CN102034683A - Laser repairing stand - Google Patents
Laser repairing stand Download PDFInfo
- Publication number
- CN102034683A CN102034683A CN201010513992XA CN201010513992A CN102034683A CN 102034683 A CN102034683 A CN 102034683A CN 201010513992X A CN201010513992X A CN 201010513992XA CN 201010513992 A CN201010513992 A CN 201010513992A CN 102034683 A CN102034683 A CN 102034683A
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- probe
- board
- base
- laser
- repairing
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Abstract
The invention discloses a laser repairing stand which is suitable for repairing an active element array substrate. The active element array substrate is provided with at least one testing line, wherein the testing line is provided with at least one pair of testing pads which are electrically connected with each other. The laser repairing stand comprises a carrying table, a laser repairing device and a resistance measurement device, wherein the carrying table is suitable for carrying the active element array substrate; the laser repairing device is suitable for firstly cutting off a part of region of the testing line to electrically insulate the pair of testing pads from each other and then forming a repair line to electrically reconnect the pair of testing pads; and the resistance measurement device is arranged on the laser repairing device and provided with at least one probe which is suitable to contact the pair of testing pads to measure the resistance of the repairing line. The laser repairing stand can reduce the probability of allowing the active element array substrate which is failed in repairing due to abnormal condition of the stand to flow to the next section of machining, so the probability of wasting manpower and material resources at the next section of machining can be reduced.
Description
Technical field
The invention relates to a kind of laser preparing board, and particularly relevant for a kind of laser preparing board with resistance measuring equipment.
Background technology
Generally in the process of making active component array base board, can carry out audit program detecting defective (defect) place, and this defective (defect) is carried out laser preparing (laser repairing) processing.Generally speaking, laser chemical vapor deposition processing (laser CVD process) is one of common laser preparing processing.Yet, add man-hour in carrying out laser preparing, normal because of spare part offset or damage in the laser preparing board, make laser beam axis skew or energy change, and then cause repairing failure.For example, when laser chemical vapor deposition was processed the energy instability of employed laser, it possibly can't reach the purpose of repairing at patch cord that fault location forms, and then causes repairing baulk.What need special instruction is, the repairing failure of this type can't be detected in real time by the personnel of working online, detect the resistance that measures patch cord in board and need that the active component array base board after this repairing is moved to another, can judge just whether the defective on the active component array base board has been repaired fully.But when carrying out the action of above-mentioned measurement resistance, many active component array base boards that cause repairing failure unusually because of laser preparing board afterflow cause the manpower that back segment processes and the waste of material to back segment processing.
Hold above-mentioned, how in laser preparing processing, monitoring laser is repaired the machine condition of board in real time, so that the unusual problem of laser preparing board machine condition can be found in time, and the continuous probability that is left in the back segment processing of the active component array base board of reduction repairing failure is one of problem of developer institute desire solution in fact.
Summary of the invention
The invention provides a kind of laser preparing board, it has the resistance measuring equipment to monitor self board situation in real time.
The invention provides a kind of laser preparing board, it is suitable for repairing active component array base board, and active component array base board has at least one measurement circuit, and measurement circuit has at least one pair of testing cushion that is electrically connected to each other.The laser preparing board comprises microscope carrier, laser repairing device and resistance measuring equipment.Microscope carrier is suitable for carrying active component array base board.The subregion that laser repairing device is suitable for cutting off measurement circuit earlier forms patch cord so that this electrically connects again to testing cushion again so that a pair of testing cushion is electrically insulated each other.The resistance measuring equipment is disposed on the laser repairing device.The resistance measuring equipment has at least one probe, and probe is suitable for this testing cushion being contacted to measure the resistance of patch cord.
In one embodiment of this invention, aforesaid resistance measuring equipment comprises drive unit, and probe is upper and lower to be moved to drive and drive unit is connected with probe.
In one embodiment of this invention, aforesaid probe comprises base and probe base.Base is connected with drive unit.Probe base is assembled on the base, and probe base has the pair of conductive terminal.
In one embodiment of this invention, the spacing of aforesaid testing cushion is identical in fact with the spacing of pair of conductive terminal.
In one embodiment of this invention, aforesaid probe base is detachable probe base.
In one embodiment of this invention, the spacing of aforesaid conducting terminal is for adjusting.
In one embodiment of this invention, aforesaid probe base is the rotary type probe base, and the rotary type probe base rotates with respect to base.
In one embodiment of this invention, carry out the measurement of resistance after aforesaid resistance measuring equipment formed with patch cord respectively before patch cord forms.
Laser preparing board of the present invention has the function of real-time monitoring self machine condition, therefore can reduce the active component array base board of repairing failure unusually because of the machine condition and flow to the probability of back segment in processing, and then reduce the probability that manpower that back segment processes and material are wasted.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the laser preparing board schematic diagram of one embodiment of the invention;
Fig. 2 A, Fig. 2 B, Fig. 2 C and Fig. 2 D are the measurement circuit schematic diagram of one embodiment of the invention;
Fig. 3 is the conducting terminal schematic diagram of one embodiment of the invention;
Fig. 4 A, Fig. 4 B are the probe base schematic diagram of one embodiment of the invention;
Wherein, Reference numeral
100: the laser preparing board
110: microscope carrier
120: laser repairing device
130: the resistance measuring equipment
132: probe
132a: base
132b: probe base
132c: conducting terminal
132d: adjust screw
134: drive unit
134a: stepper motor
134b: control unit
136: ammeter
200: active component array base board
210: measurement circuit
212: testing cushion
214: connection line
216: patch cord
Pc, Pt: spacing
Embodiment
Below in conjunction with the drawings and specific embodiments technical solution of the present invention being described in detail, further understanding purpose of the present invention, scheme and effect, but is not the restriction as claims protection range of the present invention.
Fig. 1 is the laser preparing board schematic diagram of one embodiment of the invention.Please refer to Fig. 1, the laser preparing board 100 of present embodiment can be used to repair active component array base board 200, and active component array base board 200 for example is thin-film transistor array base-plate (Thin Film Transistor Array Substrate, TFT ArraySubstrate).Yet the present invention does not limit the kind of active component array base board 200.In the present embodiment, laser preparing board 100 comprises microscope carrier 110, laser repairing device 120 and resistance measuring equipment 130, and wherein microscope carrier 110 can be used to carry active component array base board 200, and resistance measuring equipment 130 is disposed on the laser repairing device 120.
In the present embodiment, resistance measuring equipment 130 can comprise at least one probe 132 and drive unit 134.The probe 132 of present embodiment can comprise base 132a and probe base 132b, and this probe base 132b has pair of conductive terminal 132c, shown in the bottom-right diagram of Fig. 1.In the present embodiment, drive unit 134 can comprise stepper motor 134a and control unit 134b (for example computer), and wherein stepper motor 134a can be controlled by control unit 134b.The probe base 132b of present embodiment is connected with stepper motor 134a, therefore by control unit 134b may command probe 132 upper and lower moving, as shown in fig. 1.The probe 132 of present embodiment can further electrically connect the function that measures resistance to reach with ammeter 136.
Fig. 2 A is the measurement circuit schematic diagram of one embodiment of the invention.Please earlier with reference to Fig. 2 A, in the present embodiment, active component array base board 200 to be repaired has at least one measurement circuit 210.The measurement circuit 210 of present embodiment comprises at least one pair of testing cushion 212 and connection line 214, and wherein, this utilizes connection line 214 to be electrically connected to each other to testing cushion 212, as shown in Fig. 2 A.
In the present embodiment, the spacing Pc of conducting terminal 132c is identical in fact with the spacing Pt of testing cushion 212, as shown in Fig. 2 B.Therefore, the control unit 134b of the drive unit 134 of present embodiment can make whole probe 132 move down so that conducting terminal 132c contacts to measure the resistance R1 of measurement circuit 210, as shown in Fig. 2 A with testing cushion 212.Then, utilize the laser repairing device 120 of present embodiment cut off measurement circuits 210 subregion (for example subregion of connection line 214) so that testing cushion 210 be electrically insulated each other, as shown in Fig. 2 C.Then, utilize the laser repairing device 120 of present embodiment to form patch cord 216 so that testing cushion 212 is electrically connected again.Afterwards, utilizing conducting terminal 132c to contact resistance R2 with testing cushion 212, as shown in Fig. 2 D with the measurement circuit after measuring repairing 210.The resistance R1 that the resistance R2 of the measurement circuit 210 after repairing is deducted proper testing circuit 210 can preresearch estimates goes out the resistance R of patch cord 216.Utilize the resistance R that monitors this patch cord 216 in real time whether normal, whether the mending function of laser preparing board 100 that can judge present embodiment is normal, and then can reduce the active component array base board 200 continuous probability that are left in the back segment processing that cause repairing failure because of laser preparing board 100 board situations unusually.
In addition, the conducting terminal 132c of present embodiment can have multiple variation, for example can be the configuration of difformity shown in a, b among Fig. 3, c, d, e, the f and size, but the present invention is not as limit.
In addition, the probe base 132b of present embodiment can be a detachable probe base.When testing cushion 212 its spacing Pt are changed on the active component array base board to be repaired 200, this probe base 132b can be pulled down, change the spacing Pc of conducting terminal 132c and the probe base 132b identical, can successfully carry out so that measure the action of patch cord 216 resistance R to the spacing Pt of testing cushion 212.So, the invention is not restricted to this, in another embodiment of the present invention, the spacing Pc of the conducting terminal 132c of probe base 132b can adjust (shown in Fig. 4 A) by adjusting screw 132d, make the spacing Pc of conducting terminal 132c with identical, can successfully carry out so that measure the action of the resistance R of patch cord 216 to the spacing Pt of testing cushion 212.
In an embodiment more of the present invention, probe base 132b also can be a rotary type probe base (shown in Fig. 4 B), this rotary type probe base 132b can rotate with respect to base 132a, this rotary type probe base 132b rotation back is shown in the upper right side of Fig. 4 B, and the top view of rotary type probe base 132b is shown in the lower right of Fig. 4 B.When the orientation of the testing cushion on the active component array base board to be repaired 200 212 changes, can make the orientation of conducting terminal 132c consistent rotary type probe base 132b rotation, can successfully carry out so that measure the action of the resistance R of patch cord 216 with testing cushion 212 orientations.
In sum, whether laser preparing board of the present invention utilizes the resistance measuring equipment on it can monitor its mending function in real time to take place unusually, and then promotes the repairing yield of laser preparing board.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (8)
1. a laser preparing board is suitable for repairing an active component array base board, and this active component array base board has at least one measurement circuit, and this measurement circuit has at least one pair of testing cushion that is electrically connected to each other, and it is characterized in that, this laser preparing board comprises:
One microscope carrier is suitable for carrying this active component array base board;
One laser repairing device, the subregion that is suitable for cutting off this measurement circuit earlier forms a patch cord so that this electrically connects again to testing cushion again so that this is electrically insulated each other to testing cushion; And
One resistance measuring equipment is disposed on this laser repairing device, and this resistance measuring equipment has at least one probe, and this probe is suitable for this testing cushion being contacted to measure the resistance of this patch cord.
2. laser preparing board as claimed in claim 1 is characterized in that, this resistance measuring equipment comprises a drive unit, and this drive unit is connected to drive this probe upper and lower mobile with this probe.
3. as claim 2 a described laser preparing board, it is characterized in that this probe comprises:
One base is connected with this drive unit; And
One probe base is assembled on this base, and this probe base has the pair of conductive terminal.
4. as claim 3 a described laser preparing board, it is characterized in that this spacing to testing cushion is identical in fact with this spacing to conducting terminal.
5. as claim 3 a described laser preparing board, it is characterized in that this probe base is a detachable probe base.
6. as claim 3 a described laser preparing board, it is characterized in that, this to the spacing of conducting terminal for adjusting.
7. as claim 1 a described laser preparing board, it is characterized in that this probe base is a rotary type probe base, and this rotary type probe base is with respect to this base rotation.
8. as claim 1 a described laser preparing board, it is characterized in that, carry out the measurement of resistance after this resistance measuring equipment formed with patch cord respectively before patch cord forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010513992 CN102034683B (en) | 2010-10-14 | 2010-10-14 | Laser repairing stand |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010513992 CN102034683B (en) | 2010-10-14 | 2010-10-14 | Laser repairing stand |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102034683A true CN102034683A (en) | 2011-04-27 |
| CN102034683B CN102034683B (en) | 2013-03-20 |
Family
ID=43887405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010513992 Expired - Fee Related CN102034683B (en) | 2010-10-14 | 2010-10-14 | Laser repairing stand |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102034683B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102608875A (en) * | 2012-03-27 | 2012-07-25 | 深圳市华星光电技术有限公司 | Glass substrate carved number repairing method and glass substrate carved number repairing device based on repairing cabinet |
| CN105359631A (en) * | 2013-08-02 | 2016-02-24 | 奥宝科技有限公司 | A system and method for producing a conductive path on a substrate |
| CN105420694A (en) * | 2014-08-04 | 2016-03-23 | 上海和辉光电有限公司 | Monitoring device and method for laser chemical vapor deposition (LCVD) line growing and film forming repairing quality |
| CN107329069A (en) * | 2016-04-20 | 2017-11-07 | 朗姆研究公司 | For the device and correlation technique of the state for measuring electroplating unit component |
| US10840160B2 (en) | 2018-05-25 | 2020-11-17 | AU Optronics (Kunshan) Co., Ltd. | Display device and method for repairing and detecting thin film transistor of display device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5171709A (en) * | 1988-07-25 | 1992-12-15 | International Business Machines Corporation | Laser methods for circuit repair on integrated circuits and substrates |
| TW312850B (en) * | 1996-06-28 | 1997-08-11 | Vanguard Int Semiconduct Corp | Manufacturing method of field effect device with narrow gate length |
| CN101471272A (en) * | 2007-12-29 | 2009-07-01 | 财团法人工业技术研究院 | Automatic flaw detection device and method for substrate laser repairing device |
| CN101598752A (en) * | 2009-05-14 | 2009-12-09 | 福建华映显示科技有限公司 | The real-time detection method of defect repairing of thin film transistor array circuit |
| KR20100106748A (en) * | 2009-03-24 | 2010-10-04 | 삼성전자주식회사 | Apparatus for repairing defect pixel in flat display panel |
-
2010
- 2010-10-14 CN CN 201010513992 patent/CN102034683B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5171709A (en) * | 1988-07-25 | 1992-12-15 | International Business Machines Corporation | Laser methods for circuit repair on integrated circuits and substrates |
| TW312850B (en) * | 1996-06-28 | 1997-08-11 | Vanguard Int Semiconduct Corp | Manufacturing method of field effect device with narrow gate length |
| CN101471272A (en) * | 2007-12-29 | 2009-07-01 | 财团法人工业技术研究院 | Automatic flaw detection device and method for substrate laser repairing device |
| KR20100106748A (en) * | 2009-03-24 | 2010-10-04 | 삼성전자주식회사 | Apparatus for repairing defect pixel in flat display panel |
| CN101598752A (en) * | 2009-05-14 | 2009-12-09 | 福建华映显示科技有限公司 | The real-time detection method of defect repairing of thin film transistor array circuit |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102608875A (en) * | 2012-03-27 | 2012-07-25 | 深圳市华星光电技术有限公司 | Glass substrate carved number repairing method and glass substrate carved number repairing device based on repairing cabinet |
| CN105359631A (en) * | 2013-08-02 | 2016-02-24 | 奥宝科技有限公司 | A system and method for producing a conductive path on a substrate |
| US11464114B2 (en) | 2013-08-02 | 2022-10-04 | Orbotech Ltd. | System producing a conductive path on a substrate |
| CN105420694A (en) * | 2014-08-04 | 2016-03-23 | 上海和辉光电有限公司 | Monitoring device and method for laser chemical vapor deposition (LCVD) line growing and film forming repairing quality |
| CN107329069A (en) * | 2016-04-20 | 2017-11-07 | 朗姆研究公司 | For the device and correlation technique of the state for measuring electroplating unit component |
| US10436829B2 (en) | 2016-04-20 | 2019-10-08 | Lam Research Corporation | Apparatus for measuring condition of electroplating cell components and associated methods |
| CN107329069B (en) * | 2016-04-20 | 2020-03-10 | 朗姆研究公司 | Apparatus for measuring a condition of an electroplating cell assembly and related method |
| CN111624455A (en) * | 2016-04-20 | 2020-09-04 | 朗姆研究公司 | Apparatus for measuring a condition of an electroplating cell assembly and related method |
| CN111624455B (en) * | 2016-04-20 | 2023-04-04 | 朗姆研究公司 | Apparatus for measuring electrical properties of conductive paths within semiconductor processing apparatus |
| US10840160B2 (en) | 2018-05-25 | 2020-11-17 | AU Optronics (Kunshan) Co., Ltd. | Display device and method for repairing and detecting thin film transistor of display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102034683B (en) | 2013-03-20 |
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Granted publication date: 20130320 Termination date: 20201014 |