit, it has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of this luminescence unit and this conductive unit.
2. the package structure for LED of increase heat radiation as claimed in claim 1 and illumination effect, it is characterized in that: further comprise: a reflecting unit, it has one and sees through the mode of coating and form in the reflective colloid of circulating type of this substrate body upper surface around ground, wherein the reflective colloid of this circulating type is around above-mentioned at least one LED crystal particle, forming a spacing space of colloid that is positioned at this substrate body top, and this printing opacity packing colloid is limited in the spacing space of this colloid; The upper surface of the reflective colloid of this circulating type is a circular arc, the reflective gel phase of this circulating type for the angle of the circular arc tangential line of this substrate body upper surface between 40 to 50 degree, the item face of the reflective colloid of this circulating type with respect to the height of this substrate body upper surface between 0.3 to 0.7mm, the width of the reflective colloid of this circulating type bottom is between 1.5 to 3mm, the thixotropic index of the reflective colloid of this circulating type (thixotropic index) is between 4-6, and the reflective colloid of this circulating type is a white hot that the is mixed with inorganic additive reflective colloid that hardens.
3. the package structure for LED of increase heat radiation as claimed in claim 1 and illumination effect, it is characterized in that: this alloy unit has two other Ni-Pd alloy or NiPdAu alloy, and it is formed at the upper surface of above-mentioned at least one first conductive welding pad and the upper surface of above-mentioned at least one second conductive welding pad respectively.
4. the package structure for LED of increase heat radiation as claimed in claim 1 and illumination effect, it is characterized in that: the upper surface of above-mentioned at least one LED crystal particle has a positive terminal and a negative pole end, and above-mentioned two leads are electrically connected between the positive terminal of this LED crystal particle and above-mentioned at least one first conductive welding pad respectively and are electrically connected between the negative pole end and above-mentioned at least one second conductive welding pad of this LED crystal particle.
5. the package structure for LED of increase heat radiation as claimed in claim 1 and illumination effect is characterized in that: this alloy unit has the gold of sneaking into above-mentioned at least one Ni-Pd alloy, so that above-mentioned at least one Ni-Pd alloy forms a NiPdAu alloy.
6. a package structure for LED that increases heat radiation and illumination effect is characterized in that, comprising:
One base board unit, it has a substrate body, and the upper surface of this substrate body has at least one first conductive welding pad and at least onely puts brilliant weld pad;
One alloy unit, it has at least one above-mentioned at least one Ni-Pd alloy of putting on the brilliant weld pad that is formed on;
One luminescence unit, it has and at least onely sees through the tin ball solidified or tin cream and be positioned at LED crystal particle at least one Ni-Pd alloy of this alloy unit electrically;
One conductive unit, it has at least one lead, and wherein above-mentioned at least one LED crystal particle sees through above-mentioned at least one lead and is electrically connected at above-mentioned at least one first conductive welding pad; And
One encapsulation unit, it has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of this luminescence unit and this conductive unit.
7. the package structure for LED of increase heat radiation as claimed in claim 6 and illumination effect, it is characterized in that: the upper surface of above-mentioned at least one LED crystal particle and lower surface have one respectively and power on extreme and electrode tip once, and the bottom electrode end of above-mentioned at least one LED crystal particle directly sees through above-mentioned tin ball that has solidified or tin cream and above-mentioned at least one Ni-Pd alloy and is electrically connected at above-mentioned at least one brilliant weld pad of putting, and the top electrode of above-mentioned at least one LED crystal particle sees through above-mentioned at least one lead and is electrically connected at above-mentioned at least one first conductive welding pad.
8. the package structure for LED of increase heat radiation as claimed in claim 6 and illumination effect is characterized in that: this alloy unit has the gold of sneaking into above-mentioned at least one Ni-Pd alloy, so that above-mentioned at least one Ni-Pd alloy forms a NiPdAu alloy.
9. a manufacture method that increases the package structure for LED of heat radiation and illumination effect is characterized in that, comprises the following steps:
One base board unit is provided, and wherein this base board unit has a substrate body, and the upper surface of this substrate body has at least one brilliant weld pad of putting;
Be shaped at least one Ni-Pd alloy in above-mentioned at least one putting on the brilliant weld pad;
See through tin ball or tin cream, at least one LED crystal particle is arranged on above-mentioned at least one Ni-Pd alloy;
Cross the tin stove, so that above-mentioned tin ball or tin cream become tin ball or the tin cream that has solidified, wherein above-mentioned at least one LED crystal particle sees through the above-mentioned tin ball that has solidified or tin cream and is positioned on above-mentioned at least one Ni-Pd alloy;
Above-mentioned at least one light-emitting diode is electrically connected at this substrate body; And
Be shaped a printing opacity packing colloid in the upper surface of this substrate body, to cover this luminescence unit and this conductive unit.
10. the package structure for LED of increase heat radiation as claimed in claim 9 and illumination effect, it is characterized in that: this printing opacity packing colloid of above-mentioned shaping further comprises before the step of this substrate body upper surface: the mode with coating forms liquid glue material in the upper surface of this substrate body around ground, solidify this liquid state glue material then to form the reflective colloid of a circulating type, wherein the reflective colloid of this circulating type is around above-mentioned at least one LED crystal particle, forming a spacing space of colloid that is positioned at this substrate body top, and this printing opacity packing colloid is limited in the spacing space of this colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910206080 CN102044534A (en) | 2009-10-20 | 2009-10-20 | Light-emitting diode encapsulation structure capable of enhancing heat-radiating and light-emitting effects and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910206080 CN102044534A (en) | 2009-10-20 | 2009-10-20 | Light-emitting diode encapsulation structure capable of enhancing heat-radiating and light-emitting effects and manufacturing method thereof |
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| CN102044534A true CN102044534A (en) | 2011-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111463652A (en) * | 2019-01-22 | 2020-07-28 | 隆达电子股份有限公司 | Light emitting device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111463652A (en) * | 2019-01-22 | 2020-07-28 | 隆达电子股份有限公司 | Light emitting device |
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Application publication date: 20110504 |