CN102044344A - Chip capacitor - Google Patents
Chip capacitor Download PDFInfo
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- CN102044344A CN102044344A CN2009102072268A CN200910207226A CN102044344A CN 102044344 A CN102044344 A CN 102044344A CN 2009102072268 A CN2009102072268 A CN 2009102072268A CN 200910207226 A CN200910207226 A CN 200910207226A CN 102044344 A CN102044344 A CN 102044344A
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Abstract
The invention relates to a miniature chip capacitor component capable of taking the actions of oscillation, coupling, filtration, bypass, direct current blocking and alternating current passing in a circuit. The chip capacitor is formed by the following steps of: respectively forming composite electrode film layers at both sides of a cuboid barium-titanate ceramic substrate by adopting a chemical plating mode and a capacitor alloy powder ionic-spraying mode, wherein the composite electrode film layers are mutually unconnected; then, respectively spraying conductive layers of nickel-tin alloy powder at both ends of one rectangular side of the ceramic substrate as outer electrodes, wherein one outer electrode can only be connected with a composite electrode surface; and finally, spraying a layer of insulating paint on the ceramic substrate except for the outer electrodes to form the chip capacitor. The invention has the advantages of high temperature and high pressure resistance, high capacity, less loss, small size and convenience of SMT (Surface Mounting Technology), and is used for replacing a traditional AC (Alternating Current) safety ceramic capacitor and mainly applied to household appliances, office equipment, electronic instruments and other electronic products.
Description
Affiliated technical field
The present invention relates to a kind of can be in circuit oscillates, coupling, filtering, bypass and the partition direct current miniaturized patch capacity cell by alternating current function.
Background technology
At present, using traditional AC safety ceramic capacitor of decades is on two discs of a disk barium titanate ceramic body, with ooze silver-colored sintering the film mode, adhere to a kind of thin silver electrode layer, difference welding lead on the thin silver electrode layer at two ends coats one deck epoxy insulation powdery paints on whole ceramic disks surface again and forms.This type capacitor not only capacity is little, and loss is big, and volume is big, and manufacturing process and equipment complexity, the cost height, and China produced over 60 years, never had any technological innovation and breakthrough, and AC safety ceramic capacitor fails to realize high pressure and high capacity.
Summary of the invention
Excessive in order to overcome present traditional capacitor volume, equipment has high input, complex process, the cost height, and the shortcoming that is not suitable for the developing direction of miniaturization of electronic products, it is simple to the invention provides a kind of technology, low originally efficient, is fit to the chip capacitor element of SMT surface mount and miniaturization of electronic products demand for development.
The technical solution adopted for the present invention to solve the technical problems is
Adopt chemical plating and plasma spray capacitance alloy powder mode on the two sides of a cuboid barium titanate ceramic substrate, to form mutual disjunct combination electrode rete respectively, spray the conductive layer of nickeltin powder respectively as external electrode at the wherein two ends of one side of the rectangular side of ceramic substrate then, and an external electrode only links to each other with a combination electrode face, again spraying one deck coatings on the ceramic substrate except that external electrode.
The invention has the beneficial effects as follows
Can simplify production technology, reduce cost, dwindle the electric capacity volume, improve the electric capacity quality, simple in structure, make things convenient for the SMT surface mount.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is a front of the present invention outline drawing.
Fig. 2 is circuit theory diagrams of the present invention.1. positive external electrode 2. negative external electrode 3. ceramic substrates (BaTiO3) are positive electrode rete 5. negative electrode retes 4.
Fig. 3 is an embodiments of the invention cross section structural map.1. positive external electrode 2. negative external electrode 3. ceramic substrates (BaTiO3) are coatings layer 5. negative electrode rete 6. positive electrode retes 4.
Embodiment
Adopt the mode of chemical plating and plasma spray capacitance alloy powder on the two sides of a cuboid barium titanate ceramic substrate, to form the combination electrode rete, spray the conductive layer of nickeltin powder respectively as external electrode at the wherein two ends of one side of the rectangular side of ceramic substrate then, and an external electrode only links to each other with a combination electrode face, promptly two combination electrode face mask layers are not connected, again spraying one deck coatings on the ceramic substrate except that external electrode.
Claims (3)
1. patch capacitor, on two discs of a disk barium titanate ceramic body, with ooze silver-colored sintering the film mode, adhere to a kind of thin silver electrode layer, difference welding lead on the thin silver electrode layer at two ends, coat one deck epoxy insulation powdery paints on whole ceramic disks surface again, it is characterized in that: adopt chemical plating and plasma spray capacitance alloy powder mode on the two sides of a cuboid barium titanate ceramic substrate, to form mutual disjunct combination electrode rete respectively, spray the conductive layer of nickeltin powder respectively as external electrode at the wherein two ends of one side of the rectangular side of ceramic substrate then, and an external electrode only links to each other with a combination electrode face, again spraying one deck coatings on the ceramic substrate except that external electrode.
2. patch capacitor according to claim 1 is characterized in that: adopt chemical plating and plasma spray capacitance alloy powder on the two sides of a cuboid barium titanate ceramic substrate, form two mutual disjunct combination electrode retes respectively.
3. plate resistor according to claim 1, it is characterized in that: the wherein two ends of one side in the rectangular side of ceramic substrate spray the conductive layer of 2 mm wide nickeltin powder respectively as external electrode, and an external electrode only links to each other with a combination electrode face, and promptly two combination electrode face mask layers are not connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102072268A CN102044344A (en) | 2009-10-13 | 2009-10-13 | Chip capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102072268A CN102044344A (en) | 2009-10-13 | 2009-10-13 | Chip capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102044344A true CN102044344A (en) | 2011-05-04 |
Family
ID=43910387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102072268A Pending CN102044344A (en) | 2009-10-13 | 2009-10-13 | Chip capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102044344A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102891006A (en) * | 2011-07-20 | 2013-01-23 | Tdk株式会社 | Electronic component and method for manufacturing electronic component |
| CN111863459A (en) * | 2020-06-28 | 2020-10-30 | 华中科技大学 | Preparation method and application of patch type micro filter capacitor |
| CN113614866A (en) * | 2019-03-28 | 2021-11-05 | 株式会社村田制作所 | Chip-type ceramic electronic component and method for manufacturing same |
-
2009
- 2009-10-13 CN CN2009102072268A patent/CN102044344A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102891006A (en) * | 2011-07-20 | 2013-01-23 | Tdk株式会社 | Electronic component and method for manufacturing electronic component |
| CN102891006B (en) * | 2011-07-20 | 2017-04-19 | Tdk株式会社 | Electronic component and method for manufacturing electronic component |
| CN113614866A (en) * | 2019-03-28 | 2021-11-05 | 株式会社村田制作所 | Chip-type ceramic electronic component and method for manufacturing same |
| CN111863459A (en) * | 2020-06-28 | 2020-10-30 | 华中科技大学 | Preparation method and application of patch type micro filter capacitor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110504 |