CN102042511A - LED illuminating lamp with light guide and heat conduction type fibers - Google Patents
LED illuminating lamp with light guide and heat conduction type fibers Download PDFInfo
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- CN102042511A CN102042511A CN2009102360481A CN200910236048A CN102042511A CN 102042511 A CN102042511 A CN 102042511A CN 2009102360481 A CN2009102360481 A CN 2009102360481A CN 200910236048 A CN200910236048 A CN 200910236048A CN 102042511 A CN102042511 A CN 102042511A
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- illuminating lamp
- heat
- optical fiber
- described led
- heat sink
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Abstract
The invention provides a LED (light emitting diode) illuminating lamp with light guide and heat conduction type fibers and is characterized in that the invention comprises: a LED luminescence chip used for illuminating; fibers used for conducting light and heat emitted by the LED luminescence chip; and a concave heat sink used for thermal conduction. The concave heat sink is a hollow cylinder with an open end; the LED luminescence chip is positioned at the bottom of inner side of the hollow cylinder; the back side of the LED luminescence chip is in thermal contact with inner wall of the hollow cylinder while the right side is in thermal contact with the first end of the fibers; the second end of the fibers is directed to the opening of the hollow cylinder. The illuminating lamp of the invention has the advantages of high heat radiation efficiency, simple structure, high reliability and noiselessness.
Description
Technical field
The present invention relates to the LED lighting field, be specifically related to a kind of LED illuminating lamp with leaded light heat-conducting optical fiber.
Background technology
In recent years, high speed development along with urban construction and electronics and information industry, led light source is good because of its colour rendering, energy-conservation, response speed is fast, allow frequent switch, low-voltage DC supply, long service life, impact resisting vibrating firm in structure, in light weight, use raw material not contain Toxic matter, excellent specific properties such as safety and environmental protection, become and have large-scale promotion value, the luminaire that energy-saving significance is great, they not only can be widely used in video display light, the large-scale advertisement display screen, the traffic signals indicator lamp, fields such as rapid transit/tunnel and important building nightscape lighting, and become the standard configuration of vehicle signal indicator lamp just rapidly, in the automobile life cycle, need not to change.The development of corresponding product and production have become the wide rising industry of development prospect.
Yet, though LED is called as cold light source, when electric current is tied through semi-conductive pn, have only the fraction electric energy to be converted to luminous energy, all the other most of electric energy still are converted into heat.The early stage LED that uses, its input power is mostly below 100 milliwatts, thereby heat radiation is unquestionable during single uses.In recent years, the illumination level LED of power 0.5～3W is used for flashlight, traffic lights, low-power lighting etc. gradually, along with the rising of power and the raising of integrated level, has needed heat radiation is carefully designed.
Currently both at home and abroad mainly taking to be forced to cross-ventilation, water-cooled, oil cooling, free convection, radiating mode such as heat sink aspect the heat radiation of LED assembly and system thereof.In these modes, that air cooling, water-cooled, oil cooling exist is bulky, the operation complicated, need periodic inspection and replacing, and actuator can be because of the long-time running problems such as reducing component capabilities that deforms.And the free convection type of cooling is owing to have simple in structure, advantages such as cost is low, movement-less part, and in the LED of reality product, radiating mode remains based on free convection; But the limited serious further raising that restricts led light source power of free convection mode heat-sinking capability.Adopt the LED illuminating lamp of heat sink heat radiation, the heat that LED produces can only be derived from the substrate of its bottom, thereby radiating effect is bad.
Summary of the invention
The objective of the invention is to: a kind of LED illuminating lamp with leaded light heat-conducting optical fiber is provided, comprises:
Be used for luminous LED luminescence chip;
Be used to conduct the optical fiber of the light and heat that sends by described LED luminescence chip;
It is heat sink to be used for heat conducting spill;
Described spill is heat sink to be the hollow cylinder of an end opening, described LED luminescence chip is positioned at the inside bottom of this hollow cylinder, the described LED luminescence chip back side contacts with the inner surface heat of this hollow cylinder, the first end thermo-contact of positive and described optical fiber, second end of described optical fiber points to the opening of described hollow cylinder.
Aforesaid LED illuminating lamp, the inside bottom of the hollow cylinder that described spill is heat sink has the LED installation site, and described LED luminescence chip is installed on the described LED installation site.
Aforesaid LED illuminating lamp, the recessed described spill in described LED installation site is heat sink.
Aforesaid LED illuminating lamp, described hollow cylinder have the optically focused curved surface of arc on every side in described led chip installation site, be coated with high reflective material coatings on this optically focused curved surface.
Aforesaid LED illuminating lamp, described optical fiber and described LED luminescence chip also comprise high heat conductive transparent ceramic material.
Aforesaid LED illuminating lamp also comprises the drive circuit of led chip, and the bottom that described spill is heat sink has aperture, and described drive circuit is realized and being electrically connected of described led chip through described aperture.
Aforesaid LED illuminating lamp also comprises the light-emitting plate at the second end place that is positioned at described optical fiber.
Aforesaid LED illuminating lamp, described optical fiber comprises many fibre cores, described many fibre cores link to each other with light-emitting plate dispersedly by transparent binding material.
Aforesaid LED illuminating lamp, described light-emitting plate are silica gel, polymethyl methacrylate, glass or Merlon.
Aforesaid LED illuminating lamp, heat sink exterior lateral sides partly have in fin or its sidewall and have heat pipe.
Description of drawings
Fig. 1 analyses and observe schematic perspective view according to the LED illuminating lamp of the band leaded light heat-conducting optical fiber of the embodiment of the invention 1;
Fig. 2 is the adjustable high-capacity LED illuminating lamp cross-sectional schematic of terminal end shape;
Fig. 3 for heat pipe-type heat sink analyse and observe schematic perspective view.
The specific embodiment
Further describe patent of the present invention below in conjunction with the drawings and specific embodiments:
Embodiment 1:
Fig. 1 analyses and observe schematic perspective view according to the LED illuminating lamp of the band leaded light heat-conducting optical fiber of the embodiment of the invention 1.
As shown in the figure, the LED illuminating lamp of present embodiment comprises: LED luminescence chip 1, drive circuit 2, optical fiber 3, spill is heat sink 4.Wherein, the present embodiment middle concave is heat sink 4 to be the hollow cylinder of an end opening, the cylinder arranged outside is useful on the some fins (optional) that promote heat radiation, and the cylinder inside bottom is provided with led chip installation site 40 (referring to Fig. 2), preferred led chip installation site 40 is positioned at the middle part of hollow cylinder bottom, and the hollow cylinder bottom around the led chip installation site 40 is curved substantially--and be optically focused curved surface 41; Optionally, these optically focused curved surface 41 places can scribble high reflective material coatings, and then improve the luminous power to optical fiber 3 outputs.LED luminescence chip 1 back side (non-light-emitting area) is placed thereon towards this installation site 40, the bottom of installation site 40 recessed spills heat sink 4 preferably, promptly be embedded into spill heat sink 4 in the part of bottom, so that make the side of putting into LED luminescence chip 1 wherein also can contact with spill heat sink 4, the shape of installation site 40 and LED luminescence chip 1 coupling.Spill is heat sink 4 in the installation site 40 places have an aperture, drive circuit 2 links to each other by the lead-in wire in the described aperture 21 with led chip, is used to control brightness and the color of LED.Optical fiber 3 places in the spill heat sink 4, and its first end directly or indirectly contacts towards LED luminescence chip 1 and with LED luminescence chip 1, and second end points to the opening of spill heat sink 4.As shown in Figure 2, in the present embodiment between place, the heat sink bottom of spill LED luminescence chip 1 and optical fiber 3 and have a floor height heat conductive transparent ceramic material 42 (among Fig. 2 between optical fiber 3 and spill are heat sink light part) between cylinder side wall and the optical fiber 3, with promote LED luminescence chip 1 and optical fiber 3 and optical fiber 3 with heat sink between the heat conduction, and then be convenient to the heat that LED luminescence chip 1 sends and conduct also finally through heat sink 4 derivation of spill to heat sink 4 conduction of spill or along optical fiber 3 by high heat conductive transparent ceramic material 42.But should be appreciated that optical fiber 3 can directly contact with LED luminescence chip 1 in other embodiments, and need not high heat conductive transparent ceramic material 42.The exterior lateral sides that spill is heat sink can be processed into rib-type or place heat pipe and strengthen heat exchange in the heat sink sidewall of spill.
Great power LED luminescence chip 1 processes according to program is integrated by desired power after can directly buying basic led chip from market; Such as this led chip can by but be not limited to 1-5000 LED basic chips and integrate, this is the known technology in this area, technical maturity.What optical fiber 3 adopted in the present embodiment is the simple optical fiber with a plurality of fibre cores, and it can be the fibre bundle that multifiber is formed in other embodiments, and according to necessary diameter, follow procedure processes.The structure of optical fiber 3 is appropriate change as required, such as this optical fiber can by but be not limited to 1-10000 fibre core 31 combination and obtain.4 for example material such as copper, aluminium making of employing highly heat-conductive materials that spill is heat sink.Spill is heat sink in 4, and the shape of bottom can also be paraboloidal, hyperboloid shape etc.
When the LED illuminating lamp was worked, the wide part that chip sent directly imported optical fiber, and remaining light enters optical fiber by curved surface 41 emissions that heat sink 4 bottoms of spill scribble reflecting material.The heat part that led chip shed by the chip lower surface (preferably, also conduct to spill heat sink 4 by the side) conduct to spill heat sink 4 through led chip installation site 40 parts, another part heat conducts to optical fiber 3 by high heat conductive transparent ceramic material, again along optical fiber 3 to luminous plaque 5 directions conduction, heat along in optical fiber 3 conductive processes gradually the high heat conductive transparent ceramic material through heat sink 4 sidewalls of spill conduct to spill heat sink 4.The characteristics of this radiator structure are to utilize the optical fiber bright dipping simultaneously, can be in all directions that the heat of led chip is conducted to spill is heat sink, guarantee the operation of led chip stability and safety.The thermal conductivity factor of air is 0.023W/mK, and the thermal conductivity factor of optical fiber is about 1W/mK, so utilize effect that optical fiber dispels the heat significantly better than air in the front of luminescence chip (light-emitting area).This method has significantly been expanded conventional art can only be derived the deficiency of heat by the bottom, is a kind of brand-new LED thermal management scheme.
Fig. 2 is the schematic perspective view of analysing and observe of the adjustable LED illuminating lamp of the terminal end shape that obtains after embodiment 1 is suitably improved;
The LED illuminating lamp of LED illuminating lamp shown in Fig. 2 and embodiment 1 is similar, and just light-emitting plate 5 utilizes transparent binding material to link to each other with a plurality of fibre cores 31 ends of optical fiber 3.Light-emitting plate 5 can be made by silica gel, PMMA (polymethyl methacrylate), glass, PC transparent materials such as (Merlon).In light-emitting plate 5 one sides, the fibre core 31 of optical fiber connector links to each other with light-emitting plate 5 dispersedly by transparent binding material.At this moment,, can suitably regulate, for example be designed to plane, lens or other decorative shape light-emitting plate 5 according to the bright dipping requirement.This structure can also be carried out the bright dipping adjustment according to demand by being adjusted in the setting of end fibre core on light-emitting plate of optical fiber.
In addition, can also at heat sink one or more heat pipe that distributes of this heat pipe-type spill, can flow through cooling fluid in the heat pipe on every side with heat sink replacement of heat pipe-type spill as shown in Figure 3 according to the spill among the embodiment of the invention 1 and the embodiment 2 heat sink 4.Wherein diameter of the number of heat pipe and heat pipe etc. can design according to radiating requirements.This built-in heat pipe structure also comparative maturity on processing technology.Perhaps the heat sink side of spill can be made the rib-type structure and be strengthened area of dissipation.
In embodiments of the invention, adopt spill heat sink 4, a heat part that makes the chip generation is according to traditional conduction mode, by the bottom heat is reached spill heat sink 4, installation site in the recessed spill heat sink 4 is set again, make the sidewall of luminescence chip also can contact and dispel the heat that heat reaches optical fiber and finally conducts to spill heat sink 4 by the transparent highly heat-conductive carbon/ceramic ceramic material of chip front end on the other hand with spill heat sink 4.Realization is to 360 ° of comprehensive heat radiations of led chip, radiating efficiency height.
