CN102042525A - Light-emitting diode (LED) lighting device - Google Patents
Light-emitting diode (LED) lighting device Download PDFInfo
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- CN102042525A CN102042525A CN2011100308964A CN201110030896A CN102042525A CN 102042525 A CN102042525 A CN 102042525A CN 2011100308964 A CN2011100308964 A CN 2011100308964A CN 201110030896 A CN201110030896 A CN 201110030896A CN 102042525 A CN102042525 A CN 102042525A
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- circuit board
- lighting device
- radiating substrate
- led
- heat
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Abstract
The invention discloses a light-emitting diode (LED) lighting device. The LED lighting device comprises a radiating substrate (1), a circuit board (2), a plurality of LED chips (3), a light-transmitting cover (4) and a power supply (5), wherein the circuit board (2) is arranged on the bottom wall of the radiating substrate (1); the plurality of LED chips (3) are arranged on the upper surface of the circuit board (2); the light-transmitting cover (4) is connected with the radiating substrate (1); the power supply (5) is connected with the circuit board (2); the light-emitting surfaces of the plurality of LED chips (3) face the light-transmitting cover (4); and the circuit board (2) comprises 20 to 30 mass percent of epoxy resin, 15 to 25 mass percent of inorganic filling material, 25 to 50 mass percent of mixture of glass fiber cloth and glass non-woven fabric and 8 to 20 mass percent of copper foil. The LED lighting device overcomes the defects in the prior art and has high temperature resistance, high pressure resistance, high heat conductivity and high reliability.
Description
Technical field
The present invention relates to a kind of LED lighting device.
Background technology
Because the LED development of technology, LED uses also diversification day by day, by early stage power supply indicator, advance to have power saving, the life-span is grown, the LED illuminating product of visibility advantages of higher.Yet because the high-capacity LED input power only has 15 to 20% to convert light to, all the other 80 to 85% convert heat to, if these heat are not discharged outside in good time, will make LED crystal grain boundary temperature too high and influence luminous efficiency and luminescent lifetime so.The power of early stage single-chip LED is not high, and caloric value is limited, and the problem of heat is little, so its packaged type is simple relatively.But along with the continuous breakthrough of LED material technology, the encapsulation technology of LED also changes thereupon in recent years, develops into the multi-core encapsulation module of flattening, large tracts of land formula gradually from the bullet cut encapsulation of early stage single-chip; The low-power LED of its operating current about by early stage 20mA proceeds to present about 1/3 to 1A high-capacity LED, and the input power of single LEDs is up to more than the 1W, even to 3W, 5W.LED market enlarges rapidly owing to LED illuminating product and liquid crystal panel back of the body illuminator etc.Especially in the LED illuminating product, improve LED brightness and become one of impetus of technological development.The LED baseboard material of high-cooling property and high reflectance and the demands such as encapsulating material of high projection ratio appear thus.
Summary of the invention
In order to overcome the deficiency that prior art exists, the object of the present invention is to provide a kind of high temperature resistant, high pressure resistant, good heat-transfer, the LED lighting device that reliability is high.
For reaching above purpose, the invention provides a kind of LED lighting device, it comprises the heat-radiating substrate of being made by alloy material, be arranged on the circuit board on the described heat-radiating substrate diapire, be arranged on a plurality of led chips of described circuit board upper surface, the diffuser that is connected with described heat-radiating substrate, the power supply that is connected with described circuit board, the exiting surface of described a plurality of led chips is towards described diffuser, described circuit board comprises that mass percent is 20%～30% epoxy resin, mass percent is 15%～25% inorganic filling material, mass percent is 25%～50% the glass fabric and the mixture of glass nonwoven, and mass percent is 8%～20% Copper Foil.
Further improvement of the present invention is that described inorganic filling material comprises one or more in iron, copper, aluminium, tin, gold, platinum, palladium, the pottery.
Further improvement of the present invention is that described diffuser is the PC cover.
Further improvement of the present invention is that described heat-radiating substrate is provided with the circuit board connector that inserts for described circuit board.
Further improvement of the present invention is that catch and described heat-radiating substrate that described circuit board connector is provided with in opposite directions by two, extends to described circuit board central axis direction surround.
Further improvement of the present invention is that the end of described heat-radiating substrate is provided with first bayonet socket that is used for the described diffuser of clamping, and described diffuser is provided with second bayonet socket that matches with described first bayonet socket.
Further improvement of the present invention is, described first bayonet socket comprises two outward extending two first cards that are connected near the end of described heat-radiating substrate axis and with described end, and described second bayonet socket comprises second card that extends internally, can insert between described first card and the heat-radiating substrate diapire.
Owing to adopted above technical scheme, the present invention has high temperature resistant, high pressure resistant, good heat-transfer, reliability advantages of higher.
Description of drawings
Accompanying drawing 1 is the main cutaway view of a kind of LED lighting device of the present invention;
Wherein: 1, heat-radiating substrate; 2, circuit board; 21, first bayonet socket; 22, catch; 3, led chip; 4, diffuser; 41, second bayonet socket; 5, power supply.
The specific embodiment
Below preferred embodiment of the present invention is described in detail, thereby protection scope of the present invention is made more explicit defining so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that.
Referring to accompanying drawing 1, a kind of LED lighting device, it comprises the heat-radiating substrate of being made by alloy material 1, be arranged on the circuit board 2 on heat-radiating substrate 1 diapire, be arranged on a plurality of led chips 3 of circuit board 2 upper surfaces, the diffuser 4 that is connected with heat-radiating substrate 1, the power supply 5 that is connected with described circuit board 2, the exiting surface of a plurality of led chips 3 is towards diffuser 4, circuit board 2 comprises that mass percent is 23% epoxy resin, mass percent is 17% inorganic filling material, mass percent is 44% the glass fabric and the mixture of glass nonwoven, and mass percent is 16% Copper Foil.Inorganic filling material is the mixture of iron, copper, aluminium, tin, gold, platinum, palladium, pottery in the present embodiment.
In response to directly the adhere development of substrate of high-capacity LED encapsulation and chip, selecting for use except that considering thermal diffusivity of baseplate material, also must consider thermal coefficient of expansion with the chip problem that is complementary, with thermal deformation and the reliability issues of avoiding thermal stress to cause, adopt iron in the present embodiment, copper, aluminium, tin, gold, platinum, palladium, the mixture of pottery not only can make full use of the high heat dispersion of various metals as inorganic filling material, and because the metal that adopts is varied, can also be high temperature resistant, high pressure resistant, and effectively reduce thermal deformation, utilize pottery to solve the thermal deformation problem in the last present embodiment and make the present invention not only have outstanding heat dispersion, and the reliability height.
Diffuser 4 is the PC cover in the present embodiment.
Heat-radiating substrate 1 is provided with the circuit board connector that power circuit board 2 inserts in the present embodiment.The catch 22 that the circuit board connector is provided with in opposite directions by two, extends to circuit board 2 central axis directions surrounds with heat-radiating substrate 1.
The end of heat-radiating substrate 1 is provided with first bayonet socket 21 that is used for clamping diffuser 4 in the present embodiment, and diffuser 4 is provided with second bayonet socket 41 that matches with first bayonet socket 21.First bayonet socket 21 comprises two outward extending two first cards that are connected near the end of heat-radiating substrate 1 axis and with the end, and second bayonet socket 41 comprises second card that extends internally, can insert between first card and heat-radiating substrate 1 diapire.
Embodiment two
With the embodiment one difference base plate that to be in the present embodiment to adopt a model of present SUNX be R-1787 as the circuit board in the present embodiment 2.
The R-1787 thermal conductivity is 1W/mK, and the unit of thermal conductivity factor is W/mK(or W/m ℃), the expression sectional area is 1 square metre the cylinder hot conducted power the when temperature difference of 1 meter distance is 1 Kelvin (K=℃+273.15) vertically.Numerical value is big more, shows that the heat transfer speed of this material is fast more, and heat conductivility is good more.
The R-1787 base plate is different with common circuit board to be to have used multiple metal and pottery to mix as inorganic filling material, has outstanding heat dispersion.
By above embodiment as can be seen, the present invention is a kind of high temperature resistant, high pressure resistant, good heat-transfer, the LED lighting device that reliability is high.
Above embodiment only is explanation technical conceive of the present invention and characteristics; its purpose is to allow the people that is familiar with this technology understand content of the present invention and is implemented; can not limit protection scope of the present invention with this, all equivalences that spirit essence is done according to the present invention change or modification all is encompassed in protection scope of the present invention.
Claims (7)
1. LED lighting device, it is characterized in that: it comprises the heat-radiating substrate of being made by alloy material (1), be arranged on the circuit board (2) on described heat-radiating substrate (1) diapire, be arranged on a plurality of led chips (3) of described circuit board (2) upper surface, the diffuser (4) that is connected with described heat-radiating substrate (1), the power supply (5) that is connected with described circuit board (2), the exiting surface of described a plurality of led chip (3) is towards described diffuser (4), described circuit board (2) comprises that mass percent is 20%～30% epoxy resin, mass percent is 15%～25% inorganic filling material, mass percent is 25%～50% the glass fabric and the mixture of glass nonwoven, and mass percent is 8%～20% Copper Foil.
2. LED lighting device according to claim 1 is characterized in that: described inorganic filling material comprises one or more in iron, copper, aluminium, tin, gold, platinum, palladium, the pottery.
3. LED lighting device according to claim 1 is characterized in that: described diffuser (4) is the PC cover.
4. LED lighting device according to claim 1 is characterized in that: described heat-radiating substrate (1) is provided with the circuit board connector that inserts for described circuit board (2).
5. LED lighting device according to claim 4 is characterized in that: the catch (22) that described circuit board connector is provided with in opposite directions by two, extends to described circuit board (2) central axis direction surrounds with described heat-radiating substrate (1).
6. LED lighting device according to claim 1, it is characterized in that: the end of described heat-radiating substrate (1) is provided with first bayonet socket (21) that is used for the described diffuser of clamping (4), and described diffuser (4) is provided with second bayonet socket (41) that matches with described first bayonet socket (21).
7. LED lighting device according to claim 6, it is characterized in that: described first bayonet socket (21) comprises two outward extending two first cards that are connected near the end of described heat-radiating substrate (1) axis and with described end, and described second bayonet socket (41) comprises second card that extends internally, can insert between described first card and heat-radiating substrate (1) diapire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100308964A CN102042525A (en) | 2011-01-28 | 2011-01-28 | Light-emitting diode (LED) lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100308964A CN102042525A (en) | 2011-01-28 | 2011-01-28 | Light-emitting diode (LED) lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102042525A true CN102042525A (en) | 2011-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100308964A Pending CN102042525A (en) | 2011-01-28 | 2011-01-28 | Light-emitting diode (LED) lighting device |
Country Status (1)
| Country | Link |
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| CN (1) | CN102042525A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014071608A1 (en) * | 2012-11-09 | 2014-05-15 | Yao Wenbin | Heat dissipation structure of lighting appliance |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1938358A (en) * | 2004-03-29 | 2007-03-28 | 住友电木株式会社 | Resin composition, metal foil with resin, insulating sheet with base material and multilayer printed wiring board |
| CN101220160A (en) * | 2007-12-07 | 2008-07-16 | 广东生益科技股份有限公司 | Prepreg applied for multi-layer board of printed electronic circuit |
| CN201517709U (en) * | 2009-09-30 | 2010-06-30 | 大连路明发光科技股份有限公司 | LED lighting lamp |
-
2011
- 2011-01-28 CN CN2011100308964A patent/CN102042525A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1938358A (en) * | 2004-03-29 | 2007-03-28 | 住友电木株式会社 | Resin composition, metal foil with resin, insulating sheet with base material and multilayer printed wiring board |
| CN101220160A (en) * | 2007-12-07 | 2008-07-16 | 广东生益科技股份有限公司 | Prepreg applied for multi-layer board of printed electronic circuit |
| CN201517709U (en) * | 2009-09-30 | 2010-06-30 | 大连路明发光科技股份有限公司 | LED lighting lamp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014071608A1 (en) * | 2012-11-09 | 2014-05-15 | Yao Wenbin | Heat dissipation structure of lighting appliance |
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Application publication date: 20110504 |