CN102034699A - 一种抛光的方法 - Google Patents
一种抛光的方法 Download PDFInfo
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- CN102034699A CN102034699A CN2009101967181A CN200910196718A CN102034699A CN 102034699 A CN102034699 A CN 102034699A CN 2009101967181 A CN2009101967181 A CN 2009101967181A CN 200910196718 A CN200910196718 A CN 200910196718A CN 102034699 A CN102034699 A CN 102034699A
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CN2009101967181A CN102034699A (zh) | 2009-09-29 | 2009-09-29 | 一种抛光的方法 |
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CN2009101967181A CN102034699A (zh) | 2009-09-29 | 2009-09-29 | 一种抛光的方法 |
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CN102034699A true CN102034699A (zh) | 2011-04-27 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111659665A (zh) * | 2020-05-29 | 2020-09-15 | 徐州鑫晶半导体科技有限公司 | 硅片的清洗方法及硅片的清洗设备 |
CN113684032A (zh) * | 2021-08-23 | 2021-11-23 | 吉林华微电子股份有限公司 | 清洗溶液配制方法、清洗溶液及沉积物的去除方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07263384A (ja) * | 1994-03-23 | 1995-10-13 | Mitsubishi Materials Corp | 半導体装置の製造方法 |
US5709755A (en) * | 1996-08-09 | 1998-01-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for CMP cleaning improvement |
WO2009116664A1 (ja) * | 2008-03-21 | 2009-09-24 | 信越化学工業株式会社 | Soiウェーハの製造方法 |
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2009
- 2009-09-29 CN CN2009101967181A patent/CN102034699A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07263384A (ja) * | 1994-03-23 | 1995-10-13 | Mitsubishi Materials Corp | 半導体装置の製造方法 |
US5709755A (en) * | 1996-08-09 | 1998-01-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for CMP cleaning improvement |
WO2009116664A1 (ja) * | 2008-03-21 | 2009-09-24 | 信越化学工業株式会社 | Soiウェーハの製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111659665A (zh) * | 2020-05-29 | 2020-09-15 | 徐州鑫晶半导体科技有限公司 | 硅片的清洗方法及硅片的清洗设备 |
CN111659665B (zh) * | 2020-05-29 | 2022-02-01 | 徐州鑫晶半导体科技有限公司 | 硅片的清洗方法及硅片的清洗设备 |
CN113684032A (zh) * | 2021-08-23 | 2021-11-23 | 吉林华微电子股份有限公司 | 清洗溶液配制方法、清洗溶液及沉积物的去除方法 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: WUXI HUARUN SHANGHUA TECHNOLOGY CO., LTD. Effective date: 20120312 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 214061 WUXI, JIANGSU PROVINCE TO: 214028 WUXI, JIANGSU PROVINCE |
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TA01 | Transfer of patent application right |
Effective date of registration: 20120312 Address after: 214028 Wuxi provincial high tech Industrial Development Zone, Hanjiang Road, No. 5, Jiangsu, China Applicant after: Wuxi CSMC Semiconductor Co., Ltd. Address before: 214061 No. 5 Hanjiang Road, national hi tech Industrial Development Zone, Wuxi, Jiangsu, China Applicant before: Wuxi CSMC Semiconductor Co., Ltd. Co-applicant before: Wuxi Huarun Shanghua Technology Co., Ltd. |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110427 |