Among the present invention with fiber optic applications in high-capacity LED, make optical fiber first end face directly or indirectly connect the LED exiting surface, not only can derive light effectively, the performance optical fibre illumination advantage, can also provide more effective heat management space for LED.Thereby guaranteed that great power LED can satisfy the bright dipping demand, can guarantee high-power trouble free service again.The power of led chip is further improved, and this unit efficiency height, important meaning be arranged at aspect such as energy-conservation, safe.And optical fiber heat conduction light guide structure herein is not limited to the LED luminescence chip, also can be used for other light-emitting components such as laser instrument etc.In the lighting device provided by the invention, inside has the Liquid Flow when adopting the heat pipe-type spill heat sink, does not contain any moving component, and whole apparatus structure is simple, reliability height, noiselessness.
It should be noted last that above embodiment is only unrestricted in order to technical scheme of the present invention to be described.Although the present invention is had been described in detail with reference to embodiment, those of ordinary skill in the art is to be understood that, technical scheme of the present invention is made amendment or is equal to replacement, do not break away from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (10)
1. the LED illuminating lamp with leaded light heat-conducting optical fiber is characterized in that, comprising:
Be used for luminous LED luminescence chip;
Be used to conduct the optical fiber of the light and heat that sends by described LED luminescence chip;
It is heat sink to be used for heat conducting spill;
Described spill is heat sink to be the hollow cylinder of an end opening, described LED luminescence chip is positioned at the inside bottom of this hollow cylinder, the described LED luminescence chip back side contacts with described hollow cylinder inner surface heat, the first end thermo-contact of positive and described optical fiber, second end of described optical fiber points to the opening of described hollow cylinder.
2. by the described LED illuminating lamp of claim 1, it is characterized in that the inside bottom of the hollow cylinder that described spill is heat sink has the led chip installation site, described LED luminescence chip is installed on the described led chip installation site.
3. by the described LED illuminating lamp of claim 2, it is characterized in that the recessed described spill in described led chip installation site is heat sink.
4. by the described LED illuminating lamp of claim 2, it is characterized in that described hollow cylinder has the optically focused curved surface of arc on every side in described led chip installation site, be coated with high reflective material coatings on this optically focused curved surface.
5. by the described LED illuminating lamp of claim 1, it is characterized in that, also comprise high heat conductive transparent ceramic material between described optical fiber and the described LED luminescence chip.
6. by the described LED illuminating lamp of claim 1, it is characterized in that also comprise the drive circuit of led chip, the bottom that described spill is heat sink has aperture, described drive circuit is realized and being electrically connected of described led chip through described aperture.
7. by the described LED illuminating lamp of claim 1, it is characterized in that, also comprise the light-emitting plate at the second end place that is positioned at described optical fiber.
8. according to the described LED illuminating lamp of claim 7, it is characterized in that described optical fiber comprises many fibre cores, described many fibre cores link to each other with light-emitting plate dispersedly by transparent binding material.
9. according to the described LED illuminating lamp of claim 7, it is characterized in that described light-emitting plate is silica gel, polymethyl methacrylate, glass or Merlon.
10. by the described LED illuminating lamp of claim 1, it is characterized in that the exterior lateral sides that spill is heat sink partly has in fin or its sidewall and has heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102360481A CN102042511A (en) | 2009-10-19 | 2009-10-19 | LED illuminating lamp with light guide and heat conduction type fibers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102360481A CN102042511A (en) | 2009-10-19 | 2009-10-19 | LED illuminating lamp with light guide and heat conduction type fibers |
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| Publication Number | Publication Date |
|---|---|
| CN102042511A true CN102042511A (en) | 2011-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102360481A Pending CN102042511A (en) | 2009-10-19 | 2009-10-19 | LED illuminating lamp with light guide and heat conduction type fibers |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103363349A (en) * | 2012-03-29 | 2013-10-23 | Nec照明株式会社 | Lighting device |
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2009
- 2009-10-19 CN CN2009102360481A patent/CN102042511A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103363349A (en) * | 2012-03-29 | 2013-10-23 | Nec照明株式会社 | Lighting device |
| CN103363349B (en) * | 2012-03-29 | 2019-07-05 | Nec照明株式会社 | Lighting device |
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Application publication date: 20110504 |