CN102044487A - 钨双大马士革工艺 - Google Patents
钨双大马士革工艺 Download PDFInfo
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- CN102044487A CN102044487A CN2009102017097A CN200910201709A CN102044487A CN 102044487 A CN102044487 A CN 102044487A CN 2009102017097 A CN2009102017097 A CN 2009102017097A CN 200910201709 A CN200910201709 A CN 200910201709A CN 102044487 A CN102044487 A CN 102044487A
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- tungsten
- etching
- upper metal
- metal layers
- wire casing
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200910201709 CN102044487B (zh) | 2009-10-22 | 2009-10-22 | 钨双大马士革工艺 |
Applications Claiming Priority (1)
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CN 200910201709 CN102044487B (zh) | 2009-10-22 | 2009-10-22 | 钨双大马士革工艺 |
Publications (2)
Publication Number | Publication Date |
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CN102044487A true CN102044487A (zh) | 2011-05-04 |
CN102044487B CN102044487B (zh) | 2013-03-13 |
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CN 200910201709 Active CN102044487B (zh) | 2009-10-22 | 2009-10-22 | 钨双大马士革工艺 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108538779A (zh) * | 2018-03-29 | 2018-09-14 | 上海华力集成电路制造有限公司 | 双大马士革工艺方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050170625A1 (en) * | 2004-01-29 | 2005-08-04 | Chartered Semiconductor Manufacturing Ltd. | Novel method to control dual damascene trench etch profile and trench depth uniformity |
CN1812074A (zh) * | 2004-12-08 | 2006-08-02 | 三星电子株式会社 | 形成互连结构和半导体器件的方法 |
CN101410481A (zh) * | 2006-03-29 | 2009-04-15 | 英特尔公司 | 在半导体加工中蚀刻金属硬掩模材料的组合物 |
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2009
- 2009-10-22 CN CN 200910201709 patent/CN102044487B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050170625A1 (en) * | 2004-01-29 | 2005-08-04 | Chartered Semiconductor Manufacturing Ltd. | Novel method to control dual damascene trench etch profile and trench depth uniformity |
CN1812074A (zh) * | 2004-12-08 | 2006-08-02 | 三星电子株式会社 | 形成互连结构和半导体器件的方法 |
CN101410481A (zh) * | 2006-03-29 | 2009-04-15 | 英特尔公司 | 在半导体加工中蚀刻金属硬掩模材料的组合物 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108538779A (zh) * | 2018-03-29 | 2018-09-14 | 上海华力集成电路制造有限公司 | 双大马士革工艺方法 |
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Publication number | Publication date |
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CN102044487B (zh) | 2013-03-13 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20131216 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
|
TR01 | Transfer of patent right |
Effective date of registration: 20131216 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |